Optical character recognition (OCR) reading device of double-polished wafer

Abstract

The utility model discloses an OCR reading device for a double-polished wafer, and relates to the technical field of wafer production and manufacturing, and the device comprises a pedestal, a clamping assembly, and a reading assembly. The clamping assembly is fixed to the base and comprises a displacement adjuster, a rotary driver and at least three clamping columns. The clamping columns are circumferentially distributed around a preset circle center and are vertically and rotatably arranged; the rotating surface of each clamping column can be in rotating contact with the edge of the wafer; the displacement regulator is connected with at least one clamping column and is used for driving the connected clamping column to radially move relative to a preset circle center so as to clamp the wafer; the rotary driver is connected with at least one clamping column and is used for driving the connected clamping column to rotate so as to drive the clamped wafer to rotate; the reading assembly is used for reading the identification code of the front surface and / or the identification code of the back surface of the clamped wafer. The problem that the smoothness of the bottom of the wafer is reduced by a traditional bottom suction positioning mode is solved, and the adaptability is better.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer production and manufacturing, and particularly relates to an OCR reading device for double-polished wafers. BACKGROUND

[0002] An OCR (Optical Character Recognition) reading device is a device capable of converting characters in an image into editable text. In the wafer production and manufacturing process, an OCR reading device needs to be used to identify and read the code of a wafer. However, the existing OCR reading device needs to position a wafer by sucking the bottom of the wafer when fixing the wafer, which reduces the smoothness of the bottom of the wafer. This is not allowed for double-polished wafers. It can be seen that the existing OCR reading device cannot be well applied to double-polished wafers. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application aims to provide an OCR reading device for double-polished wafers, which does not reduce the smoothness of the bottom of a wafer when performing OCR reading.

[0004] To achieve the above technical purpose, the present application provides an OCR reading device for double-polished wafers, which comprises a base, a clamping assembly and a reading assembly.

[0005] The clamping assembly is fixed on the base and comprises a displacement adjuster, a rotary driver and at least three clamping columns.

[0006] Each clamping column is circumferentially distributed around a preset center and is vertically rotatably arranged.

[0007] The rotating surface of each clamping column can be in rotating contact with the edge of a wafer.

[0008] The displacement adjuster is connected with at least one clamping column and is used to drive the connected clamping column to move radially relative to the preset center, so as to clamp a wafer.

[0009] The rotary driver is connected with at least one clamping column and is used to drive the connected clamping column to rotate, so as to drive the clamped wafer to rotate.

[0010] The reading assembly is used to read the identification code on the front surface and / or the identification code on the back surface of the clamped wafer.

[0011] Further, the clamping assembly further comprises at least three fixing cylinders.

[0012] Each clamping column is one-to-one inserted into the fixing cylinder and is rotatably connected with the inner wall of the fixing cylinder through a first bearing.

[0013] The part of the clamping column extends out of the top of the fixing cylinder for clamping the wafer;

[0014] The displacement adjuster is connected with at least one of the fixing cylinders for driving the connected fixing cylinder to move, so as to drive the clamping column on the fixing cylinder to move.

[0015] Further, the clamping column is provided with an annular flange;

[0016] The annular flange is used for supporting the clamped wafer.

[0017] Further, the part of the clamping column above the annular flange is a reverse tapered column segment.

[0018] Further, the displacement adjuster comprises a sliding table body and a sliding seat;

[0019] The driving end of the sliding table body is connected with the sliding seat for driving the sliding seat to move radially relative to the preset center;

[0020] The sliding seat is installed with at least one of the clamping columns.

[0021] Further, the rotary driver is connected with each of the clamping columns through a transmission assembly for driving each of the clamping columns to rotate synchronously.

[0022] Further, the transmission assembly comprises a driving gear and at least three transmission rods;

[0023] The driving end of the rotary driver is connected with the driving gear through a shaft coupling for driving the driving gear to rotate;

[0024] The center line of the rotation of the driving gear coincides with the preset center;

[0025] Each of the clamping columns is fixed with a driven gear;

[0026] Each of the transmission rods is arranged radially relative to the preset center and corresponds to each of the clamping columns one by one;

[0027] One end of each of the transmission rods is provided with a first transmission gear meshing with the driving gear, and the other end is provided with a second transmission gear meshing with the driven gear.

[0028] Further, the driving gear and the driven gear are face gears;

[0029] The first transmission gear and the second transmission gear are cylindrical gears.

[0030] Further, the reading assembly comprises a front reader and a back reader;

[0031] The front reader is used for reading the identification code of the front of the clamped wafer.

[0032] The back reader is used for reading the identification code of the back of the clamped wafer.

[0033] Further, the clamping columns are four, two of which are fixed on the base, and the other two are fixed on the displacement adjuster.

[0034] From the above technical solutions, it can be seen that the OCR reading device for double-polished wafers provided in the present application clamps and fixes the wafer from the radial direction through three clamping columns distributed circumferentially around a preset center, thereby solving the problem of reducing the smoothness of the bottom of the wafer caused by the traditional bottom suction positioning method. Moreover, at least one of the clamping columns is adjusted in radial position through the displacement adjuster, which meets the clamping / release requirement and enables the wafer of different sizes to be clamped, thereby realizing the OCR identification of wafers of different sizes and better adaptability. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0036] Figure 1 It is a sectional view of the OCR reading device for double-polished wafers provided in the present application;

[0037] Figure 2 It is a top view of the OCR reading device for double-polished wafers provided in the present application;

[0038] Figure 3 It is a sectional view of the fixed cylinder and clamping column cooperation structure of the OCR reading device for double-polished wafers provided in the present application;

[0039] Figure 4 It is a first partial sectional view of the OCR reading device for double-polished wafers provided in the present application with a displacement adjuster;

[0040] Figure 5 It is a second partial sectional view of the OCR reading device for double-polished wafers provided in the present application with a transmission assembly;

[0041] In the figure: 100, clamping assembly; 200, reading assembly; 201, front reader; 202, back reader; 300, wafer; 400, base; 1, clamping column; 11, annular flange; 12, driven gear; 2, rotary driver; 21, shaft coupling; 3, displacement adjuster; 31, sliding seat; 32, sliding table body; 4, fixed cylinder; 51, first bearing piece; 52, second bearing piece; 53, third bearing piece; 61, driving gear; 62, transmission rod; 621, first transmission gear; 622, second transmission gear. DETAILED DESCRIPTION

[0042] The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0043] In the description of the embodiments of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0044] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or replaceable connection, or integral connection, it can be mechanical connection, or electrical connection, it can be direct connection, or indirect connection through an intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0045] The embodiments of the present application disclose an OCR reading device for double-polished wafers.

[0046] Please refer to Figure 1 An embodiment of the OCR reading device for double-polished wafers provided in the embodiments of the present application includes:

[0047] The base 400, the clamping assembly 100 and the reading assembly 200.

[0048] The clamping assembly 100 is fixed on the base 400, and comprises a displacement adjuster 3, a rotary driver 2, and at least three clamping columns 1; each of the clamping columns 1 is circumferentially distributed around a preset center, and is vertically rotatably arranged; in order to better clamp the wafer 300, the at least three clamping columns 1 are arranged in two preset semicircular clamping areas, and the included angle between two clamping columns 1 in the same area is not equal to 180°, so that the wafer 300 can be stably clamped even if there are only three clamping columns 1.

[0049] The rotary surface of each of the clamping columns 1 can be in rotary contact with the edge of the wafer 300, and the wafer 300 is clamped by being in contact with the edge of the wafer 300; the wafer 300 is clamped and fixed from the radial direction by the three circumferentially distributed clamping columns 1 around the preset center, so that the problem of reducing the smoothness of the bottom of the wafer 300 in the traditional bottom suction positioning mode is solved.

[0050] The displacement adjuster 3 is connected with at least one of the clamping columns 1, and is used to drive the connected clamping column 1 to move radially relative to the preset center, so as to clamp the wafer 300; at least one of the clamping columns 1 is adjusted in radial position by the displacement adjuster 3, so as to meet the clamping / release requirement, and to clamp wafers 300 of different sizes, so as to realize OCR identification of wafers 300 of different sizes, and better adaptability.

[0051] The rotary driver 2 is connected with at least one of the clamping columns 1, and is used to drive the connected clamping column 1 to rotate, so as to drive the clamped wafer 300 to rotate; the reading assembly 200 is used to read the identification code on the front surface and / or the identification code on the back surface of the clamped wafer 300. By rotating the wafer 300, even if the setting position of the reading assembly 200 is fixed, the identification code on the wafer 300 can be comprehensively read.

[0052] The above is an embodiment one of the OCR reading device for double-polished wafers provided by the embodiment of the present application, and the following is an embodiment two of the OCR reading device for double-polished wafers provided by the embodiment of the present application, please refer to Figures 1 to 5 .

[0053] Based on the scheme of the above embodiment one:

[0054] Further, as Figure 1 and Figure 3As shown, the clamping assembly 100 further comprises at least three fixed cylinders 4; each of the clamping columns 1 is correspondingly inserted into the fixed cylinder 4 and is rotatably connected to the inner wall of the fixed cylinder 4 through a first bearing member 51; part of the clamping column 1 extends out of the top of the fixed cylinder 4 for clamping the wafer 300; by providing the fixed cylinder 4, the clamping column 1 is conveniently rotatably installed; the fixed cylinder 4 and the base 400 can be integrally formed or fastened by bolts or other fasteners, and the specific connection mode is not limited.

[0055] Correspondingly, as shown in Figure 1 The displacement adjuster 3 is connected with at least one of the fixed cylinders 4 for driving the connected fixed cylinder 4 to move, so as to drive the clamping column 1 on the fixed cylinder 4 to move.

[0056] Further, as shown in Figure 3 An annular flange 11 is arranged on the clamping column 1, and the annular flange 11 is used for supporting the clamped wafer 300. The annular flange 11 is arranged to limit and support the clamped wafer 300, so as to avoid the wafer 300 from moving downward, thereby achieving better clamping and fixing effect.

[0057] Further, as shown in Figure 3 The column segment of the clamping column 1 above the annular flange 11 is a reverse tapered column segment; that is, the column segment between the top of the clamping column 1 and the top of the annular flange 11 has an inward inclination angle, so as to ensure that the wafer 300 does not move upward when the clamping column 1 drives the wafer 300 to rotate.

[0058] Further, as shown in Figure 1 and Figure 4 The displacement adjuster 3 comprises a slide table body 32 and a slide base 31; the driving end of the slide table body 32 is connected with the slide base 31, so as to drive the slide base 31 to move radially relative to the preset center; at least one of the clamping columns 1 is installed on the slide base 31. The slide table body 32 can be an existing starting slide table or a screw slide table, and the slide base 31 is a bearing structure for bearing the support column to be adjusted in displacement. The specific structure can be designed according to actual needs, and is not limited.

[0059] Before OCR, the slide table body 32 drives the slide base 31 to move rightward to clamp the wafer 300; after the completion of OCR, the slide table body 32 drives the slide base 31 to move leftward to release the wafer 300; by adjusting the control stroke of the slide table body 32 on the slide base 31, the OCR identification of wafers 300 of different sizes can be realized.

[0060] Further, the rotating driver 2 is connected with each clamping column 1 through a transmission assembly, for driving each clamping column 1 to rotate synchronously; by arranging the transmission assembly, one rotating driver 2 can drive each clamping column 1 to rotate synchronously, which can save driving source and reduce cost; the rotating driver 2 can be an existing servo motor which can rotate forward and backward, and the specific type is not limited.

[0061] Further, as shown in Figure 5 , the transmission assembly is designed to include a driving gear 61 and at least three transmission rods 62.

[0062] The driving end of the rotating driver 2 is connected with the driving gear 61 through a shaft coupling 21, for driving the driving gear 61 to rotate; the rotation center line of the driving gear 61 coincides with the preset circle center; in order to improve the rotation stability of the driving gear 61, the driving gear 61 is also rotationally fixed on the base 400 through a second bearing 52.

[0063] Each clamping column 1 is fixed with a driven gear 12 (as shown in Figure 2 and Figure 5 , the driven gear 12 can be fixed at the bottom of the clamping column 1, and can be integrally formed with the clamping column 1, and the specific type is not limited); each transmission rod 62 is rotationally arranged relative to the preset circle center (as shown in Figure 5 , the positions close to both ends of the transmission rod 62 are fixed through a third bearing 53 to realize the rotational arrangement), and corresponds to each clamping column 1 one by one; one end of each transmission rod 62 is provided with a first transmission gear 621 engaged with the driving gear 61, and the other end is provided with a second transmission gear 622 engaged with the driven gear 12.

[0064] The rotating driver 2 drives the driving gear 61 to rotate through the shaft coupling 21, since the driving gear 61 synchronously drives each first transmission gear 621 engaged therewith to rotate, each first transmission gear 621 synchronously drives the fixed transmission rod 62 to rotate, each transmission rod 62 drives the fixed second transmission gear 622 to rotate, and each second transmission gear 622 synchronously drives the driven gear 12 engaged therewith to rotate, thereby driving each clamping column 1 to rotate.

[0065] Further, as shown in Figure 5 , the driving gear 61 and the driven gear 12 are face gears, and the first transmission gear 621 and the second transmission gear 622 are cylindrical gears. When designing, for the transmission rod 62 fixed on the sliding seat 31, the length of the first transmission gear 621 thereof can be designed to be longer, in a long cylindrical shape, so that even if displacement adjustment occurs, the engagement with the driving gear 61 can be maintained.

[0066] Further, as shown inFigure 1 As shown in the figure, the reading assembly 200 comprises a front reader 201 and a back reader 202; the front reader 201 is used to read the identification code on the front of the clamped wafer 300; the back reader 202 is used to read the identification code on the back of the clamped wafer 300. The front and back of the reader for identifying the identification code are both provided with one, which can identify the identification code existing on the front and back at the same time, without turning over operation, and is more convenient to use compared with single reader design. The reader is an existing OCR reading camera for identification code identification, which is not described in detail.

[0067] Further, as shown in the figure, Figure 2 The clamping columns 1 are four, two of which are fixed on the base 400, and the other two are fixed on the displacement adjuster 3; of course, the specific number can be adjusted according to actual needs by those skilled in the art, without limitation.

[0068] The above provides a detailed introduction to the OCR reading device of the double-polished wafer, for those skilled in the art, according to the idea of the embodiment of the present application, the specific implementation and application range will be changed, and the above description should not be understood as a limitation of the present application.

Claims

1. An OCR reading device for double-polished wafers, characterized by, The device comprises a base (400), a clamping assembly (100) and a reading assembly (200); The clamping assembly (100) is fixed on the base (400) and comprises a displacement adjuster (3), a rotation driver (2) and at least three clamping columns (1); Each clamping column (1) is circumferentially distributed around a preset center and is vertically rotatably arranged; The rotating surface of each clamping column (1) can rotate in contact with the edge of a wafer (300); The displacement adjuster (3) is connected with at least one clamping column (1) and drives the connected clamping column (1) to move radially relative to the preset center so as to clamp the wafer (300); The rotation driver (2) is connected with at least one clamping column (1) and drives the connected clamping column (1) to rotate so as to drive the clamped wafer (300) to rotate; The reading assembly (200) is used for reading the identification code on the front surface and / or the identification code on the back surface of the clamped wafer (300).

2. The OCR reading apparatus for double-polished wafers according to claim 1, wherein The clamping assembly (100) further comprises at least three fixing cylinders (4); Each clamping column (1) is inserted into the fixing cylinder (4) one by one and is rotatably connected with the inner wall of the fixing cylinder (4) through a first bearing member (51); Part of the clamping column (1) extends out of the top of the fixing cylinder (4) and is used for clamping the wafer (300); The displacement adjuster (3) is connected with at least one fixing cylinder (4) and drives the connected fixing cylinder (4) to move so as to drive the clamping column (1) on the fixing cylinder (4) to move.

3. The OCR reading apparatus for double-polished wafers according to claim 1, wherein An annular flange (11) is arranged on the clamping column (1); The annular flange (11) is used for supporting the clamped wafer (300).

4. The OCR reading apparatus for double-throw wafers according to claim 3, wherein The column segment of the clamping column (1) above the annular flange (11) is an inverted conical column segment.

5. The OCR reading apparatus for double-polished wafers according to claim 1, wherein The displacement adjuster (3) comprises a sliding table body (32) and a sliding seat (31); The driving end of the sliding table body (32) is connected with the sliding seat (31) and drives the sliding seat (31) to move radially relative to the preset center; At least one clamping column (1) is mounted on the sliding seat (31).

6. The OCR reading apparatus for double-throw wafers according to claim 1, wherein The rotation driver (2) is connected with each clamping column (1) through a transmission assembly and drives each clamping column (1) to rotate synchronously.

7. The OCR reading apparatus for double-throw wafers according to claim 6, wherein The transmission assembly comprises a driving gear (61) and at least three transmission rods (62); The driving end of the rotation driver (2) is connected with the driving gear (61) through a shaft coupling (21) and drives the driving gear (61) to rotate; The center line of the rotation of the driving gear (61) coincides with the preset center; A driven gear (12) is fixed on each clamping column (1); Each transmission rod (62) is rotatably arranged radially relative to the preset center and corresponds to each clamping column (1) one by one; One end of each transmission rod (62) is provided with a first transmission gear (621) meshing with the driving gear (61) and the other end is provided with a second transmission gear (622) meshing with the driven gear (12).

8. The OCR reading apparatus for double-throw wafers according to claim 7, wherein The driving gear (61) and the driven gear (12) are face gears. The first transmission gear (621) and the second transmission gear (622) are cylindrical gears.

9. The OCR reading apparatus for double-throw wafers according to claim 1, wherein The reading assembly (200) comprises a front reader (201) and a back reader (202). The front reader (201) is used for reading the identification code on the front of the clamped wafer (300). The back reader (202) is used for reading the identification code on the back of the clamped wafer (300).

10. The OCR reading apparatus for double-throw wafers according to claim 1, wherein The clamping columns (1) are four, two of which are fixed on the base (400), and the other two are fixed on the displacement adjuster (3).

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