Radiator, air conditioner outdoor unit and air conditioner

Abstract

The utility model relates to the technical field of heat radiation, and discloses a heat radiator, which comprises a heat radiation substrate, a first heat radiation layer, a second heat radiation layer, a first heat radiation layer, a second heat radiation layer and a second heat radiation layer, and is characterized in that the heat radiation substrate comprises a first surface provided with heat radiation fins; the heat dissipation fins are arranged on the first surface of the heat dissipation base body, the heat dissipation fins comprise a first fin set arranged on the first base body part and a second fin set arranged on the second base body part, the thickness of the first base body part is larger than that of the second base body part, and the height of the fins in the second fin set is larger than that of the fins in the first fin set. According to the radiator provided by the embodiment of the utility model, the heat dissipation uniformity of different chips is improved. The invention further discloses the air conditioner outdoor unit and the air conditioner.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, for example to a heat sink, an air conditioner outdoor unit and an air conditioner. BACKGROUND

[0002] The variable frequency power module is an important component of the variable frequency air conditioner, and multiple power chips are integrated inside, resulting in large heat flux density and serious heat generation when the variable frequency power module works. The greater the refrigerating capacity of the air conditioner and the higher the temperature, the greater the heat generation of the variable frequency power module when the compressor works. For example, under high-temperature refrigeration conditions, the heat generation of the chip is relatively high. At this time, the requirements for the heat sink are also relatively high, and the heat sink needs to dissipate the high-temperature heat of the chip in time to ensure the normal and stable operation of the air conditioner.

[0003] The components on the air conditioner variable frequency circuit board generate a large amount of heat when working. To achieve the cooling effect, a heat sink is usually added to absorb the heat of the components in the variable frequency circuit board, and the heat is taken away by the airflow through the heat sink to improve the heat dissipation efficiency of the chip. The existing heat sink includes an aluminum base and an array of fins.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

[0005] The circuit board usually has multiple chips, and the heat generation of the multiple chips is different, and the existing heat sink has poor heat dissipation effect on the circuit board with multiple chips.

[0006] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present application, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. INVENTION CONTENTS

[0007] In order to have a basic understanding of some aspects of the disclosed embodiments, the following is a simple summary. The summary is not a general review, nor is it intended to determine the key / important elements or delineate the scope of protection of these embodiments, but as a prelude to the detailed description below.

[0008] The embodiments of the present disclosure provide a heat sink, comprising: a heat dissipation base body comprising a first surface provided with heat dissipation fins, and the heat dissipation base body comprising a first base body part and a second base body part; the heat dissipation fins are arranged on the first surface of the heat dissipation base body, and the heat dissipation fins comprise a first fin group arranged on the first base body part and a second fin group arranged on the second base body part, wherein the thickness of the first base body part is greater than the thickness of the second base body part, and the height of the fins in the second fin group is greater than the height of the fins in the first fin group.

[0009] In some optional embodiments, the distance between two adjacent fins in the first fin group is a first distance, and the distance between two adjacent fins in the second fin group is a second distance, wherein the first distance is less than or equal to the second distance.

[0010] In some optional embodiments, the heat dissipation fin comprises a fixed connection end arranged on the first surface, and a free end opposite to the fixed connection end, wherein the free end comprises a first part and a second part, and the first part is provided with a missing corner.

[0011] In some optional embodiments, the heat dissipation base comprises a low-order base part corresponding to the first part of the free end, and a high-order base part corresponding to the second part of the free end, wherein the low-order base part and the high-order base part are in a stepped shape.

[0012] In some optional embodiments, the first base part is provided with a first mounting area for mounting the first chip, and the second base part is provided with a second mounting area for mounting the second chip, wherein the power of the first chip is greater than the power of the second chip.

[0013] In some optional embodiments, the heat dissipation base further comprises a third base part and a fourth base part, the thickness of the third base part is greater than the thickness of the fourth base part, and the first base part, the second base part, the third base part and the fourth base part are sequentially arranged along the surface of the heat dissipation base, wherein the third base part is provided with a third mounting area for mounting a third chip, the fourth base part is provided with a fourth mounting area for mounting a fourth chip, and the power of the first chip and the third chip is greater than the power of the second chip.

[0014] In some optional embodiments, the heat dissipation fin comprises a wave fin or a straight-tooth fin.

[0015] In some optional embodiments, an air conditioner outdoor unit comprises the heat sink as described above.

[0016] In some optional embodiments, the air conditioner outdoor unit further comprises: an outdoor unit housing enclosing an internal cavity; a partition plate dividing the internal cavity into a compressor cavity and a fan cavity; a compressor arranged in the compressor cavity; a fan arranged in the fan cavity; and an electric control box arranged on the top of the partition plate and internally provided with a circuit board, wherein the electric control box comprises a heat dissipation air path enclosed by a bottom shell part and a side shell part, the heat sink is arranged in the heat dissipation air path, and the part of the bottom shell part located in the compressor cavity is provided with an air inlet of the heat dissipation air path, and the part of the side shell part located in the fan cavity is provided with an air outlet of the heat dissipation air path.

[0017] In some optional embodiments, an air conditioner comprises the air conditioner outdoor unit as described above.

[0018] The heat sink, the air conditioner outdoor unit and the air conditioner provided by the embodiments of the present disclosure can achieve the following technical effects:

[0019] The heat sink provided by the embodiments of the present disclosure comprises a heat dissipation base and heat dissipation fins arranged on the heat dissipation base. The heat dissipation base comprises a first surface on which the heat dissipation fins are arranged, and the heat dissipation base comprises a first base part and a second base part; the heat dissipation fins are arranged on the first surface of the heat dissipation base, and the heat dissipation fins comprise a first fin group arranged on the first base part and a second fin group arranged on the second base part. The thickness of the first base part is greater than the thickness of the second base part, and the height of the fins in the second fin group is greater than the height of the fins in the first fin group.

[0020] It can be seen that, in the heat sink provided by the embodiments of the present disclosure, the heat dissipation base has different thicknesses at different positions, and the heat dissipation fins also have different heights. In this way, the heat dissipation capacity of different positions of different heat sinks is different, and different power chips can be installed correspondingly. For example, a chip with a larger power is arranged on the first base part with a larger thickness, and a chip with a smaller power is arranged on the second base part with a smaller thickness. In this way, the heat dissipation effect of different power chips is improved simultaneously.

[0021] The foregoing general description and the following description are only exemplary and explanatory, and are not used to limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0022] One or more embodiments are exemplarily illustrated by corresponding drawings, which do not constitute limitation on the embodiments, elements with the same reference numerals in the drawings are shown as similar elements, the drawings do not constitute proportional limitation, and wherein:

[0023] Figure 1 is a structural schematic diagram of a heat sink provided by the embodiments of the present disclosure;

[0024] Figure 2 is a structural schematic diagram of another heat sink provided by the embodiments of the present disclosure;

[0025] Figure 3 is a structural schematic diagram of another heat sink provided by the embodiments of the present disclosure;

[0026] Figure 4 is a structural schematic diagram of another heat sink provided by the embodiments of the present disclosure;

[0027] Figure 5 is a structural schematic diagram of another heat sink provided by the embodiments of the present disclosure;

[0028] Figure 6 is a structural schematic diagram of another heat sink provided by the embodiments of the present disclosure;

[0029] Figure 7 is a structural schematic diagram of another heat sink provided by the embodiments of the present disclosure;

[0030] Figure 8 is another structural schematic diagram of a heat sink provided by an embodiment of the present disclosure;

[0031] Figure 9 is another structural schematic diagram of a heat sink provided by an embodiment of the present disclosure;

[0032] Figure 10 is a structural schematic diagram of an air conditioner outdoor unit provided by an embodiment of the present disclosure.

[0033] Reference signs:

[0034] 1: heat dissipation base; 101: first surface; 102: mounting hole; 103: first ear; 104: second ear;

[0035] 11: first base part; 12: second base part; 13: third base part; 14: fourth base part; 111: low-order base part; 112: high-order base part; 1101: first mounting area; 1201: second mounting area; 1301: third mounting area; 1401: fourth mounting area;

[0036] 2: heat dissipation fin; 21: first fin group; 22: second fin group; 201: fixed connection end; 202: free end; 203: missing corner; 204: wavy fin; 205: straight-toothed fin;

[0037] 31: first chip; 32: second chip; 33: third chip; 34: fifth chip;

[0038] h1: first spacing; h2: second spacing;

[0039] 41: bottom shell part; 410: air inlet; 42: side shell part; 420: air outlet;

[0040] 5: side shell part of press cavity; 51: first air inlet; 52: second air inlet;

[0041] 6: partition plate;

[0042] 7: fan;

[0043] 8: compressor. DETAILED DESCRIPTION

[0044] In order to enable a more detailed understanding of the features and technical content of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the drawings, which are only used for reference and do not limit the embodiments of the present disclosure. In the following technical description, in order to facilitate explanation, a plurality of details are provided to provide a sufficient understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices can be simplified to facilitate the drawings.

[0045] The terms "first", "second", and the like in the specification and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances in order to describe the embodiments of the present disclosure herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0046] In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "back", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the embodiments of the present disclosure and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation. In addition, in addition to being used to indicate the orientation or positional relationship, the above-mentioned terms can also be used to represent other meanings, for example, the term "upper" can also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0047] In addition, the terms "set", "connected", "fixed" should be broadly understood. For example, "connected" can be fixedly connected, detachably connected, or integrally configured; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to the specific circumstances.

[0048] Unless otherwise specified, the term "a plurality of" means two or more.

[0049] In the embodiments of the present disclosure, the character " / " represents an "or" relationship between the objects before and after it. For example, A / B represents: A or B.

[0050] The term "and / or" is a description of the association between objects, which means that there can be three relationships. For example, A and / or B, which means: A or B, or, A and B, the three relationships.

[0051] It should be noted that the embodiments in the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0052] The present disclosure provides a heat sink. As shown in Figures 2 to 9 .

[0053] Optionally, the heat sink comprises a heat sink base 1 and a heat dissipation fin 2. The heat sink base 1 comprises a first surface 101 provided with the heat dissipation fin 2, and the heat sink base 1 comprises a first base part 11 and a second base part 12; the heat dissipation fin 2 is arranged on the first surface 101 of the heat sink base 1, and the heat dissipation fin 2 comprises a first fin group 21 arranged on the first base part 11 and a second fin group 22 arranged on the second base part 12. Wherein, the thickness of the first base part 11 is greater than the thickness of the second base part 12, and the height of the fin in the second fin group 22 is greater than the height of the fin in the first fin group 21.

[0054] The thickness of the base of the existing heat sink is equal at different positions, and the height of the heat dissipation fin is also the same, as shown in Figure 1 . However, the circuit board of the air conditioner outdoor unit is provided with a plurality of chips, and the sizes and heat consumptions of different chips are different, so the heat flux densities of different chips are different. The existing heat sink with equal thickness of the base and equal height of the fin is easy to have hot spot problem. And the same base thickness, the same fin spacing and the same fin height, the material used for the heat sink is more, and the weight is large.

[0055] In the heat sink provided by the present disclosure, the heat sink base 1 comprises a first base part 11 and a second base part 12, and the thickness of the first base part 11 is greater than the thickness of the second base part 12, as shown in Figure 2 . In this way, the heat dissipation capacities of the first base part 11 and the second base part 12 are different, and different chips can be arranged in the first base part 11 and the second base part 12 according to the different powers and heat generations of the chips. For example, when the power of the first chip 31 is greater than the power of the second chip 32, the first chip 31 is arranged in the first base part 11 with greater thickness, and the second chip 32 is arranged in the second base part 12 with smaller thickness. In this way, the first chip 31 is effectively cooled, and at the same time, the thickness of the second base part 12 of the heat sink is reduced, the amount of material used for the heat sink is reduced, and the heat sink is lightened.

[0056] Optionally, the thickness of the first base part 11 and the second base part 12 is as shown by H1 in Figure 2 , or the thickness of the first base part 11 and the second base part 12 is measured along the direction shown by H1. Optionally, the first base part 11 and the second base part 12 are integrally formed to obtain an aluminum heat sink base 1.

[0057] Optionally, the surface area of the first base portion 11 is greater than the surface area of the second base portion 12, or the surface area of the first base portion 11 is greater than or equal to three times the surface area of the second base portion 12. As shown in FIG. 1, the first base portion 11 is greater than the second base portion 12 in the surface area. Figure 2 In this way, the overall heat dissipation effect of the heat sink is guaranteed.

[0058] Optionally, the two sides of the heat dissipation base 1 further comprise a first ear portion 103 and a second ear portion 104 without heat dissipation fins, which facilitates the installation of the heat sink.

[0059] Optionally, the heat dissipation base 1 is further provided with a mounting hole 102 or a positioning hole penetrating through the heat dissipation base 1, as shown in FIG. 1. Figure 3

[0060] Optionally, the heat dissipation base 1 comprises a first surface 101 provided with heat dissipation fins 2, wherein the first surface 101 can be understood as a lower surface provided with heat dissipation fins 2, as shown in FIG. 1. It can be understood that the lower surface of the overall heat dissipation base 1 comprises the lower surfaces of multiple different base portions. Figure 2

[0061] Optionally, the height of the fins in the first fin group 21 provided on the first base portion 11 is less than the height of the fins in the second fin group 22 provided on the second base portion 12. When the first chip 31 with large power and high heat flux density is provided on the first base portion 11, and the second chip 32 with small power and low heat flux density is provided on the second base portion 12, the height of the fins in the second fin group 22 is greater than the height of the fins in the first fin group 21, so that the height of the fins is increased at the position with small power and low heat flux density, thereby improving the overall heat dissipation effect of the heat sink.

[0062] Optionally, the free ends 202 of the multiple fins in the heat dissipation fins 2 are flush. The height difference between the fins in the first fin group 21 and the second fin group 22 is formed based on the thickness difference between the first base portion 11 and the second base portion 12.

[0063] Similarly, the number of fins in the first fin group 21 is greater than the number of fins in the second fin group 22, or the number of fins in the first fin group 21 is greater than or equal to three times the number of fins in the second fin group 22.

[0064] Optionally, the height of the first fin group 21 and the second fin group 22 is as shown in H2 in FIG. 1, or the thickness of the first fin group 21 and the second fin group 22 is measured in the direction shown by H2. Figure 2

[0065] Optionally, the heat dissipation base 1 and the heat dissipation fins 2 of the heat sink are integrally formed.

[0066] ​​​Optionally, the distance between two adjacent fins in the first fin group 21 is a first distance h1, and the distance between two adjacent fins in the second fin group 22 is a second distance h2, wherein the first distance h1 is less than or equal to the second distance h2.

[0067] The embodiment of the present disclosure provides a scheme of changing the fin distance. When the first chip 31 with large power and high heat flux is arranged on the first base part 11, and the second chip 32 with small power and low heat flux is arranged on the second base part 12, the fin distance at the position corresponding to the first chip 31 with large power and high heat flux is small, and the fin distance at the position corresponding to the second chip 32 with small power and low heat flux is large. In this way, the heat dissipation effect of the heat sink on the first chip 31 is improved, the hot spot problem is avoided, and the overall heat dissipation effect of the heat sink is improved.

[0068] Optionally, the distance between two adjacent fins in the first fin group 21 is a first distance h1, and the distance between two adjacent fins in the second fin group 22 is a second distance h2, wherein the first distance h1 is less than or equal to the second distance h2. Figure 3

[0069] Optionally, the distance between two adjacent fins in the first fin group 21 is a first distance h1, and the distance between two adjacent fins in the second fin group 22 is a second distance h2, wherein the first distance h1 is less than or equal to the second distance h2. Figures 4 to 7

[0070] Optionally, the distance between two adjacent fins in the first fin group 21 is a first distance h1, and the distance between two adjacent fins in the second fin group 22 is a second distance h2, wherein the first distance h1 is less than or equal to the second distance h2. Figures 4 to 7

[0071] Optionally, the distance between two adjacent fins in the first fin group 21 is a first distance h1, and the distance between two adjacent fins in the second fin group 22 is a second distance h2, wherein the first distance h1 is less than or equal to the second distance h2.

[0072] ​​​Similarly, the free end 202 of at least some of the fins in the second fin group 22 is formed with a missing corner 203; or, the second fin group 22 comprises a fifth fin, a sixth fin, a seventh fin, and an eighth fin arranged in sequence, wherein the free ends of the fifth fin and the seventh fin are provided with the missing corner 203, and the free ends of the sixth fin and the eighth fin are not provided with the missing corner; or, the second fin group 22 comprises a fifth fin, a sixth fin, a seventh fin, and an eighth fin arranged in sequence, wherein the free ends of the fifth fin and the sixth fin are provided with the missing corner 203, and the free ends of the seventh fin and the eighth fin are not provided with the missing corner 203, and the spacing between the fifth fin and the sixth fin is smaller than the spacing between the seventh fin and the eighth fin. In this way, the weight of the radiator is reduced while the problem of excessive wind resistance caused by the fins is reduced.

[0073] Optionally, the same side of the first fin group 21 and the second fin group 22 is provided with a missing corner 203 of the same shape and size, as shown in Figures 4 to 7 Thus, when the radiator in the air conditioner outdoor unit is arranged close to the fan, and the side with the missing corner 203 is arranged close to the fan, the missing corner 203 not only reduces wind resistance, but also provides a clearance for the fan blades and the air guide ring.

[0074] Optionally, the radiator base 1 comprises a low-order base portion 111 corresponding to the first portion of the free end 202, and a high-order base portion 112 corresponding to the second portion of the free end 202, wherein the low-order base portion 111 and the high-order base portion 112 are in a stepped shape. As shown in Figure 5

[0075] It can be understood that the thickness of the low-order base portion 111 is smaller than the thickness of the high-order base portion 112. Optionally, the thickness of the low-order base portion 111 is greater than or equal to half the thickness of the high-order base portion 112. Optionally, when the radiator base 1 is in a stepped shape, the chip is arranged on the high-order base portion 112. As shown in Figure 5 In the embodiments of the present disclosure, the stepped base provides a clearance for the devices on the circuit board, and a thinned design is formed on the side that needs to be avoided, which is beneficial to the lightweight of the radiator.

[0076] Optionally, the first base portion 11 is provided with a first mounting area 1101 for mounting the first chip 31, and the second base portion 12 is provided with a second mounting area 1201 for mounting the second chip 32, wherein the power of the first chip 31 is greater than the power of the second chip 32. As shown in Figure 2

[0077] ​​It can be understood that the first mounting area 1101 of the first base part 11 can be a preset virtual mounting area, or a boss protruding from the surface of the first base part 11; similarly, the second mounting area 1201 of the second base part 12 can also be a preset virtual mounting area, or a boss protruding from the surface of the second base part 12.

[0078] Optionally, the first mounting area 1101 of the first base part 11 is located on the second surface opposite to the first surface 101, and similarly, the second mounting area 1201 of the second base part 12 is also located on the second surface opposite to the first surface 101.

[0079] The thickness of the first base part 11 is greater than the thickness of the second base part 12, the first base part 11 can be used to mount the first chip 31 with larger power and heat flux density, and the second base part 12 can be used to mount the second chip 32 with smaller power and heat flux density. In this way, the problem of hot spots formed by the first chip 31 is avoided, and the heat dissipation uniformity of the heat dissipation base 1 is improved.

[0080] Optionally, the heat dissipation base 1 further comprises a third base part 13 and a fourth base part 14, the thickness of the third base part 13 is greater than the thickness of the fourth base part 14, and the first base part 11, the second base part 12, the third base part 13 and the fourth base part 14 are sequentially arranged along the surface of the heat dissipation base 1, wherein the third base part 13 is provided with a third mounting area 1301 for mounting a third chip 33, the fourth base part 14 is provided with a fourth mounting area 1401 for mounting a fourth chip, and the power of the first chip 31 and the third chip 33 is greater than the power of the second chip 32. Figure 6 and Figure 7 as shown.

[0081] Optionally, the first base part 11, the second base part 12, the third base part 13 and the fourth base part 14 of the heat dissipation base 1 are integrally formed.

[0082] The first base part 11 and the third base part 13 are two parts with relatively large thickness, and optionally, the thickness of the first base part 11 and the third base part 13 is equal; the second base part 12 and the fourth base part 14 are two parts with relatively small thickness, and optionally, the thickness of the second base part 12 and the fourth base part 14 is equal.

[0083] The plurality of base parts with different thicknesses are arranged at intervals, so that the heat dissipation base 1 forms a double-pier or a three-pier structure.

[0084] Optionally, the heat dissipation base 1 further comprises a fifth base part, the thickness of the fifth base part is equal to the thickness of the first base part 11, and the fifth base part is provided with a fifth mounting area for mounting a fifth chip 34.

[0085] It can be understood that, dividing the heat dissipation base 1 into multiple different base portions does not necessarily require that each base portion is mounted with a chip. The chip to be mounted can be arranged in a base portion with a corresponding thickness.

[0086] In the embodiment of the present disclosure, the power of the first chip 31 arranged in the first mounting area 1101 and the power of the third chip 33 arranged in the third mounting area 1301 are both greater than the power of the second chip 32 arranged in the second mounting area 1201. In this way, the heat dissipation effect of the heat sink on the two chips with greater power is improved, and the occurrence of hot spot problems is avoided. Meanwhile, the first mounting area 1101 and the third mounting area 1301 are arranged in a spaced manner, further improving the heat dissipation effect on the two chips with greater power.

[0087] Optionally, the heat dissipation fins 2 include wave fins 204 or straight-tooth fins 205. As shown in Figure 8 or Figure 9 .

[0088] In the embodiment of the present disclosure, the heat dissipation fins 2 are arranged in a wave shape or a straight-tooth pattern. In this way, the heat exchange area of the heat dissipation fins 2 is increased, the turbulence effect of the heat dissipation fins 2 is enhanced, and the heat dissipation performance of the heat sink is improved.

[0089] Optionally, the frequency conversion chip and the heat sink can be fixed by screws or thermal interface materials such as thermal grease and thermal pads. The first chip 31 and the third chip 33 have large power and high heat flux density. Therefore, the thickness of the first base portion 11 and the third base portion 13 corresponding to the first chip 31 and the third chip 33 is designed to be thickened in a targeted manner to realize uniform temperature strengthening heat transfer of the heat sink base. Compared with a full-thickened base heat sink, the base thickness is equivalent to being thinned, the fin height is equivalent to being increased, and the heat exchange area is equivalent to being increased.

[0090] Under the same boundary conditions of chip heating power, ambient temperature, and air speed, the heat sink provided in the embodiment of the present disclosure reduces the temperature of the frequency conversion power chip by 0.6℃ compared with the existing heat sink, which reflects a good heat dissipation effect.

[0091] The embodiment of the present disclosure also provides an air conditioner outdoor unit, as shown in Figure 10 .

[0092] Optionally, the air conditioner outdoor unit includes the heat sink as described above.

[0093] Optionally, the outdoor unit of the air conditioner further comprises an outdoor unit shell, a partition plate 6, a compressor 8, a fan 7 and an electric control box. The outdoor unit shell encloses an internal cavity, the partition plate 6 divides the internal cavity into a compressor cavity and a fan cavity, the compressor 8 is arranged in the compressor cavity, the fan 7 is arranged in the fan cavity, and the electric control box is arranged on the top of the partition plate 6 and internally arranged with a circuit board. The electric control box comprises a heat dissipation air channel enclosed by a bottom shell part 41 and a side shell part 42, a radiator is arranged in the heat dissipation air channel, and the bottom shell part 41 is provided with an air inlet 410 of the heat dissipation air channel at the part located in the compressor cavity, and the side shell part 42 is provided with an air outlet 420 of the heat dissipation air channel at the part located in the fan cavity.

[0094] In the embodiment of the present disclosure, the radiator is arranged at the lower part of the circuit board and in the heat dissipation air channel formed by the electric control box. The side shell part 5 of the compressor cavity of the outdoor unit of the air conditioner is provided with a first air inlet 51 and a second air inlet 52, so that air can enter the compressor cavity through the air inlets, then enter the electric control box through the air inlet 410 of the electric control box, pass through the radiator, complete heat exchange with the radiator, and then flow into the fan cavity from the air outlet 420 of the electric control box, and finally be discharged under the action of the air force of the fan 7. The outdoor unit of the air conditioner provided by the embodiment of the present disclosure realizes efficient heat dissipation of the frequency conversion chip through the side air guiding mode.

[0095] Optionally, the heat dissipation fins 2 of the radiator are arranged along the air direction of the heat dissipation air channel of the electric control box.

[0096] Optionally, the missing corner 203 of the fin of the radiator is arranged at the downstream end of the heat dissipation air channel of the electric control box, which can also be understood as that the missing corner 203 of the fin of the radiator is arranged at the side close to the air outlet 420 of the electric control box.

[0097] The embodiment of the present disclosure further provides an air conditioner comprising the outdoor unit of the air conditioner as described above.

[0098] The above description and drawings sufficiently show the embodiments of the present disclosure to enable a person skilled in the art to practice them. Other embodiments can include structural and other changes. The embodiments only represent possible changes. Unless explicitly required, individual components and functions are optional, and the order of operations can be changed. Some parts and features of some embodiments can be included in or replace parts and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is only limited by the appended claims.

Claims

1. A heat sink, characterized by, The heat sink comprises: a heat dissipation base body comprising a first surface provided with heat dissipation fins, and the heat dissipation base body comprises a first base body part and a second base body part; the heat dissipation fins are arranged on the first surface of the heat dissipation base body, and the heat dissipation fins comprise a first fin group arranged on the first base body part and a second fin group arranged on the second base body part, wherein the thickness of the first base body part is greater than the thickness of the second base body part, and the height of the fins in the second fin group is greater than the height of the fins in the first fin group.

2. The heat sink according to claim 1, wherein: the spacing between two adjacent fins in the first fin group is a first spacing, and the spacing between two adjacent fins in the second fin group is a second spacing, wherein the first spacing is less than or equal to the second spacing.

3. The heat sink according to claim 2, wherein: the heat dissipation fins comprise a fixed connection end arranged on the first surface, and a free end opposite to the fixed connection end, wherein the free end comprises a first part and a second part, and the first part is provided with a missing corner.

4. The heat sink according to claim 3, wherein: the heat dissipation base body comprises a low-order base body part corresponding to the first part of the free end, and a high-order base body part corresponding to the second part of the free end, wherein the low-order base body part and the high-order base body part are in a stepped shape.

5. The heat sink according to claim 1, wherein: the first base body part is provided with a first mounting area for mounting a first chip, and the second base body part is provided with a second mounting area for mounting a second chip, wherein the power of the first chip is greater than the power of the second chip.

6. The heat sink according to claim 5, wherein: the heat dissipation base body further comprises a third base body part and a fourth base body part, the thickness of the third base body part is greater than the thickness of the fourth base body part, and the first base body part, the second base body part, the third base body part and the fourth base body part are sequentially arranged along the surface of the heat dissipation base body, wherein the third base body part is provided with a third mounting area for mounting a third chip, the fourth base body part is provided with a fourth mounting area for mounting a fourth chip, and the power of the first chip and the third chip is greater than the power of the second chip.

7. The heat sink according to any one of claims 1 to 6, wherein: the heat dissipation fins comprise wave fins or straight-tooth fins.

8. An air conditioner outdoor unit characterized by comprising: The heat sink according to any one of claims 1 to 7.

9. The air conditioner outdoor unit according to claim 8, characterized by Further comprising: an outdoor unit housing enclosing an internal cavity; a partition plate dividing the internal cavity into a compressor cavity and a fan cavity; a compressor arranged in the compressor cavity; a fan arranged in the fan cavity; and an electric control box arranged on the top of the partition plate and internally provided with a circuit board, wherein the electric control box comprises a heat dissipation air path enclosed by a bottom shell part and a side shell part, the heat sink is arranged in the heat dissipation air path, and the part of the bottom shell part located in the compressor cavity is provided with an air inlet of the heat dissipation air path, and the part of the side shell part located in the fan cavity is provided with an air outlet of the heat dissipation air path. The air conditioner outdoor unit according to claim 8 or 9.

10. An air conditioner characterized by comprising: ​

Images