Cleaning device for wafer
The integrated wafer cleaning device solves the problems of low integration and difficult operation of sapphire wafer cleaning equipment in the existing technology, achieves efficient wafer cleaning and drying, and improves overall processing efficiency.
Patent Information
- Application Number
- CN202422769823.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-13
AI Technical Summary
In the prior art, sapphire wafer cleaning equipment has a low degree of integration, is difficult to operate, has unstable wafer storage, has low drying efficiency, and has low efficiency in pre-soaking and cleaning operations.
A highly integrated wafer cleaning device was designed, including a presetting mechanism, a pre-soaking mechanism, a cleaning mechanism, and a drying mechanism. It adopted an L-shaped layout and a waterproof ventilator. The sprinkler had switchable states. The ventilator duct was designed to increase the airflow velocity. An auxiliary placement mechanism was set to fix the grinding tools.
The integration and efficiency of the cleaning device are improved, the drying speed and overall processing speed of the wafer are increased, and the workload of the operator and the risk of wafer damage are reduced.
Smart Images
Figure CN223454701U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of wafer processing and handling, and in particular to a cleaning device for wafers. BACKGROUND
[0002] After the wafer is ground, the surface of the wafer needs to be cleaned. The wafer cleaning includes pre-foaming, cleaning and drying steps, and the wafer storage and the storage of the grinding equipment such as the star wheel after grinding are also involved in the whole process. In the prior art, there is no complete set of cleaning equipment with high integration degree. The operator often encounters operation difficulties, poor wafer storage, low drying efficiency, and low efficiency of pre-foaming and cleaning operation during the cleaning process of the wafer. CONTENT OF THE UTILITY MODEL
[0003] To solve the above problems, the present application provides a device for wafer cleaning with high integration degree.
[0004] To achieve the above purpose, the technical scheme adopted by the present application is as follows:
[0005] The present application provides a cleaning device for wafers, which is used for cleaning the wafers after grinding. The cleaning device comprises a preset mechanism, a pre-foaming mechanism, a cleaning mechanism and a drying mechanism. The preset mechanism comprises a plane or a groove-shaped space for placing the wafers. The pre-foaming mechanism is arranged on one side of the preset mechanism. The pre-foaming mechanism comprises a pre-foaming groove, and the bottom of the pre-foaming groove is provided with a pre-foaming drain. The cleaning mechanism is arranged on one side of the pre-foaming mechanism. The cleaning mechanism comprises a cleaning groove and a sprayer. The sprayer is arranged above the cleaning groove, and the bottom of the cleaning groove is provided with a cleaning drain. The drying mechanism is arranged on one side of the cleaning mechanism. The drying mechanism comprises a drying groove and a ventilator. The bottom of the drying groove is provided with a drying drain, and the ventilator is arranged below the drying drain in the height direction.
[0006] Further, the cleaning device further comprises a rack. The rack encloses a containing space. The preset mechanism is arranged in or above the containing space. At least part of the pre-foaming mechanism is arranged in the containing space. At least part of the cleaning mechanism is arranged in the containing space. At least part of the drying mechanism is arranged in the containing space.
[0007] Further, the rack is made of stainless steel.
[0008] Further, the preset mechanism and the pre-foaming mechanism are arranged along a first direction. The pre-foaming mechanism and the cleaning mechanism are arranged along a second direction. The first direction and the second direction are arranged perpendicularly.
[0009] Further, the cleaning device further comprises an auxiliary placing mechanism. The auxiliary placing mechanism is arranged on one side of the preset mechanism.
[0010] Further, the auxiliary placing mechanism comprises one of a hanging rack and a partitioned shelf.
[0011] Further, the ventilator is a waterproof ventilator.
[0012] Further, in the cleaning mechanism, the sprayer is arranged close to the pre-foaming mechanism, the sprayer comprises a first state capable of spraying water into the pre-foaming groove and a second state capable of spraying water into the cleaning groove, and the sprayer is capable of switching between the first state and the second state.
[0013] Further, the cleaning mechanism further comprises a cleaning support arranged in the cleaning groove, and the drying mechanism further comprises a drying support arranged in the drying groove.
[0014] Further, the ventilator comprises a pipeline and a fan capable of conveying airflow into the pipeline, the pipeline comprises large-diameter sections arranged at two ends and a small-diameter section arranged in the middle, the drying drainage port is connected to the small-diameter section, and the fan is arranged at one large-diameter section.
[0015] Therefore, the present application has the following beneficial effects:
[0016] 1. In the present application, the pre-setting mechanism, the pre-foaming mechanism, the cleaning mechanism and the drying mechanism are integrated, which not only improves the integration of the cleaning device, but also increases the efficiency of the cleaning process.
[0017] 2. In the present application, the drying mechanism comprising a ventilator is arranged, which can improve the drying efficiency, improve the speed of wafer flowing to the next processing procedure, and improve the overall speed of wafer processing. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 FIG. 1 is a structural schematic diagram of a cleaning device according to an embodiment of the present application;
[0019] Figure 2 FIG. 2 is a structural schematic diagram of a cleaning device according to another embodiment of the present application;
[0020] Figure 3 FIG. 3 is a sectional view of a pre-foaming mechanism, a cleaning mechanism and a drying mechanism combined according to an embodiment of the present application;
[0021] Figure 4 FIG. 4 is a sectional view of a drying mechanism according to an embodiment of the present application;
[0022] Figure 5 FIG. 5 is a top view of a cleaning device according to an embodiment of the present application;
[0023] Figure 6 FIG. 6 is a structural schematic diagram of a cleaning device according to a third embodiment of the present application;
[0024] Figure 7This is a cross-sectional schematic diagram of the combination of the pre-soaking mechanism, the cleaning mechanism, and the drying mechanism in another embodiment of the present application;
[0025] Figure 8 This is a cross-sectional schematic diagram of a drying mechanism in another embodiment of the present application;
[0026] Figure 9 for Figure 8 A magnified schematic diagram of the structure at center A.
[0027] In the figure: cleaning device 100, pre-setting mechanism 11, pre-soaking mechanism 12, pre-soaking tank 121, pre-soaking drain outlet 122, cleaning mechanism 13, cleaning tank 131, sprayer 132, cleaning drain outlet 133, cleaning bracket 134, drying mechanism 14, drying tank 141, ventilator 142, pipe 1421, large diameter section 1421a, small diameter section 1421b, fan 1422, drying drain outlet 143, drying bracket 144, rack 15, auxiliary placement mechanism 16, first direction 101, second direction 102. DETAILED DESCRIPTION
[0028] In order to enable those skilled in the art to better understand the solution of this application, the technical solution in the specific embodiment of this application will be clearly and completely described below in conjunction with the drawings in the embodiment of this application. In the description of this application, if a component has a central axis or a hollow cavity, the "inside" of the component refers to the side of the component close to the central axis of the component or arranged inside the hollow cavity; the "outside" of the component refers to the side of the component away from the central axis of the component or arranged outside the hollow cavity.
[0029] The present application provides an embodiment of Figures 1 to 3 The cleaning device 100 shown in FIG. 1 is used to clean wafers after grinding. The cleaning device 100 includes a pre-setting mechanism 11, a pre-soaking mechanism 12, a cleaning mechanism 13, and a drying mechanism 14. The pre-setting mechanism 11 is used to place the wafers to be processed. The pre-setting mechanism 11 can be as follows: Figure 1 The plane for placing the wafer shown is generally provided with a protective layer or protective coating that can prevent slipping and protect the wafer; the preset mechanism 11 can also be as follows Figure 2The groove-shaped space for placing the wafer can prevent the wafer from slipping and falling after the wafer is placed in the groove-shaped space, and ensures the safety of the wafer. The pre-foaming mechanism 12 is arranged on one side of the preset mechanism 11, and the pre-foaming mechanism 12 is arranged close to the preset mechanism 11, so as to facilitate the movement of the wafer placed in the preset mechanism 11 to the pre-foaming mechanism 12 for pre-foaming treatment. The pre-foaming mechanism 12 comprises a pre-foaming groove 121, and the bottom of the pre-foaming groove 121 is provided with a pre-foaming drain 122. The pre-foaming drain 122 can drain the waste liquid generated in the pre-foaming process in the pre-foaming groove 121 after the pre-foaming treatment is completed. The cleaning mechanism 13 is arranged on one side of the pre-foaming mechanism 12, and the cleaning mechanism 13 is arranged close to the pre-foaming mechanism 12, so as to reduce the distance of moving the wafer, improve the efficiency from the pre-foaming process to the cleaning process, and reduce the probability of damaging the wafer in the moving process. The cleaning mechanism 13 comprises a cleaning groove 131 and a sprayer 132, and the sprayer 132 is arranged above the cleaning groove 131. The sprayer 132 can spray cleaning liquid such as water to the cleaning groove 131 and the wafer placed in the cleaning groove 131, and the wafer cleaning work is mainly carried out in the cleaning groove 131. The bottom of the cleaning groove 131 is provided with a cleaning drain 133, which can facilitate the drainage of waste water in the cleaning groove 131 after the cleaning treatment is completed. The drying mechanism 14 is arranged on one side of the cleaning mechanism 13, and the drying mechanism 14 is arranged close to the cleaning mechanism 13, so as to place the wafer which is cleaned and preliminarily drained in the drying mechanism 14 for drying treatment as soon as possible, and also to carry out the cleaning treatment of the next group of wafers as soon as possible. The drying mechanism 14 comprises a drying groove 141 and a ventilator 142, and the bottom of the drying groove 141 is provided with a drying drain 143. The drying groove 141 can accommodate the wafer to be dried, and the drying groove 141 can also receive the water flowing or dripping from the wafer and drain it through the drying drain 143. The ventilator 142 can be arranged below the drying drain 143, and the ventilator 142 can increase the air flow through the surface of the wafer, and the air flow can carry away the moisture on the surface of the wafer or increase the evaporation of the moisture on the surface of the wafer, thereby achieving the purpose of drying the wafer. The ventilator 142 is installed below the drying drain 143, which can avoid the influence on the wafer taking and placing due to the installation of the ventilator 142 in the drying groove 141 or above the drying groove 141, and improve the convenience of taking and placing the wafer from the drying groove 141. Figure 4 The ventilator 142 is arranged below the drying drain 143, which can increase the air flow through the surface of the wafer, and the air flow can carry away the moisture on the surface of the wafer or increase the evaporation of the moisture on the surface of the wafer, thereby achieving the purpose of drying the wafer. The ventilator 142 is installed below the drying drain 143, which can avoid the influence on the wafer taking and placing due to the installation of the ventilator 142 in the drying groove 141 or above the drying groove 141, and improve the convenience of taking and placing the wafer from the drying groove 141.
[0030] As an optional implementation, the cleaning device 100 further comprises a rack 15, which encloses a containing space. The rack 15 constitutes the main frame of the cleaning device 100, and carries and supports the preset mechanism 11, the pre-foaming mechanism 12, the cleaning mechanism 13, the drying mechanism 14 and other mechanisms in the cleaning device 100, and also carries the wafers and the pre-foaming liquid and the cleaning liquid in the wafer cleaning process. The rack 15 encloses a containing space as a whole, which can accommodate and accommodate the above-mentioned mechanisms. The preset mechanism 11 can be arranged in the containing space or arranged on the upper surface of the rack 15, as long as the wafer can be easily taken out and placed in the preset mechanism 11 and the wafer will not slide or fall from the preset mechanism 11. Specifically, when the preset mechanism 11 is a placement plane, the preset mechanism 11 is arranged on the upper surface of the rack 15. When the preset mechanism 11 is a groove-shaped space, at least part of the preset mechanism 11 is arranged in the containing space. The pre-foaming mechanism 12, the cleaning mechanism 13 and the drying mechanism 14 all comprise a groove-shaped structure, so at least part of the pre-foaming mechanism 12, the cleaning mechanism 13 and the drying mechanism 14 are arranged in the containing space. Specifically, the pre-foaming groove 121 in the pre-foaming mechanism 12, the cleaning groove 131 in the cleaning mechanism 13 and the drying groove 141 in the drying mechanism 14 are arranged in the containing space. Arranging the above-mentioned groove-shaped structure in the containing space can also improve the stability of the corresponding mechanism.
[0031] As an optional implementation, the rack 15 is made of stainless steel. Stainless steel has high mechanical strength and can meet the production requirements. At the same time, stainless steel has good corrosion resistance and can be used in the wafer cleaning and processing environment to ensure a longer service life of the rack 15.
[0032] As an optional implementation, as shown in Figure 5 The preset mechanism 11 and the pre-foaming mechanism 12 are arranged along a first direction 101, the pre-foaming mechanism 12 and the cleaning mechanism 13 are arranged along a second direction 102, and the first direction 101 and the second direction 102 are arranged substantially perpendicular to each other. Specifically, the preset mechanism 11, the pre-foaming mechanism 12 and the cleaning mechanism 13 are arranged in an L shape. This arrangement can reduce the overall length of the cleaning device 100, and also can reduce the distance of the operator transferring the wafer between the preset mechanism 11, the pre-foaming mechanism 12 and the cleaning mechanism 13 by using the L-shaped layout, reduce the activity range of the operator, reduce the workload of the operator, and improve the efficiency of transferring or circulating the wafer.
[0033] As an optional implementation, as shown in Figure 6As shown, the cleaning device 100 further comprises an auxiliary placement mechanism 16, which is arranged at one side of the pre-placing mechanism 11. During the polishing process of the wafer, a polishing tool such as a star wheel is needed. In the prior art, there is no special placement mechanism for storing the polishing tool used during polishing when the wafer is cleaned, and the polishing tool is not placed in a standard manner, which can cause damage or loss. The auxiliary placement mechanism 16 for storing the polishing tool can provide a fixed and secure placement position for the polishing tool.
[0034] As an optional embodiment, the auxiliary placement mechanism 16 comprises one of a hanging rack or a partitioned rack. The auxiliary placement mechanism 16 can be a hanging rack for hanging a polishing tool such as a star wheel, or a partitioned rack for partitioning and inserting a plurality of polishing tools such as star wheels.
[0035] As an optional embodiment, the ventilator 142 is a waterproof ventilator. The use of a waterproof ventilator ensures that the ventilator 142 can be used in an environment with high humidity or splashing water, and ensures that the ventilator 142 has a long service life.
[0036] As an optional embodiment, in the cleaning mechanism 13, the sprayer 132 is arranged close to the pre-foaming mechanism 12, the sprayer 132 comprises a first state capable of spraying water into the pre-foaming groove 121 and a second state capable of spraying water into the cleaning groove 131, and the sprayer 132 can be switched between the first state and the second state. Arranging the sprayer 132 close to the pre-foaming mechanism 12, or arranging the sprayer 132 between the pre-foaming mechanism 12 and the cleaning mechanism 13, can not only water the pre-foaming mechanism 12, but also spray water to the cleaning mechanism 13 and the wafer in the cleaning mechanism 13, thereby improving the use efficiency of the sprayer 132 and reducing the number of sprayers arranged in the cleaning device.
[0037] As an optional embodiment, as shown in Figure 7 The cleaning mechanism 13 further comprises a cleaning support 134 arranged in the cleaning groove 131. Arranging the cleaning support 134 in the cleaning mechanism 13 can better fix the wafer and avoid disordered movement of the wafer during cleaning, thereby avoiding problems such as bumping of the wafer during cleaning.
[0038] As an optional embodiment, as shown in Figure 7 The drying mechanism 14 further comprises a drying support 144 arranged in the drying groove 141. Arranging the drying support 144 in the drying mechanism 14 can better fix the wafer and also control the relative position and spacing between the wafers during drying, thereby improving the efficiency of drying.
[0039] As an optional embodiment, as shown inFigure 8 As shown, the ventilator 142 includes a duct 1421 and a fan 1422 for delivering air flow into the duct 1421, the duct 1421 includes a large-diameter section 1421a arranged at both ends and a small-diameter section 1421b arranged in the middle, the dry drainage port 143 is communicated to the small-diameter section 1421b, and the fan 1422 is arranged at one large-diameter section 1421a. The duct 1421 in the ventilator 142 has a shape of a middle part with a small diameter and both end parts with a large diameter, when the fan 1422 arranged at the large-diameter section 1421a delivers air flow into the duct 1421, the air flow first passes through the large-diameter section 1421a, then passes through the small-diameter section 1421b, and finally is discharged through the large-diameter section 1421a. In this process, the air flow passing through the small-diameter section 1421b has a large flow rate, which can increase the fluid flow rate of the dry drainage port 143 communicated to the small-diameter section 1421b. In this way, on the one hand, the discharge speed of the water dripping from the wafer surface in the drying tank 141 can be increased, and on the other hand, the speed of the air flow from the dry drainage port can be increased, further increasing the speed of the air flow flowing through the drying tank 141, and increasing the speed of the air flow flowing through the wafer surface, accelerating the drying speed of the wafer and improving the wafer drying efficiency. In addition, the fan 1422 in the ventilator 142 is arranged in the large-diameter section 1421a at one end of the duct 1421, so that the water discharged from the dry drainage port 143 will not directly contact or invade the fan 1422, which can improve the safety and service life of the fan 1422. Even a common fan 1422 with a lower cost can be used.
[0040] The cleaning device 100 in the embodiment of the present application integrates the preset mechanism 11, the pre-foaming mechanism 12, the cleaning mechanism 13 and the drying mechanism 14 into one device, in which the cleaning work of the ground wafer can be efficiently and conveniently realized, and the wafer cleaning efficiency can be improved. In the embodiment of the present application, the ventilator 142 is arranged in the drying mechanism 14, which can increase the speed of the air flow flowing from the wafer surface, and improve the drying efficiency.
[0041] Finally, it should be noted that the above is only some preferred embodiments of the present application, and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A cleaning apparatus (100) for a wafer for cleaning a ground wafer, characterized by, Comprising a preposition mechanism (11) comprising a plane or a slot-shaped space for placing a wafer; a pre-bubble mechanism (12) arranged on one side of the preposition mechanism (11), the pre-bubble mechanism (12) comprising a pre-bubble slot (121), the bottom of the pre-bubble slot (121) being provided with a pre-bubble drain (122); a cleaning mechanism (13) arranged on one side of the pre-bubble mechanism (12), the cleaning mechanism (13) comprising a cleaning slot (131) and a sprayer (132), the sprayer (132) being arranged above the cleaning slot (131), the bottom of the cleaning slot (131) being provided with a cleaning drain (133); and a drying mechanism (14) arranged on one side of the cleaning mechanism (13), the drying mechanism (14) comprising a drying slot (141) and a ventilator (142), the bottom of the drying slot (141) being provided with a drying drain (143), the ventilator (142) being arranged below the drying drain (143) in the height direction.
2. The cleaning device (100) according to claim 1, characterized in that: the cleaning device (100) further comprises a rack (15) which encloses a containing space, the preposition mechanism (11) is arranged in or above the containing space, at least part of the pre-bubble mechanism (12) is arranged in the containing space, at least part of the cleaning mechanism (13) is arranged in the containing space, and at least part of the drying mechanism (14) is arranged in the containing space.
3. The cleaning device (100) according to claim 2, characterized in that: the rack (15) is made of stainless steel.
4. The cleaning device (100) according to claim 1, characterized in that: the preposition mechanism (11) and the pre-bubble mechanism (12) are arranged along a first direction (101), the pre-bubble mechanism (12) and the cleaning mechanism (13) are arranged along a second direction (102), and the first direction (101) and the second direction (102) are arranged perpendicularly.
5. The cleaning device (100) according to claim 1, characterized in that: the cleaning device (100) further comprises an auxiliary placement mechanism (16) arranged on one side of the preposition mechanism (11).
6. The cleaning device (100) according to claim 5, characterized in that: the auxiliary placement mechanism (16) comprises one of a hanging rack or a partitioned storage rack.
7. The cleaning device (100) according to claim 1, characterized in that: the ventilator (142) is a waterproof ventilator.
8. The cleaning device (100) according to claim 1, characterized in that: The cleaning mechanism (13) is provided with a sprayer (132) near the pre-foaming mechanism (12), the sprayer (132) comprises a first state capable of spraying water into the pre-foaming groove (121) and a second state capable of spraying water into the cleaning groove (131), and the sprayer (132) can be switched between the first state and the second state.
9. The cleaning device (100) according to claim 1, characterized in that: The cleaning mechanism (13) further comprises a cleaning support (134) arranged in the cleaning groove (131), and the drying mechanism (14) further comprises a drying support (144) arranged in the drying groove (141).
10. The cleaning device (100) according to claim 1, characterized in that: The ventilator (142) comprises a duct (1421) and a fan (1422) for conveying air flow into the duct (1421), the duct (1421) comprises a large-diameter section (1421a) arranged at both ends and a small-diameter section (1421b) arranged in the middle, the drying water outlet (143) is communicated to the small-diameter section (1421b), and the fan (1422) is arranged at one of the large-diameter sections (1421a).