Aluminum-plastic liquid cooling plate heat dissipation structure
By using PI film as the insulating and thermal conductive layer on the aluminum-plastic liquid cold plate, the problems of high energy consumption, material instability and health hazards caused by the spraying process are solved, and a high-efficiency insulation, low-cost and environmentally friendly heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202422858409.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-21
AI Technical Summary
The insulating and thermally conductive layer of existing aluminum-plastic liquid cooling panels is formed through a spraying process, which results in high energy consumption, unstable material properties, possible cracking or peeling, and the release of harmful substances that pose a health hazard and affect service life and safety.
PI film is used as the insulating and thermal conductive layer and is fixed to the liquid cold plate body by gluing, avoiding the complicated painting process. It has good insulation, thermal conductivity and chemical corrosion resistance, and its thermal expansion coefficient is similar to that of metal, reducing the risk of cracking.
It improves insulation performance and service life, reduces production costs and health risks, enhances production efficiency, avoids cracking and peeling problems, and is environmentally friendly.
Smart Images

Figure CN223462301U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to heat dissipation structure technical field, concretely relates to a kind of aluminium plastic liquid cooling plate heat dissipation structure. BACKGROUND
[0002] In order to cool the module in battery cabinet, its inside will be provided with liquid cooling plate and other heat dissipation structure.In order to guarantee insulation and heat conduction effect, the surface of existing liquid cooling plate is coated with insulating and heat conducting layer.
[0003] Aluminium plastic liquid cooling plate combines the high thermal conductivity of aluminum and the lightweight characteristics of plastic, so it has the advantages of high efficiency heat dissipation and lightness.The insulating and heat conducting layer of traditional aluminium plastic liquid cooling plate is sprayed on its surface by spraying process, and the temperature often needs to reach above 180℃, and must go through the process of cold and hot alternation.However, forming insulating and heat conducting layer on the surface of aluminium plastic liquid cooling plate by spraying process not only increases energy consumption, but also may cause instability of material performance, especially when the temperature changes sharply, the difference in expansion coefficient between aluminium plastic liquid cooling plate and insulating and heat conducting layer may cause cracking or peeling of the coating, affecting the insulation performance and service life of liquid cooling plate, in addition, VOCs will be released during the painting process, which is harmful to human health and may cause respiratory irritation, headache, dizziness and other health problems. SUMMARY
[0004] The utility model aims at overcoming the deficiencies in the prior art, and provides an aluminium plastic liquid cooling plate heat dissipation structure.
[0005] To achieve the above purpose, the utility model discloses an aluminium plastic liquid cooling plate heat dissipation structure, which comprises a liquid cooling plate body, an inlet plug and an outlet plug, a through flow channel is arranged in the liquid cooling plate body, the flow channel is used for flowing cooling medium in the liquid cooling plate body to dissipate heat for an object placed on the liquid cooling plate body, the two ends of the flow channel are an inlet and an outlet, the inlet plug and the outlet plug are connected to the inlet and the outlet respectively, and a PI film is bonded to the surface of the liquid cooling plate body.
[0006] Preferably, the surface of the liquid cooling plate body is provided with a polishing layer, and the PI film is pasted on the polishing layer.
[0007] Preferably, the liquid cooling plate body is a harmonica tube.
[0008] Preferably, one end of the inlet plug is provided with a counterplug slot, and one end of the liquid cooling plate body is inserted into the counterplug slot.
[0009] Preferably, glue is bonded between the liquid cooling plate body and the inlet plug.
[0010] Preferably, the glue is foundry glue.
[0011] Preferably, a reinforcing sleeve is further included, the reinforcing sleeve is sleeved outside the inlet plug, the inner side wall of the reinforcing sleeve is in contact with the outer side wall of the inlet plug, one end of the reinforcing sleeve extends inwardly to a limiting portion, the end face of the limiting portion close to the inlet plug is in abutment with the inlet plug, and the inner side wall of the limiting portion is in contact with the outer side wall of the liquid cooling plate body.
[0012] Preferably, the material of the liquid cooling plate body is one of AL-Mn alloy, 1060 pure aluminum, 1235 aluminum alloy and 8011 aluminum alloy.
[0013] Compared with the prior art, the utility model has the advantages that:
[0014] The PI film (polyimide film) is used as the insulating and heat-conducting layer of the aluminum-plastic liquid cooling plate, which has the following advantages compared with the traditional insulating and heat-conducting layer prepared by the spraying process:
[0015] Firstly, the PI film has good insulation performance, heat conduction performance and chemical corrosion resistance, thereby providing more reliable long-term use guarantee for the liquid cooling plate body.
[0016] Secondly, the use of the PI film has a significant advantage in cost-effectiveness, and the procurement and application cost of the PI film is lower than that of the traditional spraying process, which helps to reduce the overall production cost.
[0017] In addition, the PI film has a more friendly normal temperature operation environment, and it is fixed on the liquid cooling plate body by pasting, without the need for complex spraying and baking processes, thereby reducing the pollution to the environment and the health risk to the operators.
[0018] In addition, the PI film has a similar thermal expansion coefficient to metal and has a certain flexibility, so that even if the aluminum-plastic liquid cooling plate is in an environment with a large temperature difference, it is not easy to crack, thereby avoiding the problem that the traditional insulating and heat-conducting layer formed by spraying is easy to crack or peel off in an environment with a large temperature difference. The application of the PI film is more flexible, easy to process and form, and the production efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the aluminum-plastic liquid cooling plate heat dissipation structure in the embodiment;
[0020] Figure 2 It is a schematic diagram of the three-dimensional structure of the aluminum-plastic liquid cooling plate heat dissipation structure in the embodiment; Figure 1
[0021] Liquid cooling plate body 1; flow channel 11; inlet 111; polishing layer 12;
[0022] Inlet plug 2;
[0023] Outlet plug 3; counter plug groove 31;
[0024] Reinforcing sleeve 4; limiting portion 41;
[0025] PI film 5. DETAILED DESCRIPTION
[0026] In order to make the above-mentioned purposes, features and advantages of the utility model more apparent, obvious and comprehensible, the utility model will be further explained in detail below in combination with the drawings and specific embodiments.
[0027] An aluminum-plastic liquid cooling plate heat dissipation structure, referring to Figures 1-2 , comprising a liquid cooling plate body 1, an inlet plug 2 and an outlet plug 3, a through flow channel 11 is arranged in the liquid cooling plate body 1, the flow channel is used for flowing cooling medium in the liquid cooling plate body 1 to dissipate heat for an object placed on the liquid cooling plate body 1, both ends of the flow channel are an inlet 111 and an outlet, the inlet plug 2 and the outlet plug 3 are connected to the inlet 111 and the outlet respectively, and a PI film 5 is bonded to the surface of the liquid cooling plate body 1.
[0028] In the aluminum-plastic liquid cooling plate structure in the embodiment, the PI film 5 (polyimide film) is used as the insulating and heat-conducting layer of the aluminum-plastic liquid cooling plate, which has the following advantages compared with the traditional insulating and heat-conducting layer prepared by the spraying process: firstly, the PI film 5 has good insulating performance, heat-conducting performance and chemical corrosion resistance, which provides more reliable long-term use guarantee for the liquid cooling plate body 1. Secondly, the use of the PI film 5 has a significant advantage in cost-effectiveness, and the procurement and application cost of the PI film 5 is lower than that of the traditional spraying process, which helps to reduce the overall production cost. In addition, the normal temperature working environment of the PI film 5 is more friendly, it is fixed on the liquid cooling plate body 1 by pasting, without the need for complex spraying and baking process, thereby reducing the pollution to the environment and the health risk to the operators. In addition, the PI film 5 has a similar thermal expansion coefficient to metal and has a certain flexibility, so even if the aluminum-plastic liquid cooling plate is in an environment with a large temperature difference, it is not easy to crack, avoiding the problem that the traditional insulating and heat-conducting layer formed by spraying is easy to crack or peel off in an environment with a large temperature difference. The application of the PI film 5 is more flexible, easy to process and form, and improves the production efficiency.
[0029] In the embodiment, the surface of the liquid cooling plate body 1 is provided with a polishing layer 12, and the polishing layer 12 is formed by polishing, which can remove the oxide layer, and the PI film 5 is pasted on the polishing layer 12, which can increase the surface adsorption force and improve the pasting and fixing effect. After pasting is completed, air bubbles can be squeezed out by rolling.
[0030] In the embodiment, the liquid cooling plate body 1 is a harmonica tube, which has a simple structure, low cost and light weight.
[0031] In the embodiment, one end of the inlet plug 2 is provided with a counter plug slot, and one end of the liquid cooling plate body 1 is inserted into the counter plug slot. The other end of the liquid cooling plate is also provided with a counter plug slot 31 matched with the outlet plug 3. The two plugs are connected with the liquid cooling plate body 1 through the counter plug slots, and the structure is simple and convenient to assemble.
[0032] The glue is used to bond the liquid cooling plate body 1, the inlet plug 2 and the outlet plug 3, which can improve the fixing effect and the sealing performance, and prevent the cooling medium from leaking from the liquid cooling plate body 1, the inlet plug 2 and the outlet plug 3.
[0033] The glue is preferably cast glue, and specifically, epoxy resin AB glue 1:1 is uniformly mixed.
[0034] In the embodiment, a reinforcing sleeve 4 is further arranged outside the inlet plug 2. The inner side wall of the reinforcing sleeve 4 is in contact with the outer side wall of the inlet plug 2. One end of the reinforcing sleeve 4 extends inwardly to form a limiting portion 41. The end face of the limiting portion 41 close to the inlet plug 2 is in abutment with the inlet plug 2. The inner side wall of the limiting portion 41 is in contact with the outer side wall of the liquid cooling plate body 1. The reinforcing sleeve 4 can improve the strength between the inlet plug 2 and the liquid cooling plate body 1, and further improve the sealing performance of the connecting position.
[0035] In the embodiment, the reinforcing sleeve 4 is also arranged between the outlet plug 3 and the liquid cooling plate body 1.
[0036] In the embodiment, the material of the liquid cooling plate body 1 includes but is not limited to one of AL-Mn alloy, 1060 pure aluminum, 1235 aluminum alloy and 8011 aluminum alloy. The material of the two plugs is plastic plug material PA66+GF35.
[0037] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the utility model, and are not the limitation of the embodiments of the utility model. For ordinary skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claim.
Claims
1. An aluminum plastic liquid cooling plate heat dissipation structure, characterized in that: The liquid cooling plate body is internally provided with a through flow channel for cooling medium to flow in the liquid cooling plate body to dissipate heat for an object placed on the liquid cooling plate body, two ends of the flow channel are an inlet and an outlet, the inlet plug and the outlet plug are connected to the inlet and the outlet respectively, and a PI film is bonded to a surface of the liquid cooling plate body.
2. The liquid-cooled aluminum plastic plate heat dissipation structure according to claim 1, characterized in that: The surface of the liquid cooling plate body is provided with a polishing layer, and the PI film is bonded to the polishing layer.
3. The liquid-cooled aluminum plastic plate heat dissipation structure according to claim 1, characterized in that: The liquid cooling plate body is a harmonica tube.
4. The liquid-cooled aluminum plastic plate heat dissipation structure according to claim 1, characterized in that: One end of the inlet plug is provided with a counter plug slot, and one end of the liquid cooling plate body is inserted into the counter plug slot.
5. The liquid-cooled aluminum plastic plate heat dissipation structure according to claim 4, characterized in that: Glue is bonded between the liquid cooling plate body and the inlet plug.
6. The liquid-cooled aluminum plastic plate heat dissipation structure according to claim 5, characterized in that: The glue is a foundry glue.
7. The liquid-cooled aluminum plastic plate heat dissipation structure according to claim 4, characterized in that: A reinforcing sleeve is further included, the reinforcing sleeve is sleeved outside the inlet plug, an inner side wall of the reinforcing sleeve is in contact with an outer side wall of the inlet plug, one end of the reinforcing sleeve extends inwardly to a limiting portion, an end face of the limiting portion close to the inlet plug is in abutment with the inlet plug, and an inner side wall of the limiting portion is in contact with an outer side wall of the liquid cooling plate body. 8.The liquid-cooled aluminum plastic plate heat dissipation structure according to claim 1, characterized in that: The material of the liquid cooling plate body is one of AL-Mn alloy, 1060 pure aluminum, 1235 aluminum alloy and 8011 aluminum alloy.