Drying device for integrated circuit production

Abstract

The utility model discloses a drying device for integrated circuit production, which comprises a drying box, a drying frame is arranged in the drying box, a driving mechanism is arranged on the drying box, the driving mechanism is connected with the drying frame, and the driving mechanism drives the drying frame to rotate in the drying box; according to the drying device for integrated circuit production, by arranging the rotatable drying frame, when the drying box dries an integrated circuit board, the driving mechanism drives the drying frame to drive the integrated circuit board to rotate in the drying box, so that the integrated circuit board in the drying box is changed into a dynamic state from a static state; the distance between the dynamic integrated circuit board and the heat source is continuously changed, and the situation that the integrated circuit board is heated unevenly is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of integrated circuit production, concretely relates to a drying device for integrated circuit production. BACKGROUND

[0002] Integrated circuit is the certain quantity of common electronic components, such as resistance, capacitance, transistor etc., and the connection between these components, by semiconductor technology integrated together with specific function circuit, the existing integrated circuit in production process, especially in the cleaning and coating process, can absorb moisture, humid environment can cause integrated circuit board internal and surface accumulation moisture, influence electrical performance, even lead to short circuit, to improve the overall quality and reliability of integrated circuit board, often to integrated circuit board is carried out drying treatment, reduces the failure rate in subsequent use process.

[0003] Such as the patent with publication number CN216420053U, disclosure date is May 03, 2022, discloses an integrated circuit substrate coating drying box, including drying box shell, the top of drying box shell is uniformly provided with air hole, the inner side of drying box shell is provided with installation groove A, the inside of drying box shell is provided with installation groove B, the inside of installation groove B is equipped with medium-temperature self-limiting heating tape, the integrated circuit drying box has the function of drying the integrated circuit substrate after being sprayed, and has the function that the drying structure in the control equipment is circularly operated in the set time, and the integrated circuit substrate can be stably placed, is practical, the drying effect is remarkable, is suitable for widely popularizing and using.

[0004] The existing integrated circuit board carries out drying treatment, usually places multiple integrated circuit boards in drying box and carries out drying, integrated circuit board is statically arranged in drying box, and the distance of different integrated circuit boards and heat source is different, so that uneven heating is caused, and the quality of integrated circuit board is affected. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a drying device for integrated circuit production to solve the above-mentioned deficiencies in the prior art.

[0006] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] A drying device for integrated circuit production, comprising a drying box, a drying rack is arranged in the drying box, a driving mechanism is arranged on the drying box, the driving mechanism is connected with the drying rack, and the driving mechanism drives the drying rack to rotate in the drying box.

[0008] The drying rack comprises a connecting sleeve connected with the driving mechanism, a plurality of connecting frames are uniformly arranged on the outer side of the connecting sleeve, the connecting frames are arranged at intervals along the circumference of the connecting sleeve, a clamping frame is arranged on the connecting frame, and the clamping frame is used for fixing the integrated circuit board.

[0009] The connecting sleeve is of a telescopic structure.

[0010] The clamping frame is in a rectangular shape, a fixing portion is mounted on the inner wall of the clamping frame, and the fixing portion is used for fixing the integrated circuit board.

[0011] The drying box is further provided with an adjusting assembly, the adjusting assembly drives the clamping frame to rotate half a circle with the integrated circuit board when the driving mechanism drives the drying rack to rotate one circle.

[0012] The clamping frame is rotationally connected with the connecting frame.

[0013] The adjusting assembly comprises an adjusting shaft arranged on the clamping frame, the adjusting shaft penetrates through the connecting frame, an adjusting gear is fixedly mounted on the adjusting shaft, the adjusting gear is coaxial with the adjusting shaft, and an adjusting rack matched with the adjusting gear is fixedly mounted on the inner wall of the drying box.

[0014] The adjusting rack is in an arc shape.

[0015] The adjusting rack is used for driving the adjusting gear to rotate half a circle.

[0016] The inner wall of the drying box is provided with a ring-shaped guide groove, and the track of the guide groove is consistent with the movement track of the adjusting shaft.

[0017] The beneficial effects of the drying device for integrated circuit production provided by the utility model lie in that: in the above technical scheme, the drying device for integrated circuit production provided by the utility model is provided with a rotatable drying rack, when the drying box performs drying treatment on the integrated circuit board, the driving mechanism drives the drying rack to rotate in the drying box with the integrated circuit board, so that the integrated circuit board changes from static placement to dynamic in the drying box, the dynamic integrated circuit board continuously changes the distance from the heat source, and the situation that the integrated circuit board is unevenly heated is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical schemes in the embodiments or the prior art, the drawings needed in the embodiments will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments described in the utility model, and other drawings can be obtained by those skilled in the art according to these drawings.

[0019] Figure 1 The front view of the drying device for integrated circuit production provided by the utility model embodiment is shown in the figure.

[0020] Figure 2 The internal front structure schematic view of the drying rack is provided for the embodiments of the present application.

[0021] Figure 3 The arrangement schematic view of the guide slot and the adjusting rack of the drying rack is provided for the embodiments of the present application.

[0022] Figure 4 The structure schematic view of the clamping frame is provided for the embodiments of the present application.

[0023] Mark explanation:

[0024] 1, drying box; 2, drying rack; 21, connecting sleeve; 22, connecting frame; 23, clamping frame; 24, fixed part; 3, driving mechanism; 4, adjusting assembly; 41, adjusting shaft; 42, adjusting gear; 43, adjusting rack; 44, guide slot. Specific implementation

[0025] In order for those skilled in the art to better understand the technical scheme of the present application, the following will combine the accompanying drawings to further describe the present application. Figures 1-4 The present application will be further described in detail.

[0026] The embodiments of the present application provide a drying device for integrated circuit production, which comprises a drying box 1, a drying rack 2 arranged in the drying box 1, a driving mechanism 3 arranged on the drying box 1, the driving mechanism 3 being connected with the drying rack 2, and the driving mechanism 3 driving the drying rack 2 to rotate in the drying box 1.

[0027] Specifically, the existing drying box 1 is placed on the ground, the drying rack 2 is arranged in the drying box 1, and the drying rack 2 is used for placing integrated circuit boards. When the existing integrated circuit boards are dried, the integrated circuit boards to be dried are usually placed in the drying rack 2, and then the heat source in the drying box 1 is powered on to release heat to dry the integrated circuit boards on the drying rack 2 in the drying box 1.

[0028] Obviously, when the integrated circuit boards are placed in the drying rack 2 in the drying box 1 for drying, the drying rack 2 supports the integrated circuit boards, so that the area of the integrated circuit boards in contact with the drying rack 2 is blocked by the drying rack 2 and cannot directly contact the heat emitted by the heat source, which easily leads to the incomplete drying of the integrated circuit boards in the area. In the drying box 1, the position of the heat source is fixed, and when the integrated circuit boards are placed statically on the drying rack 2, the distances of different integrated circuit boards to the heat source are different, which leads to certain differences in drying effect. The integrated circuit boards close to the heat source are dried more completely, and vice versa, the integrated circuit boards far from the heat source are easily not completely dried.

[0029] In order to solve the above problems, in the embodiment, the outer wall of the drying box 1 is provided with a driving mechanism 3, which can be selected as a driving motor, the driving shaft of the driving mechanism 3 is connected with the drying rack 2, and the driving mechanism 3 drives the drying rack 2 to rotate around the axis of the driving shaft in the drying box 1, and the integrated circuit board is moved synchronously in the drying box 1 with the drying rack 2, and the position of the integrated circuit board on the drying rack 2 relative to the heat source is constantly changed with the rotation of the drying rack 2, so that the integrated circuit board is dried more uniformly, and the situation that the integrated circuit board is not uniformly dried when it is placed in the drying box 1 is avoided.

[0030] The drying rack 2 comprises a connecting sleeve 21 connected with the driving mechanism 3, a plurality of connecting frames 22 are uniformly arranged on the outer side of the connecting sleeve 21, the plurality of connecting frames 22 are arranged at intervals along the circumference of the connecting sleeve 21, a clamping frame 23 is arranged on the connecting frame 22, the clamping frame 23 is used for fixing the integrated circuit board, the clamping frame 23 is rectangular, and a fixing part 24 is installed on the inner wall of the clamping frame 23, and the fixing part 24 is used for fixing the integrated circuit board.

[0031] Specifically, in the embodiment, the fixing part 24 can be selected as a plurality of elastic sheets, and the plurality of elastic sheets are arranged in the circumference of the clamping frame 23. When the integrated circuit board needs to be fixed, the integrated circuit board to be processed is placed in the clamping frame 23, and the plurality of elastic sheets in the clamping frame 23 abut against the side wall of the integrated circuit board to complete the fixing of the integrated circuit board. At this time, the two board surfaces of the integrated circuit board are directly exposed in the inside of the drying box 1 for drying treatment, and when the integrated circuit board is fixed by the plurality of elastic sheets, the board surface of the integrated circuit board is not blocked, so that the integrated circuit board can be dried more completely.

[0032] Preferably, in the embodiment, the connecting sleeve 21 is a telescopic structure, specifically a telescopic sleeve, one end of the telescopic sleeve is fixedly installed on the driving end of the driving mechanism 3. When the integrated circuit board needs to be installed or disassembled, the connecting sleeve 21 can be directly pulled to elongate the connecting sleeve 21, and the elongated connecting sleeve 21 takes away the connecting frame 22, the clamping frame 23 and the clamped integrated circuit board from the drying box 1, so that the integrated circuit board in the clamping frame 23 can be conveniently taken down by manual operation.

[0033] In the embodiment, the heat source in the drying box 1 is arranged above the inner wall of the drying box 1. For the convenience of understanding, the uppermost clamping frame 23 is taken as an example. When the integrated circuit board is placed in the clamping frame 23, the integrated circuit board can be divided into a near-heat-source surface and a far-heat-source surface according to the distance from the heat source. In the initial state, the near-heat-source surface of the integrated circuit board is close to the heat source for drying. When the driving mechanism 3 drives the clamping frame 23 to rotate one circle with the integrated circuit board, the surface of the integrated circuit board close to the heat source is still the original near-heat-source surface. If the thickness of the integrated circuit board is relatively large, the integrated circuit board is prone to uneven drying.

[0034] To solve the above problems, preferably, the drying box 1 is further provided with an adjusting assembly 4. When the driving mechanism 3 drives the drying frame 2 to rotate one circle, the adjusting assembly 4 drives the clamping frame 23 to rotate half a circle with the integrated circuit board. The clamping frame 23 is rotationally connected with the connecting frame 22. The adjusting assembly 4 comprises an adjusting shaft 41 arranged on the clamping frame 23. The adjusting shaft 41 penetrates through the connecting frame 22. The adjusting shaft 41 is fixedly installed with an adjusting gear 42. The adjusting gear 42 is coaxial with the adjusting shaft 41. The inner wall of the drying box 1 is fixedly installed with an adjusting rack 43 matched with the adjusting gear 42. The adjusting rack 43 is arc-shaped. The adjusting rack 43 is used to drive the adjusting gear 42 to rotate half a circle. The inner wall of the drying box 1 is provided with a ring-shaped guide groove 44. The track of the guide groove 44 is consistent with the movement track of the adjusting shaft 41.

[0035] Specifically, the drying process of the integrated circuit board is as follows:

[0036] Firstly, the drying box 1 is opened manually. The connecting sleeve 21 is stretched. The stretched connecting sleeve 21 drives the connecting frame 22 and the clamping frame 23 to leave the inside of the drying box 1. Then, the integrated circuit board to be dried is placed in the clamping frame 23. The fixed part 24 in the clamping frame 23 fixes the integrated circuit board. The installation of the integrated circuit board is completed.

[0037] Subsequently, the connecting sleeve 21 is manually pushed to retract, and the connecting sleeve 21 with the connecting frame 22, the clamping frame 23 and the integrated circuit board enters into the inside of the drying box 1, and subsequently the driving mechanism 3 works, and the driving mechanism 3 with the connecting sleeve 21, the connecting frame 22 and the clamping frame 23 rotates in the drying box 1 to dry the integrated circuit board; with the working of the driving mechanism 3, the adjusting shaft 41 slides along the track of the guide groove 44, with the sliding of the adjusting shaft 41, the adjusting gear 42 on the adjusting shaft 41 meshes with the arc-shaped adjusting rack 43, when the adjusting gear 42 completely passes through the arc-shaped adjusting rack 43, the adjusting gear 42 rotates half a circle, the adjusting gear 42 with the clamping frame 23 on the connecting frame body 22 synchronously rotates half a circle through the adjusting shaft 41, and the integrated circuit board synchronously overturns half a circle with the clamping frame 23, at this time, the near heat source surface and the far heat source surface of the integrated circuit board are exchanged, the original near heat source surface becomes the far heat source surface, and the original far heat source surface becomes the near heat source surface, with the rotating of the driving mechanism 3 with the connecting frame 22 in the drying box 1, the far heat source surface and the near heat source surface of the integrated circuit board are exchanged once per rotation, the uniformity of the integrated circuit board heating is improved, and the situation that the near heat source end and the far heat source end of the integrated circuit board are unevenly heated when the integrated circuit board is thick is avoided.

[0038] The above only describes certain exemplary embodiments of the present application by way of illustration, and it is needless to say that the described embodiments can be modified in various ways without departing from the spirit and scope of the present application for those skilled in the art. Therefore, the above drawings and descriptions are illustrative in nature and should not be understood as limiting the scope of protection of the present application.

Claims

1. A drying apparatus for integrated circuit production, comprising a drying chamber (1) in which a drying rack (2) is arranged, characterized in that, The drying box (1) is provided with a driving mechanism (3), the driving mechanism (3) is connected with the drying frame (2), and the driving mechanism (3) drives the drying frame (2) to rotate in the drying box (1); The drying frame (2) comprises a connecting sleeve (21) connected with the driving mechanism (3), a plurality of connecting frames (22) are uniformly arranged on the outer side of the connecting sleeve (21), the plurality of connecting frames (22) are arranged at intervals along the circumference of the connecting sleeve (21), a clamping frame (23) is arranged on the connecting frame (22), and the clamping frame (23) is used for fixing the integrated circuit board; The drying box (1) is further provided with an adjusting assembly (4), when the driving mechanism (3) drives the drying frame (2) to rotate one circle, the adjusting assembly (4) drives the clamping frame (23) to rotate half a circle with the integrated circuit board; The clamping frame (23) is rotatably connected with the connecting frame (22); The adjusting assembly (4) comprises an adjusting shaft (41) arranged on the clamping frame (23), the adjusting shaft (41) penetrates through the connecting frame (22), an adjusting gear (42) is fixedly installed on the adjusting shaft (41), the adjusting gear (42) is coaxial with the adjusting shaft (41), and an adjusting rack (43) matched with the adjusting gear (42) is fixedly installed on the inner wall of the drying box (1).

2. The drying apparatus for integrated circuit production according to claim 1, wherein The connecting sleeve (21) is a telescopic structure.

3. The drying apparatus for integrated circuit production according to Claim 1, wherein The clamping frame (23) is rectangular, a fixing portion (24) is installed on the inner wall of the clamping frame (23), and the fixing portion (24) is used for fixing the integrated circuit board.

4. The drying apparatus for integrated circuit production according to Claim 1, wherein The adjusting rack (43) is arc-shaped.

5. The drying apparatus for integrated circuit production according to claim 4, wherein The adjusting rack (43) is used for driving the adjusting gear (42) to rotate half a circle.

6. The drying apparatus for integrated circuit production according to claim 5, wherein An annular guide groove (44) is formed in the inner wall of the drying box (1), and the track of the guide groove (44) is consistent with the movement track of the adjusting shaft (41).

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