Heat-conducting plastic radiator and LED lamp
By combining thermally conductive plastics with high and low thermal conductivity in LED heat sinks, the problems of limited heat sink material and poor environmental adaptability are solved, achieving better heat dissipation and wider application, especially improving stability and safety in high salt spray and humid environments.
Patent Information
- Application Number
- CN202423255732.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-28
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-12-28
AI Technical Summary
Existing LED heat sinks have limited material options, resulting in limited heat dissipation performance. Furthermore, their lifespan is shortened in environments with high salt spray, humidity, or acidity and alkalinity. The processing technology is also limited and costly, and the bond between metal and plastic is weak, making the interface prone to detachment.
High thermal conductivity plastic is used as the heat dissipation part, which is combined with a low thermal conductivity shell. It is integrally molded through two-color injection molding or insert process to increase the tightness of the connection between the heat dissipation part and the shell and improve stability in high salt spray and humid environments. An insulating thermally conductive plastic shell is used to ensure safety.
It improves heat dissipation, expands the application range, is suitable for higher power LED lights, extends service life, reduces costs, and enhances stability and safety in harsh environments.
Smart Images
Figure CN223460407U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application belongs to the field of LED lighting, and particularly relates to a heat-conducting plastic heat sink and LED lamp. BACKGROUND
[0002] The material selection of LED heat sinks (some as shells or housings) usually includes metal and heat-conducting plastic. Heat-conducting plastic has different functions and thermal conductivity coefficients. When the control panel of an LED lamp directly or indirectly contacts the heat sink, the material of the heat sink is usually selected as insulating heat-conducting plastic to avoid electric shock. The heat-conducting filler filled with high-thermal-conductivity plastic usually includes some conductive materials such as graphite, which is difficult to directly contact the control panel. The thermal conductivity coefficient (vertical thermal conductivity coefficient) of insulating heat-conducting plastic is low, and the heat dissipation effect provided by the heat sink is limited. In order to improve the heat dissipation effect, the size of the heat sink can be increased, and a heat-conducting metal (such as a metal sheet or a metal bowl) can be attached inside the heat sink through an insert injection molding process. The increase in the size of the heat sink leads to high material cost, storage and transportation cost. Although metal can improve the heat dissipation performance to a certain extent, it cannot be widely used in some specific environments (such as offshore, production environments exposed to chemical raw materials, and environments with high salt mist, humidity and acid and alkali) due to environmental corrosion, which rapidly reduces the service life. The conventional processing technology of the metal and plastic material shell is only insert injection molding, the processing technology is single, and the metal material structure design is considered more, which cannot be designed into a complex structure, and the processing cost of the complex structure is high. In addition, due to the large difference in material, the combination of metal and plastic is poor, which is prone to interface separation in long-term on-off alternating use environments, and the metal is embedded in the plastic joint. SUMMARY
[0003] In order to overcome one of the aforementioned problems in the prior art, the purpose of the present application is to provide a heat-conducting plastic heat sink and LED lamp which has a simple structure, a wide application range, a better heat dissipation effect and is more suitable for higher-power LED lamps. The technical scheme is as follows:
[0004] A heat-conducting plastic heat sink, comprising a heat dissipation part and a shell covering the heat dissipation part, the heat dissipation part being capable of fixing an LED substrate, the heat dissipation part and the shell being made of heat-conducting plastic, and the thermal conductivity coefficient of the heat dissipation part being greater than that of the shell.
[0005] Optionally, the heat dissipation part is integrally formed with the shell through a double-color injection molding process or an insert process, the shell is made of heat-conducting plastic with a thermal conductivity coefficient λ1 satisfying 0.5≤λ1≤3 W / (m·K), and the heat dissipation part is made of heat-conducting plastic with a thermal conductivity coefficient λ2 satisfying λ2>3 W / (m·K). The thermal conductivity coefficient (λ) is a vertical thermal conductivity coefficient, which is tested according to the ASTM E-1461 standard method under the condition of 80℃ and a sample thickness of 2mm.
[0006] Optionally, the shell is made of insulating and heat-conductive plastic.
[0007] Optionally, the shell is provided with a first limiting part and a second limiting part, and the heat-dissipating part is integrally formed between the first limiting part and the second limiting part by means of a double-color injection molding process or an insert molding process.
[0008] Optionally, the first limiting part and the second limiting part include one or more annular surfaces, and the heat-dissipating part includes one or more folded edge structures that are attached to the corresponding annular surfaces.
[0009] Optionally, the plurality of annular surfaces form a stepped shape.
[0010] Optionally, the second limiting part is provided with a plurality of clamping protrusions in a direction parallel to the annular surface, which limit the folded edge structure of the heat-dissipating part located at the second limiting part.
[0011] Optionally, the shell is provided with a plurality of fins on the outside.
[0012] Optionally, the heat-dissipating part is provided with a heat transfer area, which allows the LED substrate to dissipate heat through the heat transfer area, and the direction of the heat transfer area is the cross-sectional direction of the shell.
[0013] Optionally, the heat transfer area is provided with a heat-conductive metal sheet, which allows the heat of the LED substrate to quickly spread to the heat-conductive metal sheet, and then dissipate heat through the heat-dissipating part.
[0014] The application also provides an LED lamp comprising the heat-conductive plastic heat-dissipating device according to any one of the preceding embodiments.
[0015] Optionally, the LED lamp includes a high-bay lamp, a bulb lamp, a mining lamp, a down lamp, a spotlight, an A lamp, a T lamp, etc.
[0016] Compared with the prior art, the application improves the heat dissipation effect of the existing insulating and heat-conductive plastic used as a heat-dissipating device, so that the LED lamp can select a higher-power LED substrate. By utilizing the material compatibility and similar thermal expansion coefficients between the high-heat-conductive plastic material of the heat-dissipating part and the low-heat-conductive plastic material, the stability of the heat-dissipating part and the shell in high-temperature and low-temperature environments is improved, and the service life is prolonged, and the application range is wider. The selection of the material of the heat-dissipating part and the shell allows the person skilled in the art to use a double-color injection molding process according to the specific material parameters (such as the tighter combination between the polypropylene-based heat-conductive plastic and the polyamide-based heat-conductive plastic), which expands the processing mode of such heat-dissipating devices. In addition, the heat-dissipating part is light in weight and has higher design freedom.
[0017] The application scheme is more suitable for high-salt mist, humid, acidic and alkaline environments such as offshore and chemical raw material exposed production environments. The technical problem that the metal (such as aluminum and copper) cannot be used as a structural material due to the high requirements for the salt mist resistance and acid and alkali resistance of the LED lamp in such environments is overcome.
[0018] The application has simple structure, wide application range, better heat dissipation effect, and is more suitable for higher power LED lamps. BRIEF DESCRIPTION OF DRAWINGS
[0019] Fig. 1 A perspective view of the heat-conducting plastic heat sink described in Example 1;
[0020] Fig. 2 Another perspective view of the heat-conducting plastic heat sink described in Example 1 from another angle;
[0021] Fig. 3 A perspective view of the heat dissipation part described in Example 1;
[0022] Fig. 4 An exploded view of the heat-conducting plastic heat sink described in Example 1;
[0023] In the drawings, the reference signs are as follows: housing 1, first limiting part 101, second limiting part 102, clamping protrusion 103, heat dissipation part 2, and folded edge structure 201. DETAILED DESCRIPTION
[0024] The specific embodiments of the application are described in detail below through examples, but the specific embodiments of the application are not intended to limit the technical solutions of the application. Any non-substantial changes to the technical solutions described in the examples of the application, such as replacement of common technical solutions in the field, are within the scope of protection of the application. Example 1
[0025] As shown in Figs. 1 to 4 A heat-conducting plastic heat sink includes a heat dissipation part 2 and a housing 1 covering the heat dissipation part 2. The heat dissipation part 2 can fix an LED substrate. The heat dissipation part 2 and the housing 1 are both heat-conducting plastic, and the heat dissipation part 2 has a higher thermal conductivity than the housing 1.
[0026] In this embodiment, the heat dissipation part 2 is integrally formed with the housing 1 by a two-color injection molding process or an insert molding process. The housing 1 is heat-conducting plastic with a thermal conductivity λ1 satisfying 0.5≤λ1≤3 W / (m•K), and the heat dissipation part 2 is heat-conducting plastic with a thermal conductivity λ2 satisfying λ2>3 W / (m•K). The actual needs are selected by those skilled in the art.
[0027] The thermal conductivity (λ) is the vertical thermal conductivity, which is tested according to the ASTM E-1461 standard method with a test condition of 80℃ and a sample thickness of 2mm.
[0028] In this embodiment, the shell 1 is made of insulating and heat-conducting plastic, which improves the safety of the control panel located therein.
[0029] In this embodiment, the shell 1 is provided with a first limiting portion 101 and a second limiting portion 102, and the heat-dissipating portion 2 is integrally formed between the first limiting portion 101 and the second limiting portion 102 by a double-color injection molding process or an insert molding process.
[0030] In this embodiment, the first limiting portion 101 and the second limiting portion 102 include one or more annular surfaces, and the heat-dissipating portion 2 includes one or more folded edge structures 201 corresponding to the annular surfaces.
[0031] In this embodiment, the plurality of annular surfaces form a stepped shape, which can make the heat-dissipating portion 2 and the shell 1 more closely combined in the double-color injection molding or insert molding process, thereby improving the service life.
[0032] In this embodiment, the second limiting portion 102 is provided with a plurality of clamping protrusions 104 parallel to the direction of the annular surface, which limits the folded edge structure 201 of the heat-dissipating portion 2 located at the second limiting portion 102. The folded edge structure 201 can be limited in relative position to the shell 1 by the clamping protrusions 104, thereby reducing the risk of falling caused by relative displacement of the heat-dissipating portion 2 and the shell 1.
[0033] In other embodiments, the shell 1 is provided with a plurality of fins on the outside.
[0034] In other embodiments, the heat-dissipating portion 2 can be provided with a heat transfer area (which can be implemented by those skilled in the art according to the idea of the present solution, not shown in the figure), which can enable the LED substrate to dissipate heat through the heat transfer area. The direction of the heat transfer area is the cross-sectional direction of the shell 1.
[0035] In other embodiments, the heat transfer area can be provided with a heat-conducting metal sheet, which can enable the heat of the LED substrate to quickly spread to the heat-conducting metal sheet, and then dissipate heat through the heat-dissipating portion 2.
[0036] It should be noted that the volume resistivity of the insulating and heat-conducting plastic is greater than 10 10 Ω•m. Those skilled in the art can also limit it according to other parameters representing insulation characteristics, without limitation, as long as it meets the safe use of the control panel.
[0037] It should be noted that the LED substrate refers to a basic structure that carries LED chips and helps dissipate heat. In general, a heat dissipation structure needs to be provided to prevent performance degradation or shortened life caused by overheating. Embodiment 2
[0038] An LED lamp comprising the heat-conducting plastic heat sink in embodiment 1, other structures such as control board, LED substrate, lamp holder, bulb shell lamp structure for a bulb lamp are well known to those skilled in the art, not shown in the figure, and those skilled in the art can realize the scheme according to the scheme idea of the present application without creative labor.
[0039] In other embodiments, the LED lamp can also include high-bay lamp, bulb lamp, industrial and mining lamp, down lamp, spotlight, A lamp, T lamp, etc. The lamp with additional need for insulation control board installation, those skilled in the art can use the other components of the LED lamp such as reflector cup and lampshade according to the idea of the present application, and will not be described again.
[0040] It should be noted that the components used in the above embodiments can be selected or replaced by those skilled in the art according to the needs, without going beyond the scope of the present application.
Claims
1. A thermally conductive plastic heat spreader, characterized by: The heat dissipation part and the shell are integrally formed by a double-color injection molding process or an insert molding process, the shell is made of a heat-conductive plastic with a heat conductivity λ1 satisfying 0.5≤λ1≤3 W / (m·K), and the heat dissipation part is made of a heat-conductive plastic with a heat conductivity λ2 satisfying λ2>3 W / (m·K).
2. The thermally conductive plastic heat spreader of claim 1, wherein: The first limiting part and the second limiting part are arranged in the shell, and the heat dissipation part is integrally formed between the first limiting part and the second limiting part by a double-color injection molding process or an insert molding process.
3. The thermally conductive plastic heat spreader of claim 2, wherein: The first limiting part and the second limiting part include one or more annular surfaces, and the heat dissipation part includes one or more folded edge structures corresponding to the annular surfaces.
4. The thermally conductive plastic heat spreader of claim 2, wherein: The first limiting part limits the folded edge structure of the heat dissipation part located at the position of the first limiting part.
5. The thermally conductive plastic heat spreader of claim 2, wherein: The second limiting part is provided with a plurality of clamping protrusions in a direction parallel to the annular surface, and the second limiting part limits the folded edge structure of the heat dissipation part located at the position of the second limiting part.
6. The thermally conductive plastic heat spreader of claim 1, wherein: The heat dissipation part is provided with a heat transfer area, and the LED substrate can dissipate heat through the heat transfer area, and the direction of the heat transfer area is the cross-sectional direction of the shell.
7. The thermally conductive plastic heat spreader of claim 6, wherein: The heat transfer area is provided with a heat-conductive metal sheet, so that the heat of the LED substrate can be quickly spread to the heat-conductive metal sheet, and then dissipated through the heat dissipation part.
8. An LED lamp characterized by: The LED lamp includes a high-bay lamp, a bulb lamp, a mining lamp, a down lamp, a spotlight, an A lamp or a T lamp.
9. The LED lamp of claim 8, wherein: The LED lamp includes a high-bay lamp, a bulb lamp, a mining lamp, a down lamp, a spotlight, an A lamp or a T lamp.