External dust removal device for electronic chip packaging

Abstract

The utility model discloses an external dust removal device for electronic chip packaging in the technical field of chips, which comprises a dust hood, one end of the dust hood is provided with a working barrel, the inner wall of the working barrel is provided with a storage inner cavity, and the inner wall of the top end of the storage inner cavity is fixedly connected with a negative pressure dust collection motor. The output end of the negative pressure dust collection motor is fixedly connected with a connecting hose, the end, away from the negative pressure dust collection motor, of the connecting hose is fixedly connected with the side wall of one side of the dust collection cover in a penetrating mode, and a dust collection inner cavity is formed in the inner wall of the dust collection cover and penetrates towards the bottom. And the inner wall of the bottom end of the dust collection inner cavity is fixedly connected with a separation net. The dust collection cover can be fixed to an electronic chip packaging area through cooperation of the fixing lugs and the bolts, when the negative pressure dust collection motor is matched with the connecting hose and the dust collection cover to package the electronic chip, floating chippings are adsorbed, and therefore the cleanliness of the electronic chip in the packaging process is achieved, and the packaging effect and the yield of the electronic chip are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip technical field, concretely is a dust removal device is connected externally for electronic chip packaging. BACKGROUND

[0002] Packaging is the process of assembling integrated circuits into chip final products, simply speaking, it is that the integrated circuit bare chip produced by the foundry is placed on a substrate which plays a bearing role, the pin is led out, and then fixed and packaged into a whole.

[0003] When the electronic chip is packaged, a large amount of planktonic debris will be generated in the working area with the working of the processing equipment, so that the packaging environment of the electronic chip is destroyed, the packaging effect of the electronic chip and the yield of the electronic chip are reduced. UTILITY MODEL CONTENT

[0004] The utility model discloses a dust removal device is connected externally for electronic chip packaging, and the dust cover can be fixed to the electronic chip packaging area through the fixed lug cooperation bolt, and the negative pressure dust collection motor is connected with the dust cover and the connecting hose, so that planktonic debris is adsorbed when the electronic chip is packaged, so that the cleanliness of the electronic chip packaging is achieved, the packaging effect of the electronic chip is improved, and the yield of the electronic chip is improved, so as to solve the problem that a large amount of planktonic debris is generated in the working area with the working of the processing equipment when the electronic chip is packaged, so that the packaging environment of the electronic chip is destroyed, the packaging effect of the electronic chip and the yield of the electronic chip are reduced.

[0005] In order to achieve the above object, the utility model provides the following technical scheme: a dust removal device is connected externally for electronic chip packaging, including dust cover, one end of dust cover is provided with working bucket, the inner wall of working bucket is opened and is provided with storage inner chamber, the top inner wall of storage inner chamber is fixedly connected with negative pressure dust collection motor, the output of negative pressure dust collection motor is fixedly connected with connecting hose, one end of connecting hose is fixedly connected with the side wall of dust cover side and penetrates, the inner wall of dust cover is opened and is provided with dust collection inner chamber, the dust collection inner chamber is opened and is provided with the bottom, and the bottom inner wall of dust collection inner chamber is fixedly connected with isolation net.

[0006] As a further scheme of the utility model: the bottom of both sides of dust cover is fixedly connected with fixed block, and the top of a plurality of fixed lugs is penetrated and is connected with connecting bolt.

[0007] As a further scheme of the utility model: the outer wall of both ends of connecting hose is fixedly connected with sealing flange, and both ends of connecting hose are fixedly connected with dust cover and working bucket through sealing flange.

[0008] As a further scheme of the utility model: the storage inner cavity is located at the bottom end of the negative pressure dust collection motor and is connected with the dust accumulation drawer through the penetration of the movable connection.

[0009] As a further scheme of the utility model: the working bucket is provided with a power connection port on the outer wall of the top end of the dust accumulation drawer.

[0010] As a further scheme of the utility model: the bottom end of the working bucket is fixedly connected with a fixed flange.

[0011] Compared with the prior art, the utility model has the beneficial effects that: in the utility model, the dust cover can be fixed to the electronic chip packaging area through the fixed lug and the bolt, and the negative pressure dust collection motor is connected with the hose and the dust cover, so that the floating debris is adsorbed when the electronic chip is packaged, thereby achieving the cleanliness of the electronic chip packaging, improving the packaging effect of the electronic chip and the yield of the electronic chip. BRIEF DESCRIPTION OF DRAWINGS

[0012] Fig. 1 It is a front view structural schematic diagram of the utility model of an external dust removal device for electronic chip packaging.

[0013] Fig. 2 It is a sectional view structural schematic diagram of the dust cover in the utility model of an external dust removal device for electronic chip packaging.

[0014] Fig. 3 It is a partial sectional view structural schematic diagram of the working bucket in the utility model of an external dust removal device for electronic chip packaging.

[0015] Fig. 4 It is an external dust removal device for electronic chip packaging. Fig. 3 It is an enlarged schematic diagram of the structure at A in the utility model.

[0016] In the figure: 1, dust cover; 2, fixed block; 3, fixed lug; 4, connecting hose; 5, sealing flange; 6, working bucket; 7, power connection port; 8, dust accumulation drawer; 9, fixed flange; 10, dust collection inner cavity; 11, isolation net; 12, negative pressure dust collection motor; 13, storage inner cavity. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0018] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally a class, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0019] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0020] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "setting" should be understood broadly, for example, it can be fixedly connected, set, or detachably connected, set, or integrally connected, set. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0021] Please refer to Figs. 1-4 In the embodiment of the present application, an external dust removal device for electronic chip packaging includes a dust suction cover 1, one end of the dust suction cover 1 is provided with a working bucket 6, an inner wall of the working bucket 6 is provided with a storage inner cavity 13, a top end inner wall of the storage inner cavity 13 is fixedly connected with a negative pressure dust suction motor 12, an output end of the negative pressure dust suction motor 12 is fixedly connected with a connecting hose 4, one end of the connecting hose 4 away from the negative pressure dust suction motor 12 is fixedly connected with the side wall of one side of the dust suction cover 1, an inner wall of the dust suction cover 1 is provided with a dust suction inner cavity 10, the dust suction inner cavity 10 is provided with a bottom end, and a bottom end inner wall of the dust suction inner cavity 10 is fixedly connected with a separation net 11.

[0022] Preferably, in the present embodiment, the width and length dimensions of the dust suction cover 1 can be adjusted according to the actual size of the electronic chip packaging equipment, while ensuring that the dust suction cover can be installed on the packaging equipment during electronic packaging operation, the optimal dust suction effect can be achieved.

[0023] The bottom of the dust cover 1 is fixedly connected with a fixed block 2, and the two fixed blocks 2 are fixedly connected with a plurality of fixed ears 3 away from the bottom end side wall of the dust cover 1, and the top of the plurality of fixed ears 3 is penetrated by a connecting bolt.

[0024] Preferably, in the embodiment, the device is externally connected to the electronic chip packaging device through the fixed ear 3 during work, so as to adapt to more working environments.

[0025] The outer wall of the two ends of the connecting hose 4 is fixedly connected with a sealing flange 5, and the two ends of the connecting hose 4 are fixedly connected with the dust cover 1 and the working bucket 6 through the sealing flange 5.

[0026] The storage cavity 13 is located at the bottom end of the negative pressure dust collection motor 12 and is fixedly connected with a dust drawer 8.

[0027] The outer wall of the top end of the working bucket 6 is provided with a power connection port 7.

[0028] The bottom end of the working bucket 6 is fixedly connected with a fixed flange 9.

[0029] It should be noted that in this paper, the term "including", "containing" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitation, the element defined by the sentence "including a" does not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the method and device in the embodiments of the present application is not limited to the order of functions shown or discussed, but can also include functions performed in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method can be performed in an order different from the described order, and various steps can also be added, omitted or combined. In addition, the features described with reference to certain examples can be combined in other examples.

[0030] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above-mentioned specific embodiments, and the above-mentioned specific embodiments are only illustrative, not restrictive, and those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims.

Claims

1. An external dust removal device for electronic chip packaging, comprising a dust suction hood (1), characterized in that: One end of the dust cover (1) is provided with a working bucket (6), the inner wall of the working bucket (6) is provided with a storage cavity (13), the top end inner wall of the storage cavity (13) is fixedly connected with a negative pressure dust collection motor (12), the output end of the negative pressure dust collection motor (12) is fixedly connected with a connecting hose (4), one end of the connecting hose (4) away from the negative pressure dust collection motor (12) is fixedly connected with the side wall of one side of the dust cover (1), the inner wall of the dust cover (1) is provided with a dust collection cavity (10), the dust collection cavity (10) is provided through the bottom, the bottom end inner wall of the dust collection cavity (10) is fixedly connected with a isolation net (11), the bottom of both sides of the dust cover (1) is fixedly connected with a fixed block (2), the two fixed blocks (2) are respectively fixedly connected with a plurality of fixed ears (3) away from the bottom side wall of both sides of the dust cover (1), the top of the plurality of fixed ears (3) is fixedly connected with a connecting bolt.

2. The external dust removing device for an electronic chip package according to claim 1, wherein: Both ends of the connecting hose (4) are fixedly connected with a sealing flange (5), both ends of the connecting hose (4) are fixedly connected with the dust cover (1) and the working bucket (6) through the sealing flange (5).

3. The external dust removing device for an electronic chip package according to claim 1, wherein: The storage cavity (13) is located at the bottom end of the negative pressure dust collection motor (12) and is fixedly connected with a dust drawer (8).

4. The external dust removing device for an electronic chip package according to claim 1, wherein: The outer wall of the working bucket (6) at the top end of the dust drawer (8) is provided with a power connection port (7).

5. The external dust removing device for an electronic chip package according to claim 1, wherein: The bottom outer wall of the working bucket (6) is fixedly connected with a fixed flange (9).

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