Sample capacitance value testing device used before batch production of chip capacitors

Abstract

The utility model discloses a device for testing the sample capacitance value before batch production of chip capacitors, and belongs to the technical field of production of electronic components. Comprising a bottom frame, a Z-axis probe mechanism, a lower probe mechanism and a motion adjusting mechanism. The bottom frame comprises a bottom plate, a test base and a support rod, and the product seat is manufactured on the top surface of the test base; the Z-axis probe mechanism comprises a Z-axis sliding rail, a sliding block, a pressing plate, a probe connecting base, a stand column, a limiting block, an upper probe, a tension spring and a probe base adapter printed circuit board, and the upper probe is positioned and installed through a hole in the connecting base; the lower probe mechanism is located below the central position of the product base, an elastic probe is welded to the center of the lower probe switching printed circuit board, and the lower elastic probe and the upper probe are located at the concentric position; the motion adjusting mechanism comprises a stand column and tension springs, and the tension springs are located on the two sides of the stand column. The problems that an existing testing technology is poor in accuracy, low in efficiency and poor in repeatability are solved. And the method is widely applied to the batch production process test technology of double-sided bonding pad products.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the electronic component production technical field, further relates to the chip capacitor production technical field, specifically, relate to a kind of for chip capacitor batch production before sample capacitance testing device. BACKGROUND

[0002] In the field of microwave component manufacturing, many component process products (hereinafter referred to as products) are separated from the entire substrate (ceramic or glass substrate) by slicing and cutting. In order to prevent the product from falling and the position from shifting, a layer of blue film is attached to the bottom of the substrate, which has certain adhesion. Some components have single pads, i.e. signal pins and pads are located on the front surface of the product, and some components have double pads, i.e. signal pins and pads are located on both the bottom and the front surface of the product, as shown in the chip capacitor physical diagram. Figure 1 , Figure 2 In the product process, such as chip capacitors with double pads, the electrical performance parameters of the chip capacitors are determined by the production process, and the electrical performance parameters of each batch of chip capacitors are determined by the batch production process. By adjusting the batch production process, chip capacitors with different electrical performance parameters can be produced. Therefore, before mass production, test samples need to be tested to determine the batch production process. The bottom of the ceramic substrate is covered with a layer of blue film, and the blue film is an insulating material that affects testing. For products with double pads, the product needs to be removed from the blue film using tweezers before testing, and then single testing is performed according to different positions and different areas. This testing method is inefficient, has poor accuracy, and is prone to errors. In order to test the products in each area, the products need to be removed from the blue film and placed according to the area, and then tested one by one. This process not only damages single products, but also causes mistakes or mix-ups, and the entire process is time-consuming and labor-intensive.

[0003] The existing testing technology, as shown in Figure 1 , divides the test pieces on the substrate to be tested into several areas (such as 9 areas), and each area has several test points (such as 9 test points). (1) Single product needs to be clamped for small sample capacitance testing each time, but the product state is easily damaged during clamping, causing measurement errors; (2) Since the product cannot be reset after clamping, repeated testing and verification cannot be performed, so the stability of the data will be poor, increasing the risk of later stages; (3) The single clamping method is not conducive to improving the testing rate.

[0004] Therefore, the utility model is proposed. SUMMARY

[0005] The technical problem to be solved by the utility model is: to solve the problems of poor test accuracy, poor test reliability, low test efficiency, poor test repeatability, and easy production of wrong or mixed materials in the process of the existing double-sided pad product.

[0006] The utility model discloses the inventive concept is: design a testing device, change the original single clamping test mode to test under the premise of not damaging the appearance of the product under the film, and also can pierce the surface blue film, secondly, the position can be recorded and repeated test without taking off the product, thereby realizing the quick test of the product, and providing guarantee for the consistency, stability and accuracy of the test of multiple products, and providing accurate basis for the adjustment of batch production process.

[0007] Therefore, the utility model provides a kind of testing device for chip capacitor batch production sample capacitance, as shown in Figures 3-6 As shown, including: base frame 1, Z-axis probe mechanism (upper probe mechanism) 2, lower probe mechanism 3, motion adjustment mechanism 4.

[0008] The base frame 1 includes a bottom plate 5, a test base 6, and a support rod. A corresponding support rod screw hole 7 is provided on the bottom plate 5 and the test base 6 for fixing the test base 6 and the bottom plate 5 by the support rod and screws. A product seat 8 is made on the top surface of the test base 6, and the measured product is placed in the center position of the product seat 8, which can be moved arbitrarily according to the test of different positions.

[0009] The Z-axis probe mechanism 2 includes a Z-axis slide rail 9, a slider 10, a pressing plate 11, a probe connecting seat 12, a vertical column 13, a limiting block 14, an upper probe 15, a tension spring 16, and a probe seat adapter printed circuit board 17. The slider 10 is lifted vertically through the Z-axis slide rail 9. The probe connecting seat 12 is fixed on the slider 10 by screws. The probe connecting seat 12 is provided with a probe hole 18 for the installation of the probe and a probe seat screw hole 19 for the installation of the probe seat adapter printed circuit board 17. The upper probe 15 is positioned and installed through the hole on the connecting seat and transmits test signals by welding on the printed circuit board. The probe seat adapter printed circuit board 17 is fixed with the connecting seat by screws, and the Z-axis probe adapter 20 is connected with a cable to transmit electrical signals to an instrument or a power supply.

[0010] The lower probe mechanism 3 is mainly positioned below the center position of the product seat 8. The lower probe adapter printed circuit board 21 is fixed on the hole corresponding to the product seat 8 by screws. The lower probe adapter printed circuit board 21 is welded with an elastic probe 22 at the center, and the lower elastic probe is guaranteed to be in the concentric position with the upper probe. The lower probe adapter printed circuit board 21 is provided with a lower probe adapter test connector 23 for connecting a test cable.

[0011] The movement adjusting mechanism 4 includes the tension spring 16 on both sides of the stand 13, and adjusting the tightness can ensure that the upper probe 15 does not pierce the product under the film during the pressing process.

[0012] The technical effect of the utility model scheme is:

[0013] 1. The test probe does not damage the product under the film while piercing the surface film.

[0014] 2. The position of the product in the substrate can be recorded without taking the product off, and the product can be repeatedly tested. Thus, the product can be quickly tested, and the consistency, stability and accuracy of the test of multiple products are ensured.

[0015] 3. The adjustment of the batch production process of the process product provides accurate basis, and ensures the consistency, repeatability and performance parameter consistency of the batch product quality.

[0016] The utility model can be widely applied in the batch production process test technology of the process product with double-sided pads. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the whole substrate layout structure of the process product.

[0018] Figure 2 It is a schematic diagram of the shape of the chip capacitor separation core particle.

[0019] Figure 3 It is a schematic diagram of the front view structure of the test device.

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the test device.

[0021] Figure 5 It is a schematic diagram of the left view structure of the test device.

[0022] Figure 6 It is a schematic diagram of the top view structure of the test device.

[0023] In the figure, 1 is a base frame, 2 is a Z-axis probe mechanism (upper probe mechanism), 3 is a lower probe mechanism, 4 is a movement adjusting mechanism, 5 is a bottom plate, 6 is a test base, 7 is a support rod screw hole, 8 is a product seat, 9 is a Z-axis slide rail, 10 is a sliding block, 11 is a pressing plate, 12 is a probe connecting seat, 13 is a stand, 14 is a limiting block, 15 is an upper probe, 16 is a tension spring, 17 is a probe seat adapter printed circuit board, 18 is a probe hole, 19 is a probe seat screw hole, 20 is a Z-axis probe adapter, 21 is a lower probe adapter printed circuit board, 22 is an elastic probe, and 23 is a lower probe adapter test connector. DETAILED DESCRIPTION

[0024] As Figures 3-6 shown, the device for testing the capacitance of a sample before batch production of chip capacitors, the embodiment is as follows:

[0025] The bottom plate 5 is a square metal bottom plate.

[0026] The test base 6 is a square insulating base.

[0027] The Z-axis sliding rail 9 is a groove type sliding rail.

[0028] The sliding block 10 is a double-shaft core sliding block.

[0029] The double-shaft core sliding block 10 realizes uniform speed lifting in the vertical direction through the Z-axis groove type sliding rail 9.

[0030] The probe connecting seat 12 is an insulating material probe connecting seat.

[0031] The upper probe 15 is a tungsten steel needle, the inner core of the probe is a tungsten inner core, the middle part is a Teflon insulating layer, and the outer part is wrapped with a copper hollow tube layer.

[0032] The Z-axis probe adapter 20 is distributed around the probe connecting seat 12 and is connected to the corresponding cable.

[0033] The test mechanism is as follows:

[0034] 1. First, perform positioning debugging, press down the upper Z-axis probe mechanism 2, and ensure that the upper and lower probes are in concentric position; then, install the upper and lower test cables and connect the instrument;

[0035] 2. Place the product with the blue film side up in the center of the product seat;

[0036] 3. Press down the Z-axis probe mechanism 3, ensure that the upper probe pierces the surface blue film and can contact the product surface under the film;

[0037] 4. Observe the instrument test data;

[0038] 5. Reset the Z-axis part, move the product to the next test position, and repeat the above actions.

[0039] Finally, it should be noted that the above examples are only examples for clarity, and the utility model includes but is not limited to the above examples, and all implementation manners need not and cannot be exhausted here. For ordinary skilled persons in the art, other different forms of changes or variations can be made on the basis of the above description. Any implementation scheme meeting the requirements of the utility model belongs to the protection scope of the utility model.

Claims

1. A device for testing the capacitance of a sample of a batch of chip capacitors prior to production, characterized in that: It comprises a chassis (1), a Z-axis probe mechanism (2), a lower probe mechanism (3), a motion adjustment mechanism (4). The chassis (1) comprises a bottom plate (5), a test base (6), and support rods, a corresponding support rod screw hole (7) is arranged on the bottom plate (5) and the test base (6), the support rod is arranged between the test base (6) and the bottom plate (5), and the support rod is fixed to the test base (6) and the bottom plate (5) by screws; a product seat (8) is made on the top surface of the test base (6). The Z-axis probe mechanism (2) comprises a Z-axis sliding rail (9), a sliding block (10), a pressing plate (11), a probe connecting seat (12), a stand column (13), a limiting block (14), an upper probe (15), a tension spring (16), and a probe seat adapter printed circuit board (17); the sliding block (10) is matched with the Z-axis sliding rail (9); the probe connecting seat (12) is fixed on the sliding block (10) by screws; the probe connecting seat (12) is provided with a probe hole (18) for mounting the upper probe (15) and a probe seat screw hole (19), and the probe seat adapter printed circuit board (17) is mounted and fixed through the probe seat screw hole (19); the upper probe (15) is positioned and mounted through the hole in the connecting seat and is connected to the test signal on the printed circuit board by welding; the probe seat adapter printed circuit board (17) is fixed to the connecting seat by screws, and the Z-axis probe adapter (20) is connected to corresponding cables and connected to corresponding instruments or power sources through the cables. The lower probe mechanism (3) is mainly positioned below the center of the product seat (8), a lower probe adapter printed circuit board (21) is fixed on the hole position corresponding to the product seat (8) by screws, the lower probe adapter printed circuit board (21) is centrally welded with an elastic probe (22), the lower elastic probe is in a concentric position with the upper probe, and the lower probe adapter printed circuit board (21) is provided with a lower probe adapter test connector (23) connected to a test cable. The motion adjustment mechanism (4) comprises the stand column (13) and the tension spring (16), and the tension spring (16) is located on both sides of the stand column (13).

2. A device for testing the capacitance of a sample of a batch of chip capacitors prior to production, according to claim 1, characterized in that: The bottom plate (5) is a square metal bottom plate.

3. A device for testing the capacitance of a sample of a batch of chip capacitors before production, according to claim 1, characterized in that: The test base (6) is a square insulating base.

4. A device for testing the capacitance of a sample of a batch of chip capacitors before production, according to claim 1, characterized in that: The Z-axis sliding rail (9) is a groove type sliding rail.

5. A device for testing the capacitance of a sample of a batch of chip capacitors before production, according to claim 1, characterized in that: The sliding block (10) is a double-shaft core sliding block.

6. A device for testing the capacitance of a sample of a batch of chip capacitors before production, according to claim 1, characterized in that: The probe connecting seat (12) is an insulating material probe connecting seat.

7. A device for testing the capacitance of a sample of a batch of chip capacitors before production, according to claim 1, characterized in that: The probe inner core of the upper probe (15) is a tungsten inner core, the middle part is a Teflon insulating layer, and the outer part is wrapped with a purple copper hollow tube layer.

8. A device for testing the capacitance of a sample of a batch of chip capacitors before production, according to claim 1, characterized in that: The Z-axis probe adapter (20) is distributed around the probe connecting seat (12) and connected to corresponding cables.

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