Wire changing moving jig for plastic packaging of semiconductor device

Abstract

The utility model discloses a wire changing moving jig for plastic packaging of a semiconductor device, which relates to the technical field of production of the semiconductor device and comprises a wire changing moving jig assembly, a wire changing moving jig base, a wire changing moving jig base, a wire changing moving jig base and a wire changing moving jig base, and is characterized in that the wire changing moving jig assembly is used for clamping the semiconductor device; the locking mechanism is used for locking the wire changing moving jig assembly; the combined type lifting mechanism comprises a lower jig body and two sets of combined type lifting mechanisms, the two sets of combined type lifting mechanisms are symmetrically arranged, each combined type lifting mechanism comprises a lifting rod, a magnet, an extension arm, a rotating shaft and a torsional spring, and the lifting rods are located on the side face of the lower jig body. According to the utility model, the two combined parallel type lifting mechanisms can be magnetically connected, so that a user can take and move the lifting mechanisms with one hand, and the two combined parallel type lifting mechanisms can be automatically reset after being subsequently separated, and are more convenient in actual use.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device production, in particular to a line-changing mobile fixture for plastic packaging of semiconductor devices. Background Art

[0002] The conductivity of semiconductor devices is between that of good conductors and insulators. During the semiconductor production process, multiple semiconductor devices are usually required to be fixed on an outer frame for production and processing to improve the production efficiency of semiconductor devices.

[0003] After searching, the utility model patent with patent authorization announcement number CN219696428U discloses a line-changing mobile jig for plastic packaging of semiconductor devices, including a lower jig and an upper jig. A positioning block is fixedly provided in the middle of the front surface of the lower jig, and a positioning device is provided inside the positioning block. The lower jig is clamped to the upper surface of the upper jig through the positioning device. Both sides of the lower jig are provided with U-shaped receiving grooves, and handles are movably provided inside the receiving grooves on both sides; a semiconductor device fixing position is provided in the middle of the upper jig, and a fixing column is provided on the semiconductor device fixing position; and a semiconductor device pressing position is provided on the lower jig.

[0004] However, the above device still has some shortcomings in actual use. The most obvious one is that when the operator uses the unfolded handles to move the jig, since the two handles are located on both sides of the jig, in order to ensure stability during the picking process, the operator needs to use both hands to pick up the two handles separately and cannot achieve a one-handed picking operation, which is not convenient in actual use.

[0005] Therefore, it is necessary to invent a line-changing mobile fixture for semiconductor device plastic packaging to solve the above problems. Utility Model Content

[0006] The purpose of the present utility model is to provide a line-changing mobile jig for plastic packaging of semiconductor devices, which can magnetically connect two sets of combined lifting mechanisms, so that the user can pick up and move it with one hand. After the two sets of combined lifting mechanisms are subsequently separated, the two sets of combined lifting mechanisms can be automatically reset, which is more convenient in actual use. This solves the problem proposed in the above background technology that when the operator uses the unfolded handles to move the jig, since the two handles are located on both sides of the jig, in order to ensure stability during the picking process, the operator needs to use both hands to pick up the two handles separately and cannot achieve a one-handed picking operation, which is not convenient in actual use.

[0007] According to one aspect of the present disclosure, the following technical solution is provided: a line-changing moving fixture for plastic packaging of semiconductor devices, comprising:

[0008] A line-changing mobile fixture assembly, wherein the line-changing mobile fixture assembly is used to clamp semiconductor devices;

[0009] A locking mechanism, the locking mechanism being used to lock the line-changing movable fixture assembly; and

[0010] The combined lifting mechanism is provided with two groups of combined lifting mechanisms, and the two groups of combined lifting mechanisms are symmetrically arranged. The combined lifting mechanism includes a lifting rod, a magnet, an extension arm, a rotating shaft and a torsion spring. The lifting rod is located on the side of the lower jig, and the magnet is fixedly nested at the top center of the lifting rod. The magnets in the two groups of combined lifting mechanisms are attracted to each other. There are two extension arms, rotating shafts and torsion springs. The two extension arms are respectively fixedly connected to the two ends of the lifting rod, and the two rotating shafts respectively pass through the two extension arms and are fixedly connected to the lower jig. The extension arms are rotatably sleeved on the outside of adjacent rotating shafts through bearings. The two torsion springs are respectively sleeved on the outside of the two rotating shafts, and the torsion springs are fixedly connected between the lower jig and the adjacent extension arms.

[0011] According to at least one embodiment of the present disclosure, a line-changing movable jig for plastic packaging of semiconductor devices includes an upper jig and a lower jig, wherein the lower jig is located at the bottom of the upper jig.

[0012] According to at least one embodiment of the present disclosure, a line-changing movable jig for plastic packaging of semiconductor devices, the line-changing movable jig assembly further includes a positioning bump and a positioning groove, two of the positioning bumps and two of the positioning grooves are provided, the two positioning bumps are respectively fixedly provided on both sides of the bottom of the upper jig, and the two positioning grooves are respectively opened on both sides of the top of the lower jig, and the positioning bumps match the adjacent positioning grooves.

[0013] According to at least one embodiment of the present disclosure, in the line-changing movable jig for plastic packaging of semiconductor devices, the locking mechanism includes a locking groove, which is opened at the center of the front surface of the lower jig.

[0014] According to at least one embodiment of the present disclosure, the line-changing mobile jig for plastic packaging of semiconductor devices, the locking mechanism also includes an L-shaped plate, a locking pin and a return spring, the L-shaped plate is fixedly arranged at the center of the front of the upper jig, the locking pin passes through the front of the L-shaped plate and extends to the back of the L-shaped plate, and the return spring is sleeved on the outside of the locking pin and fixedly connected between the L-shaped plate and the locking pin.

[0015] The technical effects and advantages of this utility model are:

[0016] The utility model discloses a set up two groups of symmetrical setting combined type pull mechanism, in order to in with multiple semiconductor devices are clamped between upper fixture and lower fixture and utilize the locking mechanism to complete the locking of upper fixture and lower fixture, with two pull rods each adjacent rotation axis as the pivot, two rotation axes are rotated, until the extension arm in two groups of combined type pull mechanism all is in vertical state, at this time, two magnets mutually adsorb, and then connect two pull rods, and then the operator can hold the middle part of two pull rods, and then drive the line changing mobile fixture assembly to move, after moving, push two pull rods to the direction of moving away from each other, and then make two magnets separate each other, at this time, the torsional spring drives the extension arm to rotate around the rotation axis reversely, until reset, compared with the same type product of prior art, the utility model discloses can carry out the magnetic connection to two groups of combined type pull mechanism, and then can be taken and moved by the user with one hand, after separating two groups of combined type pull mechanism, two groups of combined type pull mechanism can realize automatic reset, and it is more convenient when actually using. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the general description of the disclosure given above, and the detailed description of the embodiments below, serve to explain the principles of the present disclosure.

[0018] Figure 1 It is the whole structure schematic diagram of semiconductor device plastic package line changing mobile fixture according to an embodiment of the present disclosure.

[0019] Figure 2 It is the line changing mobile fixture assembly and locking mechanism structure schematic diagram of semiconductor device plastic package line changing mobile fixture according to an embodiment of the present disclosure.

[0020] Figure 3 It is the combined type pull mechanism structure schematic diagram of semiconductor device plastic package line changing mobile fixture according to an embodiment of the present disclosure.

[0021] The specific figure mark in the drawing is:

[0022] 1, line changing mobile fixture assembly;11, upper fixture;12, lower fixture;13, positioning lug;14, positioning recess;

[0023] 2, locking mechanism;21, locking groove;22, L-shaped plate;23, locking pin;24, reset spring;

[0024] 3, combined type pull mechanism;31, pull rod;32, magnet;33, extension arm;34, rotation axis;35, torsional spring. DETAILED DESCRIPTION

[0025] For descriptive purposes, the present disclosure can use spatial or relative terms, such as "below," "lower," "under," "lessor," "above," "upper" and the like, to describe a relationship of one element, feature, structure or component to another element, feature, structure or component as illustrated in the figures. Unless otherwise noted, the spatial and / or relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture, for example, if the device in the figures is turned over, elements described as "below" or "under" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. Moreover, the device can be otherwise oriented (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0026] Figure 1 is a schematic diagram of the overall structure of a line-changing moving jig for semiconductor device plastic packaging according to an embodiment of the present disclosure.

[0027] Figure 2 is a schematic diagram of the structure of a line-changing moving jig assembly 1 and a locking mechanism 2 of a line-changing moving jig for semiconductor device plastic packaging according to an embodiment of the present disclosure.

[0028] Figure 3 is a schematic diagram of the structure of a combined lifting mechanism 3 of a line-changing moving jig for semiconductor device plastic packaging according to an embodiment of the present disclosure.

[0029] As shown in Figures 1-3 , the line-changing moving jig for semiconductor device plastic packaging of the present disclosure can include a line-changing moving jig assembly 1, a locking mechanism 2, and a combined lifting mechanism 3, and the like.

[0030] As shown in Figure 2 , in the present disclosure, the line-changing moving jig assembly 1 includes an upper jig 11, a lower jig 12, positioning lugs 13, and positioning grooves 14, wherein the lower jig 12 is located at the bottom of the upper jig 11, the positioning lugs 13 and the positioning grooves 14 are each provided with two, the two positioning lugs 13 are respectively fixedly provided on both sides of the bottom of the upper jig 11, the two positioning grooves 14 are respectively formed on both sides of the top of the lower jig 12, and the positioning lugs 13 and the adjacent positioning grooves 14 are matched.

[0031] Thus, in order to facilitate the upper jig 11 is removed from the top of the lower jig 12, then the plurality of semiconductor devices placed on the top of the lower jig 12 clamping station, then the upper jig 11 is placed on the top of the plurality of semiconductor devices, in the process, the positioning block 13 is inserted into the positioning groove 14 inside, and then the movement of the upper jig 11 is guided, until the positioning block 13 is inserted into the positioning groove 14 inside the bottom.

[0032] As shown in Figure 2 In a preferred embodiment, the locking mechanism 2 includes a locking slot 21, an L-shaped plate 22, a locking pin 23 and a return spring 24, wherein the locking slot 21 is provided on the front center of the lower jig 12, the L-shaped plate 22 is fixedly arranged on the front center of the upper jig 11, the locking pin 23 extends through the front of the L-shaped plate 22 and extends to the back of the L-shaped plate 22, and the return spring 24 is sleeved on the outside of the locking pin 23 and fixedly connected between the L-shaped plate 22 and the locking pin 23.

[0033] Thus, in order to facilitate the upper jig 11 is removed from the top of the lower jig 12, then the plurality of semiconductor devices placed on the top of the lower jig 12 clamping station, then the upper jig 11 is placed on the top of the plurality of semiconductor devices, in the process, the positioning block 13 is inserted into the positioning groove 14 inside, and then the movement of the upper jig 11 is guided, until the positioning block 13 is inserted into the positioning groove 14 inside the bottom.

[0034] As shown in Figure 3 In the present disclosure, the combined lifting mechanism 3 is provided with two groups, and the two groups of the combined lifting mechanism 3 are symmetrically arranged. The combined lifting mechanism 3 includes a lifting rod 31, a magnet 32, an extension arm 33, a rotating shaft 34 and a torsional spring 35, wherein the lifting rod 31 is located on the side of the lower jig 12, the magnet 32 is fixedly nested on the top center of the lifting rod 31, the magnets 32 in the two groups of the combined lifting mechanism 3 are attracted to each other, the extension arm 33, the rotating shaft 34 and the torsional spring 35 are provided with two, the two extension arms 33 are fixedly connected to the two ends of the lifting rod 31, the two rotating shafts 34 are respectively penetrated through the two extension arms 33 and are fixedly connected with the lower jig 12, the extension arm 33 is rotatably sleeved on the outside of the adjacent rotating shaft 34 through the bearing, and the two torsional springs 35 are respectively sleeved on the outside of the two rotating shafts 34, and the torsional spring 35 is fixedly connected between the lower jig 12 and the adjacent extension arm 33.

[0035] Thus, in order to facilitate the rotation of the two rotating shafts 34 with the adjacent rotating shaft 34 of the two lifting rods 31 as the axis until the extension arms 33 in the two combined lifting mechanisms 3 are all in the vertical state, at this time the two magnets 32 are adsorbed with each other, and then the two lifting rods 31 are connected, then the operator can hold the middle part of the two lifting rods 31, and then drive the line changing moving jig assembly 1 to move, after the movement is completed, the two lifting rods 31 are pushed away from each other, and then the two magnets 32 are separated from each other, at this time the torsional spring 35 drives the extension arm 33 to rotate reversely with the rotating shaft 34 as the axis until it is reset. Compared with the same type of product, the two combined lifting mechanisms 3 can be magnetically connected, and then the user can take and move with one hand, and after the two combined lifting mechanisms 3 are separated, the two combined lifting mechanisms 3 can be automatically reset, which is more convenient in actual use.

[0036] In addition, it also needs to be explained that the contents not described in detail in the specification belong to the prior art known to those skilled in the art.

[0037] Those skilled in the art should understand that the above embodiments are only for clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. Based on the above disclosure, other changes or modifications can also be made by those skilled in the art, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A change line transfer jig for a semiconductor device plastic package, characterized by comprising: The utility model relates to a semiconductor device production line, including: a line-changing moving jig assembly for clamping a semiconductor device; a locking mechanism for locking the line-changing moving jig assembly; and a combined lifting mechanism provided in two symmetrical groups, the combined lifting mechanism including a lifting rod, a magnet, an extension arm, a rotating shaft, and a torsional spring. The lifting rod is located on the side of the lower jig.

2. The semiconductor device plastic packaging line change moving jig according to claim 1, wherein: The magnet is fixedly nested at the center of the top of the lifting rod.

3. The semiconductor device plastic packaging line change moving jig according to claim 2, wherein: The magnets of the two groups of combined lifting mechanisms are attracted to each other.

4. The semiconductor device plastic packaging line change moving jig according to claim 3, wherein: The extension arm, the rotating shaft, and the torsional spring are each provided in two.

5. The semiconductor device plastic packaging line change moving jig according to claim 4, wherein: The two extension arms are fixedly connected to the two ends of the lifting rod. The two rotating shafts are each threaded through the two extension arms and are fixedly connected to the lower jig. The extension arm is rotatably sleeved on the outside of the adjacent rotating shaft via a bearing. The two torsional springs are each sleeved on the outside of the two rotating shafts. The torsional spring is fixedly connected between the lower jig and the adjacent extension arm. The line-changing moving jig assembly includes an upper jig and a lower jig. The lower jig is located at the bottom of the upper jig. The line-changing moving jig assembly further includes positioning lugs and positioning grooves. The positioning lugs and the positioning grooves are each provided in two. The two positioning lugs are each fixedly provided on the two sides of the bottom of the upper jig. The two positioning grooves are each formed on the two sides of the top of the lower jig. The positioning lugs are matched with the adjacent positioning grooves. The locking mechanism includes a locking slot. The locking slot is formed at the center of the front of the lower jig. The locking mechanism further includes an L-shaped plate, a locking pin, and a return spring. The L-shaped plate is fixedly provided at the center of the front of the upper jig. The locking pin is threaded through the front of the L-shaped plate and extends to the back of the L-shaped plate. The return spring is sleeved on the outside of the locking pin and is fixedly connected between the L-shaped plate and the locking pin.

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