Chip cooling system

Abstract

The utility model relates to the technical field of chip cooling, in particular to a chip cooling system, which comprises a chip cabin for placing a chip, a condensation barrel communicated with the chip cabin and a pressure sensor arranged on the chip cabin, and the condensation barrel is used for providing refrigerant for the chip cabin. When the chip is cooled, a refrigerant is led to the chip cabin from the condensation barrel, and after the chip is cooled in the chip cabin, the refrigerant is led to the condensation barrel from the chip cabin to form circulation. Due to the fact that the refrigerant is adopted for cooling and heat dissipation of the chip, compared with air, the specific heat capacity is higher, needed energy consumption is low, and the heat dissipation efficiency of the chip is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip cooling technical field, concretely relates to a chip cooling system. BACKGROUND

[0002] These years, chip computing quantity requirement is bigger and bigger, data computer room construction quantity is bigger and bigger, and a large amount of power demand is generated, wherein the chip heat dissipation usually needs mechanical refrigeration mode to provide cold quantity, and the common is to provide a cool wind to the computer room by air cooling mode, the server inhales the cool wind and discharges the hot wind, the hot wind returns to the air conditioner to form the cool wind, and the cycle is formed, due to the low air heat exchange coefficient and small specific heat capacity, the temperature of air needs to be relatively low, and the air volume is big, so the energy consumption of air cooling heat dissipation is high, and the heat dissipation efficiency of chip is low. UTILITARIAN CONTENT

[0003] The utility model solves the technical scheme that its technical problem adopts: provide a kind of chip cooling system, comprising:

[0004] Chip cabin, the chip cabin is used to place chip, the chip cabin is equipped with import pipe and export pipe, import valve is equipped on the import pipe, export valve is equipped on the export pipe, the import valve and the export valve are used to shut off;

[0005] Condensing barrel, the condensing barrel is used to provide refrigerant to the chip cabin, the outlet of the condensing barrel and the import pipe are communicated, the inlet of the condensing barrel and the export pipe are communicated, and the condensing barrel is equipped with condensing coil inside;

[0006] Pressure sensor, the pressure sensor is arranged on the chip cabin, and the pressure sensor is used to measure the pressure in the chip cabin.

[0007] Further, the chip cooling system further includes a vacuum pump, a recovery machine and an N2 bottle, the import pipe is provided with a refrigerant recovery valve and a communication pipe, the export pipe is communicated with the vacuum pump, the recovery machine and the N2 bottle through the communication pipe, the refrigerant recovery valve is used to shut off the export pipe and the communication pipe, a shut-off valve one is arranged at the inlet of the vacuum pump, a shut-off valve two is arranged at the inlet of the recovery machine, the recovery machine is used to recover refrigerant, a shut-off valve three is arranged at the inlet of the N2 bottle, and the outlet of the recovery machine and the condensing barrel are communicated with each other.

[0008] Further, the condensing barrel is communicated with a non-condensable gas discharge device, and the non-condensable gas discharge device is used to discharge non-condensable gas.

[0009] Further, the chip cabin comprises a plurality of independent cabins, and the inlet pipe, the outlet pipe, the inlet valve and the outlet valve are provided with a plurality of each, and each of the independent cabins corresponds to one of the inlet pipe, the outlet pipe, the inlet valve and the outlet valve.

[0010] Further, a plurality of sub-cabin rooms are arranged in the chip cabin, each of the sub-cabin rooms is provided with an inlet branch pipe and an outlet branch pipe, each of the inlet branch pipes is in communication with the inlet pipe, and each of the outlet branch pipes is in communication with the outlet pipe.

[0011] The chip cooling system has the advantages that: the chip cooling system comprises a chip cabin for placing chips, a condensing barrel in communication with the chip cabin, and a pressure sensor arranged on the chip cabin, and the condensing barrel is used for providing refrigerant to the chip cabin. BRIEF DESCRIPTION OF DRAWINGS

[0012] The utility model makes further explanation in combination with the drawings and examples.

[0013] In the drawings: Figure 1 The utility model provides a kind of overall structural diagram of chip cooling system.

[0014] Figure 2 The utility model provides a kind of overall structural diagram of chip cooling system in another embodiment.

[0015] Reference signs:

[0016] 100, chip cooling system; 20, chip cabin; 21, inlet pipe; 211, inlet valve; 212, refrigerant recovery valve; 213, communication pipe; 22, outlet pipe; 221, outlet valve; 23, independent cabin; 24, sub-cabin; 241, inlet branch pipe; 242, outlet branch pipe; 30, condensing barrel; 31, condensing coil; 32, non-condensable gas exhaust device; 40, pressure sensor; 50, vacuum pump; 51, shut-off valve one; 60, recovery machine; 61, shut-off valve two; 70, N2 bottle; 71, shut-off valve three. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical schemes and beneficial effects to be solved by the utility model more clear, the utility model will be described in detail in combination with the drawings. The drawing is a simplified schematic diagram, and only illustrates the basic of the utility model in a schematic way, therefore it only shows the components related to the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor belong to the protection scope of the utility model.

[0018] Please refer to Figure 1 A chip cooling system 100, comprising a chip chamber 20 where the chip is placed, a condensing barrel 30 and a pressure sensor 40, and a vacuum pump 50, a recycling machine 60 and an N2 bottle 70, specifically, in the embodiment, the chip is in an immersed state in the chip chamber 20.

[0019] The chip chamber 20 is provided with an inlet pipe 21 and an outlet pipe 22, the inlet pipe 21 is provided with an inlet valve 211, the outlet pipe 22 is provided with an outlet valve 221, and the inlet valve 211 and the outlet valve 221 are both used for closing. Specifically, in the embodiment, the inlet pipe 21 is located at the bottom of the chip chamber 20, and the outlet pipe 22 is located at the top end of the chip chamber 20.

[0020] The condensing barrel 30 is used for providing refrigerant to the chip chamber 20, the outlet of the condensing barrel 30 is communicated with the inlet pipe 21, and the inlet of the condensing barrel 30 is communicated with the outlet pipe 22. The condensing barrel 30 is provided with a condensing coil 31, and specifically, in the embodiment, the condensing coil 31 is provided with cooling water.

[0021] The pressure sensor 40 is arranged on the chip chamber 20, and the pressure sensor 40 is used for measuring the pressure in the chip chamber 20. Specifically, in the embodiment, the pressure sensor 40 is fixedly arranged on the outlet pipe 22 of the chip chamber 20.

[0022] The inlet pipe 21 is provided with a refrigerant recycling valve 212 and a communication pipe 213, the inlet pipe 21 is communicated with the vacuum pump 50, the recycling machine 60 and the N2 bottle 70 through the communication pipe 213, the refrigerant recycling valve 212 is used for closing the outlet pipe 22 and the communication pipe 213, a closing valve one 51 is arranged at the inlet of the vacuum pump 50, a closing valve two 61 is arranged at the inlet of the recycling machine 60, a closing valve three 71 is arranged at the inlet of the N2 bottle 70, and the outlet of the recycling machine 60 is communicated with the condensing barrel 30. Specifically, in the embodiment, the communication position of the communication pipe 213 and the inlet pipe 21 is closer to the chip chamber 20 than the inlet valve 211, so that when the inlet valve 211 is closed, the communication of the inlet pipe 21 with the vacuum pump 50, the recycling machine 60 and the N2 bottle 70 is not affected.

[0023] With Figure 1Taking the intersection of an inlet pipe 21 indicated by the solid circle and the pipeline connecting the refrigerant recovery valve 212 of each chip chamber 20 and the vacuum pump 50, the recovery machine 60 and the N2 bottle 70 as an example, the intersection of each inlet pipe 21 and the pipeline shown in the figure does not mean that the inlet pipe 21 and the pipeline are connected to each other. During actual installation, a bridge is made between each inlet pipe 21 and the pipeline.

[0024] A non-condensable gas discharge device 32 is connected to the condenser drum 30. This device is used to discharge non-condensable gases to prevent them from affecting the condensation of the refrigerant. Specifically, in this embodiment, the non-condensable gases are gases that cannot condense into liquids, such as air, hydrogen, and nitrogen. Non-condensable gas discharge device 32 can be any conventional non-condensable gas separator capable of separating non-condensable gases. The specific structure is not described in detail in this embodiment.

[0025] The chip chamber 20 includes multiple independent chambers 23, each of which contains a chip. There are multiple inlet pipes 21, outlet pipes 22, inlet valves 211 and outlet valves 221, and each independent chamber 23 corresponds to an inlet pipe 21, outlet pipe 22, inlet valve 211 and outlet valve 221.

[0026] Please refer to Figure 2 In some other embodiments, a plurality of sub-chambers 24 are provided in the chip chamber 20, each sub-chamber 24 contains a chip, each sub-chamber 24 is provided with an inlet branch pipe 241 and an outlet branch pipe 242, each inlet branch pipe 241 is interconnected with the inlet pipe 21, and each outlet branch pipe 242 is interconnected with the outlet branch pipe 242.

[0027] When cooling the chip, the refrigerant flows from the condenser barrel 30 to the chip compartment 20. After the chip is cooled in the chip compartment 20, the refrigerant flows from the chip compartment 20 to the condenser barrel 30, forming a cycle. Because the refrigerant used in the present invention to cool the chip has a higher specific heat capacity than air, it requires less energy and improves the heat dissipation efficiency of the chip.

[0028] The control method for a chip cooling system 100 provided in any of the above embodiments includes an initialization mode, a liquid supply mode, a refrigerant recovery mode, a vacuuming mode, and an N2 addition mode. During initial use, the chip cooling system 100 first enters the initialization mode and then switches from the initialization mode to the liquid supply mode. When the chip cooling system 100 is in normal operation, the chip cooling system 100 is in the liquid supply mode. When the chip cooling system 100 is in maintenance mode, the chip cooling system 100 sequentially enters the refrigerant recovery mode, the vacuuming mode, and the N2 addition mode.

[0029] The initialization mode includes the following steps:

[0030] First, close the door of the chip chamber 20, and make the inlet valve 211, the outlet valve 221 and the refrigerant recovery valve 212 all in the closed state. Then, open the vacuum pump 50 and the shut-off valve one 51 in sequence, and make the shut-off valve one 51 in the open state, and make the shut-off valve two 61 and the shut-off valve three 71 all in the closed state. Vacuumize the chip chamber 20. After the pressure sensor 40 measures that the vacuum pressure in the chip chamber 20 reaches 50 Pa, close the vacuum pump 50 and the shut-off valve one 51, and check the pressure recovery rate in the chip chamber 20. If the recovered pressure in the chip chamber 20 is lower than 100 Pa within 15 minutes, it is judged as normal, otherwise, an alarm is given.

[0031] After judging as normal, open the shut-off valve one 51 and the vacuum pump 50, vacuumize the chip chamber 20, and after the pressure sensor 40 measures that the pressure in the chip chamber 20 reaches 50 Pa, close the vacuum pump 50 and the shut-off valve one 51, and slowly open the outlet valve 221 to make the chip chamber 20 supplement air, and after the pressure in the chip chamber 20 is balanced, open the inlet valve 211 to switch to the liquid supply mode.

[0032] The liquid supply mode includes opening the inlet valve 211 and the outlet valve 221 to make the refrigerant in the condenser barrel 30 flow into the chip chamber 20, and making the shut-off valve one 51, the shut-off valve two 61 and the shut-off valve three 71 all in the closed state, and making the non-condensable gas exhaust device in the working state.

[0033] In the liquid supply mode, the outlet valve 221 is in the fully open state, and the opening degree of the inlet valve 211 is adjusted according to the data displayed by the pressure sensor 40. Specifically, in the embodiment, the lower the pressure in the chip chamber 20 measured by the pressure sensor 40, the smaller the opening degree of the inlet valve 211; the higher the pressure in the chip chamber 20 measured by the pressure sensor 40, the greater the opening degree of the inlet valve 211. By controlling the opening degree of the inlet valve 211 according to the pressure value in the chip chamber 20, the amount of refrigerant flowing into the chip chamber 20 can be adapted to the condition of the chips in the chip chamber 20, so as to reasonably distribute the amount of refrigerant and reduce the energy consumption of the chip cooling system 100.

[0034] In some embodiments, in the liquid supply mode, the outlet valve 221 is in the fully open state, and the opening degree of the inlet valve 211 can also be adjusted according to the heat dissipation of the chip. Specifically, in the present embodiment, the heat dissipation of the chip can be measured by setting a temperature sensor on the chip chamber 20 to measure the temperature in the chip chamber 20 or indirectly by observing the power of the power supply device supplying power to the chip. When the heat dissipation of the chip is lower, the opening degree of the inlet valve 211 is smaller; when the heat dissipation of the chip is higher, the opening degree of the inlet valve 211 is larger. By controlling the opening degree of the inlet valve 211 according to the heat dissipation value of the chip in the chip chamber 20, the amount of refrigerant flowing into the chip chamber 20 can be adapted to the condition of the chip in the chip chamber 20, thereby reasonably distributing the amount of refrigerant and reducing the energy consumption of the chip cooling system 100.

[0035] The refrigerant recovery mode includes: opening the refrigerant recovery valve 212 and closing the valve two 61, so that the recovery machine 60 is opened and the refrigerant in the chip chamber 20 is recovered, and the inlet valve 211, the outlet valve 221, the valve one 51 and the valve three 71 are all in the closed state;

[0036] Wherein, when the absolute pressure of the chip chamber 20 is lower than X, X is in the range of 1-10kPA, the valve two 61 is in the closed state, that is, the recovery machine 60 is closed.

[0037] The vacuum mode includes: opening the vacuum pump 50 and the valve one 51 in turn, so that the vacuum pump 50 performs vacuumization on the chip chamber 20, and the inlet valve 211, the outlet valve 221, the refrigerant recovery valve 212, the valve two 61 and the valve three 71 are all in the closed state;

[0038] Wherein, when the absolute pressure of the chip chamber 20 is lower than X, X is in the range of 1-10kPA, the valve one 51 is in the closed state.

[0039] The N2 adding mode includes: opening the valve three 71, so that the N2 bottle 70 and the chip chamber 20 are communicated through the communication pipe 213, and the N2 in the N2 bottle 70 flows into the chip chamber 20, and the inlet valve 211, the outlet valve 221, the refrigerant recovery valve 212, the valve one 51 and the valve two 61 are all in the closed state.

[0040] Wherein, when the absolute pressure of the chip chamber 20 is equal to the atmospheric pressure, the valve three 71 is closed, and the N2 bottle 70 is closed.

Claims

1. A chip cooling system, characterized by, The chip cooling system comprises: a chip chamber for placing a chip, the chip chamber being provided with an inlet pipe and an outlet pipe, the inlet pipe being provided with an inlet valve, the outlet pipe being provided with an outlet valve, the inlet valve and the outlet valve being used for shutting off; a condensing barrel for providing refrigerant to the chip chamber, the outlet of the condensing barrel being communicated with the inlet pipe, the inlet of the condensing barrel being communicated with the outlet pipe, the condensing barrel being provided with a condensing coil; a pressure sensor arranged on the chip chamber, the pressure sensor being used for measuring the pressure in the chip chamber.

2. The chip cooling system of claim 1, wherein: The chip cooling system further comprises a vacuum pump, a recovery machine and an N2 bottle, the inlet pipe being provided with a refrigerant recovery valve and a communication pipe, the outlet pipe being communicated with the vacuum pump, the recovery machine and the N2 bottle through the communication pipe, the refrigerant recovery valve being used for shutting off the outlet pipe and the communication pipe, a shut-off valve one being arranged at the inlet of the vacuum pump, a shut-off valve two being arranged at the inlet of the recovery machine, the recovery machine being used for recovering refrigerant, a shut-off valve three being arranged at the inlet of the N2 bottle, the outlet of the recovery machine being communicated with the condensing barrel.

3. The chip cooling system of claim 1, wherein: The condensing barrel is communicated with a non-condensable gas discharge device, the non-condensable gas discharge device being used for discharging non-condensable gas.

4. The chip cooling system of claim 3, wherein: The chip chamber comprises a plurality of independent chambers, the inlet pipe, the outlet pipe, the inlet valve and the outlet valve each being provided with a plurality of valves, each of the independent chambers corresponding to one of the inlet pipe, the outlet pipe, the inlet valve and the outlet valve.

5. The chip cooling system of claim 3, wherein: The chip chamber is provided with a plurality of sub-chambers, each of the sub-chambers being provided with an inlet branch pipe and an outlet branch pipe, each of the inlet branch pipes being communicated with the inlet pipe, each of the outlet branch pipes being communicated with the outlet pipe.

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