Quickly-assembled circuit board substrate

Abstract

The utility model discloses a fast-assembly type circuit board substrate, which relates to the technical field of circuit boards, and comprises a shell, a circuit substrate arranged in the shell, and a mounting assembly arranged at the bottom of the circuit substrate, the mounting assembly comprises a fixing plate arranged at the bottom of the circuit substrate, a toothed plate oppositely arranged on the outer side of the fixing plate and a positioning unit arranged on the side portion of the toothed plate, and the positioning unit comprises a fixing shell installed on the top of the bottom plate and a movable groove formed in the inner side of the fixing shell; the heat dissipation assembly is arranged at the bottom of the shell; the heat dissipation assembly comprises a heat dissipation opening formed in the bottom of the shell, a heat conduction plate arranged at the heat dissipation opening, and a heat conduction piece arranged between the heat conduction plate and the circuit substrate. According to the fast-assembly type circuit board substrate, through the arrangement of the installation assembly and the heat dissipation assembly, the fixing effect on the circuit substrate is improved, the heat dissipation effect is improved, and the circuit substrate is prevented from being affected and damaged by high temperature.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a quick -wearing formula circuit board base plate. BACKGROUND

[0002] The base plate is the basic material of manufacturing PCB, under normal circumstances, the base plate is copper clad laminate, single -sided, double -sided printed board is in the manufacture on the base plate material copper clad laminate, selectively carry out hole processing, chemical copper plating, electroplating copper, etching etc. Processing, get the required circuit pattern, finally make circuit board.

[0003] Disclosed in publication (announcement) No. CN219228190U is a quick -wearing formula circuit board base plate, and relates to the technical field of circuit board base plate, including installation shell and circuit base plate, the inside of installation shell is provided with circuit base plate, the bottom end in the inside of installation shell is installed with a plurality of fixed columns, the bottom end of circuit base plate is installed with a plurality of fixed rods, and the bottom end of fixed rod extends to the inside of fixed column and is installed with a disc. The utility model discloses a disc is inserted into the inside of fixed column, so that the disc extrudes the limit block to the outside, causes the limit block to disperse and allows the disc to pass, and after the disc passes, the sleeve spring is pushed down by reset and moves the sleeve, so that the sleeve pulls the moving strip close by the transmission rod, so that the limit block blocks the top of the disc, thereby limiting the return of the disc, completing the fixed connection between the circuit base plate and the fixed column, compared with the bolt fixed mode, installation is more convenient.

[0004] Although the above scheme has the advantage of convenient installation, but in the actual use process, due to the elastic attenuation of spring long -term use, it is easy to affect the extrusion force of the disc, so as to cause the clamping force of the disc to be insufficient, and the fixing effect is poor, and the above scheme does not set up the heat dissipation structure, and the circuit base plate is easy to be damaged by high temperature in the use process, therefore we propose a quick -wearing formula circuit board base plate. UTILITY MODEL CONTENTS

[0005] The main purpose of the utility model is to provide a quick -wearing formula circuit board base plate, by the installation assembly, to solve the problem that in the actual use process, due to the elastic attenuation of spring long -term use, it is easy to affect the extrusion force of the disc, so as to cause the clamping force of the disc to be insufficient, and the fixing effect is poor, by the heat dissipation assembly, to solve the problem that the above scheme does not set up the heat dissipation structure, and the circuit base plate is easy to be damaged by high temperature in the use process.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] A quick -wearing formula circuit board base plate, including shell, the circuit base plate set up in the inside of shell, still include:

[0008] A mounting assembly, the mounting assembly being disposed on the bottom of the circuit substrate;

[0009] The mounting assembly includes a fixing plate arranged at the bottom of the circuit substrate, a tooth plate arranged on the outside of the fixing plate, and a positioning unit arranged on the side of the tooth plate;

[0010] a heat dissipation component, the heat dissipation component being arranged at the bottom of the housing;

[0011] The heat dissipation assembly comprises a heat dissipation port arranged at the bottom of the shell, a heat conduction plate arranged at the heat dissipation port, and a heat conduction member arranged between the heat conduction plate and the circuit substrate.

[0012] Preferably, the shell consists of a bottom plate and vertical plates installed on four sides of the bottom plate.

[0013] Preferably, opposite side surfaces of the fixing plate are both provided with latching teeth, and the latching teeth are consistent with the tooth patterns on the side surfaces of the tooth plate.

[0014] Preferably, the positioning unit includes a fixed shell installed on the top of the base plate, a movable groove provided on the inner side of the fixed shell, a slide plate movably provided inside the movable groove, and a positioning groove provided on the top surface of the slide plate;

[0015] A reset member is provided between the slide plate and the side wall of the movable groove;

[0016] A positioning rod is provided inside the positioning groove, and an extrusion portion is provided outside the positioning rod.

[0017] Preferably, the extrusion part includes a mounting groove arranged inside the fixed shell, a limiting ring movably arranged inside the mounting groove, and an extrusion piece arranged on the top of the limiting ring, and the limiting ring is installed on the surface of the positioning rod.

[0018] Preferably, the heat conducting member includes a connecting column mounted on the top of the heat conducting plate and a heat conducting rubber column provided between the connecting column and the circuit substrate.

[0019] Preferably, heat dissipation fins are installed on the bottom of the heat conducting plate.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The utility model discloses a mounting assembly is set up, when installing circuit substrate, first place circuit substrate in the inside of shell, and make the fixed plate of circuit substrate bottom be located between two toothed plates, cooperate and press circuit substrate and make it move down, to make the fixed plate extrude two toothed plates and slide along the inside of movable slot under the action of sliding plate, to make the fixed plate move to between two toothed plates, and cooperate and limit the fixed plate with the tooth pattern of toothed plate side face and fix, and the sliding plate will extrude positioning rod and make it go up when moving, when the bottom end of positioning rod and the position of positioning groove correspond, make positioning rod go down and be combined with positioning groove under the cooperation of the elastic extrusion of extruding piece and the limiting ring, to fix the position of sliding plate and toothed plate, avoid the fixed plate to shake, improved the fixed effect of circuit substrate.

[0022] Two, the utility model discloses a heat dissipation assembly is set up, when the heat of circuit substrate is generated in the use process, and the heat will be transferred to the connecting column on the heat conduction rubber column, and is transferred to the heat conduction plate on the cooperation of connecting column, and the heat conduction plate disperses the heat on a plurality of radiating fins, and because the side of radiating fin is set up with the heat dissipation hole, increase the area of contact with air, improve the heat dissipation effect, avoid the damage of circuit substrate under the influence of high temperature. ACCURACY OF DRAWINGS

[0023] Figure 1 It is the whole three-dimensional structure schematic diagram of the utility model;

[0024] Figure 2 It is the plan view of the utility model;

[0025] Figure 3 It is the utility model Figure 2 A-A place section structure schematic diagram in the utility model;

[0026] Figure 4 It is the utility model Figure 3 B place enlarged structure schematic diagram in the utility model;

[0027] Figure 5 It is the utility model Figure 3 C place enlarged structure schematic diagram in the utility model.

[0028] In the drawing:

[0029] 1, shell;11, bottom plate;12, vertical plate;

[0030] 2, circuit substrate;

[0031] 3, mounting assembly;31, fixed plate;311, catch;32, toothed plate;33, positioning unit;331, fixed shell;332, sliding plate;333, positioning groove;334, reset piece;335, positioning rod;336, extrusion part;3361, limiting ring;3362, extruding piece;

[0032] 4. Radiating assembly; 41. Radiating port; 42. Heat-conducting plate; 43. Heat-conducting member; 431. Connecting column; 432. Heat-conducting rubber column; 44. Radiating fin. DETAILED DESCRIPTION

[0033] In order to make the technical means, creative features, purposes and effects of the utility model easy to understand, the utility model is further described below in combination with specific embodiments.

[0034] Embodiment one: as shown in a quick-mounting type circuit board substrate, comprising a shell 1, a circuit board 2 arranged inside the shell 1, further comprising: Figures 1-5 An installation assembly 3 is arranged at the bottom of the circuit board 2.

[0035] The installation assembly 3 comprises a fixing plate 31 arranged at the bottom of the circuit board 2, a toothed plate 32 oppositely arranged outside the fixing plate 31, and a positioning unit 33 arranged at the side of the toothed plate 32.

[0036] A radiating assembly 4 is arranged at the bottom of the shell 1.

[0037] The radiating assembly 4 comprises a radiating port 41 arranged at the bottom of the shell 1, a heat-conducting plate 42 arranged at the radiating port 41, and a heat-conducting member 43 arranged between the heat-conducting plate 42 and the circuit board 2.

[0038] The shell 1 is composed of a bottom plate 11 and vertical plates 12 mounted on the four side edges of the bottom plate 11, and the vertical plates 12 are fixedly connected with the bottom plate 11 through bolts, facilitating disassembly and assembly of the shell 1.

[0039] The opposite sides of the fixing plate 31 are each provided with a clamping tooth 311, which is in line with the tooth pattern on the side of the toothed plate 32, and the clamping tooth 311 cooperates with the toothed plate 32 to limit the fixing plate 31.

[0040] The positioning unit 33 comprises a fixing shell 331 mounted on the top of the bottom plate 11, a movable groove arranged inside the fixing shell 331, a sliding plate 332 movably arranged inside the movable groove, and a positioning groove 333 arranged on the top surface of the sliding plate 332, and the sliding plate 332 is mounted on the side of the toothed plate 32.

[0041] A reset member 334 is arranged between the sliding plate 332 and the side wall of the movable groove.

[0042] A positioning rod 335 is arranged inside the positioning groove 333, and an extrusion portion 336 is arranged outside the positioning rod 335, and preferably, the top of the side of the positioning groove 333 and the bottom of the side of the positioning rod 335 are each provided with a beveled surface.

[0043]

[0044] ​The extrusion part 336 includes a mounting groove arranged inside the fixed shell 331, a limiting ring 3361 movably arranged inside the mounting groove, and an extrusion piece 3362 arranged on the top of the limiting ring 3361. The limiting ring 3361 is installed on the surface of the positioning rod 335. Preferably, the extrusion piece 3362 is an extrusion spring. The top end of the positioning rod 335 extends through to the top of the fixed shell 331 and is welded with a handle.

[0045] When the locking plate 31 is unlocked, the locking plate 31 is unlocked and the locking plate 31 is unlocked, so that the two locking plates 31 are unlocked and the two locking plates 31 are unlocked.

[0046] Example 2: Figures 1-5 As shown, a quick-install circuit board substrate includes a housing 1, a circuit substrate 2 disposed inside the housing 1, and further includes:

[0047] The mounting assembly 3 is arranged at the bottom of the circuit substrate 2;

[0048] The mounting assembly 3 includes a fixing plate 31 disposed at the bottom of the circuit substrate 2, a tooth plate 32 disposed on the outside of the fixing plate 31, and a positioning unit 33 disposed on the side of the tooth plate 32;

[0049] The heat dissipation component 4 is arranged at the bottom of the housing 1;

[0050] The heat dissipation assembly 4 includes a heat dissipation port 41 disposed at the bottom of the housing 1 , a heat conduction plate 42 disposed at the heat dissipation port 41 , and a heat conduction member 43 disposed between the heat conduction plate 42 and the circuit substrate 2 .

[0051] The heat conducting member 43 includes a connecting column 431 mounted on the top of the heat conducting plate 42 and a heat conducting rubber column 432 disposed between the connecting column 431 and the circuit substrate 2 . Preferably, the connecting column 431 is made of a heat conducting material.

[0052] The bottom of the heat-conducting plate 42 is provided with heat dissipation fins 44, preferably a plurality of heat dissipation fins 44 are equidistantly distributed on the bottom of the heat-conducting plate 42, and the side surface of each heat dissipation fin 44 is provided with a heat dissipation hole.

[0053] When the circuit board 2 generates heat during use, the heat is transmitted to the connecting column 431 through the heat-conducting rubber column 432, and is transmitted to the heat-conducting plate 42 through the connecting column 431, and the heat-conducting plate 42 disperses the heat to the plurality of heat dissipation fins 44, and because the side surface of the heat dissipation fin 44 is provided with a heat dissipation hole, the area in contact with the air is increased, the heat dissipation effect is improved, and the external air enters the inside of the shell 1 through the heat dissipation port 41 to take away the heat.

Claims

1. A quick-mounting circuit board substrate comprising a housing (1), a circuit board (2) disposed inside the housing (1), characterized in that, Also include: The mounting assembly (3) is arranged at the bottom of the circuit board (2); The mounting assembly (3) includes a fixed plate (31) arranged at the bottom of the circuit board (2), a tooth plate (32) arranged opposite to the outer side of the fixed plate (31), and a positioning unit (33) arranged at the side of the tooth plate (32); The heat dissipation assembly (4) is arranged at the bottom of the shell (1); The heat dissipation assembly (4) includes a heat dissipation opening (41) arranged at the bottom of the shell (1), a heat conduction plate (42) arranged at the heat dissipation opening (41), and a heat conduction piece (43) arranged between the heat conduction plate (42) and the circuit board (2).

2. The quick-mounting circuit board substrate according to claim 1, wherein: The shell (1) is composed of a bottom plate (11) and vertical plates (12) mounted on the four side edges of the bottom plate (11).

3. The quick-mounting circuit board substrate according to claim 2, wherein: The opposite sides of the fixed plate (31) are provided with clamping teeth (311) which are matched with the tooth patterns on the side of the tooth plate (32).

4. The quick-mounting circuit board substrate according to claim 3, wherein: The positioning unit (33) includes a fixed shell (331) mounted on the top of the bottom plate (11), a movable groove arranged on the inner side of the fixed shell (331), a sliding plate (332) movably arranged in the movable groove, and a positioning groove (333) arranged on the top surface of the sliding plate (332). The sliding plate (332) and the side wall of the movable groove are provided with a reset piece (334); The positioning groove (333) is provided with a positioning rod (335) inside, and the outer side of the positioning rod (335) is provided with an extrusion part (336).

5. The quick-mounting circuit board substrate according to claim 4, wherein: The extrusion part (336) includes a mounting groove arranged inside the fixed shell (331), a limiting ring (3361) movably arranged in the mounting groove, and an extrusion piece (3362) arranged on the top of the limiting ring (3361), and the limiting ring (3361) is mounted on the surface of the positioning rod (335).

6. The quick-mounting circuit board substrate according to claim 5, wherein: The heat conduction piece (43) includes a connecting column (431) mounted on the top of the heat conduction plate (42) and a heat conduction rubber column (432) arranged between the connecting column (431) and the circuit board (2).

7. The quick-mounting circuit board substrate according to claim 6, wherein: The bottom of the heat conduction plate (42) is provided with a heat dissipation fin (44).

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