Full-mold-closing carrier and micro-fluidic chip

Through the full mold carrier design and 3D printing technology, the cumbersome and disposable problems of the microfluidic chip preparation process were solved, and efficient and simplified capillary assembly and reuse were achieved, thereby improving the success rate.

CN223464842UActive Publication Date: 2025-10-24LEAD HEALTHCARE TECHNOLOGY (GUANGZHOU) CO LTD
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Patent Information

Application Number
CN202422939583.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-10-24
Estimated Expiration
2034-11-29

AI Technical Summary

Technical Problem

Existing microfluidic chip preparation methods have the disadvantages of high production difficulty, complicated process, low success rate, and are disposable products that cannot be reused.

Method used

A full mold carrier design is adopted. By processing the groove structure on the first mold carrier and the second mold carrier, a liquid storage channel, a tube collection channel and a phase tube channel are formed to replace the traditional needle. Combined with 3D printing technology and glue sealing connection, the simple assembly and reuse of the capillary can be achieved.

Benefits of technology

It reduces the difficulty of production, improves the success rate, simplifies the assembly process, reduces manual operation time and errors, realizes convenient disassembly and maintenance of the capillary, and supports the reuse of the carrier.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a full-mold-closing carrier and a micro-fluidic chip, and relates to the technical field of micro-fluidic chips, the full-mold-closing carrier comprises a first mold-closing carrier and a second mold-closing carrier which can be in mold-closing connection with the first mold-closing carrier; a first phase pipe groove, a first liquid storage groove and a first pipe collecting groove which are coaxially communicated are sequentially formed in one side surface of the first mold closing carrier; a second phase pipe groove, a second liquid storage groove and a second pipe collecting groove which are coaxially communicated are sequentially formed in one side surface of the second die assembly carrier; the first phase pipe groove can be matched with the second phase pipe groove to form a phase pipe channel; the first liquid storage tank can be matched with the second liquid storage tank to form a liquid storage channel which is coaxially communicated with the phase pipe channel; the first pipe collecting groove can be matched with the second pipe collecting groove to form a pipe collecting channel which is coaxially communicated with the pipe collecting channel; and a first channel inlet communicated with the liquid storage channel is formed in the first mold closing carrier and / or the second mold closing carrier. The design and assembly are simple, the manual operation time is shortened, and errors are reduced.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of microfluidic chip, and particularly to a full-mold carrier and a microfluidic chip. BACKGROUND

[0002] The sleeve type microfluidic chip is one of microfluidic chips. The existing capillary sleeve structure takes a needle as a fixed support and a liquid storage cavity, takes a glass slide as a support, and is fixed and sealed by glue. During preparation, the point gluing pillow is first handled by using cutting pliers to make three needles clamp three glass tubes of different sizes; then sleeve coupling is performed under a microscope to complete coaxial alignment operation; and finally, glue fixing is performed. The above preparation method has the technical problems of high manufacturing difficulty, complicated process, low success rate, and one-time product that cannot be reused. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application aims to provide a full-mold carrier and a microfluidic chip to solve the technical problems of high manufacturing difficulty, complicated process, low success rate, and one-time product that cannot be reused in the existing microfluidic chip preparation method.

[0004] To achieve the above technical purposes, the present application provides a full-mold carrier, which comprises a first mold connection carrier and a second mold connection carrier capable of being connected with the first mold connection carrier;

[0005] A first phase tube groove, a first liquid storage groove, and a first tube collection groove are sequentially arranged on one side of the first mold connection carrier in a coaxial and conductive manner;

[0006] A second phase tube groove, a second liquid storage groove, and a second tube collection groove are sequentially arranged on one side of the second mold connection carrier in a coaxial and conductive manner;

[0007] The first phase tube groove is capable of cooperating with the second phase tube groove to form a phase tube channel;

[0008] The first liquid storage groove is capable of cooperating with the second liquid storage groove to form a liquid storage channel coaxially and conductively connected with the phase tube channel;

[0009] The first tube collection groove is capable of cooperating with the second tube collection groove to form a tube collection channel coaxially and conductively connected with the phase tube channel;

[0010] The first mold connection carrier and / or the second mold connection carrier is provided with a first channel inlet connected with the liquid storage channel.

[0011] Further, the first mold connection carrier and / or the second mold connection carrier is provided with an observation port connected with the liquid storage channel;

[0012] Further, the first mold connection carrier and / or the second mold connection carrier is provided with an observation port connected with the liquid storage channel; Further, the first mold connection carrier and / or the second mold connection carrier is provided with an observation port connected with the liquid storage channel;

[0013] Further, the observation port on the first mold carrier is located at the same side as the observation port on the second mold carrier, and the two observation ports are in communication with each other.

[0014] Further, the first mold carrier is provided with a first positioning structure.

[0015] The second mold carrier is provided with a second positioning structure which is in positioning cooperation with the first positioning structure.

[0016] Further, the first positioning structure is a positioning protrusion.

[0017] The second positioning structure is a positioning groove in which the positioning protrusion is inserted.

[0018] Further, the first storage groove is provided with at least two first alignment structures which are spaced apart.

[0019] The second storage groove is provided with at least two second alignment structures which correspond to the first alignment structures one by one.

[0020] The second alignment structures can cooperate with the first alignment structures to form an alignment through hole.

[0021] Further, the first mold carrier and the second mold carrier are both prepared by 3D printing.

[0022] Further, the first mold carrier and the second mold carrier are connected by glue sealing.

[0023] The application also discloses a microfluidic chip, which comprises a receiving tube, an inner phase tube and the full mold carrier.

[0024] The inner phase tube is installed in the phase tube passage of the full mold carrier and one end of the inner phase tube extends into the liquid storage passage of the full mold carrier to form an inner phase droplet.

[0025] The receiving tube is installed in the receiving passage of the full mold carrier and one end of the receiving tube extends into the liquid storage passage to receive the inner phase droplet.

[0026] The application also discloses a microfluidic chip, which comprises a receiving tube, an inner phase tube and the full mold carrier.

[0027] The intermediate phase tube and the inner phase tube are installed in the phase tube passage of the full mold carrier.

[0028] One end of the inner phase tube extends into the intermediate phase tube to form an inner phase droplet.

[0029] One end of the intermediate phase tube extends into the liquid storage passage of the full mold carrier to form an intermediate phase droplet with the inner phase droplet.

[0030] The full-mold carrier is provided with a second channel inlet communicating with the intermediate phase tube;

[0031] The receiving tube is installed in the receiving channel of the full-mold carrier and has one end extending into the liquid storage channel for receiving the intermediate phase droplet.

[0032] From the above technical solutions, the full-mold carrier designed in the application has the following beneficial effects:

[0033] 1. Model design (processing the required groove structure on the first mold carrier and the second mold carrier, and connecting the mold to make the groove structure matched to form the required liquid storage channel, receiving tube channel, and phase tube channel for installing the capillary tube) is used to replace the traditional needle, which reduces the manufacturing difficulty as a whole and improves the success rate.

[0034] 2. Simple assembly, reduces manual operation time, and reduces errors.

[0035] 3. The liquid storage channel is used to replace the traditional outer phase tube, which reduces the alignment operation in the sleeve and reduces errors.

[0036] 4. The full-mold design is used as a whole, which makes the receiving tube and the inner phase tube / intermediate phase tube easy to disassemble and replace, and facilitates the maintenance of the liquid storage channel, realizing the reuse of the full-mold carrier.

[0037] From the above technical solutions, the single-milk microfluidic chip designed in the application includes the full-mold carrier, the inner phase tube, and the receiving tube designed above, which has the same technical effects as the full-mold carrier.

[0038] From the above technical solutions, the double-milk microfluidic chip designed in the application includes the full-mold carrier, the intermediate phase tube, the inner phase tube, and the receiving tube designed above, which has the same technical effects as the full-mold carrier. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0040] Figure 1 It is a perspective view of a full-mold carrier provided in the application;

[0041] Figure 2 It is a sectional view of a full-mold carrier provided in the application;

[0042] Figure 3 Figure 1 is a perspective view of a first mold clamping carrier of a full mold clamping carrier provided in the present application;

[0043] Figure 4 Figure 2 is a perspective view of a second mold clamping carrier of a full mold clamping carrier provided in the present application;

[0044] Figure 5 Figure 3 is a sectional view of a single-lactation microfluidic chip provided in the present application;

[0045] Figure 6 Figure 4 is a sectional view of a double-lactation microfluidic chip provided in the present application;

[0046] In the figure: 1, first mold clamping carrier; 11, first phase tube groove; 12, first liquid storage groove; 13, first collection tube groove; 14, first alignment structure; 15, first positioning structure; 2, second mold clamping carrier; 21, second phase tube groove; 22, second liquid storage groove; 23, second collection tube groove; 24, second alignment structure; 25, second positioning structure; 31, first channel inlet; 32, second channel inlet; 10, phase tube channel; 20, liquid storage channel; 30, collection tube channel; 41, inner phase tube; 42, receiving tube; 43, intermediate phase tube. DETAILED DESCRIPTION

[0047] The technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0048] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0049] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or replaceable connection, or integral connection, it can be mechanical connection, or electrical connection, it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0050] The conventional chip based on needle making has the following disadvantages:

[0051] When using the cutting pliers to process the needle, 6 surfaces of 3 needles need to be processed to pass through 3 glass tubes with different outer diameters. The diameter of the cut needle needs to be close to the outer diameter of the 3 glass tubes. If the diameter of the cut needle is too small, the glass tube cannot pass through. If the diameter of the cut needle is too large, the needle support is insufficient and the needle is easily blocked when fixed with glue. Therefore, using the cutting pliers requires not only the control of force, but also the accurate control of the diameter of the cut needle. Each chip needs to process 3 needles to cut 6 diameters, which is complicated and time-consuming.

[0052] After processing the needle, pre-assembly is needed first. The needle, glass tube and slide are assembled from inside to outside and from small to large. The glass tube chip requires accurate positioning of the needle and glass tube, so any manual fine-tuning of the accurate positioning of the glass tube has a huge impact. When fixing with glue, the distance between the glass tube tip and the receiving tube 42 needs to be adjusted under a microscope to ensure that the distance is just right. Too far or too close will affect the droplet generation to varying degrees.

[0053] When using glue to fix, AB glue is used. The A and B glues need to be mixed and dissolved first, and then the glue is applied. It takes 5-10 minutes for the glue to dry completely. This is not only troublesome, but also slightly toxic. The choice of this glue is mainly for biological compatibility, and secondly for the role of fixing the needle and sealing the gap between the glass tube and the slide. 502 glue has strong adhesion to fix the needle, but has strong flowability, which is slightly inferior in sealing and is prone to flow into the glass tube and cause blockage. Food glue, cement and the like have strong sealing effect, but the adhesion is not strong enough to fix and support the needle. However, no matter which glue is used, the amount and position of the glue need to be very careful and accurate. Excess glue is prone to flow into the liquid inlet of the glass tube and cause liquid blockage. The position of the glue also needs to avoid the microscope observation area, otherwise it cannot be observed or the microscope image is dirty and the photographed photo is not ideal.

[0054] In summary, the existing needle-based chip production process is extremely cumbersome, time-consuming, and has a low tolerance for error. Furthermore, the needle cutting and glue application steps are prone to needle damage, glue clogging, and coaxial failure, resulting in an extremely low success rate. Furthermore, needle-based chips are disposable and cannot be reused.

[0055] To solve the above problems, an embodiment of the present application discloses a fully clamping carrier.

[0056] See also Figure 1 、 Figure 2 as well as Figure 6 , an embodiment of a fully clamped mold carrier provided in the embodiments of the present application includes:

[0057] A first clamping carrier 1 and a second clamping carrier 2 which can be connected to the first clamping carrier 1 by clamping.

[0058] A first phase pipe groove 11 , a first liquid storage groove 12 and a first pipe receiving groove 13 are sequentially provided on one side surface of the first mold clamping carrier 1 , which are coaxially connected.

[0059] A second phase pipe groove 21 , a second liquid storage groove 22 and a second pipe receiving groove 23 are sequentially provided on one side of the second mold clamping carrier 2 connected to the first mold clamping carrier 1 .

[0060] The first phase pipe groove 11 can cooperate with the second phase pipe groove 21 to form a phase pipe channel 10 . The phase pipe channel 10 is used to install the inner phase pipe 41 or the inner phase pipe 41 and the middle phase pipe 43 .

[0061] The first liquid storage tank 12 can cooperate with the second liquid storage tank 22 to form a liquid storage channel 20 that is coaxially connected to the phase pipe channel 10.

[0062] The first tube receiving groove 13 can cooperate with the second tube receiving groove 23 to form a tube receiving channel 30 coaxially communicating with the phase tube channel 10 . The tube receiving channel 30 is used for installing the receiving tube 42 .

[0063] The first mold carrier 1 and / or the second mold carrier 2 is provided with a first channel inlet 31 connected to the liquid storage channel 20. Taking the example that both the first mold carrier 1 and the second mold carrier 2 are provided with a first channel inlet 31, the two first channel inlets 31 can be independently set separately, or connected together to form a complete channel inlet, without specific limitation.

[0064] The fully clamped carrier designed in this application has the following beneficial effects:

[0065] 1. Using model design (the required groove structure is machined on the first mold carrier 1 and the second mold carrier 2. After the mold is closed and connected, the groove structures cooperate with each other to form the required liquid storage channel 20, tube collection channel 30, and phase tube channel 10 for capillary installation) to replace the traditional needle, which reduces the overall manufacturing difficulty and improves the success rate.

[0066] 2. Simple assembly, reducing manual operation time and reducing errors.

[0067] 3. The liquid storage channel 20 is used to replace the traditional external phase tube, which reduces the alignment operation in the casing and reduces the error.

[0068] 4. The overall full-mold design makes it easy to disassemble and replace the assembled receiving tube 42 and the inner phase tube 41 / intermediate phase tube 43, and facilitates maintenance in the liquid storage channel 20, thereby realizing the reuse of the full-mold carrier.

[0069] The above is the first embodiment of a fully clamped mold carrier provided by the embodiment of the present application. The following is the second embodiment of a fully clamped mold carrier provided by the embodiment of the present application. For details, please refer to Figures 1 to 4 .

[0070] Based on the solution of the above embodiment 1:

[0071] Furthermore, if Figure 1 As shown, the first mold carrier 1 and / or the second mold carrier 2 is provided with an observation port connected to the liquid storage channel 20; it also includes a transparent baffle (not shown in the figure) for closing the observation port. The provision of the transparent baffle can provide a visual window to facilitate observation of the interior of the liquid storage channel 20.

[0072] Taking the example that both the first mold carrier 1 and the second mold carrier 2 are provided with observation ports, the two observation ports can be independent of each other, so two transparent baffles need to be set; the two observation ports can be interconnected and located on the same side, so that only one transparent baffle can be shared, which saves more assembly steps.

[0073] In order to facilitate the positioning and installation of the transparent baffle, a positioning groove for the transparent baffle to be placed is provided on the full mold carrier, so as to facilitate the positioning and installation of the transparent baffle, and the transparent baffle can be sealed and fixed by glue.

[0074] Furthermore, if Figures 3 to 4 As shown, the first mold carrier 1 is provided with a first positioning structure 15, and the second mold carrier 2 is provided with a second positioning structure 25 that cooperates with the first positioning structure 15. The careful coordination between the first positioning structure 15 and the second positioning structure 25 enables quick installation of the first mold carrier 1 and the second mold carrier 2, making the entire assembly process smoother and significantly reducing the time and effort required to find the correct installation position during installation.

[0075] Further, as shown in Figure 3 and Figure 4 , the first positioning structure 15 is a positioning protrusion, and the second positioning structure 25 is a positioning groove for the positioning protrusion to be inserted. Of course, it can be reversed, that is, the first positioning structure 15 is a positioning groove, and the second positioning structure 25 is a positioning protrusion.

[0076] Further, as shown in Figure 3 and Figure 4 , the first reservoir 12 is provided with at least two first alignment structures 14 arranged at intervals; the second reservoir 22 is provided with at least two second alignment structures 24 corresponding to the first alignment structures 14 one by one; and the second alignment structure 24 can cooperate with the first alignment structure 14 to form an aligned through hole.

[0077] This design can make the coaxiality of the capillaries in the liquid storage channel 20 better, and reduce the situation of non-coaxial deviation.

[0078] Further, the first mold carrier 1 and the second mold carrier 2 are both prepared by 3D printing.

[0079] Further, the first mold carrier 1 and the second mold carrier 2 are connected by glue sealing. The preparation of the structure member is more convenient by using 3D printing, which effectively shortens the production steps. After 3D printing, the structure member can be assembled, and it is not necessary to perform coaxial operation under a microscope (because the 3D printed member has a coaxial alignment structure, and the capillary only needs to be placed in the corresponding position).

[0080] As shown in Figure 5 , the application also discloses a single-emulsion microfluidic chip, which comprises a receiving tube 42, an inner-phase tube 41, and a full mold carrier.

[0081] The inner-phase tube 41 is installed in the phase tube channel 10 of the full mold carrier, and one end of the inner-phase tube 41 extends into the liquid storage channel 20 of the full mold carrier to form an inner-phase droplet; the other end of the inner-phase tube 41 extends out of the full mold carrier to supply the inner-phase liquid, or a corresponding liquid inlet is formed on the full mold carrier to communicate with the inner-phase tube 41 to supply the inner-phase liquid.

[0082] The receiving tube 42 is installed in the receiving channel of the full mold carrier, and one end of the receiving tube 42 extends into the liquid storage channel 20 to receive the inner-phase droplet.

[0083] As shown in Figure 6 , the application also discloses a double-emulsion microfluidic chip, which comprises a receiving tube 42, an intermediate-phase tube 43, an inner-phase tube 41, and a full mold carrier. Compared with the single-emulsion microfluidic chip, the double-emulsion microfluidic chip further comprises the intermediate-phase tube 43.

[0084] The intermediate phase tube 43 and the inner phase tube 41 are installed in the phase tube channel 10 of the full mold carrier; the inner phase tube 41 extends into the intermediate phase tube 43 at one end, for forming inner phase droplets; the intermediate phase tube 43 extends into the liquid storage channel 20 of the full mold carrier at one end, for forming intermediate phase droplets with inner phase droplets; the other end of the inner phase tube 41 extends out of the full mold carrier for inner phase liquid inlet, and the full mold carrier (the first mold carrier 1 and / or the second mold carrier 2) is provided with a second channel inlet 32 communicating with the intermediate phase tube 43.

[0085] When the double-milk design is adopted, the phase tube channel 10 adopts a double-section design, one section of which is used for installing the inner phase tube 41, and the other section is used for installing the intermediate phase tube 43.

[0086] The receiving tube 42 is installed in the receiving channel of the full mold carrier, and extends into the liquid storage channel 20 at one end, for receiving intermediate phase droplets.

[0087] Taking the double-milk microfluidic chip as an example, the following steps are specifically as follows:

[0088] 1. The inner phase tube 41 is inserted into the intermediate phase tube 43, and then the two phase tubes are placed in the phase tube channel 10 of the 3D printed first mold carrier 1. The flat port of the intermediate phase tube 43 is aligned with the second channel inlet 32, and the sharp port is in the middle of one of the first alignment structures 14. The receiving tube 42 is placed in the receiving tube channel 30 of the first mold carrier 1, and one end is in the middle of the other first alignment structure 14.

[0089] 2. The intermediate phase tube 43, the inner phase tube 41 and the receiving tube 42 are fixed by using 502 glue, mainly coated on the contact part between the capillary tube and the channel, so as to fix the capillary tubes.

[0090] 3. The second mold carrier 2 is connected with the first mold carrier 1, and is pressed tightly, and a layer of 502 glue is coated at the gap of the cooperation, so as to complete the sealed fixed connection between the first mold carrier 1 and the second mold carrier 2.

[0091] 4. A transparent baffle is covered on the observation port to realize transparent visualization, and 502 glue is used for sealing and fixing.

[0092] The full mold carrier and the microfluidic chip provided by the present application are described in detail above, and for those skilled in the art, according to the idea of the embodiments of the present application, the specific implementation and application range will be changed, and the above description should not be understood as a limitation of the present application.

Claims

1. A full mold carrier, characterized by, The first mold carrier (1) and the second mold carrier (2) are connected in a mold clamping manner; A first phase tube slot (11), a first liquid storage slot (12) and a first tube collecting slot (13) are sequentially arranged on one side of the first mold carrier (1) in a coaxial and conductive manner; A second phase tube slot (21), a second liquid storage slot (22) and a second tube collecting slot (23) are sequentially arranged on one side of the second mold carrier (2) in a coaxial and conductive manner; The first phase tube slot (11) is matched with the second phase tube slot (21) to form a phase tube channel (10); The first liquid storage slot (12) is matched with the second liquid storage slot (22) to form a liquid storage channel (20) which is coaxially and conductively connected with the phase tube channel (10); The first tube collecting slot (13) is matched with the second tube collecting slot (23) to form a tube collecting channel (30) which is coaxially and conductively connected with the phase tube channel (10); A first channel inlet (31) is arranged on the first mold carrier (1) and / or the second mold carrier (2) and is connected with the liquid storage channel (20).

2. The full mold carrier of claim 1, wherein, An observation port is arranged on the first mold carrier (1) and / or the second mold carrier (2) and is connected with the liquid storage channel (20); A transparent baffle is further arranged to seal the observation port.

3. The full mold carrier of claim 2, wherein, The observation port arranged on the first mold carrier (1) and the observation port arranged on the second mold carrier (2) are located on the same side and are coaxially and conductively connected.

4. The full mold carrier of claim 1, wherein, A first positioning structure (15) is arranged on the first mold carrier (1); A second positioning structure (25) is arranged on the second mold carrier (2) and is matched with the first positioning structure (15).

5. The full mold carrier of claim 4, wherein, The first positioning structure (15) is a positioning protrusion; The second positioning structure (25) is a positioning slot for inserting the positioning protrusion.

6. The full mold carrier of claim 1, wherein, At least two first alignment structures (14) are arranged in the first liquid storage slot (12) in a spaced manner; At least two second alignment structures (24) are arranged in the second liquid storage slot (22) and are matched with the first alignment structures (14) in a one-to-one manner; The second alignment structures (24) are matched with the first alignment structures (14) to form an alignment through hole.

7. The full mold carrier of claim 1, wherein, The first mold carrier (1) and the second mold carrier (2) are both prepared by a 3D printing method.

8. The full mold carrier of claim 1, wherein, The first mold carrier (1) and the second mold carrier (2) are connected by a glue seal.

9. A microfluidic chip, characterized by The full mold carrier comprises a receiving tube (42), an inner phase tube (41) and the full mold carrier according to any one of claims 1 to 8; The inner phase tube (41) is installed in the phase tube channel (10) of the full mold carrier and one end thereof extends into the liquid storage channel (20) of the full mold carrier to form an inner phase droplet; The receiving tube (42) is installed in the receiving channel of the full mold carrier and one end thereof extends into the liquid storage channel (20) to receive the inner phase droplet.

10. A microfluidic chip, characterized by The full mold carrier comprises a receiving tube (42), an intermediate phase tube (43), an inner phase tube (41) and the full mold carrier according to any one of claims 1 to 8; The intermediate phase tube (43) and the inner phase tube (41) are installed in the phase tube channel (10) of the full mold carrier; One end of the inner phase tube (41) extends into the intermediate phase tube (43) to form inner phase droplets; One end of the intermediate phase tube (43) extends into the liquid storage channel (20) of the full mold carrier to form intermediate phase droplets with inner phase droplets; The full mold carrier is provided with a second channel inlet (32) communicating with the intermediate phase tube (43); The receiving tube (42) is installed in the receiving channel of the full mold carrier and one end extends into the liquid storage channel (20) to receive intermediate phase droplets.