Cooling system

Abstract

The utility model relates to a cooling system, which is used for cooling a heating load, and comprises a heat exchange assembly which is configured to be connected with the load so as to form a cooling loop between the heat exchange assembly and the load, the first liquid storage tank is used for storing a refrigerant; one end of the cooling loop is connected with the first liquid storage tank, and the other end of the cooling loop is connected with the first liquid storage tank or the cooling loop; a first pump configured to drive a refrigerant within the cooling circuit; and the extraction valve is arranged on the cooling loop and is connected with the heat exchange assembly. And the heat dissipation efficiency and stability of the cooling system can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of data center heat dissipation technology, in particular to a cooling system. BACKGROUND

[0002] With the rapid development of computer technology, the data center's ability to process data is becoming higher and higher. However, when the chip processes a large amount of data, excessive heat will greatly restrict the server processing capacity of the data center. Therefore, it is particularly important to cool it. At present, the commonly used cooling method is liquid cooling. The coolant flowing out of the heat exchanger flows through the heat load to absorb heat and then returns to the heat exchanger to release heat. The coolant continuously repeats this circulation process between the heat exchanger and the heat load, thereby continuously cooling the heat generating components.

[0003] In the above-mentioned cooling system, in addition to the liquid coolant and the gaseous coolant, there is also a part of air. Air is a non-condensable gas and does not produce a cooling effect, thereby not conducive to improving the cooling efficiency of the cooling system. Moreover, as the heat load of the load changes continuously, the pressure generated by the air will also change continuously, thereby causing the pressure of the cooling system to fluctuate greatly, which is also not conducive to improving the stability of the cooling system. CONTENT OF THE INVENTION

[0004] Therefore, the present application proposes a cooling system to improve the cooling efficiency and stability of the cooling system.

[0005] The present application provides a cooling system for cooling the heat load. The cooling system comprises a heat exchange assembly, a first liquid storage tank, a first pipeline, a first pump and an air extraction valve. The heat exchange assembly is configured to be connected with the load to form a cooling loop for circulating the coolant between the heat exchange assembly and the load. The first liquid storage tank is used to store the coolant. One end of the first pipeline is connected with the first liquid storage tank, and the other end of the first pipeline is connected with the first liquid storage tank or the cooling loop. The first pump is configured to drive the coolant in the cooling loop. The air extraction valve is arranged on the cooling loop and connected with the heat exchange assembly.

[0006] In some embodiments, the cooling system further comprises a second liquid storage tank and a first switch valve. The second liquid storage tank is connected with the top of the first liquid storage tank. The first switch valve is arranged on the communication pipeline between the second liquid storage tank and the first liquid storage tank.

[0007] In some embodiments, the heat exchange assembly comprises a heat exchanger and a third liquid storage tank in communication with the heat exchanger. The air extraction valve is connected with the third liquid storage tank.

[0008] In some embodiments, the heat exchanger and the third liquid storage tank are in an integrated structure.

[0009] In some embodiments, the heat exchanger and the third liquid tank are in a split structure.

[0010] In some embodiments, the cooling system further comprises a liquid supplement pipeline, one end of the liquid supplement pipeline being connected with the third liquid tank, and the other end being connected with the bottom of the first liquid tank.

[0011] In some embodiments, the cooling system further comprises a second switch valve arranged on the liquid supplement pipeline, and a first liquid level sensor arranged on the third liquid tank, the first liquid level sensor being arranged to detect the liquid level of the refrigerant in the third liquid tank and send a liquid level signal.

[0012] When the liquid level signal is lower than a preset liquid level threshold, the second switch valve is opened.

[0013] In some embodiments, both ends of the cooling circuit are connected with the first liquid tank, the first pump is arranged in the cooling circuit, and the air extraction valve is located on the outlet side of the first pump.

[0014] In some embodiments, the cooling system further comprises a controller, a pressure sensor, a third switch valve, and a fourth switch valve, the pressure sensor and the third switch valve being connected with the heat exchange assembly, and the fourth switch valve being arranged on the communication pipeline between the air extraction valve and the heat exchange assembly.

[0015] The pressure sensor is configured to acquire a pressure signal of the heat exchange assembly.

[0016] The controller is electrically connected with the first pump, the pressure sensor, the third switch valve, and the fourth switch valve.

[0017] In some embodiments, the cooling system further comprises a second pump arranged on the cooling circuit, the second pump being located between the outlet of the heat exchange assembly and the load.

[0018] The cooling system further comprises a liquid discharge pipeline, one end of the liquid discharge pipeline being connected with the cooling circuit and located on the outlet side of the second pump, and the other end being connected with the bottom of the first liquid tank.

[0019] In some embodiments, the first pump is arranged on the cooling circuit, and the first pump is located between the outlet of the heat exchange assembly and the load.

[0020] One end of the cooling circuit is connected with the first liquid tank, and the other end is connected with the cooling circuit and located on the outlet side of the first pump.

[0021] In some embodiments, the cooling system further comprises a fifth switch valve arranged on the cooling loop and a sixth switch valve arranged on a communication line between the air extraction valve and the heat exchange assembly.

[0022] The cooling system of the present application is provided with a first pipeline, a first pump and an air extraction valve. The first pipeline is a passage for circulation of refrigerant, and the first pump is configured to drive the refrigerant in the first pipeline. The air extraction valve is arranged on the first pipeline and connected with the heat exchange assembly. When the first pump drives the refrigerant to circulate in the first pipeline, a negative pressure area is formed in the air extraction valve, so that the gas such as air or air-gaseous refrigerant mixture in the heat exchange assembly is extracted into the first pipeline, and finally discharged into the first liquid tank. In this way, the active air extraction work of the first pump and the air extraction valve can realize the degassing of the cooling system, avoid the existence of too much non-condensable gas in the cooling system, and thus improve the heat dissipation efficiency and stability of the cooling system. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 Fig. 1 is a schematic structural diagram of one embodiment of the cooling system of the present application;

[0024] Figure 2 Fig. 2 is a schematic structural diagram of another embodiment of the cooling system of the present application;

[0025] Figure 3 Fig. 3 is a schematic structural diagram of one embodiment of the air extraction valve of the present application;

[0026] Figure 4 Fig. 4 is a schematic structural diagram of another embodiment of the cooling system of the present application.

[0027] The reference signs are as follows:

[0028] 10-cooling system; 11-heat exchange assembly; 111-heat exchanger; 112-third liquid tank; 113-temperature sensor; 1121-first liquid level sensor; 1122-third liquid discharge port; 12-first liquid tank; 121-second liquid level sensor; 122-second liquid discharge port; 13-first pipeline; 14-first pump; 15-air extraction valve; 151-nozzle; 1511-inlet; 152-suction chamber; 1521-suction port; 153-pressure expansion pipe; 1531-outlet; 16-second liquid tank; 161-first switch valve; 162-exhaust valve; 163-first liquid discharge port; 164-cooling water; 17-liquid supplement pipeline; 171-second switch valve; 18-pressure sensor; 19-third switch valve; 20-fourth switch valve; 21-second pump; 21a-first sub-pump; 21b-second sub-pump; 21c-check valve; 22-liquid discharge pipeline; 221-seventh switch valve; 14a-third sub-pump; 14b-fourth sub-pump; 14c-second check valve; 131-fifth switch valve; 132-sixth switch valve;

[0029] 100 - load; 200 - refrigerant; 300 - cooling circuit; 400 - liquid separator; 500 - gas collector; 600 - containing chamber; 610 - inlet; 620 - outlet; 630 - liquid level sensor; 640 - inlet on-off valve; 700 - cooling device. DETAILED DESCRIPTION

[0030] In order to make the above objectives, features and advantages of the present application more clear and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways other than the ones described herein, and one of ordinary skill in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0033] In the present application, unless otherwise specifically defined and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In the present application, unless specifically stated and limited otherwise, if there is a description of a first feature "on" or "under" a second feature, etc., it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "over", "above" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature "under", "below" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0035] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can be an intervening element. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right", and similar expressions used herein are for purposes of explanation only and are not intended to be limiting.

[0036] Embodiments of the present application provide a cooling system 10 for cooling a heat load 100. As shown in Figure 1 and Figure 2 The cooling system 10 includes a heat exchange assembly 11, a first liquid storage tank 12, a first pipeline 13, a first pump 14, and a suction valve 15. The heat exchange assembly 11 is configured to be connected to the load 100 to form a cooling loop 300 for circulation of a coolant 200 therebetween. The first liquid storage tank 12 is configured to store the coolant 200. One end of the first pipeline 13 is connected to the first liquid storage tank 12, and the other end is connected to the first liquid storage tank 12 or the cooling loop 300. The first pump 14 is configured to drive the coolant 200 in the first pipeline 13. The suction valve 15 is disposed on the first pipeline 13 and connected to the heat exchange assembly 11.

[0037] The cooling system 10 includes a heat exchange assembly 11, a first liquid storage tank 12, a first pipeline 13, a first pump 14, and a suction valve 15. The heat exchange assembly 11 is configured to be connected to the load 100 to form a cooling loop 300 for circulation of a coolant 200 therebetween. That is, the heat exchange assembly 11 is in communication with the load 100 to form the cooling loop 300, and the coolant 200 in the cooling loop 300 continuously changes state, thereby continuously transferring heat generated by the load 100 to the heat exchange assembly 11, and further cooling and cooling the load 100 by the heat exchange assembly 11. It is easy to understand that, since the heat exchange assembly 11 cools and liquefies the coolant 200 in the cooling loop 300, the heat exchange assembly 11 includes not only completely liquefied liquid coolant 200, but also unliquefied gaseous coolant 200 and air.

[0038] The following is a brief discussion of the process of refrigerant 200 circulation and heat exchange assembly 11 cooling load 100. First, the low-temperature refrigerant 200 through the load 100, and the load 100 heat exchange. At this time, the heat of the load 100 is taken away, the temperature decreases; refrigerant 200 temperature rises. Then, the high-temperature refrigerant 200 from the load 100, and then flow to the heat exchange assembly 11. Heat exchange assembly 11 can be with the high-temperature refrigerant 200 re-heat exchange. At this time, the heat of the high-temperature refrigerant 200 is taken away by the heat exchange assembly 11, the temperature decreases and re-into low-temperature refrigerant 200, while the cooling liquid in the heat exchange assembly 11 can be cooled by the cooling device 700 connected to it, such as cooling fan, cold source, etc. Through the continuous circulation of refrigerant 200, the load 100 can be continuously cooled.

[0039] Optionally, according to the state of the refrigerant 200 in the cooling system 10 when the circulation is different, the cooling system 10 can be divided into two kinds of single-phase immersion liquid cooling system and phase change immersion liquid cooling system. Single-phase immersion liquid cooling system refers to the refrigerant 200 always maintains a liquid state during the circulation cooling process, and does not change phase. And, the refrigerant 200 through the heat load 100, completely immersed in the heat load 100. Phase change immersion liquid cooling system refers to the refrigerant 200 changes phase during the circulation cooling process, which will produce a process of gas-liquid change. And, the refrigerant 200 through the heat load 100, completely immersed in the heat load 100.

[0040] In this application, the cooling system 10 is described as a phase change immersion liquid cooling system. However, it should be noted that it can also be a single-phase immersion liquid cooling system.

[0041] The first liquid storage tank 12 refers to the tank for storing refrigerant 200. The first liquid storage tank 12 can supplement the refrigerant 200 to the cooling system 10; or, can store excess refrigerant 200 in the cooling system 10.

[0042] The first pipeline 13 is a passage for the refrigerant 200 to flow through, and the first pump 14 is configured to drive the refrigerant 200 in the first pipeline 13. Specifically, one end of the first pipeline 13 is connected with the first liquid storage tank 12, and the other end is connected with the first liquid storage tank 12 or the cooling circuit 300. That is, the first pipeline 13 can be arranged in two ways.

[0043] The first kind is as shown in Figure 1 Both ends of the first pipeline 13 are connected with the first liquid storage tank 12, and the first pump 14 drives the refrigerant 200 to flow out from one end of the first liquid storage tank 12 and return to the first liquid storage tank 12 from the other end. In this case, the first pipeline 13 forms a circulation pipeline for the refrigerant 200 on the first liquid storage tank 12.

[0044] The second kind is as shown inFigure 2 As shown, one end of the first pipeline 13 is connected with the first liquid storage tank 12, and the other end is connected with the cooling circuit 300. The first pump 14 drives the refrigerant 200 from the cooling circuit 300 into the first pipeline 13, and then back to the first liquid storage tank 12. In this case, the first pipeline 13 forms a pipeline for the refrigerant 200 to flow from the cooling circuit 300 to the first liquid storage tank 12.

[0045] Further, the cooling system 10 of the present application further comprises a suction valve 15. The suction valve 15 is arranged on the first pipeline 13 and connected with the heat exchange assembly 11. The suction valve 15 refers to a component for fluid fusion by using the principle of conservation of momentum and conservation of mass. For example, the suction valve 15 can be a fluidic device. As shown, Figure 3 As shown, the suction valve 15 generally comprises three parts, i.e. a nozzle 151, a suction chamber 152 and a diffuser 153, which are in communication with each other. The nozzle 151 is provided with an inlet 1511, the suction chamber 152 is provided with a suction inlet 1521, and the diffuser 153 is provided with an outlet 1531. The suction inlet 1521 of the suction valve 15 is connected with the heat exchange assembly 11, and the inlet 1511 and the outlet 1531 are respectively connected with the first pipeline 13. The suction process of the suction valve 15 is as follows. First, the liquid refrigerant 200 with a certain pressure from the first pump 14 enters the nozzle 151 through the inlet 1511. Due to the gradually tapered shape of the nozzle 151, the pressure of the refrigerant 200 is reduced, and the flow rate is increased, so that a low pressure area is formed at the nozzle 151, and then the gas in the heat exchange assembly 11 is sucked into the suction chamber 152 through the suction inlet 1521. Next, the gas in the heat exchange assembly 11 is fully mixed with the liquid refrigerant 200 sprayed from the nozzle 151. Finally, the mixture of the gas and the liquid refrigerant 200 is sprayed from the diffuser 153.

[0046] The cooling system 10 of the present application is provided with a first pipeline 13, a first pump 14 and a suction valve 15. The first pipeline 13 is a passage for the circulation of the refrigerant 200, and the first pump 14 is configured to drive the refrigerant 200 in the first pipeline 13. The suction valve 15 is arranged on the first pipeline 13 and connected with the heat exchange assembly 11. When the first pump 14 drives the refrigerant 200 to circulate in the first pipeline 13, a negative pressure area is formed in the suction valve 15, so that the gas such as air or the mixture of air and gaseous refrigerant in the heat exchange assembly 11 is sucked into the first pipeline 13, and finally discharged into the first liquid tank 12. In this way, the active suction work of the first pump 14 and the suction valve 15 can realize the degassing of the cooling system 10, avoid the existence of too much non-condensable gas in the cooling system 10, and further improve the heat dissipation efficiency and stability of the cooling system 10. In addition, due to the entry of gas into the first liquid tank 12, the gas pressure in the first liquid tank 12 increases. In this way, more gaseous refrigerant 200 in the first liquid tank 12 is liquefied, which further improves the liquid storage effect of the first liquid tank 12 and the separation effect of the refrigerant 200. Thirdly, the negative pressure area formed in the suction valve 15 can not only suck gas, but also suck liquid. That is, when the refrigerant 200 in the cooling system 10 is excessive, the liquid level of the liquid refrigerant 200 in the heat exchange assembly 11 will be higher than the connection port position of the suction valve 15 and the heat exchange assembly 11. At this time, the suction valve 15 can automatically suck the liquid refrigerant 200 in the heat exchange assembly 11 into the first liquid tank 12. In this way, it is also beneficial to realize the automatic control liquid level function of the cooling system 10 and improve the utilization rate of the refrigerant 200. Fourthly, due to the existence of the suction valve 15, the cooling system 10 of the present application is in a micro-negative pressure state as a whole whether the cooling circuit 300 is circulating or not. In this way, it can also avoid the leakage of the refrigerant 200, and further improve the safety of the refrigerant 200.

[0047] Optionally, in some embodiments, as shown in Figure 1 and Figure 2 , the heat exchange assembly 11 of the cooling system 10 can be connected with a plurality of loads 100 to improve the heat dissipation efficiency. Specifically, as shown in Figure 1 , the plurality of loads 100 are arranged in parallel in the cooling circuit 300, and the input ends of the plurality of loads 100 are provided with a liquid distributor 400 to divide one circuit into a plurality of branches. The output ends of the plurality of loads 100 are provided with a gas collector 500 to collect the refrigerant 200 after the cooling loads 100 in the plurality of branches.

[0048] Optionally, each load 100 can be arranged in a containing cavity 600 full of refrigerant 200, such as a tool shell, a sink, etc. Optionally, each containing cavity 600 is provided with an inlet 610 and an outlet 620 to be connected with the liquid distributor 400 and the gas collector 500, respectively.

[0049] Optionally, a liquid level sensor 630 is arranged on each of the accommodating cavities 600 to monitor the liquid level of the refrigerant 200 in the accommodating cavities 600.

[0050] Optionally, an inlet switch valve 640 is arranged on each of the accommodating cavities 600 to control the opening and closing of each branch, so as to flexibly control the cooling system 10 to cool the load 100 in need of cooling.

[0051] In some embodiments, as shown in Figure 1 The cooling system 10 further includes a second liquid storage tank 16 connected to the top of the first liquid storage tank 12 and a first switch valve 161 arranged on the communication pipeline between the second liquid storage tank 16 and the first liquid storage tank 12.

[0052] In this embodiment, the cooling system 10 further includes a second liquid storage tank 16 and a first switch valve 161. The second liquid storage tank 16 is a tank for storing and recycling the refrigerant 200, and the first switch valve 161 can control the opening and closing of the communication pipeline between the second liquid storage tank 16 and the first liquid storage tank 12. The first switch valve 161 can be, for example, an electromagnetic valve or a mechanical switch valve. When the suction valve 15 sucks the gas in the heat exchange assembly 11 into the first liquid storage tank 12, the air pressure in the first liquid storage tank 12 will increase. As a result, more gaseous refrigerant 200 will be liquefied, so that the content of gaseous refrigerant 200 in the upper part of the first liquid storage tank 12 becomes less and less, and the content of air becomes higher and higher. When the air pressure in the first liquid storage tank 12 reaches a preset pressure value, the first switch valve 161 can be opened. At this time, a large amount of air and a small amount of gaseous refrigerant 200 in the first liquid storage tank 12 can flow into the second liquid storage tank 16. In this way, the second liquid storage tank 16 can further recycle the gas sucked by the suction valve 15, thereby improving the energy utilization rate of the cooling system 10.

[0053] Optionally, as shown in Figure 1As shown, the second liquid tank 16 is also filled with cooling water 164, and the top of the second liquid tank 16 is provided with an exhaust valve 162, and the bottom is provided with a first liquid outlet 163. In this way, by filling the cooling water 164, on the one hand, a small amount of gaseous refrigerant 200 entering the second liquid tank 16 is also liquefied. And because the density of the liquid refrigerant 200 is greater than water, it is deposited in the lower part of the cooling water 164, and then the liquid refrigerant 200 can be recycled through the first liquid outlet 163. On the other hand, a large amount of air entering the second liquid tank 16 floats in the upper part of the cooling water 164, and when the air pressure in the second liquid tank 16 is greater than the preset air pressure, the air can be discharged through the exhaust valve 162. That is, the cooling water 164 can separate the large amount of air and the small amount of gaseous refrigerant 200 entering the second liquid tank 16, and then realize the discharge of the air and the recycling of the refrigerant 200. In addition, the liquid refrigerant 200 is located in the lower part of the cooling water 164, which can also prevent the liquid refrigerant 200 from evaporating.

[0054] In this way, the present application can realize the triple separation of the refrigerant 200 through the heat exchange assembly 11, the air extraction valve 15, the first liquid tank 12, and the second liquid tank 16. The first separation is that the heat exchange assembly 11 cools the high-temperature liquid refrigerant 200 to liquefy it, thereby separating it from the air. At this time, the heat exchange assembly 11 contains liquid refrigerant 200 at the bottom and air and gaseous refrigerant 200 at the top. The second separation is that the air extraction valve 15 extracts the air and gaseous refrigerant 200 in the heat exchange assembly 11 into the first liquid tank 12. Because the air pressure in the first liquid tank 12 is constantly increasing, the amount of gaseous refrigerant 200 in the first liquid tank 12 is further reduced, and the amount of air is increased. The third separation is that the second liquid tank 16 receives the gas discharged from the first liquid tank 12, and through the condensation of the cooling water, the second liquid tank 16 is stratified into air, cooling water, and liquid refrigerant 200, and finally all the refrigerant 200 is successfully separated. In this way, it is beneficial to improve the refrigerant 200 recycling effect of the cooling system 10.

[0055] In some embodiments, as Figure 1As shown, the heat exchange assembly 11 includes a heat exchanger 111 and a third liquid tank 112 in communication with the heat exchanger 111, and the suction valve 15 is connected with the third liquid tank 112. The heat exchanger 111 and the third liquid tank 112 are in an integrated structure. The embodiment provides one of the structures of the heat exchange assembly 11. Specifically, the heat exchange assembly 11 includes the heat exchanger 111 and the third liquid tank 112. The heat exchanger 111 is configured to be connected with the external cooling device 700, so as to exchange heat with the refrigerant 200 flowing out of the load 100, and the third liquid tank 112 can receive the liquid refrigerant 200 condensed by the heat exchanger 111 and the gaseous refrigerant 200 not condensed. Further, the heat exchanger 111 and the third liquid tank 112 are in an integrated structure, so that the structure of the entire cooling system 10 is compact, which is conducive to improving the arrangement convenience of the cooling system 10.

[0056] In other embodiments, as shown in FIG. 2, the heat exchanger 111 and the third liquid tank 112 are in a split structure. In this way, the volume of the third liquid tank 112 is not affected by the heat exchanger 111, so that the heat dissipation power of the heat exchanger 111 and the volume of the third liquid tank 112 can be flexibly matched, thereby facilitating the design diversity of the cooling system 10. Figure 4 In some embodiments, as shown in FIG. 3, the cooling system 10 further includes a liquid supplement pipeline 17, one end of the liquid supplement pipeline 17 is connected with the third liquid tank 112 of the heat exchange assembly 11, and the other end is connected with the bottom of the first liquid tank 12. In the embodiment, the cooling system 10 further includes the liquid supplement pipeline 17. By arranging the liquid supplement pipeline 17, the refrigerant 200 in the first liquid tank 12 can be supplemented into the third liquid tank 112 of the heat exchange assembly 11 to maintain the normal operation of the cooling system 10. Further, the refrigerant 200 in the first liquid tank 12 can be automatically supplemented into the third liquid tank 112 by gravity, or the refrigerant 200 in the first liquid tank 12 can be driven to be supplemented into the third liquid tank 112 by arranging a driven pump, which is not limited in the application.

[0057] Figure 1 Optionally, as shown in FIG. 4, the liquid supplement pipeline 17 is provided with a second switch valve 171, and the third liquid tank 112 is provided with a first liquid level sensor 1121. The first liquid level sensor 1121 is configured to detect the liquid level of the refrigerant 200 in the third liquid tank 112 and send a liquid level signal. When the liquid level signal is lower than a preset liquid level threshold, the second switch valve 171 is opened.

[0058] Optionally, as shown in FIG. 4, the liquid supplement pipeline 17 is provided with a second switch valve 171, and the third liquid tank 112 is provided with a first liquid level sensor 1121. The first liquid level sensor 1121 is configured to detect the liquid level of the refrigerant 200 in the third liquid tank 112 and send a liquid level signal. When the liquid level signal is lower than a preset liquid level threshold, the second switch valve 171 is opened. Figure 1

[0059] ​​In this embodiment, the liquid supplement pipeline 17 is provided with a second switch valve 171, and the third liquid tank 112 is provided with a first liquid level sensor 1121. The second switch valve 171 can be opened or closed according to the liquid level signal sent by the first liquid level sensor 1121 on the third liquid tank 112. Specifically, when the liquid level signal is lower than the preset liquid level threshold, the second switch valve 171 is opened. At this time, the liquid supplement pipeline 17 is opened, and the refrigerant 200 in the first liquid tank 12 can be supplemented into the cooling circuit 300 to maintain the stable operation of the cooling circuit 300. When the liquid level signal is equal to or higher than the preset liquid level threshold, the second switch valve 171 is closed to avoid excessive refrigerant 200 in the cooling circuit 300. In this way, the automatic liquid supplement function of the cooling system 10 can be realized.

[0060] Further, as shown in FIG. 1, the third liquid tank 112 is provided with a third liquid outlet 1122 at the bottom. When the liquid level is too high, the refrigerant 200 can be recovered through the third liquid outlet 1122. Figure 1

[0061] In some embodiments, as shown in FIG. 1, the first liquid tank 12 is provided with a second liquid level sensor 121 and a second liquid outlet 122 at the bottom. In this way, the second liquid level sensor 121 can monitor the liquid level of the refrigerant 200 in the first liquid tank 12 in real time. When the liquid level is too high, the refrigerant 200 can be recovered through the second liquid outlet 122. Figure 1

[0062] In some embodiments, as shown in FIG. 1, the first pipeline 13 is connected to the first liquid tank 12 at both ends, the first pump 14 is arranged in the first pipeline 13, and the suction valve 15 is located on the outlet side of the first pump 14. Figure 1 In this embodiment, the first pipeline 13 is connected to the first liquid tank 12 at both ends, that is, the first pipeline 13 forms a circulating pipeline for the refrigerant 200 on the first liquid tank 12. Since the first liquid tank 12 contains liquid refrigerant 200, gaseous refrigerant 200 and air, and the liquid refrigerant 200 is located below the gaseous refrigerant 200 and the air. Therefore, preferably, one end of the first pipeline 13 is arranged at the bottom of the first liquid tank 12, which is the inlet of the refrigerant 200; the other end is arranged at the top of the first liquid tank 12, which is the outlet of the refrigerant 200. In this way, the liquid refrigerant 200 flows in the first pipeline 13, which is beneficial to improve the working efficiency of the first pump 14.

[0063]

[0064] In some embodiments, as shown in FIG. 1, the first pipeline 13 is connected to the first liquid tank 12 at both ends, the first pump 14 is arranged in the first pipeline 13, and the suction valve 15 is located on the outlet side of the first pump 14. Figure 1 ​​​As shown, the cooling system 10 further comprises a controller (not shown), a pressure sensor 18, a third switch valve 19 and a fourth switch valve 20. The pressure sensor 18 and the third switch valve 19 are connected to the heat exchange assembly 11. The fourth switch valve 20 is arranged on the communication pipeline between the suction valve 15 and the heat exchange assembly 11. The pressure sensor 18 is configured to acquire a pressure signal of the heat exchange assembly 11. The controller is electrically connected to the first pump 14, the pressure sensor 18, the third switch valve 19 and the fourth switch valve 20. The controller is configured to receive the pressure signal and, when the pressure signal is greater than a preset first pressure threshold, to open the first pump 14 and the fourth switch valve 20 and to close the third switch valve 19. The controller is further configured to receive the pressure signal and, when the pressure signal is less than a preset second pressure threshold, to close the first pump 14 and the fourth switch valve 20 and to open the third switch valve 19. The first pressure threshold is greater than the second pressure threshold.

[0065] In the embodiment, the controller is arranged to flexibly control the pressure on the cooling circuit 300 of the cooling system 10. Specifically, the pressure sensor 18 can measure the pressure in the heat exchange assembly 11 and send a pressure signal. The third switch valve 19 can control the communication between the heat exchange assembly 11 and the atmosphere. When the pressure signal is greater than the preset first pressure threshold, it indicates that the pressure of the system cooling circuit 300 is too high. At this time, the first pump 14 and the fourth switch valve 20 are opened, and the third switch valve 19 is closed. In this way, the first pipeline 13 starts to operate, and the gas in the heat exchange assembly 11 enters the first liquid tank 12 through the suction valve 15, and the cooling circuit 300 is disconnected from the atmosphere. In this way, the air and gaseous coolant 200 in the cooling circuit 300 are reduced, thereby reducing the pressure. When the pressure signal is less than the preset second pressure threshold, it indicates that the pressure of the system cooling circuit 300 is too low. At this time, the first pump 14 and the fourth switch valve 20 are closed, and the third switch valve 19 is opened. In this way, the pipeline between the suction valve 15 and the heat exchange assembly 11 is disconnected, and the cooling circuit 300 is connected to the atmosphere through the third switch valve 19. In this way, the atmosphere can supplement air into the cooling circuit 300, thereby increasing the pressure.

[0066] Optionally, as shown, the heat exchange assembly 11 is further provided with a temperature sensor 113. In this way, the temperature signal of the heat exchange assembly 11 can also be acquired in real time. Figure 1

[0067] In some embodiments, the cooling system 10 further comprises a second pump 21 arranged on the cooling circuit 300, and the second pump 21 is located between the outlet of the heat exchange assembly 11 and the load 100. By arranging the second pump 21, the driving force of the coolant 200 in the cooling circuit 300 can be provided.

[0068] ​Optionally, the second pump 21 comprises a first sub-pump 21a and a second sub-pump 21b arranged in parallel. In this way, it is beneficial to improve the flow of the cooling circuit 300 and improve the reliability of the cooling system 10. Optionally, a first one-way valve 21c is arranged on the outlet side of the first sub-pump 21a or the second sub-pump 21b on each parallel branch. In this way, it is beneficial to further improve the reliability of the cooling system 10.

[0069] Further, as shown in Figure 1 , the cooling system 10 further comprises a drain line 22, one end of the drain line 22 is in communication with the cooling circuit 300 and located on the outlet side of the second pump 21, and the other end is connected to the bottom of the first liquid tank 12. In the present embodiment, by arranging the drain line 22, the excess refrigerant 200 in the cooling circuit 300 can be drained into the first liquid tank 12, which is beneficial to improve the convenience of controlling the liquid level in the third liquid tank 112.

[0070] Optionally, the drain line 22 is further provided with a seventh on-off valve 221. In this way, the on-off of the drain line 22 can be flexibly controlled through the seventh on-off valve 221.

[0071] It should be noted that in Figure 1 the cooling system 10 shown, the excess refrigerant 200 in the cooling circuit 300 can be drained into the first liquid tank 12 through the communication line between the suction valve 15 and the third liquid tank 112 of the heat exchange assembly 11. The excess refrigerant 200 in the cooling circuit 300 can also be drained into the first liquid tank 12 through the drain line 22. Alternatively, the excess refrigerant 200 in the cooling circuit 300 can be drained into the first liquid tank 12 through the above two ways at the same time, which is beneficial to improve the drainage efficiency.

[0072] In some embodiments, as shown in Figure 2 , the first pump 14 is arranged on the cooling circuit 300, and the first pump 14 is located between the outlet of the heat exchange assembly 11 and the load 100. One end of the first line 13 is connected to the first liquid tank 12, and the other end is connected to the cooling circuit 300 and located on the outlet side of the first pump 14.

[0073] In this embodiment, one end of the first pipeline 13 is connected to the first liquid storage tank 12, and the other end is connected to the cooling circuit 300 and is located on the outlet side of the first pump 14. That is to say, the first pipeline 13 forms a pipeline for the refrigerant 200 to flow from the cooling circuit 300 to the first liquid storage tank 12. At this time, the first pump 14 has two functions. The first is to act as a driving pump on the cooling circuit 300 to drive the refrigerant 200 to circulate in the cooling circuit. The second is to act as a driving pump of the first pipeline 13 to drive the refrigerant 200 from the cooling circuit 300 to the first liquid storage tank 12, thereby forming a negative pressure area at the exhaust valve 15 to extract the gas in the third liquid storage tank 112 of the heat exchange component 11. In this way, two functions can be achieved at the same time by one driving pump, which is conducive to simplifying the structure of the cooling system 10 and reducing costs.

[0074] In some embodiments, as Figure 2 As shown, the first pump 14 includes a third sub-pump 14a and a fourth sub-pump 14b arranged in parallel. This helps increase the flow rate of the cooling circuit 300 and improve the reliability of the cooling system 10. Optionally, each parallel branch is further provided with a second one-way valve 14c located on the outlet side of the third sub-pump 14a or the fourth sub-pump 14b, which helps further improve the reliability of the cooling system 10.

[0075] In some embodiments, the cooling system 10 further includes a fifth on-off valve 131 disposed on the first pipeline 13 and a sixth on-off valve 132 disposed on the pipeline connecting the air extraction valve 15 and the heat exchange assembly 11. Thus, the fifth on-off valve 131 can be used to control the opening and closing of the first pipeline 13, and the sixth on-off valve 132 can be used to control the opening and closing of the pipeline connecting the air extraction valve 15 and the heat exchange assembly 11. When the pressure in the cooling circuit 300 of the cooling system 10 is low, the fifth on-off valve 131 can be closed and the third on-off valve 19 on the heat exchange assembly 11 can be opened to allow external air to enter the cooling circuit 300. When the pressure in the cooling circuit 300 of the cooling system 10 is high, the fifth on-off valve 131 and the sixth on-off valve 132 can be opened and the third on-off valve 19 on the heat exchange assembly 11 can be closed, allowing the gas in the cooling circuit 300 to be discharged into the first liquid storage tank 12 through the air extraction valve 15 and the first pipeline 13.

[0076] In addition, when the liquid level signal of the first liquid level sensor 1121 in the third liquid storage tank 112 is higher than the preset liquid level threshold, the fifth switch valve 131 can be opened, or the fifth switch valve 131 and the sixth switch valve 132 can be opened at the same time, and the operating frequency of the first pump 14 can be increased, so that the liquid refrigerant 200 in the third liquid storage tank 112 can be discharged into the first liquid storage tank 12 through at least one of the first pipeline 13 and the exhaust valve 15.

[0077] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, it is to be understood that the application embraces all such possible combinations.

[0078] The above-described embodiments only express several implementation manners of the application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that, for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the application, and these all belong to the protection scope of the application. Therefore, the patent protection scope of the application should be subject to the appended claims.

Claims

1. A cooling system for cooling a heat load, characterized in that: include: a heat exchange component configured to be connected to the load to form a cooling circuit for circulating refrigerant therebetween; A first liquid storage tank, used for storing refrigerant; a first pipeline, one end of the cooling circuit being connected to the first liquid storage tank, and the other end being connected to the first liquid storage tank or the cooling circuit; a first pump configured to drive the refrigerant in the cooling circuit; as well as An air extraction valve is provided on the cooling circuit and connected to the heat exchange component.

2. The cooling system according to claim 1, characterized in that The cooling system further includes a second liquid storage tank and a first switch valve. The second liquid storage tank is connected to the top of the first liquid storage tank. The first switch valve is arranged on a connecting pipe between the second liquid storage tank and the first liquid storage tank.

3. The cooling system according to claim 1, characterized in that The heat exchange assembly includes a heat exchanger and a third liquid storage tank connected to the heat exchanger, and the air extraction valve is connected to the third liquid storage tank; Wherein, the heat exchanger and the third liquid storage tank are an integrated structure; Alternatively, the heat exchanger and the third liquid storage tank are of a split structure.

4. The cooling system according to claim 3, characterized in that The cooling system further includes a liquid replenishing pipeline, one end of which is connected to the third liquid storage tank, and the other end of which is connected to the bottom of the first liquid storage tank.

5. The cooling system according to claim 4, characterized in that The cooling system further includes a second switch valve provided on the liquid replenishing pipeline and a first liquid level sensor provided on the third liquid storage tank, wherein the first liquid level sensor is positioned to detect the liquid level of the refrigerant in the third liquid storage tank and to issue a liquid level signal; When the liquid level signal is lower than a preset liquid level threshold, the second switch valve is opened.

6. The cooling system according to any one of claims 1 to 5, characterized in that: Both ends of the cooling circuit are connected to the first liquid storage tank, the first pump is arranged in the cooling circuit, and the air extraction valve is located on one side of the outflow port of the first pump.

7. The cooling system according to claim 6, characterized in that The cooling system also includes a controller, a pressure sensor, a third switch valve and a fourth switch valve. The pressure sensor and the third switch valve are both connected to the heat exchange component. The fourth switch valve is arranged on the connecting pipeline between the exhaust valve and the heat exchange component. The pressure sensor is used to obtain the pressure signal in the heat exchange component. The controller is electrically connected to the first pump, the pressure sensor, the third switch valve and the fourth switch valve.

8. The cooling system according to claim 6, characterized in that The cooling system further includes a second pump disposed on the cooling circuit, the second pump being located between the outlet of the heat exchange component and the load; The cooling system further includes a liquid discharge pipeline, one end of which is connected to the cooling circuit and located at the outlet side of the second pump, and the other end of which is connected to the bottom of the first liquid storage tank.

9. The cooling system according to any one of claims 1 to 5, characterized in that: The first pump is provided on the cooling circuit, and the first pump is located between the outlet of the heat exchange component and the load; One end of the cooling circuit is connected to the first liquid storage tank, and the other end is connected to the cooling circuit and is located at the outlet side of the first pump.

10. The cooling system according to claim 9, characterized in that The cooling system further includes a fifth switch valve provided on the cooling circuit and a sixth switch valve provided on a communication pipeline between the air extraction valve and the heat exchange component.

Images