Monocrystalline silicon wafer automatic turn-over grinding equipment

Abstract

The utility model relates to monocrystalline silicon wafer automatic turn-over grinding equipment which comprises a grinding mechanism and a transferring mechanism, the transferring mechanism is used for driving a workpiece to be transferred to the grinding mechanism and driving the workpiece to turn over, the grinding mechanism is used for grinding the workpiece, the transferring mechanism comprises a clamping assembly, a moving assembly and a first power source, and the clamping assembly is used for clamping the workpiece; the moving assembly is used for driving the clamping assembly to move transversely or vertically, and the first power source is used for driving the clamping assembly to turn over. According to the invention, a mechanical structure is adopted to drive the monocrystalline silicon wafer to turn over, so that the grinding efficiency of the monocrystalline silicon wafer is higher.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of single crystal silicon wafer processing, in particular to an automatic single crystal silicon wafer turning and grinding device. BACKGROUND

[0002] In the processing of single crystal silicon wafers, grinding equipment is used for surface treatment to make the smoothness of the wafers meet the requirements. After one side of the single crystal silicon wafer is ground, the wafer needs to be turned over for grinding the other side. Generally, the single crystal silicon wafer is turned over manually, but the efficiency of manual turning is low, which reduces the overall grinding efficiency of the single crystal silicon wafer. CONTENT

[0003] In view of the deficiencies in the prior art, one of the purposes of the present application is to provide an automatic single crystal silicon wafer turning and grinding device, which has the advantage of using a mechanical structure to turn over the single crystal silicon wafer, thereby improving the grinding efficiency of the single crystal silicon wafer.

[0004] The above purpose of the present application is achieved by the following technical solution:

[0005] An automatic single crystal silicon wafer turning and grinding device includes a grinding mechanism and a transfer mechanism. The transfer mechanism is used to transfer the workpiece to the grinding mechanism and turn over the workpiece. The grinding mechanism is used to grind the workpiece. The transfer mechanism includes a clamping assembly, a moving assembly, and a power source one. The clamping assembly is used to clamp the workpiece. The moving assembly is used to move the clamping assembly horizontally or vertically. The power source one is used to turn over the clamping assembly.

[0006] By using the above technical solution, after the moving assembly moves the clamping assembly vertically to the workpiece, the moving assembly continues to move the clamping assembly horizontally, so that the workpiece is clamped by the clamping assembly and sent to the grinding mechanism. When the workpiece needs to be turned over, the moving assembly moves the workpiece to the appropriate position, and the power source one turns over the clamping assembly, so that the workpiece is turned over, thereby improving the grinding efficiency of the workpiece.

[0007] In a preferred example, the clamping assembly can further be configured to include a clamping cavity for accommodating the workpiece. The clamping cavity is provided with a contact point and a guide surface. The contact point is used to contact the workpiece, and the guide surface is used to guide the workpiece into the clamping cavity.

[0008] By using the above technical solution, when the clamping assembly moves horizontally, the clamping cavity is close to the workpiece, and the guide surface guides the workpiece into the clamping cavity, so that the workpiece is more easily guided into the clamping cavity. The contact point contacts the workpiece, so that the clamping effect of the clamping cavity on the workpiece is higher.

[0009] The application can be further configured in a preferred example to further comprise a storage mechanism, the storage mechanism being configured to store the workpiece and move the workpiece to the clamping range of the clamping assembly under the action of the moving assembly.

[0010] The application can be further configured in a preferred example to further comprise a storage mechanism, the storage mechanism being configured to store the workpiece and move the workpiece to the clamping range of the clamping assembly under the action of the moving assembly.

[0011] By adopting the above technical scheme, the workpiece is moved from the storage barrel to the clamping range of the clamping assembly under the action of the moving assembly.

[0012] The application can be further configured in a preferred example to further comprise a storage mechanism, the storage mechanism being configured to store the workpiece and move the workpiece to the clamping range of the clamping assembly under the action of the moving assembly.

[0013] By adopting the above technical scheme, the workpiece is moved from the storage barrel to the clamping range of the clamping assembly under the action of the moving assembly.

[0014] The application can be further configured in a preferred example to further comprise a storage mechanism, the storage mechanism being configured to store the workpiece and move the workpiece to the clamping range of the clamping assembly under the action of the moving assembly.

[0015] By adopting the above technical scheme, the workpiece is moved from the storage barrel to the clamping range of the clamping assembly under the action of the moving assembly.

[0016] The application can be further configured in a preferred example to further comprise a storage mechanism, the storage mechanism being configured to store the workpiece and move the workpiece to the clamping range of the clamping assembly under the action of the moving assembly.

[0017] By adopting the above technical scheme, the workpiece is moved from the storage barrel to the clamping range of the clamping assembly under the action of the moving assembly.

[0018] The application can be further configured in a preferred example to further comprise a storage mechanism, the storage mechanism being configured to store the workpiece and move the workpiece to the clamping range of the clamping assembly under the action of the moving assembly.

[0019] By adopting the above technical scheme, the workpiece is moved from the storage barrel to the clamping range of the clamping assembly under the action of the moving assembly.

[0020] The application can be further configured in a preferred example to further comprise a storage mechanism, the storage mechanism being configured to store the workpiece and move the workpiece to the clamping range of the clamping assembly under the action of the moving assembly. BRIEF DESCRIPTION OF DRAWINGS

[0021] Fig. 1 is a structural schematic diagram of the embodiment of the application.

[0022] Fig. 2 is a structural schematic diagram of the embodiment of the application.

[0023] Fig. 3 is a structural schematic diagram of the embodiment of the application.

[0024] Reference signs: 1, frame body; 2, grinding mechanism; 21, grinding assembly; 211, grinding piece; 212, power source three; 22, support platform; 23, power source two; 24, avoiding groove; 3, transfer mechanism; 31, clamping assembly; 311, clamping cavity; 312, contact point; 313, guide surface; 32, moving assembly; 33, power source one; 34, transverse power piece; 35, vertical power piece; 4, storage mechanism; 41, storage cylinder; 411, roller; 422, through port; 42, discharging chain; 43, limiting surface; 5, workpiece. DETAILED DESCRIPTION

[0025] The application will be further described in detail below with reference to the accompanying drawings.

[0026] Reference Figs. 1 to 3 The application discloses a single crystal silicon wafer automatic turning and grinding equipment, which comprises a frame body 1, a grinding mechanism 2, a transfer mechanism 3, a storage mechanism 4 and a collecting mechanism. The grinding mechanism 2, the transfer mechanism 3 and the storage mechanism 4 are installed on the frame body 1. The transfer mechanism 3 is used for driving the workpiece 5 to move to the grinding mechanism 2 and turning the workpiece 5. The grinding mechanism 2 is used for grinding the workpiece 5. The storage mechanism 4 is used for storing the workpiece 5 and moving the workpiece 5 to the clamping range of the clamping assembly 31 under the action of the moving assembly 32. The collecting mechanism is used for collecting the waste generated in the grinding process. In the embodiment, the collecting mechanism is not shown in the drawing for the convenience of description.

[0027] The transfer mechanism 3 comprises the clamping assembly 31, the moving assembly 32 and the power source one 33. The clamping assembly 31 is used for clamping the workpiece 5. The moving assembly 32 is used for driving the clamping assembly 31 to move horizontally or vertically. The moving assembly 32 comprises the transverse power piece 34 and the vertical power piece 35. The power source one 33 is used for driving the clamping assembly 31 to turn over. The clamping assembly 31 comprises the clamping cavity 311. The clamping cavity 311 is used for containing the workpiece 5. The clamping cavity 311 is provided with the contact point 312 and the guide surface 313. The contact point 312 is used for contacting the workpiece 5. The guide surface 313 is used for guiding the workpiece 5 to enter the clamping cavity 311. In the embodiment, the transfer mechanism 3 is provided with two groups. The power source one 33 can adopt a motor. The transverse power piece 34 and the vertical power piece 35 can adopt a linear module or an air cylinder. The clamping cavity 311 is provided with a protection pad. The contact point 312 and the guide surface 313 are arranged on the protection pad. The protection pad can adopt a flexible material such as silica gel or rubber.

[0028] The storage mechanism 4 comprises a storage cylinder 41 and a feeding chain 42, the feeding chain 42 is used to drive the workpiece 5 of the storage cylinder 41 to move under the action of the moving assembly 32, in the embodiment, the number of the feeding chain 42 is provided with two groups, the feeding chain 42 is provided with a limiting surface 43, the limiting surface 43 is used to limit the position of the workpiece 5, the storage cylinder 41 is provided with a roller 411 and a passing hole 422, the passing hole 422 is used for the clamping assembly 31 to pass through, the feeding chain 42 is installed on the storage cylinder 41 through the roller 411.

[0029] The grinding mechanism 2 comprises a grinding assembly 21, a support platform 22 and a power source two 23, the power source two 23 is used to drive the support platform 22 to rotate, the support platform 22 is used to limit the position of the workpiece 5, the grinding assembly 21 is used to grind the workpiece 5 on the support platform 22, the support platform 22 is provided with an avoiding groove 24, the avoiding groove 24 is used to avoid a part of the clamping assembly 31, so that the clamping assembly 31 is more convenient to place the workpiece 5 on the support platform 22, the grinding assembly 21 comprises a grinding piece 211 and a power source three 212, the power source three 212 is used to drive the grinding piece 211 to approach or move away from the workpiece 5, the grinding piece 211 is used to grind the workpiece 5, in the embodiment, the power source two 23 can adopt a motor, the power source three 212 can adopt a cylinder and a cylinder combination to drive the grinding piece 211 to move horizontally or vertically, the grinding piece 211 can adopt a grinding wheel.

[0030] When working, the workpiece 5 is placed on the limiting surface 43 of the feeding chain by using other structures, the vertical power piece 35 drives the clamping assembly 31 to move vertically, when moving to the position of the workpiece 5, the horizontal power piece 34 drives the clamping assembly 31 to move horizontally, so that the clamping cavity 311 approaches the workpiece 5, so that the workpiece 5 is clamped by the clamping assembly 31, the vertical power piece 35 drives the workpiece 5 to move downward, the vertical power piece 35 sends the workpiece 5 to the support platform 22, the workpiece 5 drives the adjacent workpiece 5 to move to the appropriate position, the horizontal power piece 34 drives the clamping assembly 31 to move horizontally, so that the clamping assembly 31 moves away from the workpiece 5, the power source two 23 drives the support platform 22 to rotate, so that the workpiece 5 rotates, the power source three 212 drives the grinding piece 211 to approach the workpiece 5, and the workpiece 5 is ground.

[0031] After the grinding of one side is completed, the grinding piece 211 moves away from the workpiece 5, and the workpiece 5 stops rotating, the clamping assembly 31 clamps the workpiece 5, the vertical power piece 35 drives the workpiece 5 to move upward to the appropriate position, the power source one 33 drives the workpiece 5 to rotate, so that the ungrounded side of the workpiece 5 faces upward, the vertical power piece 35 drives the workpiece 5 to move downward to the support platform 22, the horizontal power piece 34 drives the clamping assembly 31 to move away from the workpiece 5, the grinding piece 211 approaches the workpiece 5, and the other side of the workpiece 5 is ground.

[0032] The implementation principle of this embodiment is as follows: after the moving component 32 drives the clamping component 31 to move vertically to the workpiece 5, the moving component 32 continues to drive the clamping component 31 to move horizontally, so that the clamping cavity 311 is close to the workpiece 5, and the guide surface 313 guides the workpiece 5 into the clamping cavity 311, making it easier for the workpiece 5 to enter the clamping cavity 311. The contact point 312 contacts the workpiece 5, so that the clamping effect of the clamping cavity 311 on the workpiece 5 is higher, so that the workpiece 5 is clamped by the clamping component 31, so that the moving component 32 sends the workpiece 5 to the grinding mechanism 2. When the workpiece 5 needs to be flipped, the moving component 32 drives the workpiece 5 to the appropriate position, and the power source 33 drives the clamping component 31 to flip, so that the workpiece 5 is turned over, thereby improving the grinding efficiency of the workpiece 5.

[0033] The embodiments of this specific implementation method are all preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An apparatus for automatically turning and grinding a single crystal silicon wafer, comprising: a wafer holding device; a wafer turning device; a wafer grinding device; and a wafer transfer device. The grinding mechanism (2) and the transfer mechanism (3) are included, the transfer mechanism (3) is used for driving the workpiece (5) to transfer to the grinding mechanism (2) and driving the workpiece (5) to turn over, the grinding mechanism (2) is used for grinding the workpiece (5), the transfer mechanism (3) includes a clamping assembly (31), a moving assembly (32) and a power source (33), the clamping assembly (31) is used for clamping the workpiece (5), the moving assembly (32) is used for driving the clamping assembly (31) to move laterally or vertically, and the power source (33) is used for driving the clamping assembly (31) to overturn.

2. The apparatus according to claim 1, wherein: The clamping assembly (31) includes a clamping cavity (311) for accommodating the workpiece (5), and a contact point (312) and a guide surface (313) are arranged on the clamping cavity (311), the contact point (312) is used for contacting the workpiece (5), and the guide surface (313) is used for guiding the workpiece (5) into the clamping cavity (311).

3. The apparatus according to claim 1, wherein: It also includes a storage mechanism (4) for storing workpieces (5) and moving the workpieces (5) to the clamping range of the clamping assembly (31) under the action of the moving assembly (32).

4. The apparatus according to claim 3, wherein: The storage mechanism (4) includes a storage cylinder (41) and a feeding chain (42), and the feeding chain (42) is used for moving the workpieces (5) of the storage cylinder (41) under the action of the moving assembly (32).

5. The apparatus according to claim 4, wherein: The feeding chain (42) is provided with a limiting surface (43) for limiting the position of the workpiece (5).

6. The apparatus according to claim 4, wherein: The storage cylinder (41) is provided with a roller (411) and a through port (422), the through port (422) is used for the clamping assembly (31) to pass through, and the feeding chain (42) is installed on the storage cylinder (41) through the roller (411).

7. The apparatus according to claim 1, wherein: The grinding mechanism (2) includes a grinding assembly (21), a support platform (22) and a power source (23), the power source (23) is used for driving the support platform (22) to rotate, the support platform (22) is used for limiting the position of the workpiece (5), and the grinding assembly (21) is used for grinding the workpiece (5) on the support platform (22).

8. The apparatus according to claim 7, wherein: The support platform (22) is provided with an avoiding groove (24) for avoiding a part of the clamping assembly (31).

9. The apparatus according to claim 4, wherein: The grinding assembly (21) includes a grinding part (211) and a power source (212), the power source (212) is used for driving the grinding part (211) to approach or move away from the workpiece (5), and the grinding part (211) is used for grinding the workpiece (5).

Images