Automatic polishing device for bonding wire

Abstract

The utility model relates to the technical field of polishing equipment, in particular to an automatic polishing device for a bonding wire. The tension adjusting mechanism comprises two fixing plates, the fixing plates are symmetrically distributed and fixedly installed at the top end of the rack, guide rods are fixedly installed on the sides, close to each other, of the fixing plates, moving blocks are symmetrically installed on the peripheries of the guide rods in a sliding mode, and connecting rods are rotatably installed at the tops of the moving blocks; a mounting frame is rotatably mounted on the upper portion of the connecting rod, an auxiliary wheel is rotatably mounted in the mounting frame, and mounting plates are slidably mounted on the two sides of the guide rod. The bonding wire grinding and polishing device has the beneficial effects that when a bonding wire passes through the auxiliary wheel, the auxiliary wheel can move, the mounting frame is matched with the connecting rod and the moving block to oppositely move along the guide rod, and then the spring is compressed, so that the auxiliary wheel can adjust the tension of the bonding wire, a grinding and polishing mechanism can conveniently grind and polish the bonding wire, and the grinding and polishing efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of polishing equipment, concretely is automatic polishing device of bonding wire. BACKGROUND

[0002] Bonding wire is a kind of wire for connecting the electrode inside integrated circuit chip and external circuit, usually used in wire bonding process, and plays an important role in semiconductor manufacturing and packaging process, and its main function is to establish stable electrical connection between internal circuit and external circuit of chip through metal lead, which not only needs to ensure the effective transmission of electrical signal, but also needs to ensure the reliability and durability of connection. According to the different materials, the bonding wire can be divided into gold wire, aluminum wire and copper wire, and each material has its unique characteristics and application occasions.

[0003] In the prior art, the bonding wire needs to be polished to remove the surface oxide layer and impurities, which helps to improve the conductivity of the bonding wire, generally, the bonding wire on the feeding frame is wound after polishing, but the bonding wire is too tight or too loose during polishing, which affects the polishing quality of the bonding wire. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing automatic polishing device of bonding wire to solve the problems in the above background.

[0005] To achieve the above purpose, the utility model provides the following technical scheme: automatic polishing device of bonding wire, comprising:

[0006] Frame;

[0007] Tension adjusting mechanism, the tension adjusting mechanism is equipped in the top of frame, the tension adjusting mechanism includes two fixed plates, the fixed plate is symmetrically distributed and is fixedly installed at the top end of frame, the fixed plate is fixedly installed with guide rod on the side close to each other, the guide rod is symmetrically slidably installed with moving block on the outer periphery, the moving block top is rotatably installed with connecting rod, the connecting rod upper part is rotatably installed with mounting bracket, the mounting bracket is rotatably installed with auxiliary wheel, the guide rod both sides are slidably installed with mounting plate, the mounting plate is fixedly installed with spring on the side close to connecting rod, the spring is fixedly installed on the same side moving block on the end away from mounting plate respectively, the mounting plate surface is rotatably installed with adjusting bolt and adjusting bolt is respectively screw threadedly connected in the both ends of guide rod;

[0008] Polishing mechanism, the polishing mechanism is equipped in one side of the top of frame.

[0009] Preferably, mounting holes are formed in the four corners of the top end of the frame, and are fixed with fixing bolts to fix the frame.

[0010] Preferably, a material receiving rack is fixedly installed at the middle of one side of the top end of the frame, and a material feeding rack is fixedly installed at the other side of the top end of the frame.

[0011] Preferably, the polishing mechanism is arranged on the same horizontal line with the material receiving rack and the material feeding rack.

[0012] Preferably, the polishing mechanism comprises a casing, which is fixedly installed at the middle of one side of the top end of the frame, and a plurality of polishing racks are fixedly installed in the casing, each of the polishing racks is fixedly installed with a plurality of groups of supporting plates, each group of the supporting plates is rotatably installed with a rotating shaft, and a polishing wheel is fixedly installed at the middle of the outer periphery of the rotating shaft.

[0013] Preferably, the polishing mechanism further comprises a plurality of groups of transmission wheels, each group of the transmission wheels is fixedly installed on the same group of the rotating shafts, each group of the transmission wheels is provided with a belt, one of each group of the supporting plates is fixedly installed with a stepping motor, and the output end of the stepping motor is connected with the same side of the rotating shaft.

[0014] Compared with the prior art, the polishing mechanism has the following beneficial effects:

[0015] The tension adjusting mechanism is arranged in the automatic polishing device for the bonding wire, the auxiliary wheel moves when the bonding wire passes through the auxiliary wheel, the mounting frame cooperates with the connecting rod, the moving block can move along the guide rod, the spring is compressed, the tension of the bonding wire is adjusted by the auxiliary wheel, the polishing mechanism is convenient for polishing the bonding wire, the polishing efficiency is improved, and the spring force can be adjusted by rotating the adjusting bolt, so that the staff can adjust according to the use requirement. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a front view of the three-dimensional structure of the utility model;

[0017] Fig. 2 It is a local structure diagram of the tension adjusting mechanism of the utility model;

[0018] Fig. 3 It is a diagram of the internal structure of the casing of the utility model;

[0019] Fig. 4 It is a local structure diagram of the polishing mechanism of the utility model.

[0020] In the figure: 1, rack; 2, mounting hole; 3, feeding frame; 4, tension adjusting mechanism; 41, fixed plate; 42, moving block; 43, guide rod; 44, connecting rod; 45, mounting frame; 46, auxiliary wheel; 47, adjusting bolt; 48, mounting plate; 49, spring; 5, receiving frame; 6, polishing mechanism; 61, machine shell; 62, polishing frame; 63, support plate; 64, belt; 65, polishing wheel; 66, transmission wheel; 67, rotating shaft; 68, stepping motor. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme of the utility model carry out clearly, complete description, and the advantage is more clear and obvious, the following combining with the figure to the utility model embodiment carries out further detailed explanation.Should understand, the specific embodiment described here is a part of the embodiment of the utility model, instead of all the embodiments, only use to explain the embodiment of the utility model, and does not use to limit the embodiment of the utility model, all other embodiments obtained by the ordinary skill in the art without making the creative labor belongs to the scope of the protection of the utility model.

[0022] Please refer to Figs. 1 to 4 The utility model provides a technical scheme: automatic polishing device for bonding wire, it includes: rack 1;Tension adjusting mechanism 4, tension adjusting mechanism 4 is located at rack 1 top, and tension adjusting mechanism 4 includes two fixed plates 41, and fixed plate 41 is symmetrically distributed fixed installation in rack 1 top end, and fixed plate 41 is fixedly installed with guide rod 43 on the side close to each other, and guide rod 43 is symmetrically slidably installed with moving block 42 on the outer periphery, and moving block 42 top is rotatably installed with connecting rod 44, and connecting rod 44 upper part is rotatably installed with mounting frame 45, and mounting frame 45 is rotatably installed with auxiliary wheel 46 in, and guide rod 43 both sides are slidably installed with mounting plate 48, and mounting plate 48 close to connecting rod 44 one side is fixedly installed with spring 49, and spring 49 far away from mounting plate 48 one end is fixedly installed on the same side moving block 42 respectively, and mounting plate 48 surface is rotatably installed with adjusting bolt 47 and adjusting bolt 47 is respectively screwed in guide rod 43 both ends, when bonding wire passes through auxiliary wheel 46, if bonding wire tension is too large, auxiliary wheel 46 will move down, and then mounting frame 45 cooperates with connecting rod 44, and moving block 42 can move along guide rod 43 towards each other, and then spring 49 will be compressed, when tension becomes small, spring 49 will reset, so that auxiliary wheel 46 will reset, so that bonding wire tension can be kept at all times, it is convenient for polishing mechanism 6 to polish bonding wire, at the same time, staff can adjust the elasticity of spring 49 by rotating adjusting bolt 47, it is convenient for staff to adjust according to the use demand.

[0023] The mounting holes 2 are arranged at the four corners of the top end of the rack 1, and cooperate with the fixing bolts to fix the rack 1. The material collecting frame 5 is fixedly installed at the middle of one side of the top end of the rack 1. The feeding frame 3 is fixedly installed at the other side of the top end of the rack 1. The polishing mechanism 6 is arranged on the same horizontal line with the material collecting frame 5 and the feeding frame 3. The bonding wires on the feeding frame 3 can be uniformly transported by arranging the feeding frame 3. The material collecting frame 5 can wind the polished bonding wires. The driving members are arranged on the feeding frame 3 and the material collecting frame 5, which facilitates feeding and material collecting.

[0024] The polishing mechanism 6 is arranged on one side of the top of the rack 1. The polishing mechanism 6 includes the shell 61, which is fixedly installed at the middle of one side of the top end of the rack 1. A plurality of polishing frames 62 are fixedly installed in the shell 61. A plurality of groups of supporting plates 63 are fixedly installed in each polishing frame 62. A rotating shaft 67 is rotatably installed in each group of supporting plates 63. A polishing wheel 65 is fixedly installed at the middle of the outer periphery of the rotating shaft 67. The polishing mechanism 6 further includes a plurality of groups of transmission wheels 66. The transmission wheels 66 are fixedly installed on the same group of rotating shafts 67. The outer periphery of each group of transmission wheels 66 is provided with a belt 64. A stepping motor 68 is fixedly installed on the surface of each group of supporting plates 63. The output end of the stepping motor 68 is connected to the same side of the rotating shaft 67. The corresponding rotating shaft 67 can be driven to rotate by controlling the stepping motor 68. The polishing wheel 65 can rotate at a constant speed by cooperating with the rotating wheel and the belt 64. The bonding wires in the shell 61 can be uniformly polished.

[0025] In actual use, the bonding wires on the feeding frame are sequentially passed through the auxiliary wheel 46, the shell 61 and the material collecting frame 5. The stepping motor 68 is controlled, and the rotating shaft 67 can be driven to rotate by the stepping motor 68. The polishing wheel 65 can rotate by cooperating with the rotating wheel and the belt 64, and the bonding wires can be polished. The auxiliary wheel 46 cooperates with the connecting rod 44, the moving block 42, the guide rod 43 and the spring 49 to automatically adjust the tension, which facilitates the polishing of the polishing wheel 65.

[0026] Although the above describes the specific embodiments of the present application to facilitate the understanding of the present application by those skilled in the art, the present application is not limited to the scope of the specific embodiments. For those skilled in the art, all applications created by utilizing the concept of the present application are within the scope of the present application.

Claims

1. An automated bonding wire polishing apparatus, characterized by: Include: Frame (1); Tension adjusting mechanism (4), the tension adjusting mechanism (4) is located at the top of the frame (1), the tension adjusting mechanism (4) includes two fixed plates (41), the fixed plate (41) is symmetrically fixedly installed at the top end of the frame (1), the fixed plate (41) is fixedly installed with a guide rod (43) on the side close to each other, the guide rod (43) is symmetrically slidably installed with a moving block (42), the moving block (42) is rotatably installed with a connecting rod (44) on the top, the connecting rod (44) is rotatably installed with a mounting bracket (45) on the upper portion, the mounting bracket (45) is rotatably installed with an auxiliary wheel (46), the guide rod (43) is slidably installed with a mounting plate (48) on both sides, the mounting plate (48) is fixedly installed with a spring (49) on the side close to the connecting rod (44), the spring (49) is fixedly installed on the same side moving block (42) on the end away from the mounting plate (48), the mounting plate (48) is rotatably installed with an adjusting bolt (47) on the surface and the adjusting bolt (47) is respectively screwed in the both ends of the guide rod (43); Polishing mechanism (6), the polishing mechanism (6) is located at one side of the top of the frame (1).

2. The bonded wire automated polishing apparatus of claim 1, wherein: The mounting hole (2) is formed at the top of the frame (1) at the four corners, and the fixed bolt is matched to fix the frame (1).

3. The bonded wire automated polishing apparatus of claim 1, wherein: The material receiving frame (5) is fixedly installed on one side of the top of the frame (1), and the feeding frame (3) is fixedly installed on the other side of the top of the frame (1).

4. The bonded wire automated polishing apparatus of claim 1, wherein: The polishing mechanism (6), the material receiving frame (5) and the feeding frame (3) are located on the same horizontal line.

5. The bonded wire automated polishing apparatus of claim 1, wherein: The polishing mechanism (6) includes a shell (61), the shell (61) is fixedly installed on one side of the top of the frame (1), a plurality of uniformly distributed polishing frames (62) are fixedly installed in the shell (61), a plurality of groups of supporting plates (63) are fixedly installed in each polishing frame (62), a rotating shaft (67) is rotatably installed in each group of supporting plates (63), and a polishing wheel (65) is fixedly installed on the outer periphery of the rotating shaft (67).

6. The bonded wire automated polishing apparatus of claim 5, wherein: The polishing mechanism (6) further includes a plurality of groups of transmission wheels (66), the transmission wheels (66) are respectively fixedly installed on the same group of rotating shafts (67), each group of transmission wheels (66) is provided with a belt (64) on the outer periphery, each group of supporting plates (63) is fixedly installed with a stepping motor (68) on the surface, and the output end of the stepping motor (68) is connected with the same side rotating shaft (67).

Images