Anti-electromagnetic interference computer circuit board

Abstract

The utility model discloses an anti-electromagnetic interference computer circuit board, which comprises a computer circuit board, a CPU (Central Processing Unit) main body is integrally arranged on the computer circuit board, and an electromagnetic shielding cover is arranged on the CPU main body; and the heat dissipation module is arranged above the CPU main body and is used for carrying out heat dissipation treatment on the CPU main body. The electromagnetic shielding cover is arranged on the CPU main body, so that the interference of external electromagnetic waves can be effectively shielded, the stability and the safety of data processing are guaranteed, and the anti-interference capability of a computer circuit board is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of circuit boards, specifically to a kind of anti-electromagnetic interference computer circuit board. BACKGROUND

[0002] In modern computer systems, with the improvement of processor performance and the complexity of computing tasks, the environment faced by computer circuit boards becomes more complex. Common technical problems include electromagnetic interference (EMI), poor heat dissipation, and the convenience of system installation and maintenance, etc.

[0003] When the computer circuit board is working, high-frequency components such as CPU will generate electromagnetic waves. If the electromagnetic shielding measures are not in place, the external electromagnetic waves will interfere with the data processing inside the computer, causing system instability, and in severe cases, may cause data loss or system crash.

[0004] CPU will generate a large amount of heat when working under high load. If the heat is not dissipated in time, it will cause CPU overheating, affecting system performance, and even may damage hardware. UTILITY MODEL CONTENT

[0005] The technical problem to be solved by the utility model is to provide an anti-electromagnetic interference computer circuit board to solve the problems existing in the background art.

[0006] The anti-electromagnetic interference computer circuit board of the utility model is realized by the following technical solutions, comprising:

[0007] A computer circuit board, the computer circuit board is integrally provided with a CPU main body, and the CPU main body is provided with an electromagnetic shield;

[0008] A heat dissipation module is arranged above the CPU main body to dissipate heat from the CPU main body.

[0009] As a preferred technical solution, the computer circuit board is provided with mounting holes arranged around the CPU main body.

[0010] The heat dissipation module is fixed to the computer circuit board through the mounting holes, and the heat dissipation end of the heat dissipation module is in contact with the electromagnetic shield on the CPU main body.

[0011] As a preferred technical solution, the computer circuit board is provided with a multi-layer structure, which includes an upper shielding layer, a circuit board main body, and a lower shielding layer.

[0012] The upper shielding layer is arranged above the circuit board main body, and the lower shielding layer is arranged below the circuit board main body. The CPU main body is connected to the circuit board main body through the upper shielding layer.

[0013] As a preferred technical scheme, the heat dissipation module comprises a fixing bottom plate, a temperature guide plate and a heat dissipation fin.

[0014] The fixing bottom plate is arranged at the bottom of the computer circuit board, and the fixing bottom plate is provided with fixing seats corresponding to the mounting holes, and the fixing seats are arranged through the mounting holes.

[0015] The temperature guide plate is provided with locking screws corresponding to the fixing seats around, and the locking screws are connected with the locking holes on the fixing seats; the heat dissipation fin is connected with the temperature guide plate through a copper pipe, so as to realize the installation of the heat dissipation module.

[0016] As a preferred technical scheme, the computer main body is further provided with a plurality of connection interfaces, and the connection interfaces are connected with the circuit board main body inside the computer circuit board.

[0017] As a preferred technical scheme, the computer circuit board is provided with mounting positions around, and the computer circuit board is fixed on the case main body through the mounting positions.

[0018] The beneficial effects of the utility model are:

[0019] The electromagnetic shielding cover is arranged on the CPU main body, can effectively shield the interference of external electromagnetic waves, guarantees the stability and safety of data processing, and improves the anti-interference ability of the computer circuit board.

[0020] The heat dissipation module forms an efficient heat conduction path, rapidly dissipates the heat generated by the CPU to the air, so that the CPU main body can maintain a relatively low temperature under long-time high-load operation, and guarantees the stable operation of the computer circuit board.

[0021] The computer circuit board is composed of an upper shielding layer, a circuit board main body and a lower shielding layer, the CPU main body is connected with the circuit board main body through the upper shielding layer, not only enhances the anti-interference ability of the circuit board, but also improves the overall stability and durability. DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor.

[0023] Fig. 1 It is a three-dimensional structure schematic view of the utility model;

[0024] Fig. 2 It is an explosion structure schematic view of the utility model;

[0025] Fig. 3 It is the computer circuit board section structure schematic view of the utility model.

[0026] Mark explanation:

[0027] 1, computer circuit board;2, heat dissipation module;3, CPU main body;4, electromagnetic shield;5, mounting hole;6, upper shielding layer;7, circuit board main body;8, lower shielding layer;9, fixed bottom plate;10, temperature guide plate;11, heat dissipation fin;12, fixing seat;13, locking screw;14, copper pipe;15, installation position. Specific implementation

[0028] All features disclosed in this specification, or all steps of the methods or processes disclosed, can be combined in any manner, except where mutually exclusive.

[0029] As Figs. 1-3 Indicated, an anti-electromagnetic interference computer circuit board of the utility model, comprising:

[0030] Computer circuit board 1, the computer circuit board 1 is integrally provided with CPU main body 3, and CPU main body 3 is provided with electromagnetic shield 4, effectively resists the invasion of external electromagnetic wave, and guarantees the stability and safety of data processing.

[0031] Heat dissipation module 2, the heat dissipation module 2 is arranged above CPU main body 3, and CPU main body 3 is heat dissipation treatment.

[0032] Among them, the computer circuit board 1 is provided with mounting hole 5, and mounting hole 5 is arranged around CPU main body 3.

[0033] The heat dissipation module 2 is fixed on the computer circuit board 1 through mounting hole 5, and the heat dissipation end of heat dissipation module 2 contacts electromagnetic shield 4 on CPU main body 3, forms high-efficiency heat conduction path, and effectively dissipates heat for CPU main body.

[0034] As Fig. 3 Indicated, computer circuit board 1 is provided with multilayer structure, which includes upper shielding layer 6, circuit board main body 7 and lower shielding layer 8.

[0035] The upper shielding layer 6 is arranged above circuit board main body 7, and the lower shielding layer 8 is arranged below circuit board main body 7, and CPU main body 3 is connected through upper shielding layer 6 and circuit board main body 7;Not only enhance the anti-interference ability of circuit board, also improve its overall stability and durability.

[0036] Among them, heat dissipation module 2 includes fixed bottom plate 9, temperature guide plate 10 and heat dissipation fin 11.

[0037] The fixed bottom plate 9 is arranged at the bottom of the computer circuit board 1, and the fixed bottom plate 9 is provided with a fixed seat 12 corresponding to the mounting hole 5, and the fixed seat 12 is arranged through the mounting hole 5;

[0038] The temperature guide plate 10 is provided with a locking screw 13 corresponding to the fixed seat 12 around, and the locking screw 13 is connected with the locking hole on the fixed seat 12, forming a stable heat dissipation channel; the heat dissipation fin 11 is connected with the temperature guide plate 10 through the copper pipe 14, and the heat generated by the CPU is rapidly dissipated to the air, so that the CPU main body can also maintain a lower temperature under long-time high-load operation.

[0039] In addition, the computer main body is also included, and a plurality of connection interfaces are arranged on the computer main body and connected with the circuit board main body 7 inside the computer circuit board 1.

[0040] In addition, the computer circuit board 1 is provided with a mounting position 15 around, and the computer circuit board 1 is fixed to the case main body through the mounting position 15.

[0041] The electromagnetic shielding cover of the utility model is arranged on the CPU main body, can effectively shield the interference of external electromagnetic wave, guarantees the stability and safety of data processing, improves the anti-interference ability of computer circuit board; the heat dissipation module forms a high-efficiency heat conduction path, and the heat generated by the CPU is rapidly dissipated to the air, so that the CPU main body can also maintain a lower temperature under long-time high-load operation, and guarantees the stable operation of the computer circuit board.

[0042] The above is only a specific embodiment of the utility model, but the protection scope of the utility model is not limited to this, any change or replacement without creative labor is covered in the protection scope of the utility model. Therefore, the protection scope of the utility model should be limited by the protection scope defined in the claims.

Claims

1. An electromagnetic interference resistant computer circuit board, characterized in that: include: A computer circuit board (1), wherein a CPU body (3) is integrally provided on the computer circuit board (1), and an electromagnetic shielding cover (4) is provided on the CPU body (3); A heat dissipation module (2), the heat dissipation module (2) being arranged above the CPU body (3) and performing heat dissipation treatment on the CPU body (3); The heat dissipation module (2) comprises a fixed base plate (9), a heat conduction plate (10) and heat dissipation fins (11); The fixed base plate (9) is arranged at the bottom of the computer circuit board (1), and a fixing seat (12) corresponding to the mounting hole (5) is arranged on the fixed base plate (9), and the fixing seat (12) is arranged through the mounting hole (5); The heat conducting plate (10) is provided with locking screws (13) corresponding to the fixing seat (12) around it, and the locking screws (13) are connected to the locking holes on the fixing seat (12); the heat dissipation fins (11) are connected to the heat conducting plate (10) through the copper tube (14), thereby realizing the installation of the heat dissipation module (2).

2. The electromagnetic interference resistant computer circuit board according to claim 1, characterized in that: The computer circuit board (1) is provided with mounting holes (5), and the mounting holes (5) are arranged around the CPU body (3); The heat dissipation module (2) is fixed on the computer circuit board (1) through the mounting hole (5), and the heat dissipation end of the heat dissipation module (2) is in contact with the electromagnetic shielding cover (4) on the CPU body (3).

3. The electromagnetic interference resistant computer circuit board according to claim 1, characterized in that: The computer circuit board (1) is provided with a multi-layer structure, which includes an upper shielding layer (6), a circuit board body (7) and a lower shielding layer (8); The upper shielding layer (6) is arranged above the circuit board body (7), the lower shielding layer (8) is arranged below the circuit board body (7), and the CPU body (3) passes through the upper shielding layer (6) and is connected to the circuit board body (7).

4. The electromagnetic interference resistant computer circuit board according to claim 1, characterized in that: It also includes a computer main body, and a plurality of connection interfaces are provided on the computer main body, and the connection interfaces are connected to the circuit board main body (7) inside the computer circuit board (1).

5. The electromagnetic interference resistant computer circuit board according to claim 1, characterized in that: The computer circuit board (1) is provided with mounting positions (15) on all four sides, and the computer circuit board (1) is fixed to the chassis body via the mounting positions (15).

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