LED support, LED lamp bead and LED equipment

Abstract

The utility model provides an LED support, LED lamp bead and LED equipment, the LED support comprises a support wall, a first base plate and a second base plate, the support wall encloses to form an accommodating cavity, the first base plate is provided with a plurality of accommodating grooves used for accommodating solid crystal glue, the second base plate is provided with a plurality of positioning groove groups used for positioning the solid crystal glue, and the positioning groove groups are used for positioning the solid crystal glue. The positioning groove set comprises a first positioning groove, a second positioning groove and a third positioning groove, the first positioning groove, the second positioning groove and the third positioning groove all penetrate through the second bottom plate and are communicated with the containing groove, one end of the LED chip penetrates through the first positioning groove and is connected with the bottom of the containing groove, and the first positioning groove is located between the second positioning groove and the third positioning groove. By arranging the containing groove and the flowing range of the die bonding glue, the containing groove is matched with the first positioning groove to limit the sliding range of the LED chip, and the phenomenon of crystal connection is effectively prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially a LED support, LED lamp pearl and LED equipment. BACKGROUND

[0002] With the increasingly fierce competition in the lighting field in the LED technical field, the customers' requirements for the reliability and lighting performance of the lamp pearl are also higher and higher.

[0003] In order to improve the lighting performance of the lamp pearl, it is an effective means to place more light emitting chips on the limited internal functional area of the lamp pearl, that is, to place more light emitting chips on a LED support.

[0004] In the prior art, the light emitting chip is placed in the functional area of the LED support through packaging die bonding operation, and the functional area is a plane structure. Usually, after the die bonding glue is dotted on the plane, the chip is grabbed and placed on the glue by a die bonding equipment, and the position of the chip is fixed after the glue is solidified. However, the functional area is limited, and placing a larger number of chips will inevitably lead to a smaller distance between the chips. However, the die bonding glue has a certain fluidity, and when the die bonding equipment grabs and places the chip, the chip is easy to slide on the glue, leading to mutual adhesion between the chips and the "die bonding" phenomenon. In addition, the die bonding equipment has a certain deviation when placing the chip, and the die bonding phenomenon is more likely to occur. If the error of the amount of glue when dotting the glue leads to more glue, the phenomenon of chip sliding and adhesion is more likely to occur. When the side edges of the chips are mutually adhered, it is easy to cause the side to be unable to heat in time, the side to be unable to emit light, and the chip to be short-circuited, etc. This makes the brightness of the manufactured LED lamp pearl decrease, the service life shorten, and even the problem of short-time dead lamp failure occurs. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of the prior art, the purpose of the utility model is to provide a LED support, LED lamp pearl and LED equipment, aiming at solving the problem of die bonding operation deviation and chip sliding on the die bonding glue surface to cause die bonding phenomenon in the prior art.

[0006] In order to achieve the above purpose, the utility model is realized by the following technical scheme:

[0007] An LED support includes a support wall, a first bottom plate and a second bottom plate, one side of the first bottom plate is connected with the second bottom plate, one side of the second bottom plate away from the first bottom plate is connected with the support wall, the support wall encloses a containing cavity for containing a plurality of LED chips, a plurality of containing grooves are formed on the first bottom plate for containing die bonding glue, a plurality of positioning groove groups are formed on the second bottom plate, each of the positioning groove groups includes a first positioning groove, a second positioning groove and a third positioning groove, the first positioning groove, the second positioning groove and the third positioning groove all penetrate through the second bottom plate and communicate with the containing grooves, one end of the LED chip penetrates through the first positioning groove and is connected with the bottom of the containing groove, and the first positioning groove is located between the second positioning groove and the third positioning groove.

[0008] Compared with the prior art, the beneficial effects of the utility model lie in that the containing grooves are arranged to contain the die bonding glue, the flow range of the die bonding glue is limited, the containing grooves cooperate with the first positioning grooves to limit the sliding range of the LED chip, the die bonding phenomenon is effectively prevented, if the die bonding glue volume is large due to die bonding error, when the LED chip is put into the first positioning groove, the die bonding glue is extruded, the glue can overflow from the second positioning groove and the third positioning groove, the LED chip is not blocked when sliding on the high die bonding glue liquid surface, and the die bonding phenomenon is further prevented in the area of other chips.

[0009] Further, the first positioning groove is square, the length of the first positioning groove is greater than the length of the LED chip by 80-120 mu m, and the width of the first positioning groove is greater than the width of the LED chip by 80-120 mu m.

[0010] Further, the area of the top surface of the second positioning groove is greater than the area of the bottom surface of the second positioning groove, and the area of the top surface of the third positioning groove is greater than the area of the bottom surface of the third positioning groove.

[0011] Further, the total depth of the containing groove and the first positioning groove is 1 / 3-1 / 2 of the thickness of the LED chip.

[0012] Further, the side of the second bottom plate away from the first bottom plate is provided with an insulating protruding strip, and the two ends of the insulating protruding strip are connected with the opposite sides of the support wall respectively.

[0013] Further, the height of the insulating protruding strip is 0.02-0.22 mm.

[0014] An LED lamp bead includes the LED support as described in the above technical solutions.

[0015] The LED device comprises the LED lamp bead as described in the above technical solutions. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A structure schematic diagram of the LED support in the embodiment of the present application;

[0017] Figure 2 A top view structure schematic diagram of the LED support in the embodiment of the present application;

[0018] Figure 3 A structure schematic diagram of the LED support in the embodiment of the present application;

[0019] Figure 4 A schematic diagram of placing the LED chip on the LED support provided with the square groove in the embodiment of the present application;

[0020] Figure 5 A schematic diagram of placing the LED chip on the LED support in the embodiment of the present application;

[0021] Main element symbol explanation:

[0022] first bottom plate 100 accommodation groove 110 second bottom plate 200 first positioning groove 210 second positioning groove 220 third positioning groove 230 insulation protrusion 240 LED chip 300

[0023] The following specific embodiments will further illustrate the present application in combination with the above-mentioned drawings. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application. As used in this description, the singular forms "a", "an" and "the" include plural references unless the context clearly dictates otherwise.

[0027] Referring to Figure 1 and Figure 2 The LED support in the embodiment of the application comprises a support wall, a first bottom plate 100 and a second bottom plate 200. One side of the first bottom plate 100 is connected to the second bottom plate 200. The side of the second bottom plate 200 opposite to the first bottom plate 100 is connected to the support wall. The support wall encloses a containing cavity for containing a plurality of LED chips 300. A plurality of containing grooves 110 are formed on the first bottom plate 100 for containing die-bonding adhesive. A plurality of positioning groove groups are formed on the second bottom plate 200. Each positioning groove group comprises a first positioning groove 210, a second positioning groove 220 and a third positioning groove 230. The first positioning groove 210, the second positioning groove 220 and the third positioning groove 230 all penetrate through the second bottom plate 220 and are in communication with the containing grooves 110. The first positioning groove 210 is square. The length of the first positioning groove 210 is greater than the length of the LED chip 300 by 80-120 μm. The width of the first positioning groove 210 is greater than the width of the LED chip 300 by 80-120 μm. The area of the top surface of the second positioning groove 220 is greater than the area of the bottom surface of the second positioning groove 220. The area of the top surface of the third positioning groove 230 is greater than the area of the bottom surface of the third positioning groove 230. One end of the LED chip 300 penetrates through the first positioning groove 210 and is connected to the bottom of the containing groove 110. The first positioning groove 210 is located between the second positioning groove 220 and the third positioning groove 230. The total depth of the containing groove 110 and the first positioning groove 210 is 1 / 3-1 / 2 of the thickness of the LED chip 300.

[0028] Preferably, the accommodating groove 110 and the positioning groove group can be formed by etching process, the two opposite side walls of the accommodating groove 110 are inclined, further, the cross section of the accommodating groove 110 is trapezoidal, and the top area is larger than the bottom area, and the cross sections of the second positioning groove 220 and the third positioning groove 230 are both right trapezoidal, the side wall of the second positioning groove 220 away from the first positioning groove 210 is inclined and coplanar with the same side wall of the accommodating groove 110, the side wall of the third positioning groove 230 away from the first positioning groove 210 is inclined and coplanar with the same side wall of the accommodating groove 110, the total depth of the first positioning groove 210 and the accommodating groove 110 is 60 μm, the thickness of the LED chip 300 is 170 μm, the length of the first positioning groove 210 is 1.2 mm, and the width is 0.75 mm. It can be understood that, referring to Figure 3 , if the die bonding glue is on the flat plate, when the LED chip 300 is placed on the glue, because the glue has a certain fluidity, the bottom of the LED chip 300 is not fixed with the plate, and is easy to slide on the glue liquid surface, slide to the adjacent LED chip 300, and be adhered with it, resulting in the occurrence of the die bonding phenomenon, which seriously affects the quality of the LED lamp bead.

[0029] Further, referring to Figure 4 , if a common square groove is opened on the LED support bottom plate, although it has a certain accommodating effect on the die bonding glue, there is deviation in the die bonding operation, if the glue amount is more, a convex surface is formed in the square groove, when the LED chip 300 is placed on the die bonding glue liquid, a certain extrusion is generated on the die bonding glue liquid, part of the die bonding glue liquid overflows at the edge of the square groove, and the liquid surface where the LED chip 300 is located and the die bonding glue liquid surface of the overflow part are continuous, which is easy to slide to the die bonding glue liquid surface of the overflow part, and still cannot completely avoid the die bonding phenomenon; referring to Figure 5When the LED chip 300 is put into the die-bonding glue liquid from the first positioning groove 210, the die-bonding glue liquid is extruded, and due to the adaptation of the first positioning groove 210 and the LED chip 300, the die-bonding glue liquid is difficult to overflow from the gap between the first positioning groove 210 and the LED chip 300, and overflow from the second positioning groove 220 and the third positioning groove 230, and due to the structure of the second bottom plate 200 between the first positioning groove 210 and the second positioning groove 220 and between the first positioning groove 210 and the third positioning groove 230, the liquid level of the overflowed die-bonding glue liquid is discontinuous with the liquid level where the LED chip 300 is located, and the LED chip 300 cannot slip to the overflowed die-bonding glue liquid under the limitation of the first positioning groove 210, and the LED support can effectively avoid the phenomenon of die-bonding even if there is deviation in the die-bonding operation, and avoid the negative situations such as heat dissipation not in time, short circuit and even dead lamp caused by side adhesion between chips, and effectively guarantee the reliability of the LED lamp bead and the LED product.

[0030] The second bottom plate 200 is provided with an insulating convex strip 240 on the side opposite to the first bottom plate 100, the two ends of the insulating convex strip 240 are connected to the opposite sides of the support wall respectively, and the height of the insulating convex strip 240 is 0.02mm-0.22mm. Preferably, the height of the insulating convex strip 240 is 0.12mm. Understandably, the insulating convex strip 240 is beneficial to improve the reliability of the LED lamp bead and prevent the phenomenon of short circuit and dead lamp.

[0031] Another embodiment of the utility model also provides a LED lamp bead, the LED lamp bead includes the LED support as described in the above embodiment.

[0032] Another embodiment of the utility model also provides a LED device, the LED device includes the LED lamp bead as described in the above embodiment.

[0033] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0034] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but can not therefore be understood as the limitation of the utility model patent range. It should be pointed out that for ordinary skilled person in the art, without departing from the utility model concept, several deformations and improvements can be made, which belong to the protection range of the utility model. Therefore, the protection range of the utility model patent should be subject to the appended claims.

Claims

1. An LED holder, characterized by, The bracket wall, the first bottom plate and the second bottom plate are connected, one side of the first bottom plate is connected with the second bottom plate, the other side of the second bottom plate is connected with the bracket wall, the bracket wall is enclosed to form a containing cavity, the containing cavity is used for containing a plurality of LED chips, a plurality of containing grooves are arranged on the first bottom plate, the containing grooves are used for containing fixed crystal glue, a plurality of positioning groove groups are arranged on the second bottom plate, the positioning groove groups include a first positioning groove, a second positioning groove and a third positioning groove, the first positioning groove, the second positioning groove and the third positioning groove all penetrate through the second bottom plate and communicate with the containing grooves, one end of the LED chip penetrates through the first positioning groove and is connected with the bottom of the containing groove, and the first positioning groove is located between the second positioning groove and the third positioning groove.

2. The LED support of claim 1, wherein, The first positioning groove is square, the length of the first positioning groove is greater than the length of the LED chip by 80-120μm, and the width of the first positioning groove is greater than the width of the LED chip by 80-120μm.

3. The LED support of claim 1, wherein, The area of the top surface of the second positioning groove is greater than the area of the bottom surface of the second positioning groove, and the area of the top surface of the third positioning groove is greater than the area of the bottom surface of the third positioning groove.

4. The LED support of claim 1, wherein, The total depth of the containing groove and the first positioning groove is 1 / 3-1 / 2 of the thickness of the LED chip.

5. The LED support of claim 1, wherein, The other side of the second bottom plate is provided with an insulating convex strip, and the two ends of the insulating convex strip are respectively connected with the two opposite sides of the bracket wall.

6. The LED support of claim 5, wherein, The height of the insulating convex strip is 0.02-0.22mm.

7. An LED lamp bead, characterized in that, The LED bracket includes the LED bracket as claimed in any one of claims 1-6.

8. An LED apparatus, characterized by The LED lamp bead includes the LED lamp bead as claimed in claim 7.

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