Electroplating edge control device

Abstract

The utility model provides an electroplating edge control device which comprises a diffuser, a guide vane and a driving assembly, the guide vane is driven by the driving assembly to move on a circulating part of the diffuser, and part of the circulating part can be sealed and covered in the direction from the edge to the center or part of the circulating part can be opened in the direction from the center to the edge through the guide vane. Therefore, the flow of the electroplating liquid passing through the circulation part is adjusted, certain influence is exerted on the flow guide of the electroplating liquid, the edge electric field effect of the electroplating cavity is changed, and the electroplating thickness and the overall uniformity of the wafer edge are controlled. Therefore, according to the design of the device, the flow control of the electroplating liquid can be realized without stopping the equipment to modify the flow guide ring, so that the control on the electroplating thickness of the wafer is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor equipment technical field, especially a kind of electroplating edge control device. BACKGROUND

[0002] In the manufacturing process of semiconductor devices, the plating thickness at the edge of the wafer needs to be controlled, and uniform plating material coverage on the thin seed layer is achieved, while a device suitable for plating wafers is designed. The current plating control method is to use multiple fixed-size flow guides to control the flow of plating solution according to different process requirements. Considering that the size of the flow guide is fixed, if adjustment is needed, the equipment needs to be stopped to modify the flow guide, which undoubtedly increases the workload and difficulty. SUMMARY

[0003] The utility model aims to provide a kind of electroplating edge control device, can realize the flow control of plating solution without stopping the equipment to modify the flow guide.

[0004] To solve the above technical problems, the utility model provides an electroplating edge control device, which comprises:

[0005] A diffuser having a flow passage for the plating solution to pass through;

[0006] A flow guide vane attached to the diffuser;

[0007] A drive assembly connected to the flow guide vane for moving the flow guide vane closer to or away from the center of the flow passage from the outer edge of the flow passage.

[0008] Optionally, the drive assembly includes a movable member, a first assembly structure and a second assembly structure. The movable member can rotate around the center line of the flow passage. The flow guide vane is movably connected to the diffuser through the second assembly structure, and the moving direction extends through the center line of the flow passage. The first assembly structure connects the movable member and the flow guide vane, and converts the rotational motion of the movable member into the moving motion of the flow guide vane.

[0009] Optionally, the first assembly structure includes a first protrusion and a first sliding groove. The first protrusion can move in the first sliding groove. The extension direction of the first sliding groove is arranged at an angle with the moving direction of the flow guide vane. One of the first protrusion and the first sliding groove is arranged on the movable member, and the other is arranged on the flow guide vane.

[0010] Optionally, the second assembly structure comprises a second protruding part and a second sliding groove, the second protruding part is movable in the second sliding groove, the extension direction of the second sliding groove passes through the center line of the flow-through part, one of the second protruding part and the second sliding groove is arranged on the diffuser, and the other is arranged on the guide vane.

[0011] Optionally, the first assembly structure and the second assembly structure are arranged staggeredly around the center line of the flow-through part.

[0012] Optionally, the extension direction of the first sliding groove is parallel to the plane of the flow-through part, the extension direction of the second sliding groove is parallel to the plane of the flow-through part, the distance between the end of the first sliding groove close to the flow-through part and the end of the second sliding groove close to the flow-through part is greater than the distance between the end of the first sliding groove away from the flow-through part and the end of the second sliding groove away from the flow-through part.

[0013] Optionally, the driving assembly further comprises a servo motor connected with the movable part.

[0014] Optionally, the electroplating edge control device comprises a plurality of the guide vanes, the guide vanes are distributed circumferentially around the center line of the flow-through part, the driving assembly comprises a plurality of the movable parts, a plurality of the first assembly structures and a plurality of the second assembly structures, and the guide vanes, the movable parts, the first assembly structures and the second assembly structures are in one-to-one correspondence.

[0015] Optionally, the plurality of the movable parts are integrally formed as a movable ring.

[0016] Optionally, one side of the guide vane towards the center of the flow-through part is arc-shaped.

[0017] Optionally, the flow-through part comprises a plurality of uniformly distributed flow-through holes.

[0018] In conclusion, in the electroplating edge control device, the movement of the guide vanes on the flow-through part is driven by the driving assembly, the flow-through part is capped from the edge to the center by the guide vanes, or the flow-through part is opened from the center to the edge by the guide vanes, so as to adjust the flow size of the electroplating liquid through the flow-through part and exert a certain influence on the flow of the electroplating liquid, and then change the edge field effect of the electroplating cavity and control the electroplating thickness and overall uniformity of the wafer edge. In this way, the design of the device can realize the flow control of the electroplating liquid without stopping the equipment to reform the guide ring, thereby realizing the control of the electroplating thickness of the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0019] Those skilled in the art should understand that the provided drawings are used to better understand the present application, and do not constitute any limitation on the scope of the present application. Among them:

[0020] Figure 1 is a schematic diagram of the electroplating edge control device of an embodiment of the present application;

[0021] Figure 2 is a top view and a front view of the diffuser of an embodiment of the present application;

[0022] Figure 3 is a schematic diagram of the electroplating edge control device, wafer and electroplating cavity of an embodiment of the present application;

[0023] Figure 4 is another schematic diagram of the electroplating edge control device, wafer and electroplating cavity of an embodiment of the present application;

[0024] Figure 5 is a schematic diagram of the guide vane after moving close to the center of the flow-through part of an embodiment of the present application;

[0025] Figure 6 is a schematic diagram of the guide vane after moving away from the center of the flow-through part of an embodiment of the present application

[0026] Figure 7 is a top view and a front view of the guide vane of an embodiment of the present application;

[0027] Figure 8 is a top view and a front view of the movable ring of an embodiment of the present application. DETAILED DESCRIPTION

[0028] In order to make the purpose, advantages and characteristics of the present application clearer, the present application will be further described in detail below in combination with the drawings and specific embodiments. It should be noted that the drawings are all very simplified and not drawn to scale, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present application. In addition, the structures shown in the drawings are often part of the actual structures. In particular, the emphasis shown in each drawing is different, and sometimes different scales are used.

[0029] As used in the present application, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. The term "or" is generally employed in its sense including "and / or" unless the context clearly dictates otherwise. The term "at least two" is generally employed in its sense including "two or more" unless the context clearly dictates otherwise. In addition, the terms "first," "second," "third," etc. are used only to describe different instances and do not imply or suggest a relative importance or an implied indication of the number of the technical features indicated. Thus, the features defined with "first," "second," "third" can explicitly or implicitly include one or at least two of the features. The terms "one end" and "the other end" and "proximal end" and "distal end" generally refer to the two parts corresponding to each other, which not only includes the end points, and the terms "mounting," "connecting," and "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship between two elements. In addition, as used in the present application, a component disposed in another component generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two components, and the connection, coupling, cooperation or transmission between the two components can be direct or indirect through an intermediate component, and cannot be understood as indicating or suggesting the spatial positional relationship between the two components, i.e. one component can be in any orientation inside, outside, above, below or one side of another component, unless the context clearly indicates otherwise. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] Referring to Figures 1 to 4 , the utility model exemplarily provides a kind of electroplating edge control device, including diffuser 10, guide vane 20 and drive assembly 30, diffuser 10 is arranged on electroplating cavity 40, electroplating cavity 40 contains electroplating solution, electroplating cavity 40 has the flow-through portion 11 ( Figure 2 It is shown) for electroplating solution to pass through, flow-through portion 11 is like round area.Electroplating solution is guided to wafer 50 after passing through flow-through portion 11 and is electroplated.Guide vane 20 is arranged on diffuser 10 and is located the outer edge of flow-through portion 11, specifically can be arranged on the side of diffuser 10 away from electroplating cavity 40, drive assembly 30 is connected with guide vane 20, drive assembly 30 can drive guide vane 20 to move relative to diffuser 10, to realize that guide vane 20 moves from the outer edge of flow-through portion 11 to the center of flow-through portion 11.

[0031] In this way, the movement of guide vane 20 on flow-through portion 11 can be closed part of flow-through portion 11 ( Figure 5The edge portion of the flow-through portion does not pass the electroplating solution, or the direction from the center to the edge opens the flow-through portion 11 Figure 6 Thus, the flow rate of the electroplating solution passing through the flow-through portion 11 and the flow guiding of the electroplating solution can be adjusted, and the edge field effect of the electroplating cavity 40 can be changed, so as to control the electroplating thickness and the overall uniformity of the wafer 50 edge. Thus, the flow rate of the electroplating solution can be controlled without stopping the equipment and modifying the flow guide ring, so as to control the electroplating thickness of the wafer 50.

[0032] In an embodiment, the flow-through portion 11 includes a plurality of uniformly distributed flow-through holes (not shown), the axial direction of the flow-through holes is perpendicular to the plane of the flow-through portion 11, and the flow guide blades 20 move to close or open some of the flow-through holes.

[0033] Further, referring to Figure 5 and Figure 6 , the plurality of flow guide blades 20 are circumferentially arranged around the center line of the flow-through portion 11, and preferably, the plurality of flow guide blades 20 are circumferentially and uniformly arranged around the center line of the flow-through portion 11. The driving assembly 30 drives all the flow guide blades 20 to move synchronously, that is, to move towards or away from the center of the flow-through portion 11 at the same time. Thus, the area of the flow-through portion 11 through which the electroplating solution passes can be further controlled, and the flow guiding and flow direction of the electroplating solution can be further controlled, so as to further ensure the uniformity of the electroplating thickness of the wafer 50.

[0034] Further, continuing to refer to Figure 1 , the driving assembly 30 includes a movable member 310, a first assembly structure 32, and a second assembly structure 33. The movable member 310 is rotatable around the center line of the flow-through portion 11. The flow guide blades 20 are movably connected to the diffuser 10 through the second assembly structure 33, and the moving direction extends through the center line of the flow-through portion 11, that is, the flow guide blades 20 are moved relative to the diffuser 10 through the second assembly structure 33, and the second assembly structure limits the moving direction of the flow guide blades 20. The movable member 310 is connected to the flow guide blades 20 through the first assembly structure 32, and the first assembly structure 32 converts the rotating movement of the movable member 310 into the moving movement of the flow guide blades 20, that is, the first assembly structure 32 converts the driving force generated by the rotating of the movable member 310 into the driving force required by the moving of the flow guide blades 20. Thus, by controlling the rotation of the movable member 310 and the cooperation of the first assembly structure 32 and the second assembly structure 33, the movement of the flow guide blades 20 can be controlled. For example, referring to Figure 5 , the movable member 310 is controlled to rotate counterclockwise, so as to move the flow guide blades 20 towards the center of the flow-through portion 11, thereby closing a part of the flow-through portion 11, and referring to Figure 6, the movable member 310 is controlled to rotate clockwise, causing the guide vane 20 to move away from the center of the flow passage 11, thereby opening the closed portion of the flow passage 11. To control the rotation of the movable member 310, a servo motor 34 connected to the movable member 310 can be provided to control the direction and speed of the movable member 310.

[0035] In one embodiment, the first assembly structure 32 includes a first protrusion 321 and a first slide groove 322. The first protrusion 321 can move in the first slide groove 322. The extension direction of the first slide groove 322 is set at an angle to the movement direction of the guide vane 20. Preferably, the extension direction of the first slide groove 322 is parallel to the plane of the flow portion 11. One of the first protrusion 321 and the first slide groove 322 is set on the movable part 310, and the other is set on the guide vane 20. For example, the first protrusion 321 is set on the movable part 310 ( Figure 8 As shown), the first chute 322 is provided on the guide vane 20 ( Figure 7 As the movable member 310 rotates, the first protrusion 321 moves within the first sliding groove 322 , thereby driving the guide vane 20 to move along the first assembly structure 32 , thereby moving closer to or away from the center of the circulation portion 11 .

[0036] In one embodiment, the second assembly structure 33 includes a second protrusion 331 and a second slide groove 332. The second protrusion 331 can move in the second slide groove 332. The extension direction of the second slide groove 332 passes through the center line of the circulation portion 11. Preferably, the extension direction of the second slide groove 332 is parallel to the plane of the circulation portion 11. One of the second protrusion 331 and the second slide groove 332 is provided on the diffuser 10, and the other is provided on the guide vane 20. In this way, the extension direction of the first slide groove 322 and the extension direction of the second slide groove 332 are provided at an angle. For example, the second protrusion 331 is provided on the guide vane 20 ( Figure 7 As shown), the second chute 332 is provided on the diffuser 10 ( Figure 2 shown).

[0037] Preferably, the first assembly structure 32 and the second assembly structure 33 are staggered around the centerline of the circulation portion 11 to avoid interference. Specifically, the first chute 322 and the second chute 332 can be staggered around the centerline of the circulation portion 11. Furthermore, the first chute 322 and the second chute 332 are inclined relative to each other, and can be configured so that the distance between the end of the first chute 322 closer to the circulation portion 11 and the end of the second chute 332 closer to the circulation portion 11 is greater than the distance between the end of the first chute 322 farther from the circulation portion 11 and the end of the second chute 332 farther from the circulation portion 11.

[0038] It should be noted that for the movement control of the plurality of guide vanes 20, the drive assembly 30 comprises a plurality of moving parts 310, a plurality of first assembly structures 32 and a plurality of second assembly structures 33, and the guide vanes 20, the moving parts 310, the first assembly structures 32 and the second assembly structures 33 are in one-to-one correspondence. By controlling the rotating movement of the corresponding moving part 310, the movement control of the corresponding single guide vane 20 can be realized, and by synchronously controlling the rotating movement of all moving parts 310, the synchronous control of the movement of all guide vanes 20 can be realized.

[0039] Preferably, the plurality of moving parts 310 are integrally formed as a moving ring 31, and the moving ring 31 and the flow passage 11 are concentrically arranged, so that by controlling the rotation of the moving ring 31 by the servo motor 34, the synchronous control of the movement of all guide vanes 20 can be realized.

[0040] In an embodiment, one side of the guide vane 20 towards the center of the flow passage 11 is arc-shaped, and when all guide vanes 20 move synchronously to a certain position, the arc-shaped sides of all guide vanes 20 can enclose a circle, for example, when all guide vanes 20 move to the position closest to the center of the flow passage 11, that is, the degree of closure of the guide vanes 20 to the flow passage 11 reaches the maximum, the arc-shaped sides of all guide vanes 20 enclose a circle. Considering that the wafer 50 is usually circular, the guide vanes 20 configured with arc-shaped sides can better adapt to the shape of the wafer 50, and during electroplating, the flow of the edge electroplating liquid can be uniformly controlled, and the edge electroplating thickness of the wafer 50 can be better homogenized. In some other embodiments, the side of the guide vane 20 close to the center of the flow passage 11 can also be linear, wavy, etc.

[0041] Although the utility model discloses the above-mentioned preferred embodiment, however, the above-mentioned embodiment is not used to limit the utility model. For any skilled person in the art, without departing from the utility model technical scheme range, can utilize the technical content disclosed above to the utility model technical scheme make many possible changes and modification, or modify as equivalent variation equivalent embodiment. Therefore, all the contents not departing from the utility model technical scheme, according to the technical essence of the utility model to the above embodiment made any simple modification, equivalent variation and modification, all still belong to the utility model technical scheme protection range.

Claims

1. An electroplating edge control device, characterized by, The application relates to an electroplating edge control device. The device comprises a diffuser with a flow passage for electroplating solution to pass through; a guide vane connected to the diffuser; and a driving assembly connected to the guide vane for driving the guide vane to move towards or away from the center of the flow passage. The driving assembly comprises a movable member, a first assembly structure and a second assembly structure, the movable member is rotatable around the center line of the flow passage, the guide vane is movably connected to the diffuser through the second assembly structure, the moving direction of the guide vane extends through the center line of the flow passage, the first assembly structure connects the movable member and the guide vane, and the first assembly structure converts the rotating motion of the movable member into the moving motion of the guide vane. The first assembly structure comprises a first protruding part and a first sliding groove, the first protruding part is movable in the first sliding groove, the extending direction of the first sliding groove is arranged at an angle with the moving direction of the guide vane, one of the first protruding part and the first sliding groove is arranged on the movable member, and the other is arranged on the guide vane.

2. The electroplating edge control device of claim 1, wherein, The second assembly structure comprises a second protruding part and a second sliding groove, the second protruding part is movable in the second sliding groove, the extending direction of the second sliding groove extends through the center line of the flow passage, one of the second protruding part and the second sliding groove is arranged on the diffuser, and the other is arranged on the guide vane.

3. The electroplating edge control device of claim 2, wherein, The first assembly structure and the second assembly structure are arranged at different positions around the center line of the flow passage.

4. The electroplating edge control device of claim 2, wherein, The driving assembly further comprises a servo motor connected to the movable member.

5. The electroplating edge control device of claim 2, wherein, The electroplating edge control device comprises a plurality of guide vanes, the guide vanes are distributed around the center line of the flow passage, the driving assembly comprises a plurality of movable members, a plurality of first assembly structures and a plurality of second assembly structures, and the guide vanes, the movable members, the first assembly structures and the second assembly structures are in one-to-one correspondence.

6. The electroplating edge control device of claim 2, wherein, The plurality of movable members are integrally formed as a movable ring.

7. The electroplating edge control device of claim 2, wherein, One side of the guide vane towards the center of the flow passage is arc-shaped.

8. The electroplating edge control device of claim 7, wherein, The flow passage comprises a plurality of uniformly distributed flow holes.

9. The electroplating edge control device of claim 1, wherein, ​ 10. The electroplating edge control device of claim 1, wherein, ​

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