Air and liquid cooling heat dissipation charging module

Abstract

The utility model relates to the technical field of charging piles, in particular to a wind-liquid cooling heat dissipation charging module which comprises a shell, a plurality of fans are installed on the side wall of the shell, PCB mainboards are fixedly connected to the inner top and the inner bottom of the shell, and an electrical interface is installed on the side wall, away from the fans, of the shell. A plurality of heat dissipation holes are formed in the inner wall, away from the fan, of the shell; the liquid cooling plate is located between the two PCB mainboards, the upper end and the lower end of the liquid cooling plate are attached to the two PCB mainboards respectively, and the liquid cooling plate comprises a liquid cooling inlet component, a liquid cooling outlet component and a heat exchange collecting plate; the interior of the heat exchange collecting plate is of a micro-channel structure. According to the utility model, the liquid cooling plate is arranged between the two PCB mainboards, and the liquid cooling plate is in contact with the two PCB mainboards, so that heat can be brought out through conduction heat dissipation even if local blockage exists and convection heat dissipation can not be realized, and convection heat dissipation can be realized for non-power devices at the same time.

Description

TECHNICAL FIELD

[0001] The utility model relates to charging pile technical field, concretely relates to a wind liquid cooling heat dissipation charging module. BACKGROUND

[0002] New energy automobile development drives the development and update of fast charging and super charging charging piles, and one of the core components of DC fast charging and DC super charging charging piles is a charging module, and the prior art divides the charging module into air cooling charging module and liquid cooling charging module based on heat dissipation mode.

[0003] Among them, the air cooling charging module mainly adopts a large overpressure panel fan to forcibly transport air to the internal PCB mainboard to realize convection heat dissipation, and the liquid cooling charging module mainly adopts a cooling liquid to be introduced into a cold plate type shell to contact and conduct heat dissipation with the internal PCB mainboard.

[0004] However, in the actual operation process, the air cooling charging module adopts a large overpressure fan, which has a large noise, and dust is easy to accumulate after a period of use, causing local blockage and local heat dissipation disadvantage, resulting in device damage phenomenon, and the liquid cooling charging module adopts a full sealing structure, part of the device cannot contact the shell or the cold plate, and there is no convection phenomenon. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the shortcomings in the prior art and provides a wind liquid cooling heat dissipation charging module.

[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A wind liquid cooling heat dissipation charging module, comprising:

[0008] A shell, a plurality of fans are installed on the side wall of the shell, a PCB mainboard is fixedly connected to the inner top and the inner bottom of the shell, an electrical interface is installed on the side wall of the shell away from the fan, and a plurality of heat dissipation holes are formed in the inner wall of the shell away from the fan;

[0009] A liquid cooling plate is located between the two PCB mainboards, and the upper end and the lower end of the liquid cooling plate are respectively attached to the two PCB mainboards, and the liquid cooling plate comprises a liquid cooling inlet component, a liquid cooling outlet component and a heat exchange set plate;

[0010] The heat exchange set plate adopts a microchannel structure inside, and the thickness of the heat exchange set plate is less than or equal to 10mm;

[0011] The liquid cooling inlet component comprises a first fixed frame, and the inner wall of the first fixed frame is fixedly connected with a liquid inlet pipe;

[0012] The liquid cooling outlet component comprises a second fixed frame, and the inner wall of the second fixed frame is fixedly connected with a liquid outlet pipe;

[0013] The side walls of the liquid inlet pipe and the liquid outlet pipe both penetrate the inner wall of the housing away from the fan;

[0014] The heat exchange collecting plate includes a first heat dissipation plate, a plurality of parallel fine holes are opened on the side wall of the first heat dissipation plate, and the first fixing frame and the second fixing frame are of the same size;

[0015] The liquid cooling plate also includes a reflux frame, and the side walls of the first fixed frame and the second fixed frame are fixedly connected to the inner wall of the outer shell away from the fan, and the first fixed frame and the second fixed frame are arranged on the same side, and the inner side walls of the first fixed frame and the second fixed frame close to each other are both penetrated, and the inner side walls of the first fixed frame and the second fixed frame close to each other are sealed and fixedly connected, and the inner side walls of the first fixed frame and the second fixed frame are jointly sealed and fixedly connected to the outer side wall of the first heat dissipation plate, and the inner side wall of the reflux frame is sealed and fixedly connected to the outer side wall of the first heat dissipation plate away from the first fixed frame and the second fixed frame.

[0016] The utility model has the following beneficial effects:

[0017] 1. A liquid cooling plate is placed between the two PCB mainboards, and the liquid cooling plate is in contact with the two PCB mainboards. Even if there is a local blockage and convection heat cannot be dissipated, the heat can be removed through conduction heat dissipation. Convection heat dissipation can also be achieved for non-power devices.

[0018] 2. A liquid cooling plate is implanted between the two PCB mainboards instead of using a customized liquid cooling plate in the entire shell. This allows the liquid cooling plate in this module to be processed through profiles, which is lower in cost. It can be used not only for new equipment but also for the renovation of old equipment, facilitating its promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural diagram of Example 1;

[0020] Figure 2 for Figure 1 Schematic diagram of the rear view structure;

[0021] Figure 3 for Figure 1 A schematic diagram of a top cross-sectional structure;

[0022] Figure 4 for Figure 3 A magnified schematic diagram of the structure at B in the middle;

[0023] Figure 5 for Figure 1 Schematic diagram of the structure of the liquid cooling plate and the two PCB mainboards;

[0024] Figure 6 for Figure 5 Schematic diagram of the rear view structure;

[0025] In the figure: 1, the shell; 2, the fan; 3, the PCB mainboard; 4, the electrical interface; 5, the first heat sink; 6, the first fixed frame; 7, the second fixed frame; 8, the fine hole; 9, the liquid inlet pipe; 10, the liquid outlet pipe; 16, the backflow frame; 17, the heat dissipation hole. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0027] Referring to Figures 1-4 A wind-liquid cooling heat dissipation charging module, comprising a shell 1, a plurality of fans 2 are installed on the side wall of the shell 1, a PCB mainboard 3 is fixedly connected to the top and bottom of the shell 1, an electrical interface 4 is installed on the side wall of the shell 1 away from the fan 2, and a plurality of heat dissipation holes 17 are formed in the inner wall of the shell 1 away from the fan 2.

[0028] It should be noted that the electrical interface 4 is electrically connected with the plurality of fans 2, and the electrical interface 4 is electrically connected with the two PCB mainboards 3, and the connection mode is prior art.

[0029] The liquid cooling plate is located between the two PCB mainboards 3, and the upper end and the lower end of the liquid cooling plate are respectively attached to the two PCB mainboards 3, and the liquid cooling plate comprises a liquid cooling inlet component, a liquid cooling outlet component and a heat exchange collector.

[0030] The heat exchange collector adopts a microchannel structure, and the thickness of the heat exchange collector is ≤10mm.

[0031] The liquid cooling inlet component comprises a first fixed frame 6, and the inner wall of the first fixed frame 6 is fixedly connected with a liquid inlet pipe 9.

[0032] The liquid cooling outlet component comprises a second fixed frame 7, and the inner wall of the second fixed frame 7 is fixedly connected with a liquid outlet pipe 10.

[0033] The side walls of the liquid inlet pipe 9 and the liquid outlet pipe 10 penetrate the inner wall of the shell 1 away from the fan 2.

[0034] Embodiment one

[0035] Referring to Figures 1-6 The heat exchange collector comprises a first heat sink 5, a plurality of parallel fine holes 8 are formed in the side wall of the first heat sink 5, and the first fixed frame 6 and the second fixed frame 7 are the same size.

[0036] The liquid cooling plate further comprises a reflux frame 16, the inner walls of the first fixing frame 6 and the second fixing frame 7 are fixedly connected to the inner wall of the shell 1 away from the fan 2, and the first fixing frame 6 and the second fixing frame 7 are located on the same side, the inner walls of the first fixing frame 6 and the second fixing frame 7 close to each other are both provided with through holes, the inner walls of the first fixing frame 6 and the second fixing frame 7 close to each other are fixedly connected in a sealed manner, the inner walls of the first fixing frame 6 and the second fixing frame 7 are fixedly connected in a sealed manner with the outer wall of the first heat dissipation plate 5, and the inner wall of the reflux frame 16 is fixedly connected in a sealed manner with the outer wall of the first heat dissipation plate 5 away from the first fixing frame 6 and the second fixing frame 7.

[0037] The reflux frame 16 is arranged so that the refrigerant flows out through the first fixing frame 6, the plurality of holes 8, the reflux frame 16, the plurality of holes 8, the second fixing frame 7 and the liquid outlet pipe 10, thereby increasing the flow path and time of the refrigerant in the shell 1 and better carrying away the heat on the two PCB mainboards 3.

[0038] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A wind liquid cooling heat dissipation charging module, characterized in that, Include: The shell (1), the side wall of the shell (1) is provided with a plurality of fans (2), the inner top and the inner bottom of the shell (1) are fixedly connected with PCB mainboard (3), the side wall of the shell (1) away from the fan (2) is provided with electrical interface (4), the inner wall of the shell (1) away from the fan (2) is provided with a plurality of heat dissipation holes (17); Liquid cooling plate, the liquid cooling plate is located between two PCB mainboards (3), and the upper end and the lower end of the liquid cooling plate are respectively attached to the two PCB mainboards (3), the liquid cooling plate includes liquid cooling inlet component, liquid cooling outlet component and heat exchange set plate; The heat exchange set plate adopts microchannel structure inside, and the thickness of the heat exchange set plate is less than or equal to 10 mm; The liquid cooling inlet component includes a first fixed frame (6), and the inner wall of the first fixed frame (6) is fixedly connected with a liquid inlet pipe (9); The liquid cooling outlet component includes a second fixed frame (7), and the inner wall of the second fixed frame (7) is fixedly connected with a liquid outlet pipe (10); The side wall of the liquid inlet pipe (9) and the liquid outlet pipe (10) penetrates the inner wall of the shell (1) away from the fan (2); The heat exchange set plate includes a first heat dissipation plate (5), the side wall of the first heat dissipation plate (5) is provided with a plurality of parallel arranged fine holes (8), the first fixed frame (6) and the second fixed frame (7) are the same size; The liquid cooling plate further includes a backflow frame (16), the side wall of the first fixed frame (6) and the second fixed frame (7) is fixedly connected with the inner wall of the shell (1) away from the fan (2), and the first fixed frame (6) and the second fixed frame (7) are located on the same side, the inner side wall of the first fixed frame (6) and the second fixed frame (7) is penetratingly arranged, the inner side wall of the first fixed frame (6) and the second fixed frame (7) is sealingly and fixedly connected, the inner side wall of the first fixed frame (6) and the second fixed frame (7) is sealingly and fixedly connected with the outer side wall of the first heat dissipation plate (5), the inner side wall of the backflow frame (16) is sealingly and fixedly connected with the outer side wall of the first heat dissipation plate (5) away from the first fixed frame (6) and the second fixed frame (7).

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