Heat dissipation device for water quality comprehensive toxicity on-line monitor

By designing a heat dissipation device for the online water quality comprehensive toxicity monitor, and utilizing a fan, coolant tank, water pump system, and semiconductor refrigeration chips, the problem of poor temperature control in the culture storage room and reaction pool was solved, ensuring the activity and responsiveness of the culture, and achieving efficient temperature management.

CN223460675UActive Publication Date: 2025-10-21SICHUAN BELAM TECH
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Patent Information

Application Number
CN202422686185.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-05
Publication Date
2025-10-21
Estimated Expiration
2034-11-05

AI Technical Summary

Technical Problem

Existing technologies cannot effectively control the temperature of the bacterial strain storage chamber and reaction pool of the online water quality comprehensive toxicity monitor, which affects the activity of the bacterial strain and the toxicity response capability.

Method used

A heat dissipation device is designed, which includes a coolant tank, a fan, a cooling structure and a water pump. The fan dissipates heat, the water pump delivers coolant, and semiconductor refrigeration plates are used to cool the reaction pool, stirring motor and culture storage chamber. Combined with real-time temperature monitoring at the control end, the water pump power is adjusted to ensure that the temperature is within the appropriate range.

Benefits of technology

It achieves effective cooling of the reaction tank, stirring motor and culture storage chamber, maintains the activity and toxicity response capability of the culture, and improves the heat dissipation efficiency and temperature control accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heat dissipation device for a water quality comprehensive toxicity on-line monitor, which comprises a cooling liquid tank, a fan, a cooling structure and a water pump, and the cooling liquid tank is used for storing cooling liquid; the fan is positioned below the cooling liquid tank; the cooling structure is used for cooling the reaction tank, the stirring motor and the strain storage chamber; the water pump is arranged below the cooling liquid tank, a liquid inlet pipe and a liquid outlet pipe are installed on the water pump, the liquid inlet pipe is communicated with the cooling liquid tank, the liquid outlet pipe is communicated with the cooling liquid tank, the cooling structure is communicated with the liquid outlet pipe, and the water pump is electrically connected with a control end. The cooling device has the advantages that the fan is arranged to dissipate heat of the surface of the cooling liquid box for storing cooling liquid so as to dissipate heat of the cooling liquid to ensure that the cooling liquid has a good heat dissipation effect, and the water pump is arranged to convey the cooling liquid into the cooling structure, so that the cooling effect is improved. And cooling liquid is used for taking away the temperature in the reaction tank, the stirring motor and the strain storage chamber.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the technology of heat dissipation structure, concretely relates to a heat dissipation device for water quality comprehensive toxicity on -line monitor. BACKGROUND

[0002] Water quality comprehensive toxicity detection is an important means of evaluating water environment safety. At present, water quality comprehensive toxicity on -line monitor adopts luminescent bacteria as test organism, realizes the on -line monitoring of water quality through the change of its luminous intensity. But luminescent bacteria is sensitive to environmental temperature, and the temperature of strain storage room and reaction pool needs to be controlled. At the same time, the strain storage room needs to run the stirring motor for a long time to maintain the activity of the strain, and the long-term operation of the stirring motor will cause the temperature to rise, reducing its service life.

[0003] At present, air conditioner or fan is used for heat dissipation of comprehensive toxicity detector, and the air conditioner has good refrigeration effect on the room where the comprehensive toxicity detector and the strain storage room are placed, but the refrigeration effect on the strain storage room and reaction pool arranged in the comprehensive toxicity detector is poor, so the internal temperature of the strain storage room and reaction pool cannot be stably controlled in the appropriate range, affecting the activity and toxicity response capacity of the strain. SUMMARY

[0004] The utility model wants to solve the technical problem that the internal temperature of the strain storage room and reaction pool cannot be stably controlled in the appropriate range by air conditioner at present, affecting the activity and toxicity response capacity of the strain, and aims at providing a heat dissipation device for water quality comprehensive toxicity on -line monitor, which sets up cooling structure to control the temperature of reaction pool, stirring motor and strain storage room in the appropriate range, and ensures the activity and toxicity response capacity of the strain.

[0005] The utility model realizes by the following technical scheme:

[0006] A heat dissipation device for water quality comprehensive toxicity on -line monitor, including cooling liquid tank, fan, cooling structure and water pump, the cooling liquid tank is used for storing cooling liquid, the fan is located below the cooling liquid tank, the cooling structure is used for cooling reaction pool, stirring motor and strain storage room, the water pump is arranged below the cooling liquid tank, the water pump is installed with inlet pipe and outlet pipe, the inlet pipe is connected with cooling liquid tank, the outlet pipe is connected with cooling liquid tank, the cooling structure is communicated with the outlet pipe, and the water pump is electrically connected with control end.

[0007] The utility model discloses beneficial effect is, through setting up the surface heat dissipation of the cooling liquid tank of the fan to the storage cooling liquid, further realizes the heat dissipation of cooling liquid to ensure that cooling liquid has better heat dissipation effect, and sets up water pump and transports cooling liquid to cooling structure, further through cooling liquid takes away the cooling of reaction pool, stirring motor and strain storage chamber in, because control end real -time acquisition reaction pool and the temperature in strain storage chamber, therefore, water pump is electrically connected with control end, and control end controls the power of water pump, start or stop according to the temperature value obtained, further control the temperature of reaction pool, stirring motor and strain storage chamber in the proper range, ensure the activity and toxicity response ability of strain.

[0008] In some embodiments, the water pump is a double-outlet pump, the outlet pipe includes a first outlet pipe and a second outlet pipe, the cooling structure includes a first cooling structure, one end of the first outlet pipe is connected with the water pump, the other end is connected with the first cooling structure, one end of the second outlet pipe is connected with the first cooling structure, the other end is connected with the cooling liquid tank, and the first cooling structure is used for cooling the reaction pool. By setting the first outlet pipe and the second outlet pipe, the cooling liquid can be easily input into the first cooling structure through the first outlet pipe, and the cooling liquid can flow into the cooling liquid tank from the second outlet pipe after passing through the cooling structure, thereby taking away the heat of the cooling structure and the reaction pool, and achieving the cooling of the reaction pool.

[0009] In some embodiments, the first cooling structure includes a first cooling box, the first cooling box is in the shape of a rectangular box, a plurality of concave-convex structures are arranged at both ends of the first cooling box, and two pipe joints are arranged at both ends of the bottom of the first cooling box and connected with the first outlet pipe and the second outlet pipe respectively. By setting the first cooling structure in the shape of a rectangular box and arranging a plurality of concave-convex structures at both ends of the first cooling structure, the heat dissipation area of the cooling structure is increased, the heat dissipation effect is improved, and the two pipe joints are arranged at both ends of the cooling structure, so that the cooling liquid can flow through the entire structure of the first cooling structure, thereby ensuring the cooling effect.

[0010] In some embodiments, the first cooling structure further includes a first semiconductor refrigeration sheet, the bottom of the first semiconductor refrigeration sheet is bonded to the top of the first cooling box through heat-conducting silicone grease, and the top of the first semiconductor refrigeration sheet is bonded to the bottom of the reaction pool through heat-conducting silicone grease. By bonding the semiconductor refrigeration sheet to the top of the first cooling box, the reaction pool can be cooled by the first semiconductor refrigeration sheet, and the heat of the first semiconductor refrigeration sheet can be taken away by the cooling liquid flowing through the first cooling box, thereby ensuring the cooling effect of the first semiconductor refrigeration sheet.

[0011] In some embodiments, the liquid outlet pipe further comprises a third liquid outlet pipe and a fourth liquid outlet pipe, the cooling structure further comprises a second cooling structure, one end of the third liquid outlet pipe is connected with the water pump, the other end is connected with the second cooling structure, one end of the fourth liquid outlet pipe is connected with the second cooling structure, the other end is connected with the cooling liquid tank, and the second cooling structure is used for cooling the stirring motor and the strain storage chamber. By arranging the third liquid outlet pipe and the fourth liquid outlet pipe, the cooling liquid can be input into the second cooling structure through the third liquid outlet pipe, and the cooling liquid can flow into the cooling liquid tank from the fourth liquid outlet pipe after passing through the cooling structure, thereby removing the heat of the cooling structure, the stirring motor and the strain storage chamber, and achieving the internal cooling of the stirring motor and the strain storage chamber.

[0012] In some embodiments, the second cooling structure comprises a second cooling box, the second cooling box is in the shape of a rectangular box as a whole, a plurality of concave-convex structures are arranged at both ends of the second cooling box, and two pipe joints are arranged at both ends of the bottom of the second cooling box and connected with the third liquid outlet pipe and the fourth liquid outlet pipe respectively. By arranging the second cooling structure in the shape of a rectangular box and arranging a plurality of concave-convex structures at both ends of the second cooling structure, the heat dissipation area of the cooling structure is increased, the heat dissipation effect is improved, and the two pipe joints are arranged at both ends of the cooling structure, so that the cooling liquid can flow through the entire structure of the second cooling structure.

[0013] In some embodiments, the second cooling structure further comprises a second semiconductor refrigeration sheet, the bottom of the second semiconductor refrigeration sheet is bonded to the top of the second cooling box through heat-conducting silicone grease, and the top of the second semiconductor refrigeration sheet is bonded to the stirring motor and the strain storage chamber through heat-conducting silicone grease. By bonding the semiconductor refrigeration sheet to the top of the second cooling box, the reaction tank can be cooled by the second semiconductor refrigeration sheet, the heat of the second semiconductor refrigeration sheet can be removed when the cooling liquid flows through the second cooling box, and the cooling effect of the second semiconductor refrigeration sheet is ensured.

[0014] In some embodiments, a housing is further arranged, the housing is connected to the bottom of the cooling liquid tank, a plurality of fans are arranged, the fans are connected to one side of the housing, and the air outlets of the fans are located in the inner cavity of the housing. By arranging the housing, the air flow generated by the fans is used to remove the heat of the cooling liquid tank, the wind energy is saved, and the cooling effect of the cooling liquid tank is improved.

[0015] In some embodiments, a heat dissipation row is arranged on the side wall of the housing, the heat dissipation row is located on the side of the housing away from the side where the fan is arranged, and the water pump is arranged in the housing. By arranging the heat dissipation row, the air flow removing the heat of the cooling liquid tank is discharged from the heat dissipation row.

[0016] In some embodiments, the cooling liquid tank is made of transparent material, and the top of the cooling liquid tank is provided with a cooling liquid adding part. By setting the cooling liquid tank as a transparent structure, the amount of cooling liquid in the cooling liquid tank can be observed, and the cooling liquid can be added into the cooling liquid tank through the cooling liquid adding part.

[0017] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0018] 1. The fan is arranged to dissipate heat from the surface of the cooling liquid tank storing the cooling liquid, thereby realizing heat dissipation of the cooling liquid to ensure better heat dissipation effect of the cooling liquid, and the water pump is arranged to deliver the cooling liquid into the cooling structure, thereby removing heat in the reaction tank, the stirring motor and the strain storage chamber by the cooling liquid.

[0019] 2. Since the control end acquires the temperature in the reaction tank and the strain storage chamber in real time, the water pump and the semiconductor refrigerating sheet are electrically connected to the control end, the control end controls the power, start or stop of the water pump and the semiconductor according to the acquired temperature value, thereby controlling the temperature of the reaction tank, the stirring motor and the strain storage chamber within a proper range to ensure the activity and toxicity response capability of the strain.

[0020] 3. The semiconductor refrigerating sheet is bonded to the top of the cooling box, thereby facilitating cooling of the reaction tank, the stirring motor and the strain storage chamber by the semiconductor refrigerating sheet, and the cooling liquid removes the heat of the semiconductor refrigerating sheet when flowing through the cooling box to ensure the cooling effect of the semiconductor refrigerating sheet.

[0021] 4. The shell is arranged to make the air flow generated by the fan remove the heat of the cooling liquid tank, save wind energy and improve the cooling effect on the cooling liquid tank. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the example embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can be obtained without creative labor under the premise of the drawings:

[0023] Figure 1 It is a structural diagram of the utility model;

[0024] Figure 2 It is a partial structural diagram of the utility model;

[0025] Figure 3 It is a partial structural diagram of the utility model.

[0026] Markings in the drawings and corresponding names of parts:

[0027] Cooling liquid addition 1, cooling liquid tank 2, fan 3, first liquid outlet pipe 4, second liquid outlet pipe 5, third liquid outlet pipe 6, fourth liquid outlet pipe 7, shell 10, heat dissipation row 12, first semiconductor refrigeration piece 13, first cooling box 14, second semiconductor refrigeration piece 131, second cooling box 141, reaction pool 15, stirring motor 16, strain storage chamber 17. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with examples and drawings, the schematic implementation mode of the utility model and its description are only used to explain the utility model, and do not serve as the limitation of the utility model.

[0029] Throughout the specification, the reference to "one embodiment", "an embodiment", "one example" or "an example" means that a particular feature, structure or characteristic described in connection with the embodiment or example is included in at least one embodiment of the utility model. Therefore, the phrases "one embodiment", "an embodiment", "one example" or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, specific features, structures or characteristics can be combined in one or more embodiments or examples in any appropriate combination and / or subcombination. In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale. The term "and / or" used herein includes any and all combinations of one or more of the relevant listed items.

[0030] In the description of the utility model, the orientation or position relationship indicated by the terms "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "high", "low", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the protection scope of the utility model.

[0031] The terms "first", "second" and the like used in the utility model are only for the purpose of distinguishing corresponding parts for the sake of clarity, and are not intended to limit any order or emphasize importance. In addition, the term "connection" used herein can be direct connection or indirect connection via other components without special description.

[0032] The embodiment provides a heat dissipation device for a water quality comprehensive toxicity on-line monitor, which is used for the heat dissipation device of the water quality comprehensive toxicity on-line monitor, comprising a shell, a first semiconductor refrigeration piece, a second semiconductor refrigeration piece and a heat dissipation row. Figures 1-3The utility model relates to a cooling device for fermentation tank, including cooling liquid tank 2 for storing cooling liquid, fan 3 below the cooling liquid tank 2, cooling structure for cooling reaction pool 15, stirring motor 16 and strain storage chamber 17, water pump below the cooling liquid tank 2, the water pump is installed with liquid inlet pipe and liquid outlet pipe, the liquid inlet pipe is connected with cooling liquid tank 2, the liquid outlet pipe is connected with cooling liquid tank 2, the cooling structure is communicated with the liquid outlet pipe, and the water pump is electrically connected with control end.

[0033] Referring to Figure 1 The water pump is double outlet water pump, the liquid outlet pipe includes first liquid outlet pipe 4 and second liquid outlet pipe 5, the cooling structure includes first cooling structure, one end of first liquid outlet pipe 4 is connected with water pump, the other end is connected with first cooling structure, one end of second liquid outlet pipe 5 is connected with first cooling structure, the other end is connected with cooling liquid tank 2, and first cooling structure is used to cool reaction pool 15. By setting first liquid outlet pipe 4 and second liquid outlet pipe 5, it is convenient to input cooling liquid to first cooling structure through first liquid outlet pipe 4, and cooling liquid flows into cooling liquid tank 2 from second liquid outlet pipe 5 after passing through first cooling structure, removes the heat of cooling structure and reaction pool 15, realizes the cooling of reaction pool 15.

[0034] Referring to Figure 1 And Figure 3 The first cooling structure includes first cooling box 14, the first cooling box 14 is overall rectangular box shape, a plurality of concave-convex structures are arranged at the both ends of first cooling box 14, and two pipe joints are arranged at the both ends of the bottom of first cooling box 14, and the two pipe joints are connected with first liquid outlet pipe 4 and second liquid outlet pipe 5 respectively. By setting first cooling structure as rectangular box shape, and arranging a plurality of concave-convex structures at the both ends of first cooling structure, the heat dissipation area of cooling structure is increased, the heat dissipation effect is improved, and the two pipe joints are arranged at the both ends of cooling structure, so that cooling liquid can flow through the whole structure of first cooling structure, and the cooling effect is ensured.

[0035] Referring to Figure 1 And Figure 3 The first cooling structure further includes first semiconductor refrigerating sheet 13, the bottom of first semiconductor refrigerating sheet 13 is bonded to the top of first cooling box 14 through heat-conducting silicone grease, and the top of first semiconductor refrigerating sheet 13 is bonded to the bottom of reaction pool 15 through heat-conducting silicone grease. By bonding semiconductor refrigerating sheet to the top of first cooling box 14, it is convenient to cool reaction pool 15 through first semiconductor refrigerating sheet 13, and the heat of first semiconductor refrigerating sheet 13 is removed when cooling liquid flows through first cooling box 14, so that the cooling effect of first semiconductor refrigerating sheet 13 is ensured.

[0036] Referring to Figure 1 AndFigure 3 The liquid outlet pipe further comprises a third liquid outlet pipe 6 and a fourth liquid outlet pipe 7, and the cooling structure further comprises a second cooling structure, one end of the third liquid outlet pipe 6 is connected with the water pump, and the other end is connected with the second cooling structure, one end of the fourth liquid outlet pipe 7 is connected with the second cooling structure, and the other end is connected with the cooling liquid tank 2, and the second cooling structure is used for cooling the stirring motor 16 and the strain storage chamber 17. By arranging the third liquid outlet pipe 6 and the fourth liquid outlet pipe 7, the cooling liquid can be input into the second cooling structure through the third liquid outlet pipe 6, and the cooling liquid can flow into the cooling liquid tank 2 from the fourth liquid outlet pipe 7 after passing through the cooling structure, thereby removing the heat of the cooling structure, the stirring motor 16 and the strain storage chamber 17, and achieving the internal cooling of the stirring motor 16 and the strain storage chamber 17.

[0037] Referring to Figure 1 and Figure 3 The second cooling structure comprises a second cooling box 141, the second cooling box 141 is in the shape of a rectangular box as a whole, a plurality of concave-convex structures are arranged at two ends of the second cooling box 141, and two pipe joints are arranged at the bottom of the second cooling box 141, and the two pipe joints are connected with the third liquid outlet pipe 6 and the fourth liquid outlet pipe 7 respectively. By arranging the second cooling structure in the shape of a rectangular box, and arranging a plurality of concave-convex structures at two ends of the second cooling structure, the heat dissipation area of the cooling structure is increased, the heat dissipation effect is improved, and the two pipe joints are arranged at two ends of the cooling structure, so that the cooling liquid can flow through the entire structure of the second cooling structure.

[0038] Referring to Figure 1 and Figure 3 The second cooling structure further comprises a second semiconductor refrigeration sheet 131, the bottom of the second semiconductor refrigeration sheet 131 is bonded to the top of the second cooling box 141 through heat-conducting silicone grease, and the top of the second semiconductor refrigeration sheet 131 is bonded to the stirring motor 16 and the strain storage chamber 17 through heat-conducting silicone grease. By bonding the semiconductor refrigeration sheet to the top of the second cooling box 141, the reaction tank 15 can be cooled by the second semiconductor refrigeration sheet 131, the heat of the second semiconductor refrigeration sheet 131 is removed when the cooling liquid flows through the second cooling box 141, and the cooling effect of the second semiconductor refrigeration sheet 131 is ensured. The second semiconductor refrigeration sheet 131 and the first semiconductor refrigeration sheet 13 are electrically connected with the control end, so as to automatically control the power of the semiconductor refrigeration sheet and control the strain temperature.

[0039] Referring to Figure 1 and Figure 3Still include the casing 10, the casing 10 is connected in the bottom of the cooling liquid tank 2, the fan 3 includes several, the fan 3 is connected in one side of the casing 10, the air outlet of the fan 3 is located in the inner chamber of the casing 10. By setting the casing 10, so that the wind flow generated by the fan 3 is used to take away the heat of the cooling liquid tank 2, saves the wind energy, and improves the cooling effect of the cooling liquid tank 2.

[0040] Figure 1 The side wall of the casing 10 is provided with a heat dissipation row 12, the heat dissipation row 12 is located in the side of the casing 10 away from the side provided with the fan 3, and the water pump is arranged in the casing 10. By setting the heat dissipation row 12, the wind flow taking away the heat of the cooling liquid tank 2 is discharged from the heat dissipation row 12.

[0041] Referring to Figure 2 And Figure 2 Figure 1 Figure 2 The cooling liquid tank 2 is made of transparent material, and the cooling liquid tank 2 is provided with a cooling liquid adding part 1 on the top. By setting the cooling liquid tank 2 as a transparent structure, the amount of cooling liquid in the cooling liquid tank 2 is observed, and the cooling liquid is filled in the cooling liquid tank 2 through the cooling liquid adding part 1. The cooling liquid adding part 1 adopts a pipe joint, and the pipe joint is provided with a plug. When filling the cooling liquid, the plug is pulled out, and after filling is completed, the plug is connected to the pipe joint.

[0042] The above specific embodiments further illustrate the purpose, technical scheme and beneficial effects of the utility model, and it should be understood that the above description is only a specific embodiment of the utility model, and is not used to limit the protection scope of the utility model. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A heat dissipation device for an on-line water quality comprehensive toxicity monitor, characterized in that, The utility model provides a cooling device for fermentation tank, including: Cooling liquid tank for storing cooling liquid; Fan located below the cooling liquid tank; Cooling structure including cooling box and semiconductor refrigeration sheet, the semiconductor refrigeration sheet is pasted on the upper end of cooling box through heat-conducting adhesive, and the semiconductor refrigeration sheet is used to cool reaction pool, stirring motor and strain storage chamber; Water pump is arranged below the cooling liquid tank, and the water pump is mounted with liquid inlet pipe and liquid outlet pipe, the liquid inlet pipe is communicated with cooling liquid tank, the liquid outlet pipe is communicated with the cooling liquid tank, the cooling box is communicated with the liquid outlet pipe, and the water pump is electrically connected with control end.

2. The heat dissipation device for the water quality comprehensive toxicity online monitor according to claim 1, characterized in that, The water pump is double-outlet pump, the liquid outlet pipe includes first liquid outlet pipe and second liquid outlet pipe, the cooling structure includes first cooling structure, one end of the first liquid outlet pipe is connected with the water pump, the other end is connected with the first cooling structure, one end of the second liquid outlet pipe is connected with the first cooling structure, and the other end is connected with the cooling liquid tank, and the first cooling structure is used to cool reaction pool.

3. The heat dissipation device for the water quality comprehensive toxicity online monitor according to claim 2, characterized in that, The first cooling structure includes first cooling box, the first cooling box is overall rectangular box shape, a plurality of concave-convex structures are arranged at both ends of the first cooling box, and two pipe joints are arranged at both ends of the bottom of the first cooling box.

4. The heat dissipation device for the water quality comprehensive toxicity online monitor according to claim 3, characterized in that, The semiconductor refrigeration sheet includes first semiconductor refrigeration sheet, the bottom of the first semiconductor refrigeration sheet is adhered to the top of the first cooling box through heat-conducting silicone grease, and the top of the first semiconductor refrigeration sheet is adhered to the bottom of reaction pool through heat-conducting silicone grease.

5. The heat dissipation device for the water quality comprehensive toxicity online monitor according to claim 1, characterized in that, The liquid outlet pipe also includes third liquid outlet pipe and fourth liquid outlet pipe, the cooling structure also includes second cooling structure, one end of the third liquid outlet pipe is connected with the water pump, the other end is connected with the second cooling structure, one end of the fourth liquid outlet pipe is connected with the second cooling structure, and the other end is connected with the cooling liquid tank, and the second cooling structure is used to cool stirring motor and strain storage chamber.

6. The heat dissipation device for the water quality comprehensive toxicity online monitor according to claim 5, characterized in that, The second cooling structure includes second cooling box, the second cooling box is overall rectangular box shape, a plurality of concave-convex structures are arranged at both ends of the second cooling box, and two pipe joints are arranged at both ends of the bottom of the second cooling box.

7. The heat dissipation device for the water quality comprehensive toxicity online monitor according to claim 6, characterized in that, The semiconductor refrigeration sheet also includes second semiconductor refrigeration sheet, the bottom of the second semiconductor refrigeration sheet is adhered to the top of the second cooling box through heat-conducting silicone grease, and the top of the second semiconductor refrigeration sheet is adhered to stirring motor and strain storage chamber through heat-conducting silicone grease.

8. The heat dissipating device for the water quality comprehensive toxicity online monitor according to claim 1, characterized in that, It also includes the shell, the shell is connected in the bottom of the cooling liquid tank, the fan includes a plurality of, the fan is connected in one side of the shell, and the air outlet of the fan is located in the inner chamber of the shell.

9. The heat dissipation device for the water quality comprehensive toxicity online monitor according to claim 8, characterized in that, The side wall of the shell is provided with the heat dissipation row, the heat dissipation row is located in the side of the shell away from being provided with the fan, and the water pump is arranged in the shell.

10. The heat dissipation device for the water quality comprehensive toxicity on-line monitoring instrument according to any one of claims 1-9, characterized in that, The cooling liquid tank is made of transparent material, and the top of the cooling liquid tank is provided with a cooling liquid adding piece.