Substrate support assembly for supporting substrate and substrate processing apparatus including such substrate support assembly

Abstract

According to one embodiment, a substrate support assembly for supporting a substrate is provided. According to another embodiment, a substrate processing apparatus including such a substrate support assembly for supporting a substrate is provided. The substrate support assembly includes: a stage body having a surface configured to face the substrate; a stage frame coupled to the stage main body; the edge supporting frame can move relative to the table frame; and one or more pins coupled to the stage body or the stage frame and movable relative to the stage body, and configured to apply a force on the substrate.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to supporting a substrate, for example on a substrate support assembly. In particular, embodiments of the present disclosure relate to a substrate masked and fixed to a substrate support assembly. Further, the substrate support assembly can be configured to move, for example rotate, around an axis. Embodiments include a movable pin. Embodiments of the present disclosure relate in particular to a substrate support assembly and a substrate processing apparatus, a method of fixing an edge support frame to a table frame. BACKGROUND

[0002] Several methods for depositing material on a substrate are known. For example, a substrate can be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputter process and a spray process, or a chemical vapor deposition (CVD) process. The substrate on which the material is deposited, i.e. the substrate to be coated, is introduced into a vacuum chamber of a vacuum processing system and positioned relative to a processing region of the vacuum chamber of the vacuum processing system. For example, the coating process can be performed in the vacuum chamber.

[0003] For example in display manufacturing technology, it can be considered to use a coating process, i.e. a material deposition process, for large area substrates. The coated substrates can be further used in several technical fields, for example for the production of microelectronics, semiconductor devices, substrates with thin film transistors, and insulating panels, etc. For example when manufacturing larger displays, there is a tendency to use larger substrates, which leads to larger vacuum processing systems.

[0004] In a coating process, the substrate can be held in a substrate support. The coupling of the substrate to the substrate support can involve mechanical fixings performing a clamping function. The substrate can be masked by a mask, such as an edge exclusion mask. For example, the mask can mask the edges of the substrate and / or in particular the edges of a display device to be manufactured on the substrate.

[0005] Particularly during display manufacturing, some substrate processing applications include horizontal substrate loading and vertical substrate processing. Therefore, a substrate swing module or a substrate rotation module is provided in a substrate processing apparatus to change the orientation of the substrate from horizontal to vertical and vice versa.

[0006] In view of the above, it would be beneficial to provide an improved support for a substrate, for example for large area substrates for masked substrate processing and / or substrate processing with orientation change. SUMMARY

[0007] According to an embodiment, a substrate support assembly for supporting a substrate is provided. The substrate support assembly includes a platen body having a surface configured to face the substrate, a platen frame coupled to the platen body, an edge support frame configured for supporting a mask, the edge support frame movable relative to the platen frame, and one or more pins coupled to the platen body or the platen frame and movable relative to the platen body to protrude from the surface toward the edge support frame and configured to exert a force on the substrate.

[0008] According to an embodiment, the one or more pins are movable in a direction perpendicular to the surface.

[0009] According to an embodiment, the one or more pins include spring-loaded pins.

[0010] According to an embodiment, the spring-loaded pins provide at least one of a mechanical force or a spring force.

[0011] According to an embodiment, the substrate support assembly further includes a plurality of magnetic fixtures including a plurality of first members including magnets, a plurality of second members including magnetic elements, wherein at least one of the first members and the second members are disposed in a plurality of grooves within the platen frame, wherein a magnetic force between the first members and the second members is configured to secure the edge support frame to the platen frame.

[0012] According to an embodiment, the magnets include permanent magnets and the magnetic elements include ferromagnetic material.

[0013] According to an embodiment, the substrate support assembly includes a plurality of lift pins for at least one of reversibly raising and lowering the edge support frame relative to the platen frame.

[0014] According to an embodiment, raising the edge support frame separates the plurality of magnetic fixtures between the platen frame and the edge support frame, and wherein lowering the edge support frame applies the edge support frame to the platen frame, thereby forming the plurality of magnetic fixtures.

[0015] According to an embodiment, the substrate support assembly includes a tilt drive, wherein the tilt drive is configured for tilting the platen body between a horizontal and a vertical orientation.

[0016] According to an embodiment, the tilt drive is configured for tilting the platen body, the platen frame, and the edge support frame between a horizontal and a vertical orientation.

[0017] According to embodiments, the substrate support assembly further comprises a mask having a device opening, and wherein the pin is disposed at a location of the device opening.

[0018] According to embodiments, the mask comprises an edge exclusion mask.

[0019] According to embodiments, the pin is disposed at a location of the edge support frame.

[0020] According to one embodiment, a substrate processing apparatus is provided. The substrate processing apparatus comprises a substrate support assembly according to any of the embodiments described herein, wherein the table frame and the edge support frame are disposed within a vacuum chamber of the substrate processing apparatus. BRIEF DESCRIPTION OF DRAWINGS

[0021] So that the manner in which the above recited features of the present disclosure can be understood in detail, a brief description of the

[0022] Figure 1 A schematic side cross-sectional view of a portion of a substrate support assembly according to embodiments of the present disclosure is shown;

[0023] Figure 2 Another schematic side cross-sectional view of a portion of a substrate support assembly according to embodiments of the present disclosure is shown;

[0024] Figure 3 A schematic top view of a substrate support assembly according to embodiments of the present disclosure is shown;

[0025] Figure 4 A schematic side view of a substrate support assembly having a plurality of movable pins according to embodiments of the present disclosure is shown;

[0026] Figure 5 A schematic view of a substrate processing apparatus according to embodiments of the present disclosure is shown; and

[0027] Figure 6 A flowchart illustrating one or more methods of supporting a substrate in a deposition apparatus according to embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0028] The deposition system can include a substrate support assembly that generally includes a substrate support table, such as a table body and a table frame coupled to the table body. The table frame can be reversibly coupled to an edge support frame (ESF). The ESF can support a mask, such as a mask for edge exclusion, particularly for edge exclusion of one or more display devices on the substrate. The substrate can be positioned between the table body and the edge support frame or mask.

[0029] For processing, the substrate is typically positioned between a stage frame and an ESF. The ESF is coupled to the stage frame. This partially holds the mask and substrate in place for processing. This processing may involve tilting the substrate support assembly for coating, i.e., moving the substrate between different orientations. After processing, the ESF is separated from the stage frame, and the coated substrate is exchanged. The coupling between the stage frame and ESF should be stable during processing and easily detachable for substrate exchange.

[0030] According to some embodiments, the substrate support assembly may include a magnetic clamp to hold the mask in place on the substrate. The design of the mask includes, for example, a device opening. In particular, at or around the mask opening, the mask may not be in sufficiently uniform contact with the substrate over the entire area. This affects process uniformity and shadowing effects at the device opening. For embodiments of the present disclosure, particularly when changes in substrate orientation are included, the relative position of the substrate and the mask and sufficient contact between the substrate and the mask can be provided in a vertical substrate orientation. Embodiments of the present disclosure include pins that provide a passive force, for example, the pins are movable in the direction of the force. The pins may be spring-loaded pins. The pins may be disposed below the bottom of the substrate and configured to apply a force in a direction toward the mask, for example, in an upward direction, to hold the substrate in place on the mask during a horizontal substrate orientation.

[0031] Reference will now be made in detail to various embodiments, one or more examples of which are shown in the figures. Each example is provided by way of explanation and is not intended to be limiting. For example, features illustrated or described as part of one embodiment may be used on other embodiments or used in combination with any other embodiment to produce yet another embodiment. This disclosure is intended to include such modifications and variations. In the following description of the drawings, the same reference numerals represent the same or similar components. Generally, only the differences with respect to individual embodiments are described. Unless otherwise stated, the description of a part or aspect in one embodiment may also apply to the corresponding part or aspect in another embodiment.

[0032] The embodiments described herein particularly relate to components of substrate processing apparatuses, e.g. components of deposition systems for depositing materials, e.g. for display manufacturing on large area substrates or on a plurality of coupons, i.e. smaller substrate pieces, which can be arranged on a carrier or coupon tray. According to some embodiments, the size of the large area substrate or carrier supporting one or more substrates can be at least 0.5 m 2 . For example, the deposition system can be suitable for processing large area substrates, e.g. GEN 5 substrates corresponding to approximately 1.4 m 2 substrates (1.1 m x 1.3 m), GEN 7.5 substrates corresponding to approximately 4.29 m 2 substrates (1.95 m x 2.2 m), GEN 8.5 substrates corresponding to approximately 5.7 m 2 substrates (2.2 m x 2.5 m), or even GEN 10 substrates corresponding to approximately 8.7 m 2 substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can be similarly implemented. According to yet another embodiment, half sizes of the above generations of substrates can be processed. Alternatively or additionally, semiconductor wafers can be processed and coated in the deposition system according to the present disclosure.

[0033] The apparatuses and systems described herein can be configured to mask substrates, particularly with surfaces of 1 m 2 or more. The term "substrate" can particularly include substrates for display manufacturing, similar to glass substrates. The term "substrate" can also include substrates similar to wafers, transparent crystal pieces such as sapphire, etc. However, the term "substrate" can include other non-flexible or flexible substrates, e.g. foils or webs. The substrate can be formed of any material suitable for material deposition.

[0034] According to some embodiments, which can be combined with other embodiments described herein, the substrate can be provided as a large area glass plate. Alternatively, the substrate can be or can include a plurality of smaller substrates or substrate pieces, e.g. coupons, which can be arranged on a carrier or coupon tray. The coupons can be arranged in a 2x2, 2x3, 3x3, 4x3 or 4x4 array. Moreover, a large number of coupons can be arranged, e.g. in the form of an array. In comparison to a glass substrate, i.e. a large area glass substrate, the coupon tray can be arranged with a metal plate having outer dimensions.

[0035] According to some embodiments, the coupon tray can have 4, 6, 9, 12 or more number of cutouts or openings for smaller coupons, e.g. coupon glass. The pins or movable pins of embodiments according to the present disclosure allow to secure the coupons in the tray and provide a force acting on the mask to have friction for tilting and improved shadowing effects.

[0036] Some embodiments described herein can particularly relate to a component of a deposition system, wherein loading and unloading can be a substrate in a horizontal orientation, and wherein the substrate is processed, e.g. coated, in a vertical orientation. In particular, the component of a deposition system according to embodiments described herein is suitable for a deposition apparatus wherein the substrate is supported in different orientations, in particular for a deposition apparatus comprising a tilt drive for moving the substrate between the horizontal and vertical orientation.

[0037] Embodiments described herein relate to masking of a substrate, and in particular to providing a substrate with appropriate force against a mask to have friction for tilting and improved shadowing effects, in particular for a fixture that can be reversibly coupled and decoupled. Further, glass breakage can be reduced by controlled force of a movable pin. Decoupling generally involves a motion to separate the ESF from the table frame. The ESF and the table frame can be provided horizontally, and the motion of the ESF can be performed in a vertical direction.

[0038] Figure 1 A portion of a substrate support assembly 100 is shown. The substrate support assembly 100 is configured to support a substrate 10. The substrate 10 can be a substrate for display manufacturing as described herein. The substrate support assembly 100 comprises a table body 102 having a surface configured to face the substrate. A table frame 106 is coupled to the table body 102. An edge support frame 112 is supported to be movable relative to the table frame. Accordingly, the edge support frame can move the edge exclusion mask relative to the substrate, respectively the shadow frame 114 or the edge exclusion mask. For example, the edge exclusion mask is moved relative to the substrate and / or the surface of the table body to load or unload the substrate.

[0039] After loading the substrate, the edge support frame 112 can be fixed to the table frame by one or more fixtures, e.g. a magnetic fixture 120. The one or more magnetic fixtures comprise a respective first member 122 comprising a magnet and a respective second member 124 comprising a magnetic element. The one or more magnetic fixtures provide a force to support the substrate 10 between the table body and the mask. In particular, when the substrate support assembly is moved between the horizontal orientation and the vertical orientation, supporting the substrate between the table body and the mask facilitates contacting the substrate with the mask and facilitates providing friction to the substrate to have a stable position.

[0040] According to embodiments of the present disclosure, one or more pins 150 are provided. The pins can be as described above Figure 1The pins provide additional force from the substrate towards the mask as indicated by the arrows in FIG. 1. In the horizontal loading orientation, additional force is provided from the substrate bottom. Thus, improved contact with the mask can be provided. The improved contact of the substrate with the mask is provided at the front side of the substrate, i.e. at the side of the substrate to be processed. For example, the substrate processing can be a layer deposition, in particular with a PVD process such as a sputter process. The sputter process can comprise sputtering from an array of rotatable sputter cathodes. The rotatable sputter cathodes can be cylindrical.

[0041] The additional force generated by the pins provides more friction between the substrate and the mask. Improved alignment with openings in the mask, e.g. device openings on the mask, can be provided in the processing position.

[0042] According to embodiments, a substrate support assembly for supporting a substrate is provided. The substrate support assembly comprises a table body having a surface configured to face the substrate and a table frame coupled to the table body. Further, an edge support frame is provided which is movable relative to the table frame. The substrate support assembly comprises one or more pins movable relative to the table body, e.g. towards and away from the edge support frame. The one or more pins are configured to exert a force on the substrate, in particular to enhance the contact of the substrate with a mask. The one or more pins are coupled to the table body or the table frame. For example, the one or more pins are movable in a direction perpendicular to the surface of the table body. Additionally or alternatively, the one or more pins can be movable to protrude from the surface of the table body towards the edge support frame. By making the one or more pins movable, glass breakage can be reduced or avoided. For stationary pins or solid pins, glass breakage can occur due to an over-compression of the mask against the substrate, in particular due to manufacturing tolerances which can accumulate.

[0043] According to some embodiments, which can be combined with other embodiments described herein, the one or more pins can be spring-loaded pins. For example, the spring-loaded pins can provide at least one mechanical force. For example, the spring-loaded pins can comprise a mechanical spring or a synthetic rubber providing an elastic force. The spring loading is indicated by reference sign 152 in FIG. 1. Figure 1

[0044] The spring-loaded pins or spring-loaded support pins exert a uniform pressure or force from one side of the substrate towards the opposite side of the substrate which contacts the mask. Thus, a force can be provided in addition to the clamping force of the plurality of magnetic fixtures. The clamping force of the magnetic fixtures is provided from the top when the edge support frame 112 is clamped to the table frame 106 by the magnetic fixtures 120.

[0045] As Figure 1 ​As shown, the magnetic fixture 120 can comprise a first member 122 comprising, for example, a magnet. Further, a second member 124 comprising a magnetic element is provided. At least one of the first member and the second member is arranged in a recess within the table frame 106. The magnetic force between the first member and the second member fixes the edge support frame to the table frame. For example, the magnet can comprise a permanent magnet. Additionally or alternatively, the magnetic element can comprise a ferromagnetic material.

[0046] The first member 122 comprises a magnet. In particular when the magnetic fixture 120 is in the coupled state, the magnet generates a magnetic field. The magnet can be a permanent magnet, for example a neodymium magnet, in particular a N38 NdFeB magnet. Other permanent magnets can also be suitable, for example a samarium-cobalt magnet or an alnico magnet. According to embodiments which can be combined with other embodiments described herein, the magnet can be an electromagnet, in particular a switchable electromagnet. The electromagnet can have a coil. The coil can be adapted to interact with a magnetic element, for example a ferromagnetic element, in particular a ferromagnetic pin. The coil can be annular or a hollow cylinder such that the coil has an inner hollow portion. The coil can be adapted to have a ferromagnetic pin at least partially inserted into the central hollow portion of the coil such that the ferromagnetic pin interacts with the magnetic field generated by the electromagnet, in particular such that the ferromagnetic pin is attracted by the electromagnet. The electromagnet can be driven by a driving circuit.

[0047] According to embodiments which can be combined with other embodiments described herein, the second member 124 comprises a magnetic element. The magnetic element can be the second member 124. The magnetic element can be a ferromagnetic component, for example a metallic component, for example a steel component, in particular a stainless steel component, for example a component comprising DIN 1.2083 steel. The magnetic element can comprise a ferromagnetic material. The second member can comprise other materials or combinations of materials, for example a ferrite material, provided that the second member 124 interacts with the magnetic field generated by the magnet when the magnetic fixture 120 is in the coupled state such that an attractive force, for example a magnetic force, is exerted between the first member and the second member.

[0048] According to embodiments which can be combined with other embodiments described herein, the first member can be partially or completely arranged in a recess within the table frame, which can have the same beneficial effects as arranging the second member in a recess within the table frame.

[0049] The additional force provided by the pin 150 improves mask alignment and leads to a reduction of shadow effects, i.e. a reduction of inner coating, and thus a reduction of particle generation. Figure 2Another schematic view of a portion of a substrate support assembly is shown. Three pins 150 are shown, which are movable relative to a table frame or relative to a table body 102. This movement is indicated by the arrows in the pins 150. In addition, reference numeral 152 indicates spring loading of the pins 150. A substrate 10 is supported between the surfaces 104 of the table body 102. The pins 150 are movable toward and away from the edge support frame, and are configured to exert a force on the substrate. For example, as Figure 2 exemplarily shown in the horizontal orientation, an upward force from the bottom of the substrate 10 toward the mask 20 is provided by the spring-loaded pins.

[0050] According to some embodiments, which can be combined with other embodiments described herein, one or more pins are movable in a direction perpendicular to the surface. In addition, one or more pins can be moved to protrude from the surface toward the edge support frame, i.e. upward in Figure 2 . Thus, before the substrate is loaded, the pins protrude from the surface. During loading of the substrate, the substrate is lowered and the clamping force of the magnetic fixtures is provided. When the clamping force is applied, the substrate is moved downward and moves the pins. The spring-loaded pins receive the load and / or are compressed. In the processing position of the substrate relative to the edge support frame and the table body, the spring loading provides an additional force from the bottom to allow for better contact of the substrate with the mask. The improved contact improves the shadowing effect and reduces the edge exclusion coating of the deposited material under the mask.

[0051] According to some embodiments, which can be combined with other embodiments described herein, support pins can be provided at a mask position, the mask having device openings 22, e.g. device openings having a size 23. According to some embodiments, which can be combined with other embodiments described herein, a shadow frame can provide an edge exclusion mask for one or more devices to be manufactured on the substrate, i.e. display devices. According to some embodiments, which can be combined with other embodiments described herein, the mask can comprise an Invar alloy or other nickel-iron alloy having a coefficient of thermal expansion lower than 10 -5 K -1 .

[0052] Figure 3 A schematic view from the top of the substrate support assembly 100 is shown. The edge support frame 112 comprises a plurality of openings, which can correspond to a plurality of device openings 22 in a shadow frame or mask. In addition, a plurality of magnetic fixtures 120 is provided to couple the edge support frame 112 to a table frame (not shown). According to embodiments of the present disclosure, a plurality of pins 150, e.g. spring-loaded pins, can be provided. As Figure 3As shown, the pins can be provided at the location of the device opening 22 and / or at the location of the edge support frame 112. The pins 150 provide a force from a first side of the substrate facing the table body towards a second side of the substrate facing the mask or the edge support frame 112, respectively.

[0053] The spring-loaded pins according to embodiments of the present disclosure can also be referred to as clamps, in particular for clamping the substrate between the table body and the edge support frame. The clamps can be referred to as fastening means for holding or securing the substrate between the substrate support surface and the edge support frame, for example to prevent movement or detachment. In particular, movement of the mask relative to the edge exclusion can be reduced.

[0054] Reference is made to Figure 4 A substrate support assembly 100 according to embodiments described herein is schematically shown in form of a side view comprising a plurality of magnetic fasteners 120 and a plurality of pins 150. The substrate support assembly 100 comprises a table body having a table frame 106. According to embodiments described herein, the table frame 106 comprises a plurality of recesses 108. Figure 4 According to the shown embodiment, the first members 122 of the plurality of magnetic fasteners are provided within the recesses within the table frame.

[0055] As Figure 4 According to embodiments, the substrate support assembly comprises an ESF 112, as shown. The ESF 112 is drawn in a coupled configuration with solid lines. According to embodiments, which can be combined with other embodiments described herein, the ESF 112 comprises a plurality of second members 124 of magnetic fasteners according to embodiments described herein. The second members can be arranged such that they oppose the first members 122 when the substrate support assembly is in the coupled configuration. The plurality of second members can be provided within a plurality of recesses within the ESF 112.

[0056] According to embodiments, which can be combined with other embodiments described herein, the substrate support assembly 100 can have a substrate (not shown) arranged between the table frame 106 and the ESF 112. The substrate can be fixed between the table frame and the ESF. By the force provided by the plurality of magnetic fasteners, the substrate can be fixed, for example clamped, between the table frame and the ESF. The force provided between the substrate and the ESF is enhanced by the pins 150, for example spring-loaded pins. The pins 150 can be movable and can provide a defined force on the substrate towards the edge support frame 112.

[0057] As Figure 4As shown, according to embodiments, the substrate support assembly 100 can comprise a tilt drive 420 for tilting a portion of the substrate support assembly 100, in particular a portion comprising a substrate, for example a platen body with the platen frame 106 and the ESF 112 in a coupled configuration. Tilting a portion of the substrate support assembly can involve a tilt motion 424. The tilt motion can involve rotating a portion of the substrate support assembly around a common axis along a defined angular range. Tilting of the substrate support assembly can cause a portion of the substrate support assembly to change from a horizontal orientation to a vertical orientation, for example Figure 4 The vertical orientation 426 is shown. The vertical orientation can be advantageously used for operations of substrate processing, for example material deposition operations. The horizontal orientation can be advantageously used for other operations of substrate processing, for example loading and / or unloading of the substrate.

[0058] According to yet further additional or alternative modifications of the substrate support assembly, the substrate support assembly can further comprise a linear actuator. For example, a scan out preamplifier can be provided to move the platen body in a direction parallel to Figure 5 The axis of the tilt drive is shown. Additionally or alternatively, a linear actuator can be provided to move the platen body towards and away from the substrate processing region. Thus, in particular when the substrate is provided in the vertical orientation, a movement of the substrate can occur, for example a linear movement. For example, the scan out preamplifier can be used to move the substrate relative to the cathode array. The force on the substrate, for example provided by the combined action of the platen frame and the ESF and the fixing between the pins, is advantageously large enough to keep the position of the substrate relative to the mask during tilting and / or during linear movement, for example in the vertical orientation during coating. The force on the substrate, for example the residual spring force of the movable pins, presses the substrate against the mask. The resulting frictional force is larger than the substrate weight (in the vertical platen position) and any other acceleration forces of the tilt platen motion or scan motion.

[0059] As Figure 4 The substrate support assembly 100 can comprise a lift pin assembly comprising a lift pin 410 and a lift pin drive 412, as shown. The lift pin assembly can be configured to in particular be used to lift a portion of the substrate support assembly 100, in particular to lift the ESF 112 in a direction of an ESF motion 414. According to embodiments described herein, the direction of the ESF motion 414 can be an axial direction.

[0060] As Figure 4As shown, according to embodiments, the action of the lift rod assembly can change the substrate support assembly 100 from the coupled state to the uncoupled state 416 by raising the ESF in the axial direction relative to the table frame 106. This can separate the first members of the plurality of magnetic fixtures from the second members of the plurality of magnetic fixtures. Separating the plurality of first members from the plurality of second members can change each of the plurality of magnetic fixtures from the coupled state to the uncoupled state. According to embodiments that can be combined with other embodiments described herein, the uncoupled state can be used for loading and / or unloading the substrate.

[0061] According to some embodiments, which can be combined with other embodiments described herein, the substrate support assembly can comprise a plurality of lift rods for at least one of: reversibly raising and lowering the edge support frame relative to the table frame; and / or reversibly raising and lowering the substrate onto the plurality of pins. In particular, for the lift rods that reversibly raise and lower the edge support frame, raising the edge support frame separates the magnetic fixtures between the table frame and the edge support frame, and lowering the edge support frame applies the edge support frame to the table frame such that the elements of the magnetic fixtures couple to each other. Furthermore, additionally or alternatively, the substrate support assembly can comprise a tilt drive, wherein the tilt drive is configured to move the table body between a horizontal and a vertical orientation. Additionally or alternatively, a scanning final stage preamplifier can be provided, e.g. for linear movement along a cathode array. According to embodiments of the present disclosure, the horizontal orientation can deviate from a precise horizontal orientation by ±15°, and the vertical orientation can deviate from a precise vertical orientation by ±15°.

[0062] For substrate processing apparatuses comprising a swing module or a substrate rotation module (or a tilt drive 420), e.g. PVD systems with rotatable sputter cathodes for low damage deposition, wherein the substrate is loaded in a horizontal orientation and material layers are deposited in a vertical orientation, the pins for generating a force of the substrate towards the mask comprised in embodiments of the present disclosure can be particularly advantageous. By using the swing module or the tilt drive, respectively, during the tilting movement or in the vertical orientation, the clamping force generated by the magnetic fixtures can be insufficient. Thus, the pins according to embodiments of the present disclosure improve the contact between the substrate and the mask, e.g. for better mask alignment.

[0063] Figure 5 A substrate processing apparatus 500 is shown. The substrate processing apparatus 500 comprises a vacuum chamber 520. A substrate support assembly 100 is provided in the vacuum chamber 520. The substrate 10, which is located on pins of a table body or coupled to the table body 102, can be moved into a processing orientation, in particular a vertical processing orientation, by a tilt drive 420 generating a tilting motion 424. In the processing orientation, material can be deposited on the substrate by a sputter cathode 510.

[0064] According to embodiments, a substrate processing apparatus is provided. The substrate processing apparatus comprises a substrate support assembly according to embodiments of the present disclosure. A table frame and an edge support frame are arranged within a vacuum chamber of the substrate processing apparatus.

[0065] According to embodiments, which can be combined with embodiments described herein, the substrate support assembly, in particular the substrate support assembly 100, described herein can be configured to operate within a vacuum chamber, in particular a vacuum chamber of a substrate processing apparatus, e.g. a deposition apparatus.

[0066] Figure 5 A schematic view of a substrate processing apparatus 500 for depositing material on a substrate 10 is shown. The substrate is moved relative to a processing region within a vacuum chamber 520. Figure 5 A material deposition source is shown. In particular, the material deposition source can be a sputter cathode 510 of a cathode array, e.g. a rotatable sputter cathode. The processing region is arranged in a region in front of the material deposition source.

[0067] The edge exclusion mask according to embodiments described herein partially covers the substrate 10 supported on the support surface of the substrate support assembly. As described above, the edge exclusion mask can comprise an edge support frame and a shadow mask. The shadow mask can comprise device openings for masking edges of one or more display devices to be manufactured on the substrate.

[0068] Embodiments described herein can relate to components of a deposition system, wherein loading and unloading can be substrates of substrates as described above in a horizontal configuration and wherein processing, e.g. coating, of the substrates is performed in a vertical configuration. Components of a deposition system according to some embodiments described herein are suitable for deposition apparatuses wherein the substrates are supported in different configurations, in particular for deposition apparatuses comprising a tilt drive for moving the substrate between the horizontal and the vertical configuration. As Figure 5 The vacuum processing apparatus or vacuum deposition apparatus shown can be arranged in a cluster system, wherein one or more vacuum processing apparatuses are coupled to a central transfer chamber, in particular a central vacuum transfer chamber.

[0069] Figure 6 A flow chart illustrating a method according to the present disclosure is shown. According to one embodiment, a method of fixing an edge support frame to a table frame of a substrate processing apparatus is provided. In operation 602, a substrate is moved onto pins of a substrate support assembly. For example, the substrate is lowered towards the pins. In operation 604, the edge support frame is moved towards the table frame. For example, the edge support frame is lowered towards the table frame.

[0070] In operation 606, pins are moved towards the table frame or the table body, respectively. The pins are moved by lowering at least one of the substrate and the edge support frame. The pins are pushed by the substrate and / or the edge support frame. Especially when manufacturing tolerances can add up and pins positioned at the device openings can break the glass for non-movable pins, glass breakage can be reduced as the pins are moved. According to advantageous embodiments which can be combined with other embodiments described herein, the pins do not move or are substantially not moved by the weight (gravity) of the substrate when the ESF is coupled to the table frame and are moved, e.g. substantially only moved. Additionally or alternatively, a spring loading of the spring-loaded pins can generate a force on the substrate towards the edge support frame when the pins are moved. Thus, an improved contact between the substrate and the mask can be provided. In operation 608, the edge support frame is fixed to the mask, e.g. with a magnetic fixture as described herein.

[0071] According to one embodiment, a method of fixing an edge support frame to a table frame of a substrate processing apparatus is provided. The method comprises lowering a substrate towards a table body and lowering an edge support frame towards the table frame. Further, the method comprises moving a plurality of pins towards the table frame or table body when lowering at least one of the substrate and the edge support frame and fixing the edge support frame to the table frame. According to some embodiments which can be combined with other embodiments described herein, the edge support frame can be fixed to the table frame by a magnetic fixture. According to some embodiments which can be combined with other embodiments described herein, the method can further comprise generating a force on the substrate in a direction of the edge support frame by the plurality of pins. For example, the force can be generated by the plurality of pins comprising one or more spring-loaded pins.

[0072] According to yet further embodiments which can be combined with other embodiments described herein, a method of manufacturing a part of a display device is provided. The method of manufacturing a part of a display device comprises a method of fixing an edge support frame to a table frame of a substrate processing apparatus according to any one of the embodiments of the present disclosure and depositing a material layer on a substrate which is partially arranged between the table frame and the edge support frame. Further, additionally or alternatively, a substrate support assembly according to any one of the embodiments described herein can be provided for manufacturing a part of a display device. According to some embodiments which can be combined with other embodiments described herein, the method of manufacturing a part of a display device can comprise moving the substrate support assembly from a horizontal orientation to a vertical orientation. In particular, the substrate support assembly can be moved with a substrate arranged on the substrate support assembly. The movement can be provided by a tilt drive, i.e. a drive providing a movement around an axis.

[0073] Embodiments of the present disclosure can provide a number of advantages as described herein. Pin movement can reduce or eliminate accumulated manufacturing tolerances, and thus can reduce glass breakage. The force that can be provided by the moveable pins improves alignment of the substrate relative to the mask and / or improves process uniformity. Further, shadowing effects of the mask can be improved and / or internal coating that can in turn cause particles (contamination particles) can be reduced.

[0074] According to some embodiments, the substrate support assemblies and methods utilizing the substrate support assemblies according to the embodiments described herein can be used for low damage deposition (LDD). Face target sputtering (FTS) systems provide plasma confinement regions facing each other, i.e. pointing directly or at least partially towards the other opposing target. Since the plasma confinement of one or more targets is not pointing towards the substrate but is parallel or substantially parallel deviating from or towards the substrate, e.g. up to an angle of 30°, damage that can occur at the substrate due to energy or UV radiation of particles deposited on the substrate is reduced. A low damage deposition (LDD) can be provided. According to one example, a method of depositing a material on a substrate can include sputtering at least one component of the material from a first rotating target having a first magnet assembly and a second rotating target having a second magnet assembly, the first magnet assembly within the first rotating target providing a first plasma confinement in a first direction towards the second rotating target and the second magnet assembly within the second rotating target providing a second plasma confinement in a second direction towards the first rotating target. As another example, off-center LDD can be provided to improve the damage to deposition rate ratio of face target sputtering. Off-center LDD blocks the shortest sputter path between the plasma confinement region and the substrate by a aperture plate having one or more shielded portions positioned off-center. The off-center aperture can be arranged relative to the facing target. For example, the aperture is specifically provided for longer sputter paths to reduce particle kinetic energy and / or block the strongest UV radiation emitted from the center of the facing target, especially on short mean free paths. Thus, a method of depositing a material on a substrate can include a first deposition having sputtering from a first rotating target having a first magnet assembly having a first plasma confinement and having an aperture plate; and simultaneously sputtering from a second rotating target having a second magnet assembly having a second plasma confinement and having an aperture plate, the first plasma confinement facing the second rotating target and the second plasma confinement facing the first rotating target, the first plasma confinement and the second plasma confinement providing a plasma region between the first rotating target and the second rotating target, the plasma region having a centerline normal to a substrate surface of the substrate, the aperture plate having a body with shielded portions configured to shield an area between the plasma region and the substrate at least at the centerline, utilizing other embodiments of the substrate support assemblies as described herein.

[0075] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure can be devised without departing from the scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. A substrate support assembly for supporting a substrate, characterized in that: Comprising: a table body having a surface configured to face the substrate; a table frame coupled to the table body; an edge support frame configured to support a mask, the edge support frame movable relative to the table frame for loading or unloading the substrate; one or more pins coupled to the table body or the table frame and movable relative to the table body to protrude from the surface toward the edge support frame and configured to exert a force on the substrate that acts on the mask to have a friction for tilting and improved shadowing effects.

2. The substrate support assembly of claim 1, wherein, The one or more pins are movable in a direction perpendicular to the surface.

3. The substrate support assembly of claim 1, wherein, The one or more pins comprise spring-loaded pins.

4. The substrate support assembly of claim 3, wherein, The spring-loaded pins provide at least one of a mechanical force or a spring force.

5. The substrate support assembly of any of claims 1 to 4, wherein, The substrate support assembly further comprises: a plurality of magnetic fixtures comprising: a plurality of first members comprising magnets, a plurality of second members comprising magnetic elements, wherein at least one of the first members and the second members are disposed in a plurality of grooves within the table frame, wherein a magnetic force between the first members and the second members is configured to secure the edge support frame to the table frame.

6. The substrate support assembly of claim 5, wherein, The magnets comprise permanent magnets and the magnetic elements comprise ferromagnetic material.

7. The substrate support assembly of claim 5, wherein: The substrate support assembly comprises a plurality of lift pins for at least one of reversibly raising and lowering the edge support frame relative to the table frame.

8. The substrate support assembly of claim 7, wherein, Raising the edge support frame separates the plurality of magnetic fixtures between the table frame and the edge support frame, and wherein lowering the edge support frame applies the edge support frame to the table frame, thereby forming the plurality of magnetic fixtures.

9. The substrate support assembly of any of claims 1 to 4, wherein, The substrate support assembly comprises a tilt drive, wherein the tilt drive is configured to tilt the table body between a horizontal and a vertical orientation.

10. The substrate support assembly of claim 9, wherein, The tilt drive is configured to tilt the table body, the table frame, and the edge support frame between a horizontal and a vertical orientation.

11. The substrate support assembly of any of claims 1 to 4, wherein, The substrate support assembly further comprises a mask having a device opening, and wherein the pins are disposed at locations of the device opening.

12. The substrate support assembly of claim 11, wherein, The mask comprises an edge exclusion mask.

13. The substrate support assembly of claim 11, wherein, The pins are disposed at locations of the edge support frame.

14. The substrate support assembly of any of claims 1 to 4, wherein, The pins are disposed at locations of the edge support frame.

15. A substrate processing apparatus, characterized by comprising: Comprising: The substrate support assembly of any of claims 1-4, wherein the table frame and the edge support frame are disposed within a vacuum chamber of the substrate processing device.

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