Air and liquid cooling heat dissipation charging module

Abstract

The utility model relates to the technical field of charging piles, in particular to a wind-liquid cooling heat dissipation charging module which comprises a shell, a plurality of fans are installed on the side wall of the shell, PCB mainboards are fixedly connected to the inner top and the inner bottom of the shell, and an electrical interface is installed on the side wall, away from the fans, of the shell. A plurality of heat dissipation holes are formed in the inner wall, away from the fan, of the shell; the liquid cooling plate is located between the two PCB mainboards, the upper end and the lower end of the liquid cooling plate are attached to the two PCB mainboards respectively, and the liquid cooling plate comprises a liquid cooling inlet component, a liquid cooling outlet component and a heat exchange collecting plate; the interior of the heat exchange collecting plate is of a micro-channel structure. According to the utility model, the liquid cooling plate is arranged between the two PCB mainboards, and the liquid cooling plate is in contact with the two PCB mainboards, so that heat can be brought out through conduction heat dissipation even if local blockage exists and convection heat dissipation can not be realized, and convection heat dissipation can be realized for non-power devices at the same time.

Description

TECHNICAL FIELD

[0001] The utility model relates to charging pile technical field, concretely relates to a wind liquid cooling heat dissipation charging module. BACKGROUND

[0002] New energy automobile development drives the development and update of fast charging and super charging charging piles, and one of the core components of DC fast charging and DC super charging charging piles is a charging module, and the prior art divides the charging module into air cooling charging module and liquid cooling charging module based on heat dissipation mode.

[0003] Among them, the air cooling charging module mainly adopts a large overpressure panel fan to forcibly transport air to the internal PCB mainboard to realize convection heat dissipation, and the liquid cooling charging module mainly adopts a cooling liquid to be introduced into a cold plate type shell to contact and conduct heat dissipation with the internal PCB mainboard.

[0004] However, in the actual operation process, the air cooling charging module adopts a large overpressure fan, which has a large noise, and dust is easy to accumulate after a period of use, causing local blockage and local heat dissipation disadvantage, resulting in device damage phenomenon, and the liquid cooling charging module adopts a full sealing structure, part of the device cannot contact the shell or the cold plate, and there is no convection phenomenon. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the shortcomings in the prior art and provides a wind liquid cooling heat dissipation charging module.

[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A wind liquid cooling heat dissipation charging module, comprising:

[0008] A shell, a plurality of fans are installed on the side wall of the shell, a PCB mainboard is fixedly connected to the inner top and the inner bottom of the shell, an electrical interface is installed on the side wall of the shell away from the fan, and a plurality of heat dissipation holes are formed in the inner wall of the shell away from the fan;

[0009] A liquid cooling plate is located between the two PCB mainboards, and the upper end and the lower end of the liquid cooling plate are respectively attached to the two PCB mainboards, and the liquid cooling plate comprises a liquid cooling inlet component, a liquid cooling outlet component and a heat exchange set plate;

[0010] The heat exchange set plate adopts a microchannel structure inside, and the thickness of the heat exchange set plate is less than or equal to 10mm;

[0011] The liquid cooling inlet component comprises a first fixed frame, and the inner wall of the first fixed frame is fixedly connected with a liquid inlet pipe;

[0012] The liquid cooling outlet component comprises a second fixed frame, and the inner wall of the second fixed frame is fixedly connected with a liquid outlet pipe;

[0013] The liquid inlet pipe and the liquid outlet pipe side walls are both through the inner wall of the shell away from the fan;

[0014] The heat exchange set plate comprises a second heat dissipation plate and a third heat dissipation plate, the second heat dissipation plate and the third heat dissipation plate are tightly attached to each other between the side walls close to each other, a plurality of first through grooves are formed in the side wall of the second heat dissipation plate, a plurality of second through grooves corresponding to the plurality of first through grooves are formed in the side wall close to the second heat dissipation plate of the third heat dissipation plate, and the rubber gaskets are fixedly connected to the inner walls of the two first through grooves close to the two sides of the second heat dissipation plate, so that the sealing between the second heat dissipation plate and the third heat dissipation plate is realized.

[0015] The liquid cooling plate further comprises a backflow frame, the side walls of the first fixed frame and the second fixed frame are fixedly connected to the inner wall of the shell away from the fan, and the first fixed frame and the second fixed frame are located on the same side and are arranged in a penetrating manner, the inner side walls close to each other of the first fixed frame and the second fixed frame are fixedly connected in a penetrating manner, the inner side walls of the first fixed frame and the second fixed frame are fixedly connected in a sealing manner, and the inner side walls of the first fixed frame and the second fixed frame are fixedly connected in a sealing manner with the outer side walls of the second heat dissipation plate and the third heat dissipation plate.

[0016] The utility model has the following beneficial effects:

[0017] 1. The liquid cooling plate is arranged between the two PCB mainboards, and the liquid cooling plate is in contact with the two PCB mainboards, so that even if there is local blockage and convection cooling is impossible, heat can be taken out through conduction cooling, and convection cooling can also be realized for non-power devices.

[0018] 2. The liquid cooling plate is arranged between the two PCB mainboards, and the overall shell adopts a customized liquid cooling plate, so that the liquid cooling plate in the module can be processed by section material, the cost is lower, and the liquid cooling plate can be used not only for new equipment but also for old equipment modification, and is convenient to popularize and use. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structural schematic view of the first embodiment;

[0020] Figure 2 It is a structural schematic view of the back of the second embodiment; Figure 1 It is a vertical sectional structural schematic view of the second embodiment;

[0021] Figure 3 It is a structural schematic view of the back of the third embodiment; Figure 1 It is a structural schematic view of the back of the fourth embodiment;

[0022] Figure 4 It is a structural schematic view of the inside of the fourth embodiment; Figure 1 It is a structural schematic view of the inside of the fifth embodiment;

[0023] Figure 5 is a vertical sectional structure schematic view of the embodiment of the present application; Figure 4 is a vertical sectional structure schematic view of the embodiment of the present application;

[0024] Figure 6 is a vertical sectional structure schematic view of the embodiment of the present application; Figure 4 is a vertical sectional structure schematic view of the embodiment of the present application.

[0025] In the figure: 1, outer shell; 2, fan; 3, PCB mainboard; 4, electrical interface; 5, first heat dissipation plate; 6, first fixed frame; 7, second fixed frame; 8, fine hole; 9, liquid inlet pipe; 10, liquid outlet pipe; 11, second heat dissipation plate; 12, third heat dissipation plate; 13, first through slot; 14, second through slot; 15, rubber gasket; 16, backflow frame; 17, heat dissipation hole. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0027] Referring to Figures 1-3 , a wind liquid cooling heat dissipation charging module, comprising an outer shell 1, a plurality of fans 2 are installed on the side wall of the outer shell 1, a PCB mainboard 3 is fixedly connected to the inner top and inner bottom of the outer shell 1, an electrical interface 4 is installed on the side wall of the outer shell 1 away from the fan 2, and a plurality of heat dissipation holes 17 are formed in the inner wall of the outer shell 1 away from the fan 2.

[0028] It should be noted that the electrical interface 4 is electrically connected with the plurality of fans 2, and the electrical interface 4 is electrically connected with the two PCB mainboards 3, and the connection mode is prior art.

[0029] The liquid cooling plate is located between the two PCB mainboards 3, and the upper end and the lower end of the liquid cooling plate are respectively attached to the two PCB mainboards 3, and the liquid cooling plate comprises a liquid cooling inlet component, a liquid cooling outlet component and a heat exchange collector.

[0030] The heat exchange collector adopts a micro-channel structure, and the thickness of the heat exchange collector is ≤10mm;

[0031] The liquid cooling inlet component comprises a first fixed frame 6, and the inner wall of the first fixed frame 6 is fixedly connected with a liquid inlet pipe 9.

[0032] The liquid cooling outlet component comprises a second fixed frame 7, and the inner wall of the second fixed frame 7 is fixedly connected with a liquid outlet pipe 10.

[0033] The side walls of the liquid inlet pipe 9 and the liquid outlet pipe 10 penetrate the inner wall of the outer shell 1 away from the fan 2.

[0034] Embodiment one

[0035] Referring to Figures 4-6The heat exchange set plate comprises a second heat dissipation plate 11 and a third heat dissipation plate 12, the second heat dissipation plate 11 and the third heat dissipation plate 12 are tightly attached to each other between the side walls close to each other, a plurality of first through grooves 13 are formed in the side wall of the second heat dissipation plate 11, a plurality of second through grooves 14 corresponding to the plurality of first through grooves 13 are formed in the side wall of the third heat dissipation plate 12 close to the second heat dissipation plate 11, and rubber gaskets 15 are fixedly connected to the inner walls of the two first through grooves 13 close to the two sides of the second heat dissipation plate 11, so that the second heat dissipation plate 11 and the third heat dissipation plate 12 are sealed.

[0036] The liquid cooling plate further comprises a reflux frame 16, the side walls of the first fixed frame 6 and the second fixed frame 7 are fixedly connected to the inner walls of the shell 1 away from the fan 2, the first fixed frame 6 and the second fixed frame 7 are arranged on the same side, the inner side walls close to each other of the first fixed frame 6 and the second fixed frame 7 are both throughly arranged, the inner side walls close to each other of the first fixed frame 6 and the second fixed frame 7 are fixedly and sealingly connected, the inner side walls of the first fixed frame 6 and the second fixed frame 7 are fixedly and sealingly connected to the outer side walls of the second heat dissipation plate 11 and the third heat dissipation plate 12, and the inner side wall of the reflux frame 16 is fixedly and sealingly connected to the outer side walls of the second heat dissipation plate 11 and the third heat dissipation plate 12 away from the first fixed frame 6 and the second fixed frame 7.

[0037] In the use process of the module, a plurality of fans 2 are started, and then the external air flows through the plurality of fans 2, the inside of the shell 1 and the plurality of heat dissipation holes 17, and carries away the heat on the two PCB mainboards 3, and at the same time, the refrigerant is pumped into the outside through the liquid inlet pipe 9 (the pumping method is the prior art), and then the refrigerant flows out through the first fixed frame 6, the heat exchange set plate, the second fixed frame 7 and the liquid outlet pipe 10, so that the heat on the two PCB mainboards 3 is carried away through the liquid cooling mode, so that even if air cooling is used, the heat can be carried away through conduction cooling, and the heat can also be carried away through convection cooling for non-power devices.

[0038] The above is only a preferred specific implementation manner of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.

Claims

1. A wind liquid cooling heat dissipation charging module, characterized in that, The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate. The utility model relates to a liquid cooling plate and liquid cooling plate with microchannel structure and liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate.

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