Bottom filling glue packaging equipment for temperature compensation crystal processing
By introducing auxiliary heat baking and anti-precipitation mechanisms into the bottom filling glue packaging equipment, the problem of moisture affecting the solidification of the glue is solved, rapid solidification and prevention of precipitation and stratification are achieved, and processing efficiency and quality are improved.
Patent Information
- Application Number
- CN202422792919.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-15
AI Technical Summary
Existing bottom filling glue packaging equipment does not have an auxiliary heat drying function during use, which causes moisture to affect the solidification of the glue and form bubbles. In addition, the glue solidifies too slowly, affecting processing efficiency and speed.
A bottom filling glue packaging equipment was designed, which included an auxiliary thermal drying mechanism and an anti-precipitation mechanism. The thermal drying process was performed by the cooperation of a heating component and a fan, and the glue liquid was prevented from precipitation and stratification by a driving motor and a stirring frame.
It effectively prevents the formation of bubbles during the solidification process of the glue, improves the processing speed and efficiency, and ensures the quality of the glue and the stable operation of the equipment.
Smart Images

Figure CN223454521U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of warm compensation crystal processing, in particular to a bottom filling glue packaging equipment for warm compensation crystal processing. BACKGROUND
[0002] The warm compensation crystal refers to the crystal oscillator that keeps the output frequency in a certain precision range through compensation within a certain temperature range, so the bottom filling glue packaging equipment is needed during the assembly and processing.
[0003] Through the search, the chip glue sealing equipment of a kind of backlight source wafer with the announcement No. CN214848498U, including equipment bottom plate, side plate and moving plate, by research and analysis, found, although in the process of using thereby when sealing glue to wafer, two glue pipes can simultaneously seal glue to wafer, this can effectively replace manual operation, but, to a certain extent, there are still the following shortcomings.
[0004] For example: the existing bottom filling glue packaging equipment does not have the auxiliary hot baking function during use, cannot be assisted hot baking during use, which leads to the moisture in the material substrate before filling in the above-mentioned situation, and the glue solution solidifies slowly after filling, which will affect the overall processing efficiency and effect, the moisture on the material substrate will form bubbles in the glue strip after filling, and the slow solidification of the glue solution after filling will also affect the overall processing speed, in order to solve the above technical problems, therefore, we design a bottom filling glue packaging equipment for warm compensation crystal processing. UTILITY MODEL CONTENT
[0005] The utility model aims at providing a bottom filling glue packaging equipment for warm compensation crystal processing, which has the advantages of being able to heat the material before and after glue filling, and being able to prevent the glue from precipitating and stirring when used at a uniform speed, solving the problem that the existing bottom filling glue packaging equipment does not have the function of auxiliary hot baking and anti-precipitation during use.
[0006] To achieve the above object, the utility model provides following technical scheme: a kind of bottom filling glue packaging equipment for warm compensation crystal processing, including base plate, the top of the base plate is fixedly connected with main frame body, the right side of the top of main frame body is fixedly connected with glue bucket, the top of glue bucket is connected with anti-precipitation mechanism by bolt, the anti-precipitation mechanism includes drive motor, the bottom of the rear side of main frame body is fixedly connected with auxiliary hot drying mechanism, the auxiliary hot drying mechanism includes mounting seat, the top of main frame body is fixedly connected with first push rod, the output end of first push rod is fixedly connected with upper linear motor and is penetrated through main frame body, the bottom of upper linear motor is provided with lower linear motor, the bottom of lower linear motor is provided with glue injection assembly, the front side of the top of base plate is fixedly connected with controller.
[0007] Preferably, the front side of the mounting seat is fixedly connected with the main frame body, the rear side of the mounting seat is fixedly connected with a temperature control box, the top of the rear side of the mounting seat is fixedly connected with a second push rod on both sides, the output end of the second push rod is fixedly connected with an air outlet strip pipe and penetrates through the mounting seat, the rear side of the temperature control box is connected with a flat plate by bolts, the top of the rear side of the flat plate is fixedly connected with a heating assembly, the bottom of the rear side of the flat plate is fixedly connected with a fan on both sides, the bottom of the rear side of the flat plate is fixedly connected with a dustproof plate, the top of the temperature control box is connected with a gas delivery pipe, the bottom end of the gas delivery pipe is connected with the air outlet strip pipe, and the output end of the controller is electrically connected with the second push rod, the heating assembly, and the fan in one direction.
[0008] Preferably, the bottom of the drive motor is connected with the glue bucket by bolts, the output end of the drive motor penetrates into the inner cavity of the glue bucket and is fixedly connected with a main shaft, the surface of the main shaft is fixedly connected with a stirring frame group, the bottom of the surface of the main shaft is fixedly connected with a scraper group, the top of the inner cavity of the glue bucket is fixedly connected with a temperature sensor, the controller is bidirectionally electrically connected with the temperature sensor, and the output end of the controller is unidirectionally electrically connected with the drive motor.
[0009] Preferably, the bottom of the glue bucket is connected with a glue delivery valve pipe, the bottom end of the glue delivery valve pipe penetrates through the main frame body and is connected with the glue injection assembly, and the output end of the controller is unidirectionally electrically connected with the first push rod, the upper linear motor, the lower linear motor, and the glue delivery valve pipe.
[0010] Preferably, the top of the base plate is fixedly connected with a conveying assembly, the output end of the controller is unidirectionally electrically connected with the conveying assembly, the front side and the rear side of the bottom of the surface of the glue bucket are fixedly connected with reinforcing plates, and the bottom of the reinforcing plates is fixedly connected with the main frame body.
[0011] Preferably, the bottom of the base plate is fixedly connected with a support short column at four corners, and the rear side of the top of the base plate is provided with an adjusting fixed plate.
[0012] Compared with the prior art, the utility model have the advantages that:
[0013] 1, the utility model discloses the cooperation of mounting seat, temperature adjusting box, air outlet strip pipe, heating assembly and fan, possess auxiliary hot drying function, first through the controller start heating assembly and fan, heating assembly will heat the air in the temperature adjusting box, then will be blown out by the fan through the air outlet strip pipe, also will bring the outside air into the temperature adjusting box circulation step while the fan blows hot air, this mechanism can effectively carry out auxiliary hot drying, avoid the moisture on the material substrate to form the bubble after filling, also prevent the glue liquid solidification after filling too slow influence the overall processing speed.
[0014] 2, the utility model discloses the cooperation of drive motor, main shaft, stirring frame group, scraper group and temperature sensor, possess anti -precipitation function, first through the controller start drive motor, drive motor runs through main shaft and drives stirring frame group and scraper group rotation, and then agitates the glue liquid in the bucket, and temperature sensor will monitor the temperature situation in the bucket in real time, this mechanism can effectively carry out anti -precipitation stratification, can guarantee glue liquid filling still keeps the qualified state, avoids the glue liquid with precipitation or stratification and shoots, ensures the overall processing efficiency of equipment. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is the structure isometric drawing of the utility model;
[0016] Figure 2 It is the structure rear view isometric drawing of the utility model;
[0017] Figure 3 It is the structure right view isometric drawing of the utility model;
[0018] Figure 4 It is the auxiliary hot drying mechanism section view isometric drawing of the utility model;
[0019] Figure 5 It is the anti -precipitation mechanism section view isometric drawing of the utility model.
[0020] In the drawing: 1, base plate;2, main frame;3, glue bucket;4, anti -precipitation mechanism;5, auxiliary hot drying mechanism;6, first push rod;7, upper linear motor;8, lower linear motor;9, glue injection assembly;10, glue delivery valve pipe;11, conveying assembly;12, controller;13, mounting seat;14, temperature adjusting box;15, air outlet strip pipe;16, heating assembly;17, fan;18, drive motor;19, main shaft;20, stirring frame group;21, scraper group;22, temperature sensor. DETAILED DESCRIPTION
[0021] Please refer to Figures 1-5The utility model provides a kind of underfilling glue packaging equipment for warm compensation crystal processing, including base plate 1, the top of base plate 1 is fixedly connected with main frame 2, the right side of the top of main frame 2 is fixedly connected with glue barrel 3, the top of glue barrel 3 is connected with anti-precipitation mechanism 4 by bolt, anti-precipitation mechanism 4 includes driving motor 18, the bottom of the rear side of main frame 2 is fixedly connected with auxiliary hot drying mechanism 5, auxiliary hot drying mechanism 5 includes mounting seat 13, the top of main frame 2 is fixedly connected with first push rod 6, the output end of first push rod 6 is fixedly connected with upper linear motor 7 and is connected with upper linear motor 7 through main frame 2, the bottom of upper linear motor 7 is provided with lower linear motor 8, the bottom of lower linear motor 8 is provided with glue injection assembly 9, the front side of the top of base plate 1 is fixedly connected with controller 12.
[0022] Please refer to Figure 1 、 Figure 2 、 Figure 3 And Figure 4 , the front side of mounting seat 13 is fixedly connected with main frame 2, the rear side of mounting seat 13 is fixedly connected with temperature adjustment box 14, the two sides of the top of the rear side of mounting seat 13 are fixedly connected with second push rod, the output end of second push rod is fixedly connected with air outlet strip pipe 15 and is connected with air outlet strip pipe 15 through mounting seat 13, the rear side of temperature adjustment box 14 is connected with flat plate by bolt, the top of the rear side of flat plate is fixedly connected with heating assembly 16, the two sides of the bottom of the rear side of flat plate are fixedly connected with fan 17, the bottom of the rear side of flat plate is fixedly connected with dustproof plate, by setting dustproof plate, play the role of auxiliary, so as to prevent external dust and sundries etc. from being sucked into temperature adjustment box 14 by fan 17 when mechanism runs, so as to ensure the normal operation of mechanism, the top of temperature adjustment box 14 is communicated with gas delivery pipe, the bottom end of gas delivery pipe is communicated with air outlet strip pipe 15, the output end of controller 12 is unidirectionally electrically connected with second push rod, heating assembly 16 and fan 17 respectively.
[0023] Please refer to Figure 1 、 Figure 2 、 Figure 3 And Figure 5 , the bottom of driving motor 18 is connected with glue barrel 3 by bolt, the output end of driving motor 18 is fixedly connected with main shaft 19 and is connected with main shaft 19 through the inner cavity of glue barrel 3, the surface of main shaft 19 is fixedly connected with stirring frame group 20, the bottom of the surface of main shaft 19 is fixedly connected with scraper group 21, the top of the inner cavity of glue barrel 3 is fixedly connected with temperature sensor 22, controller 12 is bidirectionally electrically connected with temperature sensor 22, by setting temperature sensor 22, play the role of auxiliary monitoring, can monitor the temperature condition inside glue barrel 3 in real time, can timely feedback to staff and make corresponding measures, the output end of controller 12 is unidirectionally electrically connected with driving motor 18.
[0024] Please refer to Figure 1 、 Figure 2 And Figure 3The bottom of the glue bucket 3 is communicated with the glue feeding valve pipe 10, the bottom end of the glue feeding valve pipe 10 penetrates through the main frame 2 and is communicated with the glue injection assembly 9, the output end of the controller 12 is respectively unidirectionally electrically connected with the first push rod 6, the upper linear motor 7, the lower linear motor 8 and the glue feeding valve pipe 10, the first push rod 6 is arranged, plays an auxiliary role, so that the glue outlet part of the equipment can be randomly raised or lowered, the equipment can be more flexible, meanwhile, the glue outlet part can avoid interfering with the remaining assemblies.
[0025] Please refer to Figure 1 、 Figure 2 and Figure 3 The top of the base plate 1 is fixedly connected with the conveying assembly 11, the output end of the controller 12 is unidirectionally electrically connected with the conveying assembly 11, the front side and the rear side of the surface of the bottom of the glue bucket 3 are fixedly connected with the reinforcing plates, the reinforcing plates are arranged, play an auxiliary role, so that the installation firmness of the glue bucket 3 at the top can be strengthened, the glue bucket 3 can be prevented from shaking or falling, and the bottom of the reinforcing plate is fixedly connected with the main frame 2.
[0026] Please refer to Figure 1 、 Figure 2 and Figure 3 Figure 1 Figure 2 Figure 3 The four corners of the bottom of the base plate 1 are fixedly connected with the supporting short columns, the rear side of the top of the base plate 1 is provided with the adjusting fixed plate, the adjusting fixed plate is arranged, plays an auxiliary role of adjusting the fixed distance, so that the base of the equipment can be fixed with conveying assemblies 11 of different sizes, and the equipment can fill materials of different sizes.
[0027] In use, first, the controller 12 starts the conveying assembly 11 and places the prepared material and the substrate on the fixed groove on the surface of the conveying assembly 11. When the material moves to the position directly below the glue nozzle, the glue valve pipe 10 is started by the controller 12, and the first push rod 6, the upper linear motor 7 and the lower linear motor 8 are started respectively. The three cooperate to drive the glue injection assembly 9 to move along the set route. At the same time, the glue injection assembly 9 is started by the controller 12, and the glue liquid in the glue tank 3 enters the glue injection assembly 9 through the glue valve pipe 10 and is finally extruded and filled. In the processing process, the glue liquid in the glue tank 3 needs to be stirred to prevent sedimentation and stratification. First, the controller 12 starts the driving motor 18. The driving motor 18 drives the stirring frame group 20 and the scraper group 21 to rotate through the main shaft 19, thereby stirring the glue liquid in the tank. The temperature sensor 22 can monitor the temperature in the tank in real time. This mechanism can effectively prevent sedimentation and stratification, so as to ensure that the glue liquid still maintains a qualified state when filled, avoid the glue liquid with sediment or stratification being extruded and filled, and ensure the overall processing efficiency of the equipment, thereby completing the anti-settling treatment. Before or after filling each time, hot baking treatment is needed. First, the controller 12 starts the heating assembly 16 and the fan 17. The heating assembly 16 heats the air in the temperature adjusting box 14, which is then blown out by the fan 17 through the air outlet strip pipe 15. At the same time, the fan 17 blows hot air and also brings external air into the temperature adjusting box 14 for circulation. This mechanism can effectively assist in hot baking, avoid the moisture on the material substrate causing bubbles in the glue strip after filling, and prevent the glue liquid from solidifying too slowly after filling, thereby completing the auxiliary hot baking treatment.
[0028] In summary: the bottom filling glue packaging equipment for warm compensation crystal processing solves the problems that the existing bottom filling glue packaging equipment does not have auxiliary hot baking treatment and does not have anti-settling function in use by the cooperation of the mounting seat 13, the temperature adjusting box 14, the air outlet strip pipe 15, the heating assembly 16, the fan 17, the driving motor 18, the main shaft 19, the stirring frame group 20, the scraper group 21 and the temperature sensor 22.
Claims
1. A underfill encapsulation apparatus for warm compensation crystal processing, comprising a base plate (1), characterized in that: The top of the base plate (1) is fixedly connected with a main frame (2), the right side of the top of the main frame (2) is fixedly connected with a glue barrel (3), the top of the glue barrel (3) is connected with a anti-settling mechanism (4) through bolts, the anti-settling mechanism (4) comprises a driving motor (18), the bottom of the rear side of the main frame (2) is fixedly connected with an auxiliary hot drying mechanism (5), the auxiliary hot drying mechanism (5) comprises a mounting seat (13), the top of the main frame (2) is fixedly connected with a first push rod (6), the output end of the first push rod (6) penetrates through the main frame (2) and is fixedly connected with an upper linear motor (7), the bottom of the upper linear motor (7) is provided with a lower linear motor (8), the bottom of the lower linear motor (8) is provided with a glue injection assembly (9), and the front side of the top of the base plate (1) is fixedly connected with a controller (12).
2. The underfill encapsulation apparatus for warm-probe crystal processing of claim 1, wherein: The front side of the mounting seat (13) is fixedly connected with the main frame (2), the rear side of the mounting seat (13) is fixedly connected with a temperature adjusting box (14), and the two sides of the top of the rear side of the mounting seat (13) are fixedly connected with second push rods, the output ends of the second push rods penetrate through the mounting seat (13) and are fixedly connected with air outlet strip pipes (15), the rear side of the temperature adjusting box (14) is connected with a flat plate through bolts, the top of the rear side of the flat plate penetrates and is fixedly connected with a heating assembly (16), the two sides of the bottom of the rear side of the flat plate penetrate and are fixedly connected with fans (17), the bottom of the rear side of the flat plate is fixedly connected with a dustproof plate, the top of the temperature adjusting box (14) is communicated with a gas conveying pipe, the bottom end of the gas conveying pipe is communicated with the air outlet strip pipes (15), and the output end of the controller (12) is unidirectionally and electrically connected with the second push rods, the heating assembly (16) and the fans (17).
3. The underfill encapsulation apparatus for warm-probe crystal processing of claim 1, wherein: The bottom of the driving motor (18) is connected with the glue barrel (3) through bolts, the output end of the driving motor (18) penetrates into the inner cavity of the glue barrel (3) and is fixedly connected with a main shaft (19), the surface of the main shaft (19) penetrates and is fixedly connected with a stirring frame group (20), the bottom of the surface of the main shaft (19) penetrates and is fixedly connected with a scraper group (21), the top of the inner cavity of the glue barrel (3) is fixedly connected with a temperature sensor (22), the controller (12) is bidirectionally and electrically connected with the temperature sensor (22), and the output end of the controller (12) is unidirectionally and electrically connected with the driving motor (18).
4. The underfill encapsulation apparatus for warm-probing crystal processing of claim 1, wherein: The bottom of the glue barrel (3) is communicated with a glue conveying valve pipe (10), the bottom end of the glue conveying valve pipe (10) penetrates through the main frame (2) and is communicated with the glue injection assembly (9), and the output end of the controller (12) is unidirectionally and electrically connected with the first push rod (6), the upper linear motor (7), the lower linear motor (8) and the glue conveying valve pipe (10).
5. The underfill encapsulation apparatus for warm-probing crystal processing of claim 1, wherein: The top of the base plate (1) is fixedly connected with a conveying assembly (11), the output end of the controller (12) is unidirectionally and electrically connected with the conveying assembly (11), and the front side and the rear side of the bottom of the surface of the glue barrel (3) are fixedly connected with reinforcing plates, and the bottoms of the reinforcing plates are fixedly connected with the main frame (2).
6. The underfill encapsulation apparatus for warm-probe crystal processing of claim 1, wherein: The bottom of the base plate (1) is fixedly connected with support short columns at four corners, and the top of the base plate (1) is provided with an adjusting fixed plate at the rear side.
Citation Information
Patent Citations
Wafer glue sealing equipment for backlight source chip
CN214848498U