Clamping workpiece for wafer chamfering

Abstract

A clamping workpiece for wafer chamfering comprises a mounting substrate, a clamping adjusting assembly and a linkage driving assembly. Two connecting ports are formed in the mounting substrate; the clamping adjusting assembly comprises a left moving plate, a right moving plate and an upper moving plate, a plurality of clamping columns are fixed to the left moving plate, the right moving plate and the upper moving plate, and a rotating adjusting sleeve is arranged on any clamping column; the linkage driving assembly comprises a first rack, a middle gear, a second rack, a horizontal driving piece and a lifting driving piece, the first rack and the second rack are parallel and are arranged in a sliding mode, the right moving plate is connected with the first rack through a first connecting sliding plate, and the left moving plate is connected with the second rack through a second connecting sliding plate; the first rack and the second rack are both meshed with the intermediate gear, the horizontal driving part is connected with the first rack to drive the right moving plate and the left moving plate to synchronously move in the opposite directions, and the lifting driving part is connected with the upper moving plate. According to the utility model, the wafer can be rapidly clamped and the angle of the wafer can be finely adjusted and corrected.

Description

Technical Field

[0001] The utility model relates to the field of wafer chamfering clamping and transporting technical equipment, in particular to a workpiece clamping device for wafer chamfering. Background Art

[0002] Wafer chamfering involves using specific cutting techniques to remove or round the corner between the upper edge of the wafer cutting edge and the side of the workpiece. This process smoothes the wafer edge, reduces burrs and cracks generated during the cutting process, and improves the wafer's surface finish. Smooth wafer edges help reduce damage during subsequent processing and transportation, extending the wafer's lifespan and stability. Chamfered wafer edges are also more suitable for packaging processes, reducing micro-shorts and gap issues during the packaging process, thereby improving packaging efficiency and quality.

[0003] However, in the prior art, the chamfering of the wafer is usually performed by a chamfering system. Before chamfering, a clamping tool is required to clamp the wafer and transfer it to the wafer chamfering workbench for chamfering. However, due to the influence of factors such as the operation process or personnel, the angle of the wafer may deviate when the clamping tool clamps the wafer. If the clamping tool places the wafer on the chamfering workbench, the placement angle of the wafer will also deviate. The deviation in the placement angle of the wafer on the chamfering workbench will affect the quality and effect of the chamfering. Utility Model Content

[0004] The utility model aims to provide a clamping workpiece for wafer chamfering, which can quickly clamp the wafer and fine-tune the angle of the wafer.

[0005] In order to solve the above technical problems, the specific solution adopted by the utility model is a workpiece clamp for wafer chamfering, comprising a mounting base, a clamping and adjusting assembly arranged on the front side of the mounting base, and a linkage drive assembly arranged on the back side of the mounting base; the mounting base is symmetrically provided with two connection ports for connecting the clamping and adjusting assembly and the linkage drive assembly;

[0006] The clamping adjustment assembly includes a left movable plate, a right movable plate and an upper movable plate. The upper movable plate is arranged between the upper ends of the left movable plate and the right movable plate. A plurality of clamping columns are vertically fixed on the left movable plate, the right movable plate and the upper movable plate, respectively. A rotating sleeve is provided on any clamping column.

[0007] The linkage driving assembly comprises a first rack, an intermediate gear, a second rack, a horizontal driving part and a lifting driving part, the first rack and the second rack are parallel to each other and are slidably arranged on the mounting base plate, the right moving plate is connected with the first rack through the first connecting sliding plate, the left moving plate is connected with the second rack through the second connecting sliding plate, the first rack and the second rack are engaged with the intermediate gear, the horizontal driving part is connected with the first rack, so that the right moving plate and the left moving plate are synchronously moved towards the opposite direction to clamp the wafer or the opposite direction to release the wafer by driving the first rack to move; the lifting driving part is connected with the upper moving plate to drive the upper moving plate to descend to clamp the wafer or to ascend to release the wafer.

[0008] As another optimization scheme of the above-mentioned wafer chamfering clamping workpiece, the rotating adjusting sleeve gradually decreases in diameter from the two ends to the center.

[0009] As another optimization scheme of the above-mentioned wafer chamfering clamping workpiece, the back of the mounting base plate is provided with two horizontal sliding rails, the two horizontal sliding rails are arranged side by side and are spaced apart, and the first connecting sliding plate and the second connecting sliding plate are respectively provided with sliding grooves for sliding cooperation with the corresponding horizontal sliding rails.

[0010] As another optimization scheme of the above-mentioned wafer chamfering clamping workpiece, the side of the first rack slidably cooperating with the mounting base plate is provided with a fixed step, the upper end of the first connecting sliding plate slidably cooperates with the horizontal sliding rail, and the lower end of the first connecting sliding plate is fixed on the fixed step.

[0011] As another optimization scheme of the above-mentioned wafer chamfering clamping workpiece, the horizontal driving part is a gas cylinder, and the first spring is connected between the horizontal driving part and the first rack.

[0012] As another optimization scheme of the above-mentioned wafer chamfering clamping workpiece, the lifting driving part is a gas cylinder, and the piston rod of the lifting driving part is hinged to the mounting base plate, and the upper moving plate is fixedly connected with the cylinder body of the lifting driving part.

[0013] As another optimization scheme of the above-mentioned wafer chamfering clamping workpiece, the cylinder body of the lifting driving part is slidably connected with the lifting sliding rail arranged on the mounting base plate through the sliding block.

[0014] As another optimization scheme of the above-mentioned wafer chamfering clamping workpiece, the second spring is arranged between the mounting base plate and the cylinder body of the lifting driving part.

[0015] Compared with the prior art, the wafer chamfering clamping workpiece has the following beneficial effects:

[0016] The right moving plate is connected with the first rack through the first connecting sliding plate, and the left moving plate is connected with the second rack through the second connecting sliding plate, the first rack connected with the horizontal driving part can drive the second rack to move in the opposite direction synchronously through the intermediate gear engaged with the first rack, so that the left moving plate and the right moving plate are driven to move in the opposite direction synchronously to realize the quick clamping and fixing of the wafer or the wafer is placed down, the upper moving plate connected with the lifting driving part can be lifted or lowered to move in the direction away from or close to the left moving plate and the right moving plate under the driving of the lifting driving part, the clamping column on the upper moving plate can be matched with the clamping column on the left moving plate and the right moving plate to stably clamp the wafer, and the clamping angle of the wafer can be adjusted through the rotation of the rotating adjusting sleeve sleeved on the clamping column after the wafer is clamped, so that the wafer angle deviation affecting the wafer chamfering or edging effect is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a side view structure schematic view of the utility model;

[0018] Figure 2 It is a rear view structure schematic view of the utility model;

[0019] Figure 3 It is a structure schematic view of clamping and adjusting assembly clamping wafer;

[0020] Figure 4 It is a structure schematic view of rotating adjusting sleeve.

[0021] Figure 5 It is a structure schematic view of first connecting sliding plate and first rack side fixed step connection;

[0022] Fig. 1, mounting base plate, 101, connecting port, 2, clamping and adjusting assembly, 201, left moving plate, 202, clamping column, 2021, rotating adjusting sleeve, 203, upper moving plate, 204, right moving plate, 3, wafer, 4, linkage driving assembly, 401, horizontal sliding rail, 402, first rack, 4021, fixed step, 403, horizontal driving part, 4031, first spring, 4032, connecting plate, 404, intermediate gear, 405, second connecting sliding plate, 406, second rack, 407, lifting driving part, 4071, second spring, 4072, sliding block, 4073, lifting sliding rail, 408, first connecting sliding plate. DETAILED DESCRIPTION

[0023] The technical scheme of the utility model will be further described in detail in combination with specific embodiments, and the parts not described in detail in the following embodiments of the utility model, such as the model and specification of the horizontal driving part as a cylinder and the model and specification of the lifting driving part as a cylinder, are all prior art known or should be known by the person skilled in the art.

[0024] As shown in Figures 1-5 A wafer chamfering clamping workpiece includes a mounting base plate 1, a clamping adjustment assembly 2 and a linkage driving assembly 4. The clamping adjustment assembly 2 is arranged on the front surface of the mounting base plate 1 for clamping a wafer 3 and fine-tuning the angle of the wafer 3. The linkage driving assembly 4 is arranged on the back surface of the mounting base plate 1 for driving the clamping adjustment assembly 2 to clamp or release the wafer 3. Two connecting ports 101 are symmetrically arranged on the mounting base plate 1, and the clamping adjustment assembly 2 is connected to the linkage driving assembly 4 through the connecting ports 101.

[0025] The clamping adjustment assembly 2 includes a left moving plate 201 arranged at the left connecting port 101 of the mounting base plate 1, a right moving plate 204 arranged at the right connecting port 101 of the mounting base plate 1, and an upper moving plate 203 arranged between the upper ends of the left moving plate 201 and the right moving plate 204. The upper moving plate 203 is arranged in a mounting groove arranged in the middle of the upper side of the mounting base plate 1, and the upper moving plate 203 is connected to the linkage driving assembly 4 through the mounting groove. The left moving plate 201 and the right moving plate 204 are symmetrically arranged with the upper moving plate 203 as the center of symmetry, and the upper moving plate 203, the left moving plate 201 and the right moving plate 204 are arranged on the same horizontal plane.

[0026] The back surface of the upper moving plate 203, the left moving plate 201 and the right moving plate 204 is not in direct contact with the front surface of the mounting base plate 1. Two clamping columns 202 are fixed on the front surface of the upper moving plate 203, the left moving plate 201 and the right moving plate 204, respectively. Each clamping column 202 is vertically fixed on the corresponding plate surface. Eight. A rotating adjustment sleeve 2021 is rotatably arranged on each clamping column 202. The two ends of the rotating adjustment sleeve 2021 are large ends, and the diameter of the rotating adjustment sleeve 2021 gradually decreases from the two ends to the middle. When the clamping column 202 clamps and fixes the wafer 3, the rotating adjustment sleeve 2021 can rotate to fine-tune and correct the angle of the wafer 3, reduce the deviation of the placement angle of the wafer 3, and ensure the chamfering quality and effect of the wafer 3.

[0027] The linkage driving assembly 4 includes a first rack 402, an intermediate gear 404 and a second rack 406. The first rack 402 and the second rack 406 are arranged on the mounting base plate 1 in parallel and slide, respectively. The tooth surface of the first rack 402 is arranged opposite to the tooth surface of the second rack 406. The first rack 402 is horizontally arranged at the position of the lower side of the left connecting port 101 on the back surface of the mounting base plate 1. A slide rail is horizontally fixed at the position of the lower side of the left connecting port 101 on the back surface of the mounting base plate 1. Correspondingly, a slide groove is arranged on the side surface of the first rack 402 facing the back surface of the mounting base plate 1 along the length direction of the first rack 402 for sliding cooperation with the slide rail.

[0028] Similarly, the second rack 406 is horizontally arranged at a position between the upper edges of the two connecting ports 101 on the back of the mounting base plate 1, and a slide rail for horizontal sliding of the second rack 406 is arranged at a position corresponding to the position of the second rack 406. The intermediate gear 404 is rotationally arranged between the first rack 402 and the second rack 406 and is in meshing cooperation with the first rack 402 and the second rack 406, respectively.

[0029] If the first rack 402 slides towards the right side, the first rack 402 can drive the second rack 406 to slide towards the opposite left side by driving the intermediate gear 404 to rotate. If the first rack 402 slides towards the left side, the first rack 402 can drive the second rack 406 to slide towards the opposite right side by driving the intermediate gear 404 to rotate.

[0030] The left moving plate 201 is connected with the second rack 406 through the second connecting slide plate 405. The left side edge of the second connecting slide plate 405 is fixedly connected with the right end of the second rack 406. The second connecting slide plate 405 is slidingly arranged at the right side portion on the back of the mounting base plate 1. A slide groove is formed in the upper end of the second connecting slide plate 405 towards the side surface of the mounting base plate 1 along the length direction thereof. Correspondingly, a horizontal slide rail 401 for sliding cooperation with the slide groove of the upper end of the second connecting slide plate 405 is fixed on the back of the mounting base plate 1. The horizontal slide rail 401 is located at a position above the upper edge of the connecting port 101 on the right side of the back of the mounting base plate 1 and is parallel to the second rack 406.

[0031] A fixed step 4021 is arranged on the side surface of the first rack 402 in sliding cooperation with the slide rail. The fixed step 4021 is arranged in the gap between the first rack 402 and the back of the mounting base plate 1. The right moving plate 204 is connected with the first rack 402 through the first connecting slide plate 408. The first connecting slide plate 408 is slidingly arranged at the left side portion on the back of the mounting base plate 1. The lower end of the first connecting slide plate 408 is fixed on the fixed step 4021.

[0032] A horizontal driving member 403 is arranged at a position on the back of the mounting base plate 1 below the first rack 402. The horizontal driving member 403 is a pneumatic cylinder. The cylinder body of the horizontal driving member 403 is fixed on the mounting base plate 1 through a mounting bracket. The piston rod of the horizontal driving member 403 is fixedly connected with the right end of the first rack 402 through a connecting plate 4032.

[0033] When the piston rod of the horizontal driving member 403 is extended, the first rack 402 moves left and synchronously drives the second rack 406 to move right through the intermediate gear 404. The oppositely moving first rack 402 and the second rack 406 drive the right moving plate 204 and the left moving plate 201 to oppositely move through the first connecting slide plate 408 and the second connecting slide plate 405, respectively. The oppositely moving left moving plate 201 and right moving plate 204 open the square wafer 3.

[0034] When the piston rod of the horizontal drive 403 is retracted, the first rack 402 moves right and the second rack 406 moves left synchronously through the intermediate gear 404, and the right moving plate 204 and the left moving plate 201 connected therewith move synchronously towards the opposite direction.

[0035] The back of the mounting base plate 1 is provided with a lifting drive 407 for driving the upward moving plate 203 to move up and down, the lifting drive 407 is a cylinder, the piston rod end of the lifting drive 407 is hinged to the mounting base plate 1 through a hinge, and the upward moving plate 203 is fixed to one side surface of the cylinder body of the lifting drive 407. The position of the mounting base plate 1 at the mounting groove is provided with a lifting slide rail 4073, which is arranged along the direction of the upward moving plate 203 moving up or down.

[0036] Correspondingly, the right side surface of the cylinder body of the lifting drive 407 is fixed with a sliding block 4072 for sliding fit with the lifting slide rail 4073. Under the drive of the lifting drive 407, the upward moving plate 203 is lowered to cooperate with the clamping columns 202 on the left moving plate 201 and the right moving plate 204 to clamp the wafer 3. After the clamping columns 202 on the upward moving plate 203 clamp the wafer 3, the rotation adjusting sleeve 2021 on the clamping columns 202 is rotated to finely adjust the angle of the wafer 3, so as to reduce the deviation of the placement angle of the wafer 3.

[0037] Further, in order to keep the sliding stability of the first connecting slide plate 408, a horizontal slide rail 401 is fixed to the position of the left side of the connecting port 101 on the back of the mounting base plate 1. The upper end of the first connecting slide plate 408 is provided with a sliding groove for sliding fit with the horizontal slide rail 401.

[0038] Further, the first spring 4031 is installed between the cylinder body of the horizontal drive 403 and the connecting plate 4032, and the second spring 4071 is installed between the cylinder body of the lifting drive 407 and the mounting base plate 1. When the left moving plate 201, the right moving plate 204 and the upward moving plate 203 do not reach the position for clamping the wafer 3, the first spring 4031 and the second spring 4071 can assist in pulling to the position for clamping the wafer 3.

Claims

1. A workpiece for wafer beveling, characterized by: The utility model relates to a wafer clamping device, including installation base plate (1), set up in the clamping adjustment assembly (2) of installation base plate (1) front and set up in the linkage drive assembly (4) of installation base plate (1) back, installation base plate (1) on the two symmetrical connection mouth (101) that are opened with clamping adjustment assembly (2) with linkage drive assembly (4) are connected, Clamping adjustment assembly (2) includes left mobile board (201), right mobile board (204) and upper mobile board (203), and upper mobile board (203) is arranged between left mobile board (201) and right mobile board (204) upper end portion, and a plurality of clamping columns (202) are vertically fixed on left mobile board (201), right mobile board (204) and upper mobile board (203) respectively, and a rotating adjustment sleeve (2021) is rotatably arranged on any one clamping column (202), Linkage drive assembly (4) includes first rack (402), intermediate gear (404), second rack (406), horizontal drive part (403) and lifting drive part (407), first rack (402) and second rack (406) are parallel to each other and are slidably arranged on installation base plate (1), right mobile board (204) is connected with first rack (402) through first connecting slide plate (408), left mobile board (201) is connected with second rack (406) through second connecting slide plate (405), first rack (402) and second rack (406) are engaged with intermediate gear (404), horizontal drive part (403) is connected with first rack (402), so as to drive right mobile board (204) and left mobile board (201) to move synchronously towards opposite wafer (3) or opposite direction to move down wafer (3) by driving first rack (402) to move; lifting drive part (407) is connected with upper mobile board (203) to drive upper mobile board (203) to descend and cooperate wafer (3) or to ascend and move down wafer (3).

2. The clamping workpiece for wafer chamfering according to claim 1, characterized in that: The rotating adjustment sleeve (2021) gradually decreases in diameter from its two ends to the center.

3. The clamping workpiece for wafer chamfering according to claim 1, wherein: Two horizontal slide rails (401) are installed on the back of the installation base plate (1), the two horizontal slide rails (401) are arranged side by side and spaced apart, and a sliding groove is formed on the first connecting slide plate (408) and the second connecting slide plate (405) for sliding cooperation with the corresponding horizontal slide rail (401).

4. The clamping workpiece for wafer chamfering according to claim 3, characterized in that: A fixed step (4021) is formed on the side of the first rack (402) that is in sliding cooperation with the installation base plate (1), the upper end of the first connecting slide plate (408) is in sliding cooperation with the horizontal slide rail (401), and the lower end of the first connecting slide plate (408) is fixed on the fixed step (4021).

5. The clamping workpiece for wafer chamfering according to claim 1, characterized in that: The horizontal drive part (403) is a gas cylinder, and a first spring (4031) is connected between the horizontal drive part (403) and the first rack (402).

6. The clamping workpiece for wafer chamfering according to claim 1, wherein: The lifting drive part (407) is a gas cylinder, the piston rod of the lifting drive part (407) is hinged to the installation base plate (1), and the cylinder body of the lifting drive part (407) is connected and fixed with the upper mobile board (203).

7. The clamping workpiece for wafer chamfering according to claim 6, characterized in that: The cylinder body of the lifting drive part (407) is in sliding cooperation with the lifting slide rail (4073) arranged on the installation base plate (1) through a sliding block (4072).

8. The clamping workpiece for wafer chamfering according to claim 6, characterized in that: A second spring (4071) is arranged between the mounting substrate (1) and a cylinder of the lifting drive (407).

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