Feeding device for semiconductor processing equipment

Abstract

The utility model discloses a feeding device for semiconductor processing equipment, which comprises a supporting device, a displacement device is sleeved at the front end of the supporting device in a sliding manner, and a positioning device is fixedly mounted at the top end, close to the supporting device, of the displacement device. The positioning device comprises first hydraulic air cylinders, guide rods, a supporting bottom plate, a contact plate and a buffer spring, the first hydraulic air cylinders are symmetrically and fixedly installed at the top end of the supporting bottom plate, the buffer spring is fixedly installed in the center of the bottom end of the supporting bottom plate, and the contact plate is fixedly installed at the bottom end of the buffer spring; and the guide rod slidably penetrates through the supporting bottom plate to be connected with the contact plate, the displacement device comprises second hydraulic air cylinders, a supporting back plate, a supporting base plate and a displacement support, and the second hydraulic air cylinders are symmetrically and fixedly installed at the rear end of the top of the displacement support. According to the utility model, the positioning device, the displacement device and the supporting device are arranged, so that the purpose of stably limiting the wafer is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, specifically to a feeding device for semiconductor processing equipment. BACKGROUND

[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, etc. Diodes, for example, are devices made of semiconductors.

[0003] For example, a semiconductor chip pushing device with a safety sensing structure for a wire bonding machine disclosed in Chinese Patent No. CN220591871U includes a pad frame and a sensing type pushing mechanism. The sensing type pushing mechanism includes a contact type sensor, a push rod assembly, an alarm, and a sensing contact end. The push rod assembly further includes an outer cylinder rod, an inner cylinder rod, a top rod, and a shock absorbing spring.

[0004] The semiconductor pushing device in the above patent can only achieve rapid inspection during use. However, existing semiconductor feeding devices mostly use a shovel frame to shovel the wafer as a whole. However, the shovel frame lacks a limiting mechanism for the wafer, which may cause the wafer to tip over. Therefore, an improved device is needed to solve the above problems. SUMMARY

[0005] The utility model aims at providing a feeding device for semiconductor processing equipment to solve the problems raised in the background.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a feeding device for semiconductor processing equipment, including support device, the front end of support device is sleeved with displacement device, the top end of displacement device is fixedly installed with positioning device, the positioning device includes first hydraulic cylinder, guide rod, support base plate, contact plate and buffer spring, the top end of support base plate is fixedly installed with first hydraulic cylinder, the bottom end center of support base plate is fixedly installed with buffer spring, the bottom end of buffer spring is fixedly installed with contact plate, the guide rod is connected with contact plate through sliding penetration support base plate.

[0007] Preferably, the displacement device includes a second hydraulic cylinder, a support back plate, a support pad plate, and a displacement bracket. The second hydraulic cylinder is symmetrically fixedly installed at the top rear end of the displacement bracket. The support back plate is fixedly installed at the top end of the second hydraulic cylinder. The support pad plate is symmetrically fixedly installed on the side end of the support back plate away from the displacement bracket. The support device includes a semiconductor processing equipment, an extension frame, a lead screw, and a drive motor. The extension frame is fixedly installed at the front end bottom of the semiconductor processing equipment. The drive motor is fixedly installed at the front end center of the extension frame. The lead screw is rotatably installed at the inner center of the extension frame.

[0008] Preferably, the displacement bracket is sleeved with threads on the outer ring of the lead screw, and the top end of the first hydraulic cylinder is connected with the support back plate near the top of the side end of the support base plate.

[0009] Preferably, the bottom end of the contact plate and the top end of the support base plate are fixedly installed with plastic pads.

[0010] Preferably, the outer ring of the displacement bracket is attached to the inner ring of the extension frame.

[0011] Preferably, the contact plate is vertically aligned with the support base plate.

[0012] Compared with the prior art, the device has the following beneficial effects:

[0013] When the device is used, the support base plate can be driven to shovel up the wafer when the second hydraulic cylinder is started, so that the wafer can be temporarily placed, and at the same time, the first hydraulic cylinder can be started to drive the support base plate to move downward until the contact plate is tightly attached to the wafer, so that the wafer can be prevented from falling, and the buffer spring between the support base plate and the contact plate can prevent the wafer from being damaged by the contact plate, and the wafer can be positioned and limited. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a schematic diagram of the main structure of the device;

[0015] Figure 2 It is a schematic diagram of the positioning device structure of the device;

[0016] Figure 3 It is a schematic diagram of the displacement device structure of the device;

[0017] Figure 4 It is a schematic diagram of the support device structure of the device.

[0018] In the figure: 1-positioning device, 2-displacement device, 3-support device, 4-first hydraulic cylinder, 5-guide rod, 6-support base plate, 7-contact plate, 8-buffer spring, 9-second hydraulic cylinder, 10-support back plate, 11-support base plate, 12-displacement bracket, 13-semiconductor cutting equipment, 14-extension frame, 15-lead screw, 16-driving motor. DETAILED DESCRIPTION

[0019] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts under the premise that no creative efforts are made, belong to the scope of protection of the present application.

[0020] Please refer to Figures 1-4 The utility model provides an embodiment: a kind of for semiconductor processing equipment's feeding device, including support device 3, displacement device 2 is slidably sleeved on the front end of support device 3, displacement device 2 is fixedly installed on the top end of support device 3 close, positioning device 1 includes first hydraulic cylinder 4, guide rod 5, support base plate 6, contact plate 7 and buffer spring 8, first hydraulic cylinder 4 is fixedly installed on the top end of support base plate 6 symmetrically, buffer spring 8 is fixedly installed in the bottom end center of support base plate 6, contact plate 7 is fixedly installed in the bottom end of buffer spring 8, guide rod 5 is slidably penetrated support base plate 6 and is connected with contact plate 7.

[0021] Displacement device 2 includes second hydraulic cylinder 9, support back plate 10, support pad plate 11 and displacement bracket 12, second hydraulic cylinder 9 is fixedly installed on the top rear end of displacement bracket 12 symmetrically, support back plate 10 is fixedly installed on the top end of second hydraulic cylinder 9, support pad plate 11 is fixedly installed on the side end of support back plate 10 away from displacement bracket 12 symmetrically, support device 3 includes semiconductor processing equipment 13, extension frame 14, lead screw 15 and drive motor 16, extension frame 14 is fixedly installed on the front end bottom of semiconductor processing equipment 13, drive motor 16 is fixedly installed on the front end center of extension frame 14, lead screw 15 is rotatably installed in the inner center of extension frame 14, and the inner center of displacement bracket 12 is provided with a threaded hole, so that lead screw 15 can drive displacement bracket 12 to displace when rotating.

[0022] Displacement bracket 12 is threadedly sleeved on the outer circle of lead screw 15, and the top end of first hydraulic cylinder 4 is connected with the top of the side end of support back plate 10 close to support pad plate 11, so as to support first hydraulic cylinder 4 to work.

[0023] The bottom end of contact plate 7 and the top end of support pad plate 11 are fixedly installed with plastic gaskets, so as to facilitate the damage to the die.

[0024] The outer circle of displacement bracket 12 is attached to the inner circle of extension frame 14, so as to ensure that displacement bracket 12 moves along a straight line in the inner part of extension frame 14.

[0025] Contact plate 7 is vertically aligned with support pad plate 11, so as to facilitate limiting the die between contact plate 7 and support pad plate 11.

[0026] Working principle: in use, when the wafer processing in the semiconductor processing equipment 13 is finished, the cover in the semiconductor processing equipment 13 can be opened, so that the wafer can be taken out, then, the semiconductor processing equipment 13 can be operated to release the processed wafer, and the driving motor 16 is started to drive the screw rod 15 to rotate, when the screw rod 15 rotates counterclockwise, the displacement support 12 can be driven to move towards the inside of the semiconductor processing equipment 13, so that the supporting pad 11 can be moved to the bottom end of the base inside the semiconductor processing equipment 13, the supporting pad 11 and the bottom end of the wafer are vertically aligned, then, the second hydraulic cylinder 9 is started to drive the supporting pad 11 to lift upwards, so that the supporting pad 11 can lift the wafer in the semiconductor processing equipment 13, so that the wafer can be taken out from the base inside the semiconductor processing equipment 13, then, the first hydraulic cylinder 4 is started to drive the supporting bottom plate 6 and the contact plate 7 to move downwards, when the contact plate 7 contacts the wafer on the supporting pad 11, the wafer can be limited on the contact plate 7 and the supporting pad 11, at the same time, the bottom end of the contact plate 7 and the top end of the supporting pad 11 are both provided with plastic pads, so that the wafer can be prevented from being damaged, the elasticity of the buffer spring 8 can allow the contact plate 7 to displace upwards, so that the contact plate 7 can be prevented from excessively pressing the wafer, and the guide rod 5 is provided, so that when the contact plate 7 contacts the wafer, the supporting bottom plate 6 moves along a straight line, the accuracy of the contact between the contact plate 7 and the wafer is improved, then, when the wafer is limited, the driving motor 16 is started again to drive the screw rod 15 to rotate clockwise, so that the displacement support 12 can drive the supporting pad 11 to displace away from the semiconductor processing equipment 13, so that the contact plate 7 and the supporting pad 11 can take the wafer at the same time, and the wafer can be taken out from the inside of the semiconductor processing equipment 13, then, when the wafer is removed from the inside of the semiconductor processing equipment 13, the first hydraulic cylinder 4 is started to drive the supporting bottom plate 6 to lift upwards until the contact plate 7 is separated from the wafer, so that the wafer can be released, and the wafer can be moved to the next process by the external equipment, and the work is completed.

[0027] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A feeding device for semiconductor processing equipment, comprising a supporting device (3), a displacement device (2) being slidably sleeved on the front end of the supporting device (3), and a positioning device (1) being fixedly mounted on the top end of the displacement device (2) near the support device (3), characterized in that: The positioning device (1) comprises a first hydraulic cylinder (4), a guide rod (5), a support bottom plate (6), a contact plate (7) and a buffer spring (8), the first hydraulic cylinder (4) is symmetrically fixedly installed at the top end of the support bottom plate (6), the buffer spring (8) is fixedly installed at the bottom center of the support bottom plate (6), the contact plate (7) is fixedly installed at the bottom end of the buffer spring (8), and the guide rod (5) is slidably penetrated through the support bottom plate (6) and connected with the contact plate (7).

2. The material feeding device for semiconductor processing equipment according to claim 1, wherein: The displacement device (2) comprises a second hydraulic cylinder (9), a support back plate (10), a support pad plate (11) and a displacement support (12), the second hydraulic cylinder (9) is symmetrically fixedly installed at the top rear end of the displacement support (12), the support back plate (10) is fixedly installed at the top end of the second hydraulic cylinder (9), the support pad plate (11) is symmetrically fixedly installed on the side end of the support back plate (10) away from the displacement support (12), the support device (3) comprises a semiconductor processing equipment (13), an extension frame (14), a lead screw (15) and a driving motor (16), the extension frame (14) is fixedly installed at the front end bottom of the semiconductor processing equipment (13), the driving motor (16) is fixedly installed at the front end center of the extension frame (14), and the lead screw (15) is rotatably installed at the inner center of the extension frame (14).

3. The material feeding device for semiconductor processing equipment according to claim 2, wherein: The displacement support (12) is threadedly sleeved on the outer ring of the lead screw (15), and the top end of the first hydraulic cylinder (4) is connected with the support back plate (10) close to the top of the side end of the support pad plate (11).

4. The material feeding device for semiconductor processing equipment according to claim 3, wherein: The bottom end of the contact plate (7) and the top end of the support pad plate (11) are fixedly installed with plastic gaskets.

5. The material feeding device for semiconductor processing equipment according to claim 4, wherein: The outer ring of the displacement support (12) is attached to the inner ring of the extension frame (14).

6. The material feeding device for semiconductor processing equipment according to claim 5, wherein: The contact plate (7) is vertically aligned with the support pad plate (11).

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