Heat dissipation device for flat plate type thyristor

Abstract

The heat dissipation device for the flat plate type thyristor comprises an annular liquid cooling shell, a cylindrical inner shell is coaxially arranged in the middle of the annular liquid cooling shell, the flat plate type thyristor is installed in the cylindrical inner shell, and phase change materials are filled between the annular liquid cooling shell and the cylindrical inner shell. According to the heat dissipation device for the flat plate type thyristor, a liquid cooling and phase change material coupling heat dissipation mode is adopted, the heat dissipation speed of the thyristor is accelerated, heat generated by the thyristor is rapidly dissipated to the external environment, safe operation of the thyristor is guaranteed, and the service life of the thyristor is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of thyristor heat management, especially to a heat dissipation device for flat plate thyristor. BACKGROUND

[0002] For the heat dissipation of thyristor, the main heat dissipation modes are air cooling, liquid cooling and the like. The air cooling is suitable for occasions where the heat generated by the thyristor is small, and needs to be used together with a fan. The liquid cooling needs to design a complex cooling flow channel, and needs to have good sealing to prevent the leakage of cooling water and avoid the short circuit problem of the equipment. In addition, there is also a heat dissipation device that combines air cooling and liquid cooling for cooling. The problem of air cooling and liquid cooling is that: because the air cooling structure and the liquid cooling structure need to be set respectively, the structure is relatively complex, and the occupied space of the equipment is increased; at the same time, because the air cooling structure and the liquid cooling structure need to be set respectively, additional system power needs to be consumed, and the use economic cost is high.

[0003] Therefore, a new type of thyristor heat dissipation device is needed to solve the above problems. UTILITY MODEL CONTENTS

[0004] In order to solve the above technical problems, the utility model provides a heat dissipation device for flat plate thyristor.

[0005] The heat dissipation device for flat plate thyristor of the utility model, including annular liquid cooling shell, wherein, the middle part of annular liquid cooling shell is provided with coaxial cylinder inner shell, the flat plate thyristor is installed in cylinder inner shell, and the annular liquid cooling shell is filled with phase change material between the cylinder inner shell.

[0006] In an embodiment, a plurality of heat-conducting fins are further arranged between the annular liquid cooling shell and the cylinder inner shell.

[0007] In an embodiment, the plurality of heat-conducting fins are uniformly distributed around the circumference of the cylinder inner shell, and the phase change material is arranged between adjacent heat-conducting fins.

[0008] In an embodiment, the two ends of the heat-conducting fins are respectively connected to the inner wall of the annular liquid cooling shell and the outer wall of the cylinder inner shell.

[0009] In an embodiment, the phase change material fills the gap between the annular liquid cooling shell and the cylinder inner shell.

[0010] In an embodiment, the annular liquid cooling shell is hollow inside, and the annular liquid cooling shell is respectively provided with a water inlet and a water outlet.

[0011] In one embodiment, the water inlet and the water outlet are arranged at the lower end of the annular liquid cooling shell.

[0012] In one embodiment, the phase change material is a paraffin / expanded graphite composite phase change material.

[0013] In one embodiment, the height of the cylindrical inner shell and the height of the heat-conducting fins are not higher than the height of the annular liquid cooling shell.

[0014] In one embodiment, the inner diameter of the cylindrical inner shell is adapted to the diameter of the plate-type thyristor, and the height of the cylindrical inner shell is adapted to the height of the plate-type thyristor.

[0015] Compared with the prior art, the heat dissipation device for the plate-type thyristor of the present application adopts a liquid cooling and phase change material coupled heat dissipation mode, accelerates the heat dissipation speed of the thyristor, rapidly dissipates the heat generated by the thyristor to the external environment, ensures the safe operation of the thyristor, and improves the service life thereof.

[0016] The above technical features can be combined in various technically feasible ways to produce new embodiments, as long as the purpose of the present application can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The present application will be described in more detail in the following based on non-limiting examples and with reference to the drawings. In which:

[0018] Figure 1 A perspective view of the heat dissipation device for the plate-type thyristor of the present application and the plate-type thyristor is shown;

[0019] Figure 2 A structural view of the heat dissipation device (not including the phase change material) in Figure 1

[0020] Figure 3 An exploded view of the heat dissipation device and the plate-type thyristor in Figure 1

[0021] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to scale.

[0022] In which, the reference numerals are:

[0023] 1, annular liquid cooling shell; 2, heat-conducting fin; 3, cylindrical inner shell; 4, water inlet; 5, water outlet; 6, phase change material; 7, plate-type thyristor. DETAILED DESCRIPTION

[0024] ​​The utility model will make further detailed instructions below combining with the drawings and specific embodiments of the specification. It needs to be explained that, as long as not constitute the conflict, each embodiment in the utility model and each feature in each embodiment can be combined mutually, and the technical scheme formed is within the protection scope of the utility model.

[0025] The part not described in the utility model can be realized by using or referring to the existing technology.

[0026] As Figure 1 The utility model discloses a heat dissipation device for flat plate type thyristor, including annular liquid cooling shell 1, wherein the middle part of annular liquid cooling shell 1 is provided with coaxially arranged cylindrical inner shell 3, flat plate type thyristor 7 is installed in cylindrical inner shell 3, and annular liquid cooling shell 1 is filled with phase change material 6 between cylindrical inner shell 3.

[0027] As a new type of passive cooling mode, phase change material has the advantages of low cost, simple structure, convenient maintenance and no need to consume additional power of the system, and can play a good heat dissipation and temperature control effect on heat generating components. The heat dissipation device for flat plate type thyristor of the utility model adopts the heat dissipation mode of liquid cooling and phase change material coupling, accelerates the heat dissipation speed of thyristor, rapidly dissipates the heat generated by thyristor to the external environment, ensures the safe operation of thyristor and improves its service life.

[0028] In an optional embodiment, a plurality of heat-conducting fins 2 are further arranged between the annular liquid cooling shell 1 and the cylindrical inner shell 3.

[0029] By arranging heat-conducting fins, heat conduction is enhanced, and the heat generated by the thyristor is rapidly dissipated to the external environment by using the mode of phase change material heat absorption-heat-conducting fin heat conduction-liquid cooling heat transfer, further enhancing the heat dissipation speed of the thyristor.

[0030] In an optional embodiment, the plurality of heat-conducting fins 2 are uniformly distributed around the circumference of the cylindrical inner shell 3, and the phase change material 6 is arranged between adjacent heat-conducting fins 2.

[0031] The plurality of heat-conducting fins are uniformly distributed, which can ensure that the thyristor can uniformly dissipate heat at different positions.

[0032] In an optional embodiment, the two ends of the heat-conducting fin 2 are respectively connected with the inner wall of the annular liquid cooling shell 1 and the outer wall of the cylindrical inner shell 3.

[0033] The two ends of the heat-conducting fin are respectively connected with the inner wall of the annular liquid cooling shell 1 and the outer wall of the cylindrical inner shell 3, which can quickly transfer the heat of the thyristor to the annular liquid cooling shell, and dissipate heat through liquid cooling.

[0034] In an alternative embodiment, the phase change material 6 fills the gap between the annular liquid cooling shell 1 and the cylindrical inner shell 3, which can further accelerate the heat dissipation of the thyristor and enable uniform heat dissipation. The heat generated by the thyristor is rapidly dissipated to the external environment through the heat absorption-heat conduction fin-liquid cooling heat transfer mode of the phase change material.

[0035] In an alternative embodiment, the annular liquid cooling shell 1 is hollow inside, and the annular liquid cooling shell 1 is provided with a water inlet 4 and a water outlet 5 respectively. The water inlet 4 and the water outlet 5 are arranged at the lower end of the annular liquid cooling shell 1.

[0036] The liquid cooling water flows into the annular liquid cooling shell from the water inlet at the lower end of the annular liquid cooling shell, flows through the hollow part inside the annular liquid cooling shell, and flows out from the water outlet. The heat generated by the thyristor is promptly dissipated to the external environment through the heat absorption-heat conduction fin-liquid water heat transfer mode, thereby controlling the temperature of the thyristor operation and improving the safety of the thyristor use.

[0037] In an alternative embodiment, the phase change material 6 is a paraffin / expanding graphite composite phase change material, i.e. a mixture of paraffin and expanding graphite.

[0038] Paraffin is a good phase change heat storage material due to its high heat storage density, almost no cooling, low vapor pressure, good thermal chemical stability and self-nucleation, but it needs heat transfer enhancement due to its low thermal conductivity. Expanding graphite has excellent thermal conductivity, and after absorbing paraffin, it can still maintain its original loose and porous worm-like phase state. The paraffin / expanding graphite composite phase change material has a shorter heat storage time than paraffin, improves the poor thermal conductivity of paraffin and overcomes the liquid flow problem of paraffin during heat storage. When applied to heat dissipation in the present application, it can fully absorb the heat generated by the thyristor and promptly dissipate the heat generated by the thyristor to the external environment through the heat absorption-heat conduction fin-liquid water heat transfer mode, thereby controlling the temperature of the thyristor operation and improving the safety of the thyristor use.

[0039] In other alternative embodiments, the phase change material can also select carbon nanotubes, graphene / graphite sheets, metal particles, etc. as phase change composite materials.

[0040] In other alternative embodiments, the phase change material can also select fatty acid [CH3(CH2) 2n COOH], but fatty acid is more volatile than industrial paraffin, has slight corrosiveness and unpleasant odor.

[0041] In an alternative embodiment, the height of the cylindrical inner shell 3 and the height of the heat conduction fin 2 are not higher than the height of the annular liquid cooling shell 1.

[0042] In an alternative embodiment, the inner diameter of the cylindrical inner shell 3 is adapted to the diameter of the thyristor 7, and the height of the cylindrical inner shell 3 is adapted to the height of the thyristor 7.

[0043] The height of the cylindrical inner shell 3, the height of the heat-conducting fins 2 and the height of the annular liquid cooling housing 1 are equal. More preferably, the height of the cylindrical inner shell 3, the height of the heat-conducting fins 2 and the height of the annular liquid cooling housing 1 are such that the cylindrical inner shell 3 just accommodates the thyristor 7.

[0044] Compared with the prior art, the heat dissipation device for the thyristor of the utility model adopts the heat dissipation mode of liquid cooling and phase change material coupling, enhances heat conduction by setting heat-conducting fins, and adopts the mode of phase change material heat absorption-heat-conducting fin heat conduction-liquid cooling heat transfer to rapidly dissipate the heat generated by the thyristor to the external environment, thereby ensuring the safe operation of the thyristor and improving the service life thereof.

[0045] Unless otherwise defined, technical terms or scientific terms used in the utility model should be understood as the usual meaning understood by a person with ordinary skills in the art to which the utility model belongs. The terms "first", "second" and similar words used in the utility model do not represent any order, quantity or importance, but are only used to distinguish different components. "Include" or "contain" and similar words mean that the elements or objects before the words cover the elements or objects listed after the words and their equivalents, without excluding other elements or objects. "Connected" or "connected" and similar words are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. In the description of the utility model, the terms "vertical", "horizontal" and similar terms indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation. When the absolute position of the described object changes, the relative positional relationship may also change accordingly, so it cannot be understood as a limitation on the utility model.

[0046] At this point, those skilled in the art should realize that although the utility model has been described with reference to the preferred embodiments, various improvements can be made and equivalent parts can be replaced without departing from the scope of the utility model. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A heat dissipating device for a planar thyristor, characterized by, The ring-shaped liquid cooling shell is filled with phase change material between the ring-shaped liquid cooling shell and the cylindrical inner shell.

2. The heat sink for a planar thyristor according to claim 1, characterized in that A plurality of heat-conducting fins are arranged between the ring-shaped liquid cooling shell and the cylindrical inner shell.

3. The heat sink for a planar thyristor according to claim 2, characterized in that The plurality of heat-conducting fins are uniformly distributed around the circumference of the cylindrical inner shell, and the phase change material is arranged between adjacent heat-conducting fins.

4. A heat sink for a plate-type thyristor according to any one of claims 1-3, characterized in that The phase change material fills the gap between the ring-shaped liquid cooling shell and the cylindrical inner shell.

5. A heat sink for a thyristor of the plate type according to claim 2 or 3, characterized in that, The two ends of the heat-conducting fins are respectively connected to the inner wall of the ring-shaped liquid cooling shell and the outer wall of the cylindrical inner shell.

6. The heat sink for a plate-type thyristor according to claim 1, wherein The ring-shaped liquid cooling shell is hollow, and the ring-shaped liquid cooling shell is respectively provided with a water inlet and a water outlet.

7. The heat sink for a plate-type thyristor according to claim 6, characterized in that, The water inlet and the water outlet are arranged at the lower end of the ring-shaped liquid cooling shell.

8. The heat sink for a plate-type thyristor according to claim 1, characterized in that, The phase change material is a paraffin / expanding graphite composite phase change material.

9. The heat sink for a plate-type thyristor according to claim 2, characterized in that, The height of the cylindrical inner shell and the height of the heat-conducting fins are not higher than the height of the ring-shaped liquid cooling shell.

10. The heat sink for a plate-type thyristor according to claim 9, characterized in that, The inner diameter of the cylindrical inner shell is matched with the diameter of the plate-type thyristor, and the height of the cylindrical inner shell is matched with the height of the plate-type thyristor.

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