PCB, PCB assembly, electronic product and vehicle

Abstract

The utility model relates to a PCB, a PCB assembly, an electronic product and a vehicle, the PCB comprises a PCB body and an electromagnetic shielding layer, the PCB body comprises a connecting surface, the connecting surface is used for connecting a component, the electromagnetic shielding layer is laid on the connecting surface, and the electromagnetic shielding layer and the component are arranged adjacently or at an interval. According to the PCB, electromagnetic interference signals (namely EMI signals) can be effectively shielded and isolated, the PCB is protected from being interfered by external EMI signals, meanwhile, the PCB can be prevented from causing radiation interference to the outside, the size of the PCB can be prevented from being too large, and miniaturization of electronic products is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB boards, in particular to a PCB board, a PCB board assembly, an electronic product and a vehicle. BACKGROUND

[0002] Many devices on the PCB of an electronic product are stray radiation sources / interference sources, the devices themselves and the circuit electromagnetic radiation are strong, which often causes interference to other components or products; there are also some sensitive devices on the PCB, which are also easily interfered if the circuit is not handled properly, causing product quality problems. And with the control of cost pressure, the number of layers of the PCB board is reduced, there are a large number of traces on the surface of the PCB, and the EMI problem of the electronic product is increasingly prominent.

[0003] In the related art, the EMI problem is mainly solved by installing a shielding cover on the PCB, but the shielding cover will cause the PCB to be too large, which is not conducive to the miniaturization of the electronic product. CONTENT OF THE INVENTION

[0004] The embodiments of the present application provide a PCB board, which can avoid the PCB board being too large and is conducive to the miniaturization of the electronic product, to at least partially solve the above technical problems.

[0005] In order to achieve the above purpose, according to the first aspect of the present application, a PCB board is provided, comprising:

[0006] A PCB board body comprising a connection surface, the connection surface being used to connect components;

[0007] An electromagnetic shielding layer is laid on the connection surface, and the electromagnetic shielding layer is arranged adjacent to or spaced apart from the components.

[0008] Optionally, the connection surface is formed with a grounding layer, and the electromagnetic shielding layer is electrically connected with the grounding layer.

[0009] Optionally, the PCB board comprises a first insulating layer, and the first insulating layer is arranged between the grounding layer and the electromagnetic shielding layer.

[0010] Optionally, the first insulating layer is formed with a connection hole, so that the electromagnetic shielding layer can be electrically connected with the grounding layer.

[0011] Optionally, the first insulating layer is formed with a plurality of connection holes, wherein,

[0012] At least part of the connection holes are uniformly distributed around the components; and / or,

[0013] The connection surface is connected with at least two components, two components are connected by a connection line, and at least part of the connection holes are uniformly distributed around the connection line.

[0014] Optionally, the connecting surface is provided with a mounting area for mounting the component, and the electromagnetic shielding layer is adjacent to or spaced apart from the mounting area.

[0015] Optionally, the first insulating layer is formed with a plurality of the connecting holes, and at least part of the connecting holes are uniformly distributed around the mounting area.

[0016] Optionally, the electromagnetic shielding layer has a thickness of 0.03mm to 0.07mm.

[0017] Optionally, the PCB further comprises a wave-absorbing layer, the wave-absorbing layer is arranged on a side of the electromagnetic shielding layer away from the connecting surface, and the wave-absorbing layer is used for absorbing electromagnetic wave energy.

[0018] Optionally, along a thickness direction of the PCB body, a height of the wave-absorbing layer protruding from the connecting surface is less than a height of the component protruding from the connecting surface.

[0019] Optionally, the wave-absorbing layer has a thickness of 0.1mm to 0.3mm; and / or,

[0020] the wave-absorbing layer has a wave-absorbing frequency range of 10MHz to 10GHz; and / or,

[0021] the wave-absorbing layer has a magnetic permeability of 20H / m to 200H / m.

[0022] Optionally, the PCB further comprises a second insulating layer, the second insulating layer is arranged on a side of the wave-absorbing layer away from the electromagnetic shielding layer.

[0023] Optionally, along a thickness direction of the PCB, a height of the second insulating layer protruding from the connecting surface is less than a height of the component protruding from the connecting surface.

[0024] According to a second aspect of the present application, a PCB assembly is further provided, comprising a component and a PCB as described above, and the component is mounted on the connecting surface.

[0025] According to a third aspect of the present application, an electronic product is further provided, comprising a PCB assembly as described above.

[0026] According to a fourth aspect of the present application, a vehicle is further provided, comprising an electronic product as described above.

[0027] In the PCB provided in the embodiment of the present application, the electromagnetic shielding layer is arranged adjacent to or spaced apart from the components and devices, so that the electromagnetic shielding layer can effectively shield and isolate electromagnetic interference signals (i.e. EMI signals), thereby protecting the PCB from the interference of external EMI signals, and meanwhile avoiding the radiation interference caused by the PCB to the outside. Moreover, the electromagnetic shielding layer is laid on the connecting surface, and thus does not affect the thickness of the components and devices on the PCB body, i.e. does not affect the overall thickness of the PCB with the components and devices, thereby avoiding the excessively large size of the PCB and being conducive to the miniaturization of electronic products.

[0028] Other features and advantages of the present application will be described in detail in the following specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the following embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0030] In order to more completely understand the present application and its advantages, the following will be described in conjunction with the drawings, wherein the same reference numerals in the following description represent the same parts.

[0031] Figure 1 is a structural schematic diagram of a PCB provided in an exemplary embodiment of the present disclosure;

[0032] Figure 2 is a planar schematic diagram of a PCB provided in an exemplary embodiment of the present disclosure;

[0033] Figure 3 is a structural schematic diagram of a PCB assembly provided in an exemplary embodiment of the present disclosure.

[0034] Explanation of Reference Numerals:

[0035] 1, PCB body; 2, components and devices; 3, electromagnetic shielding layer; 4, grounding layer; 5, first insulating layer; 6, mounting area; 7, wave-absorbing layer; 8, second insulating layer; 11, connecting surface; 21, connecting line; 51, connecting hole. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the protection scope of the present application.

[0037] According to a first aspect of the present application, referring to Figure 1 , Figure 2 and Figure 3 , the present disclosure provides a PCB board. The PCB board comprises a PCB board body 1 and an electromagnetic shielding layer 3, the PCB board body 1 comprises a connecting surface 11, the connecting surface 11 is used for connecting components 2, the electromagnetic shielding layer 3 is laid on the connecting surface 11, and the electromagnetic shielding layer 3 is arranged adjacent to or spaced apart from the components 2.

[0038] It can be understood that the electromagnetic shielding layer 3 is arranged adjacent to or spaced apart from the components 2, so that the electromagnetic shielding layer 3 can effectively shield and isolate electromagnetic interference signals (i.e. EMI signals), protect the PCB board from external EMI signals, and also avoid the PCB board from causing radiation interference to the outside. Moreover, the electromagnetic shielding layer 3 is laid on the connecting surface 11, which does not affect the thickness of the components 2 on the PCB board body 1, that is, does not affect the overall thickness of the PCB board connected with the components 2, and can avoid the PCB board from being too large, which is beneficial to the miniaturization of electronic products.

[0039] It can be understood that the electromagnetic shielding layer 3 can be laid in a specific area in a targeted manner, and the design is flexible and targeted, which can provide electromagnetic protection for the PCB board circuit and is not affected by external electromagnetic interference, and will not radiate electromagnetic noise to the outside. Moreover, it will not increase the overall thickness of the main board and the components 2, and can save space for the thin and light design of the product.

[0040] It can be understood that, compared with the related art in which a shielding cover is used to cover the components 2, the electromagnetic shielding layer 3 of the present application avoids the area of the components 2, and the PCB maintenance is simple and does not need to remove components such as the shielding cover.

[0041] In some examples, the electromagnetic shielding layer 3 is, for example, a metal layer or a composite material layer.

[0042] It can be understood that, when the electromagnetic shielding layer 3 is a metal layer, the electromagnetic shielding layer 3 is arranged adjacent to the components 2, which means that the electromagnetic shielding layer 3 is arranged adjacent to the non-conductive position of the components 2, so as to avoid causing short circuit of the components 2.

[0043] In some examples, the electromagnetic shielding layer 3 can be laid in a local or all areas that need EMI protection.

[0044] In some examples, the PCB board comprises two oppositely arranged connecting surfaces 11, and the two connecting surfaces 11 are provided with structures such as components 2 and the electromagnetic shielding layer 3. It can be understood that the two sides of the PCB board are symmetrically designed.

[0045] In some embodiments, referring to Figure 1 and Figure 3The connecting surface 11 is provided with a grounding layer 4, and the electromagnetic shielding layer 3 is electrically connected with the grounding layer 4.

[0046] It can be understood that the electromagnetic shielding layer 3 is electrically connected with the grounding layer 4, so that the electromagnetic shielding layer 3 and the grounding layer 4 form a shielding structure to shield and isolate the EMI signal, thereby improving the shielding and isolation effect of the EMI signal.

[0047] It can be understood that the grounding layer 4 can reduce the ground impedance, improve the electrical conductivity of the PCB, and enhance the mechanical strength and stability of the PCB.

[0048] In some examples, the grounding layer 4 is, for example, a copper or grounding metal layer on the surface of the PCB.

[0049] In some examples, the grounding layer 4 is located between the electromagnetic shielding layer 3 and the connecting surface 11.

[0050] In some embodiments, referring to Figure 1 and Figure 3 , the PCB includes a first insulating layer 5, which is arranged between the grounding layer 4 and the electromagnetic shielding layer 3.

[0051] It can be understood that the first insulating layer 5 is arranged on the side of the grounding layer 4 away from the connecting surface 11, and the first insulating layer 5 can protect the PCB to prevent the surface of the PCB (such as the grounding layer 4, the wiring of the PCB, etc.) from being affected by the external environment and causing oxidation, corrosion, pollution, etc.

[0052] In some examples, the first insulating layer 5 covers the grounding layer 4, that is, the first insulating layer 5 can cover the PCB body 1 and the grounding layer 4.

[0053] In some embodiments, referring to Figure 2 , the first insulating layer 5 is formed with a connecting hole 51, so that the electromagnetic shielding layer 3 can be electrically connected with the grounding layer 4.

[0054] It can be understood that by forming the connecting hole 51 in the first insulating layer 5, the electromagnetic shielding layer 3 and the grounding layer 4 can be directly electrically connected through the connecting hole 51, so that the connection of the electromagnetic shielding layer 3 and the grounding layer 4 is more convenient.

[0055] In some examples, by forming the connecting hole 51 in the first insulating layer 5, when the electromagnetic shielding layer 3 is arranged on the side of the first insulating layer 5 away from the grounding layer 4, part of the electromagnetic shielding layer 3 will pass through the connecting hole 51 and be connected with the grounding layer 4.

[0056] In some examples, the electromagnetic shielding layer 3 is formed with an extension, the extension is arranged in the connecting hole 51 and connected with the grounding layer 4.

[0057] In some examples, the ground layer 4 is formed with protrusions which are arranged in the connecting holes 51 and connected to the electromagnetic shielding layer 3.

[0058] In some embodiments, referring to Figure 2 , the first insulating layer 5 is formed with a plurality of connecting holes 51, and at least part of the connecting holes 51 are uniformly distributed around the component 2.

[0059] It can be understood that, by uniformly distributing at least part of the connecting holes 51 around the component 2, the connecting points of at least part of the electromagnetic shielding layer 3 and the ground layer 4 are uniformly distributed around the component 2, so as to ensure the shielding and isolation effect on the EMI signals.

[0060] It can be understood that the EMI signals are likely to propagate through the connection between the component 2 and the PCB body 1, and therefore at least part of the connecting holes 51 are arranged around the component 2, so as to improve the shielding and isolation effect on the EMI signals.

[0061] In some embodiments, referring to Figure 2 , the first insulating layer 5 is formed with a plurality of connecting holes 51, and the connecting surface 11 is connected with at least two components 2, the two components 2 are connected by a connecting line 21, and at least part of the connecting holes 51 are uniformly distributed around the connecting line 21.

[0062] It can be understood that, by uniformly distributing at least part of the connecting holes 51 around the connecting line 21, the connecting points of at least part of the electromagnetic shielding layer 3 and the ground layer 4 are uniformly distributed around the connecting line 21, so as to ensure the shielding and isolation effect on the EMI signals.

[0063] It can be understood that the EMI signals are likely to propagate through the connecting line 21 between the components 2, and therefore at least part of the connecting holes 51 are arranged around the connecting line 21, so as to improve the shielding and isolation effect on the EMI signals.

[0064] In some examples, the position, shape, size and number of the connecting holes 51 can be adjusted according to actual needs. For example, the larger the electromagnetic signal protection area, the more the number of the connecting holes 51 can be, and when the working frequency of the protected object is high, the density of the connecting holes 51 can be larger.

[0065] In some embodiments, referring to Figure 2 , the connecting surface 11 is provided with a mounting area 6 for mounting the component 2, and the electromagnetic shielding layer 3 is arranged adjacent to or spaced from the mounting area 6.

[0066] It can be understood that, by mounting the component 2 in the mounting area 6 and arranging the electromagnetic shielding layer 3 adjacent to or spaced from the mounting area 6, the electromagnetic shielding layer 3 can shield and isolate the EMI signals, and can also avoid short circuit and other influences on the component 2.

[0067] In some examples, a spacing is provided between the component 2 and the edge of the mounting area 6 to ensure that the component 2 is separated from the electromagnetic shielding layer 3. For example, the spacing between the component 2 and the mounting area 6 is between 1 mm and 2 mm.

[0068] In some embodiments, referring to Figure 2 , the first insulating layer 5 is formed with a plurality of connecting holes 51, and at least some of the connecting holes 51 are uniformly distributed around the mounting area 6.

[0069] It can be understood that, by uniformly distributing at least some of the connecting holes 51 around the mounting area 6, at least some of the connecting points of the electromagnetic shielding layer 3 and the grounding layer 4 are uniformly distributed around the mounting area 6, so as to ensure the shielding and isolation effect on the EMI signal.

[0070] It can be understood that the EMI signal is likely to propagate through the connection between the component 2 and the PCB body 1, and therefore at least some of the connecting holes 51 are arranged around the mounting area 6 to improve the shielding and isolation effect on the EMI signal.

[0071] In some embodiments, the thickness of the electromagnetic shielding layer 3 is between 0.03 mm and 0.07 mm.

[0072] It can be understood that, if the thickness of the electromagnetic shielding layer 3 is less than 0.03 mm, the shielding and isolation effect of the electromagnetic shielding layer 3 on the EMI signal can be insufficient. If the thickness of the electromagnetic shielding layer 3 is greater than 0.07 mm, the electromagnetic shielding layer 3 has a greater impact on the thickness of the PCB body 1. Therefore, the thickness of the electromagnetic shielding layer 3 is set to be between 0.03 mm and 0.07 mm in the present application, so as to ensure that the electromagnetic shielding layer 3 can effectively shield and isolate the EMI signal while reducing the impact on the thickness of the PCB body 1.

[0073] For example, the thickness of the electromagnetic shielding layer 3 is preferably 0.05 mm.

[0074] In some embodiments, referring to Figure 1 , the PCB further comprises a wave-absorbing layer 7, which is arranged on the side of the electromagnetic shielding layer 3 away from the connecting surface 11, and the wave-absorbing layer 7 is used to absorb electromagnetic wave energy.

[0075] It can be understood that the wave-absorbing layer 7 can absorb electromagnetic wave energy, reduce or eliminate reflected electromagnetic waves, thereby reducing electromagnetic radiation, purifying the electromagnetic space environment, and improving the overall stability of the PCB and the electronic product system provided with the PCB.

[0076] In some examples, the wave-absorbing layer 7 can be laid in a local or entire area where EMI protection is required.

[0077] In some embodiments, along the thickness direction of the PCB body 1 , the height of the absorbing layer 7 protruding from the connection surface 11 is smaller than the height of the component 2 protruding from the connection surface 11 .

[0078] It is understood that the vertical distance between the end surface of component 2 facing away from PCB body 1 and PCB body 1 is greater than the vertical distance between the end surface of absorbing layer 7 facing away from PCB body 1 and PCB body 1. In other words, structures such as absorbing layer 7 and electromagnetic shielding layer 3 do not affect the overall thickness of the PCB board on which component 2 is mounted, thus preventing the PCB board from being too bulky.

[0079] In some embodiments, the thickness of the absorbing layer 7 is between 0.1 mm and 0.3 mm.

[0080] It is understandable that when the thickness of the absorbing layer 7 is less than 0.1 mm, the absorbing layer 7 is less effective in absorbing and eliminating electromagnetic wave energy. When the thickness of the absorbing layer 7 is greater than 0.3 mm, the absorbing layer 7 is likely to affect the overall thickness of the PCB. Therefore, the present application sets the thickness of the absorbing layer 7 between 0.1 mm and 0.3 mm. This ensures that the absorbing layer 7 effectively absorbs and eliminates electromagnetic wave energy while minimizing the impact on the overall thickness of the PCB.

[0081] For example, the thickness of the absorbing layer 7 is preferably 0.2 mm.

[0082] In some embodiments, the absorbing frequency range of the absorbing layer 7 is between 10 MHz and 10 GHz, so that the absorbing layer 7 can absorb EMI signals.

[0083] In some embodiments, the magnetic permeability of the absorbing layer 7 is between 20 H / m and 200 H / m, which ensures the ability of the absorbing layer 7 to absorb electromagnetic waves, so that the absorbing layer 7 can effectively absorb EMI signals.

[0084] In some embodiments, see Figure 3 The PCB board further includes a second insulating layer 8 , which is arranged on a side of the absorbing layer 7 away from the electromagnetic shielding layer 3 .

[0085] It is understandable that the second insulating layer 8 can protect the absorbing layer 7 to prevent the absorbing layer 7 from being affected by the external environment and causing oxidation, corrosion, pollution, etc.

[0086] In some examples, the second insulating layer 8 covers the absorbing layer 7 , that is, the first insulating layer 5 can cover the absorbing layer 7 .

[0087] In some embodiments, along the thickness direction of the PCB board, the height of the second insulating layer 8 protruding from the connection surface 11 is smaller than the height of the component 2 protruding from the connection surface 11 .

[0088] It can be understood that the side of the second insulating layer 8 away from the connecting surface 11 is closer to the connecting surface 11 than the side of the component 2 away from the connecting surface 11, so that the second insulating layer 8, the wave-absorbing layer 7, the electromagnetic shielding layer 3 and the like do not affect the overall thickness of the PCB board on which the component 2 is mounted, and the volume of the PCB board can be prevented from being too large.

[0089] According to a second aspect of the present application, referring to Figure 3 The present disclosure provides a PCB board assembly. The PCB board assembly comprises the component 2 and the PCB board described above, and the component 2 is mounted on the connecting surface 11.

[0090] It can be understood that the electromagnetic shielding layer 3 is arranged adjacent to or spaced apart from the component 2, so that the electromagnetic shielding layer 3 can effectively shield and isolate electromagnetic interference signals (i.e., EMI signals), protect the PCB board from external EMI signals, and also avoid the PCB board from causing radiation interference to the outside. Moreover, the electromagnetic shielding layer 3 is laid on the connecting surface 11, does not affect the thickness of the component 2 on the PCB board body 1, i.e., does not affect the overall thickness of the PCB board on which the component 2 is connected, can avoid the volume of the PCB board from being too large, reduces the volume of the PCB board assembly, and is conducive to the miniaturization of electronic products.

[0091] According to a third aspect of the present application, the present disclosure provides an electronic product. The electronic product comprises the PCB board assembly described above.

[0092] It can be understood that the electromagnetic shielding layer 3 is arranged adjacent to or spaced apart from the component 2, so that the electromagnetic shielding layer 3 can effectively shield and isolate electromagnetic interference signals (i.e., EMI signals), protect the PCB board from external EMI signals, and also avoid the PCB board from causing radiation interference to the outside. Moreover, the electromagnetic shielding layer 3 is laid on the connecting surface 11, does not affect the thickness of the component 2 on the PCB board body 1, i.e., does not affect the overall thickness of the PCB board on which the component 2 is connected, can avoid the volume of the PCB board from being too large, reduces the volume of the PCB board assembly, and is conducive to the miniaturization of electronic products.

[0093] According to a fourth aspect of the present application, the present disclosure provides a vehicle. The vehicle comprises the electronic product described above.

[0094] It can be understood that the electromagnetic shielding layer 3 is adjacent to or spaced from the components 2, so that the electromagnetic shielding layer 3 can effectively shield and isolate the electromagnetic interference signals (i.e. EMI signals), protect the PCB from external EMI signals, and also avoid the PCB from causing radiation interference. The electromagnetic shielding layer 3 is laid on the connecting surface 11, and does not affect the thickness of the components 2 on the PCB body 1, i.e. does not affect the overall thickness of the PCB connected with the components 2, can avoid the PCB being too large, reduces the volume of the PCB assembly, and is beneficial to the miniaturization of electronic products.

[0095] In the description of the present application, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0096] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can refer to the related description of other embodiments.

[0097] The embodiments, implementation manners and related technical features of the present application can be combined, replaced with each other without conflict.

[0098] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Any simple modification, equivalent change and modification of the above embodiment based on the technical essence of the present application, without departing from the technical solution of the present application, still belongs to the scope of the technical solution of the present application.

Claims

1. A PCB board, characterized in that: include: The PCB body includes a connection surface for connecting components; An electromagnetic shielding layer is laid on the connection surface, and the electromagnetic shielding layer is adjacent to or spaced apart from the components.

2. The PCB board according to claim 1, characterized in that: A ground layer is formed on the connection surface, and the electromagnetic shielding layer is electrically connected to the ground layer.

3. The PCB board according to claim 2, characterized in that: The PCB board includes a first insulating layer, which is arranged between the ground layer and the electromagnetic shielding layer.

4. The PCB board according to claim 3, characterized in that: The first insulating layer is formed with a connection hole so that the electromagnetic shielding layer can be electrically connected to the ground layer.

5. The PCB board according to claim 4, characterized in that: The first insulating layer is formed with a plurality of the connection holes, wherein At least some of the connection holes are evenly distributed around the components; and / or, The connection surface is connected to at least two of the components, and the two components are connected via a connection line, and at least part of the connection holes are evenly distributed around the connection line.

6. The PCB board according to claim 4, characterized in that: The connection surface is provided with a mounting area, the mounting area is used to mount the components, and the electromagnetic shielding layer is adjacent to or spaced apart from the mounting area.

7. The PCB board according to claim 6, characterized in that: The first insulating layer is formed with a plurality of connection holes, and at least some of the connection holes are evenly distributed around the mounting area.

8. The PCB board according to any one of claims 1 to 7, characterized in that: The thickness of the electromagnetic shielding layer is between 0.03 mm and 0.07 mm.

9. The PCB board according to any one of claims 1 to 7, characterized in that: The PCB board further includes a wave absorbing layer, which is arranged on a side of the electromagnetic shielding layer away from the connecting surface, and is used for absorbing electromagnetic wave energy.

10. The PCB board according to claim 9, characterized in that: Along the thickness direction of the PCB board body, the height of the absorbing layer protruding from the connecting surface is smaller than the height of the component protruding from the connecting surface.

11. The PCB board according to claim 9, characterized in that: The thickness of the absorbing layer is between 0.1 mm and 0.3 mm; and / or, The absorbing frequency range of the absorbing layer is between 10 MHz and 10 GHz; and / or, The magnetic permeability of the wave absorbing layer is between 20H / m and 200H / m.

12. The PCB board according to claim 9, characterized in that: The PCB board further includes a second insulating layer, which is arranged on a side of the absorbing layer away from the electromagnetic shielding layer.

13. The PCB board according to claim 12, characterized in that: Along the thickness direction of the PCB board, the height of the second insulating layer protruding from the connection surface is smaller than the height of the component protruding from the connection surface.

14. A PCB board assembly, characterized in that: The method comprises components and a PCB board according to any one of claims 1 to 13, wherein the components are mounted on the connection surface.

15. An electronic product, characterized in that: Comprising the PCB board assembly as claimed in claim 14.

16. A vehicle, characterized in that: Comprising the electronic product as claimed in claim 15.

Images