Heat exchange device, electronic device and equipment
By setting different waveform surfaces of the flow divider in the heat exchange device, the fluid disturbance is enhanced to form turbulence, which solves the problem of poor heat dissipation effect of microchannels and achieves a more efficient heat dissipation effect.
Patent Information
- Application Number
- CN202422616134.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-10-28
AI Technical Summary
Existing microchannel cooling devices have uniform and equal-width channels, resulting in smooth flow of the cooling medium and limited heat dissipation effect.
A flow divider is installed inside the containment cavity of the heat exchanger. The two sides of the flow divider are constructed with curved surfaces of different waveforms to enhance fluid disturbance, form turbulence, reduce flow resistance, and increase heat exchange area.
Turbulent heat transfer improves the heat exchange capacity of the fluid, reduces fluid kinetic energy loss, and increases the heat exchange area of the fluid through the flow channel.
Smart Images
Figure CN223452271U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of heat exchange devices, in particular, to a heat exchange device, electronic device and equipment. BACKGROUND
[0002] With the continuous development of modern technology, electronic devices are gradually becoming smaller. In order to enable small-sized electronic devices to operate normally, a micro-channel heat dissipation device is usually used to dissipate heat for the electronic devices.
[0003] In the related art, the flow channel of the micro-channel heat dissipation device is a uniform and equal-width flow channel, which enables the cooling medium to flow smoothly. However, the heat dissipation effect is limited. CONTENT OF THE INVENTION
[0004] The purpose of the present disclosure is to provide a heat exchange device, electronic device and equipment which can solve the above technical problems.
[0005] In order to achieve the above purpose, the present disclosure provides a heat exchange device, comprising: a housing having a receiving cavity therein, the receiving cavity having openings at opposite ends thereof for the cooling fluid to enter and exit; and a flow divider arranged in the receiving cavity and extending along the direction of the cooling fluid flow to divide the receiving cavity into a plurality of flow channels, at least two side surfaces of the flow divider being configured as curved surfaces of different waveforms.
[0006] Optionally, the receiving cavity has a mounting surface therein, the flow divider is arranged on the mounting surface, and a gap is formed between the side surface of the flow divider away from the mounting surface and the housing.
[0007] Optionally, the side surface of the flow divider away from the mounting surface is configured as a curved surface.
[0008] Optionally, the opposite side surfaces of the flow divider adjacent to the mounting surface and extending in the same direction as the direction of the cooling fluid flow are both configured as curved surfaces.
[0009] Optionally, the side surface of the flow divider away from the mounting surface and the opposite side surfaces of the flow divider adjacent to the mounting surface and extending in the same direction as the direction of the cooling fluid flow are configured as curved surfaces of different waveforms.
[0010] Optionally, the flow divider comprises a plurality of flow bodies, and the flow bodies are arranged at intervals.
[0011] Optionally, the flow divider has at least one gap between the flow divider and the housing for the cooling fluid to pass through.
[0012] Optionally, a plurality of flow dividers are arranged at intervals to form a plurality of flow channels.
[0013] Optionally, the housing comprises a base plate and a cover plate, the mounting surface is arranged on the base plate, and the cover plate is arranged on the opposite side of the mounting surface.
[0014] Optionally, the heat exchange device is configured as a micro-channel heat exchange device.
[0015] A second object of the present disclosure is to provide an electronic device comprising the heat exchange device described above.
[0016] A third object of the present disclosure is to provide an apparatus comprising the electronic device described above.
[0017] With the above technical solution, in the heat exchange device provided by the present disclosure, the housing has a containing cavity, and the containing cavity has an opening for the cooling fluid to enter and exit. A flow dividing member extending along the direction of the cooling fluid flow is arranged in the containing cavity to divide the containing cavity into a plurality of flow channels. At least two side surfaces of the flow dividing member are configured as curved surfaces with different waveforms, so that the direction of the cooling fluid changes constantly when the cooling fluid flows in the containing cavity, the fluid disturbance is enhanced, the cooling fluid forms a turbulent flow, and the heat exchange capacity of the fluid passing through the flow channel is increased. The side surface of the flow dividing member is configured as a curved surface, which can reduce the flow resistance, reduce the resistance of the fluid passing through the flow channel, and reduce the loss of kinetic energy of the fluid. At the same time, the curved surface has a larger area than the flat surface, and the heat exchange area is increased.
[0018] Other features and advantages of the present disclosure will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0019] The accompanying drawings are used to provide a further understanding of the present disclosure, and constitute a part of the specification, and are used to explain the present disclosure together with the following specific embodiments, but do not constitute a limitation on the present disclosure. In the drawings:
[0020] Figure 1 is a structural schematic view of a first embodiment of the heat exchange device in the present disclosure;
[0021] Figure 2 is a transverse sectional view of the heat exchange device in the present disclosure;
[0022] Figure 3 is a longitudinal sectional view of the heat exchange device in the present disclosure;
[0023] Figure 4 is a structural schematic view of a second embodiment of the heat exchange device in the present disclosure.
[0024] EXPLANATION OF REFERENCE NUMERALS
[0025] 1, housing; 11, cover plate; 12, base plate; 121, mounting surface; 2, flow dividing member; 21, flow dividing body; 3, containing cavity; 31, opening; 4, flow channel. DETAILED DESCRIPTION
[0026] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended for illustration and explanation of the present disclosure and are not intended to limit the present disclosure.
[0027] In the present disclosure, the orientation words such as 'top, bottom' used without the opposite description generally refer to the top, bottom of the corresponding component in the direction of gravity in the use state, and 'inner, outer' refers to the inner, outer relative to the outline of the component or structure itself. In addition, in the description with reference to the drawings, the same marks in different drawings represent the same elements.
[0028] In nature, sand particles are naturally formed into sand dunes under the accumulation of wind transport, and the sand dune surface forms a topography structure with certain undulating rules. Since nature follows the principle of minimum resistance, that is, all matter will move along the path of minimum resistance, which means that the energy loss of wind is the smallest when it passes through the path formed by these topography structures, which means that the resistance of the surface of such sand dune structure to wind is the smallest. The present disclosure utilizes the above principle, observes the shape characteristics of sand dunes in the desert, and applies the sand dune structure to the heat exchange device.
[0029] As shown in Figures 1-4 The present disclosure provides a heat exchange device, comprising: a shell 1, the shell 1 has a containing cavity 3 inside, the containing cavity 3 has openings 31 for the inlet and outlet of cooling fluid at opposite ends; and a flow divider 2, which is arranged in the containing cavity 3 and extends along the direction of the flow of the cooling fluid to separate the containing cavity 3 into several flow channels 4, and at least two side surfaces of the flow divider 2 are configured as curved surfaces with different waveforms.
[0030] In the heat exchange device provided by the present disclosure, the shell 1 has a containing cavity 3 inside, and the containing cavity 3 has openings 31 for the inlet and outlet of cooling fluid, and the containing cavity 3 is provided with a flow divider 2 extending along the direction of the flow of the cooling fluid to separate the containing cavity 3 into several flow channels 4, and at least two side surfaces of the flow divider 2 are configured as curved surfaces with different waveforms, so that the direction of the cooling fluid changes constantly when flowing in the containing cavity 3, the fluid disturbance is enhanced, the cooling fluid forms a turbulent flow, and after the flow of the fluid appears turbulent, turbulent heat transfer occurs. Due to the irregular motion of the fluid particles, the various quantities in the flow field change randomly with time and space coordinates, resulting in a smaller temperature difference between the center of the flow channel 4 and the wall of the flow channel 4, and the heat exchange efficiency is improved compared with laminar heat transfer. The heat exchange capacity of the fluid through the flow channel 4 is increased; and the side surface of the flow divider 2 is configured as a curved surface, which can reduce the flow resistance and reduce the resistance of the fluid when passing through the flow channel 4, and reduce the loss of kinetic energy of the fluid. At the same time, the curved surface has a larger area than the flat surface, which increases the heat exchange area.
[0031] As an optional embodiment, as shown in Figure 3As shown, the accommodating cavity 3 has a mounting surface 121, and the diverter 2 is disposed on the mounting surface 121. A gap is formed between the side of the diverter 2 away from the mounting surface 121 and the housing 1. The mounting surface 121 is used to mount the diverter 2. For example, the mounting surface 121 is the bottom surface of the housing 1. The mounting surface 121 is a flat surface. A gap is formed between the side of the diverter 2 opposite the mounting surface 121 and the housing 1 to allow the cooling fluid to pass through, thereby increasing the area through which the fluid can pass. The diverter 2 extends along its length and has a width of 10-60 microns, for example, 10 microns, 20 microns, 30 microns, 60 microns, etc. The height of the highest point of the diverter 2 is 1-2 times its width.
[0032] Alternatively, as Figure 3 As shown, the side surface of the diverter 2 away from the mounting surface 121 is configured as a curved surface, which changes the direction of the fluid and enhances the fluid disturbance.
[0033] Alternatively, as Figures 1-2 and Figure 4 As shown, the two opposing side surfaces of the flow divider 2 adjacent to the mounting surface 121 and extending in the same direction as the cooling fluid flow are both configured as curved surfaces. The opposing sides of the flow divider 2 are also configured as curved surfaces, further increasing fluid disturbance. In other embodiments, one side surface may be configured as a curved surface, while the other side surface may be configured as a flat surface.
[0034] Alternatively, as Figures 2-3 As shown, the side surface of the diverter 2 away from the mounting surface 121 and the two opposite side surfaces adjacent to the mounting surface 121 and extending in the same direction as the flow of the cooling fluid are constructed as curved surfaces with different waveforms. The three curved surfaces can be constructed as curved surfaces with any suitable waveform, as long as the waveforms of the three curved surfaces are different, for example, the distance between the crest and the trough of the curved surface is less than 1 / 2 of the width of the diverter 21, and the waveforms of the three curved surfaces are different, so that the direction of the cooling fluid in the three directions changes continuously during the flow, further increasing the disturbance of the cooling fluid.
[0035] As an optional implementation, Figures 1-4 As shown, the flow divider 2 includes a plurality of flow dividers 21, which are spaced apart. The number of flow dividers 21 is no less than three. For example, the flow dividers 21 are spaced evenly apart. The length of a flow divider 21 is 3-4 times its width, and the spacing between adjacent flow dividers 21 is 0.5-1.5 times the width of the flow divider 21. The spacing between adjacent flow dividers 21 allows the cooling fluid to flow between the flow dividers 21, further increasing fluid turbulence. Of course, in other embodiments, the flow divider 2 can also be constructed as a continuous flow divider 21.
[0036] As an optional implementation, Figure 1As shown, the flow distributor 2 is provided with at least one gap for the cooling fluid to pass through, and the flow distributor 2 is provided with at least one flow channel 4 formed between the flow distributor 2 and the side wall of the housing 1.
[0037] As another alternative embodiment, as shown in Figure 4 As shown, the flow distributor 2 is provided with a plurality of gaps to form a plurality of flow channels 4 to increase the cooling area, and the width of the flow channels 4 can be set to be different according to the components to be cooled, for example, the width of the flow distributor 21 can be 1-10 times.
[0038] As another alternative embodiment, as shown in Figure 1 and Figure 4 As shown, the housing 1 includes a base plate 12 and a cover plate 11, the mounting surface 121 is provided on the base plate 12, the cover plate 11 is provided on the opposite side of the mounting surface 121, the flow distributor 2 is mounted on the base plate 12, and the cross-section of the base plate 12 is configured as a U-shaped, and the cover plate 11 is provided at the opening end of the U-shaped, which facilitates the processing and maintenance of the heat exchange device.
[0039] As an alternative embodiment, the heat exchange device is configured as a micro-channel heat exchange device, which is a heat exchanger with a flow channel 4 diameter of 10-1000 microns, used for heat dissipation of small-sized electronic devices.
[0040] The second object of the present disclosure is to provide an electronic device comprising the above-mentioned heat exchange device, the heat exchange device is configured as a micro-channel heat exchange device, for example, a chip is provided in the electronic device, and the heat exchange device is provided on one side of the chip to dissipate heat for the chip, and at least two sides of the flow distributor 2 of the present disclosure are configured as different wave-shaped curved surfaces, so that the direction of the cooling fluid changes constantly when flowing in the accommodation cavity 3, the fluid disturbance is enhanced, the cooling fluid forms a turbulent flow, and the heat exchange capacity of the fluid passing through the micro-channel is increased.
[0041] The third object of the present disclosure is to provide an apparatus comprising the above-mentioned electronic device, which is cooled by the heat exchange device of the present disclosure, and the cooling effect is better.
[0042] The preferred embodiments of the present disclosure are described in detail above with reference to the accompanying drawings, but the present disclosure is not limited to the specific details in the above-described embodiments, and various simple modifications can be made to the technical solutions of the present disclosure within the technical concept of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
[0043] In addition, it should be noted that each specific technical feature described in the above-described specific embodiments can be combined in any appropriate manner without contradiction, and in order to avoid unnecessary repetition, the present disclosure will not describe various possible combinations again.
[0044] Furthermore, the various embodiments of the present disclosure can be arbitrarily combined with each other unless they contradict each other, and it should be understood that the same should be construed as being included in the disclosure of the present disclosure.
Claims
1. A heat exchange device, characterized in that: include: a housing, wherein the housing has a housing cavity, and opposite ends of the housing cavity have openings for the inlet and outlet of a cooling fluid; as well as The flow dividing member is arranged in the accommodating cavity and extends along the flow direction of the cooling fluid to divide the accommodating cavity into a plurality of flow channels. At least two side surfaces of the flow dividing member are constructed as curved surfaces with different waveforms.
2. The heat exchange device according to claim 1, characterized in that: The accommodating cavity has a mounting surface in it, the diverter is arranged on the mounting surface, and a gap is formed between a side surface of the diverter away from the mounting surface and the shell.
3. The heat exchange device according to claim 2, characterized in that: A side surface of the diverter away from the mounting surface is configured as a curved surface.
4. The heat exchange device according to claim 3, characterized in that: The two opposite side surfaces of the flow dividing member adjacent to the mounting surface and extending in the same direction as the flow direction of the cooling fluid are both configured as curved surfaces.
5. The heat exchange device according to claim 4, characterized in that: A side surface of the flow dividing member away from the mounting surface and two opposite side surfaces adjacent to the mounting surface and extending in the same direction as the flow direction of the cooling fluid are constructed as curved surfaces with different waveforms.
6. The heat exchange device according to claim 1, characterized in that: The flow dividing member includes a plurality of flow dividing bodies, and the plurality of flow dividing bodies are arranged at intervals.
7. The heat exchange device according to claim 1, characterized in that: At least one flow dividing member is provided, and a gap is provided between the flow dividing member and the shell for the cooling fluid to pass through.
8. The heat exchange device according to claim 1, characterized in that: The flow dividing members are provided with a plurality of flow channels at intervals.
9. The heat exchange device according to claim 2, characterized in that: The housing includes a base plate and a cover plate. The mounting surface is arranged on the base plate, and the cover plate is arranged on the opposite side of the mounting surface.
10. The heat exchange device according to any one of claims 1 to 9, characterized in that: The heat exchange device is configured as a microchannel heat exchange device.
11. An electronic device, characterized in that: include: The heat exchange device according to any one of claims 1 to 10.
12. A device, characterized in that include: The electronic device according to claim 11.