Power adapter with harmonic current suppression function

Abstract

The utility model relates to the technical field of power adapters, in particular to a power adapter with harmonic current suppression. According to the technical scheme, the power module is provided with a base and a top cover, the base is provided with an input interface and an output interface, the top end of the top cover is provided with a dustproof heat dissipation module, the dustproof heat dissipation module is composed of a film radiator, a fixing frame and a filter screen, the fixing frame is provided with a through hole, the bottom end of the filter screen is provided with a rubber column, and the rubber column is provided with a through hole. The filter screen is installed on the fixing frame in a limiting mode through mutual insertion of the rubber columns and the through holes, the fixing frame is installed on the top cover through adhesive, and the film radiator is located on the top cover and located in the fixing frame. The power adapter adopts a closed structure, the closed structure can prevent dust, moisture and other external environmental factors from entering the power module, corrosion or damage to internal components is reduced, heat can be uniformly transmitted to the radiator from a heating source through mediation of the vapor chamber, and the heat radiation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to power adapter technical field, concretely relates to a kind of power adapter with harmonic current suppression. BACKGROUND

[0002] The power adapter with harmonic current suppression is the power adapter that is reduced harmonic current generated by using specific circuit design or additional harmonic suppression device, and possibly simultaneously improve power factor.This kind of power adapter not only provides stable voltage and current output, but also can effectively reduce harmonic pollution, protect the safe operation of power grid and other electrical equipment.

[0003] Through retrieval, patent announcement No.CN105391272B discloses a heat dissipation type power adapter, although the device can open cover when charging, utilize heat dissipation fan to heat dissipation power adapter, when not working, cover cover, can effectively prevent dust, moisture and impurities from entering power adapter, affect the service life of power adapter, but the device needs air to flow in power adapter when using, therefore air is easy to bring dust into power adapter internal, power adapter can generate a large amount of heat when working, needs to discharge these heat through heat dissipation design to keep normal working temperature.The accumulation of dust can block heat dissipation channel, such as fin, fan blade etc., so that heat cannot be effectively dissipated, thereby making the temperature inside power adapter rise.Long time high temperature operation not only can accelerate the aging of electronic components, but also can cause overheat protection mechanism, lead to power adapter performance decline or even damage.And dust can contain conductive particles, such as metal fragments, small conductive substances in dust etc.After the accumulation of these particles in power adapter internal, potential short-circuit path can be formed by contacting the components on circuit board.Short circuit not only can cause the sudden failure of power adapter, but also can cause fire and other serious consequences. UTILITARIAN CONTENT

[0004] In view of the deficiencies of the prior art, the utility model provides a kind of power adapter with harmonic current suppression, solve the problems raised in background art.

[0005] The technical problems solved by the utility model are as follows:

[0006] A kind of power adapter with harmonic current suppression, including power module, the power module is equipped with base and top cover, input interface and output interface are equipped on the base;

[0007] The top end of the top cover is provided with a dustproof and heat dissipation module, the dustproof and heat dissipation module is composed of a film radiator, a fixing frame and a filter screen, a through hole is formed in the fixing frame, a rubber column is arranged at the bottom end of the filter screen, the filter screen is limitingly installed on the fixing frame through the mutual insertion of the rubber column and the through hole, the fixing frame is installed on the top cover through an adhesive, and the film radiator is located in the fixing frame on the top cover.

[0008] Based on the above technical scheme, the utility model further can make improvement as follows.

[0009] Further, the fixing frame is provided with notches on both sides, and the notches are clamped with the film radiator to further fix the film radiator.

[0010] The beneficial effects of the above further scheme are:

[0011] The notches provide additional fixing points for the film radiator, further increasing the stability of the radiator. Even when the equipment is vibrating or subjected to external impact, the film radiator can maintain a firm installation position, reducing the risk of loosening. Through the clamping of the notches and the film radiator, the fixing frame can evenly distribute mechanical stress on multiple contact points of the radiator, avoiding stress concentration caused by a single fixing point, thereby prolonging the service life of the radiator and the fixing frame.

[0012] Further, the top cover is inlaid with a uniform heating plate, and the uniform heating plate is evenly distributed on the top cover.

[0013] The beneficial effects of the above further scheme are:

[0014] The uniform heating plate is usually made of high thermal conductivity material and can quickly and effectively conduct heat from the heat generating components of the power module to a larger area. The uniform distribution of the uniform heating plate on the top cover allows heat to spread quickly, avoiding local overheating and improving overall heat dissipation efficiency. Due to the uniform distribution of the uniform heating plate, heat can be more evenly transferred to the film radiator. This design ensures that every part of the film radiator can participate in heat dissipation, maximizing the role of the radiator and improving the cooling effect of the equipment. The uniform distribution of the uniform heating plate can reduce the temperature gradient on the surface and inside the top cover, preventing uneven temperature from causing material expansion or stress concentration, thereby improving the reliability and life of the equipment.

[0015] Further, the position and size of the film radiator are adapted to the position and size of the uniform heating plate.

[0016] The beneficial effects of the above further scheme are:

[0017] The position and size of the thin film heat sink are matched with the vapor chamber, ensuring that the heat transferred by the vapor chamber can be directly and efficiently conducted to the thin film heat sink. This precise matching reduces heat loss during conduction and improves overall heat dissipation efficiency. The thin film heat sink is usually made of high-thermal-conductivity materials such as copper, aluminum, or special thermal conductivity composite materials, which can quickly conduct heat from the heat-generating components. The high thermal conductivity of the material ensures that heat can be effectively conducted from the heat source to the surface of the heat sink. The thin film heat sink uses micro air flow technology to generate micro air flows through the vibration or other means of the thin film surface. These air flows can carry away the heat emitted from the surface of the thin film, forming local convection, thereby improving the heat dissipation efficiency. The micro air flows can form vortexes, further enhancing the heat dissipation effect. Due to the strong heat exchange capacity of the air flow, these micro air flows can carry away heat from the surface of the heat sink, allowing the heat sink to dissipate heat more efficiently.

[0018] Further, a limiting plugboard and buckle are arranged below the top cover, and the top cover is mutually spliced with the base through the limiting plugboard and buckle, and then fixed by screw locking.

[0019] The beneficial effects of adopting the above further scheme are:

[0020] The fixing mode combining the limiting plugboard and buckle with screw locking can effectively enhance the stable connection between the top cover and the base. This multiple fixing mechanism prevents the components from loosening due to vibration or impact during use, ensuring the stability and reliability of the equipment. The limiting plugboard and buckle design simplifies the docking process of the top cover and the base, and only needs to align the top cover and the base during installation, and then completes the locking through the screw. This design reduces the complexity and time of installation, improving production efficiency. When maintenance or replacement of components is required, users can easily separate the top cover and the base by disassembling the screws and buckles, facilitating quick and convenient maintenance or replacement operations.

[0021] Further, the power module is of a closed structure, and the heat in the power module is conducted to the thin film heat sink through the vapor chamber.

[0022] The beneficial effects of adopting the above further scheme are:

[0023] The enclosed structure can prevent external environmental factors such as dust and moisture from entering the power module, reducing corrosion or damage to internal components. At the same time, the design of the heat spreader helps maintain the device at a suitable operating temperature, improving the reliability and stability of the device. The enclosed power module can effectively isolate the external environment, thereby reducing the impact of external factors on internal components. At the same time, the enclosed design prevents the direct dissipation of heat, allowing the heat to be concentrated and conducted to the heat spreader for effective management. The heat spreader has good thermal conductivity and can evenly distribute the heat generated in the power module to the thin film heat sink. Through the mediation of the heat spreader, heat can be evenly transferred from the heat source to the radiator, improving the heat dissipation efficiency.

[0024] Furthermore, the upper end surface of the fixing frame is a curved surface, and the filter screen is in contact with the upper end surface of the fixing frame.

[0025] The beneficial effects of adopting the above further scheme are:

[0026] The curved surface design effectively guides airflow, reducing resistance as air passes through the mounting bracket and filter. This design helps improve airflow flow, thereby enhancing heat dissipation. The curved shape distributes airflow more evenly across the entire filter surface, preventing airflow from concentrating in certain areas and ensuring even heat dispersion across the filter surface. The curved design of the upper end surface of the mounting bracket ensures closer contact between the filter and the mounting bracket, optimizing the heat transfer path and improving heat dissipation efficiency. Heat is more effectively transferred from the filter to the mounting bracket and then to the radiator, enhancing overall heat dissipation performance.

[0027] The utility model provides a power adapter with harmonic current suppression.

[0028] Beneficial effects:

[0029] This adapter features a thin-film heat sink installed on the top cover, combined with a vapor chamber, to effectively improve heat dissipation efficiency. The vapor chamber evenly transfers internal heat to the thin-film heat sink, rapidly reducing the temperature inside the power module. This design improves the adapter's thermal management performance and extends its lifespan, making it particularly suitable for the cooling needs of high-power electronic devices.

[0030] The top cover and base are connected by limit plates and clips, and then fixed with screws to ensure the stability of the overall structure. This modular design facilitates assembly and maintenance, allowing users to quickly disassemble and install, reducing maintenance costs.

[0031] The dust-proof heat dissipation module on the top cover integrates a filter, which is secured to the mounting bracket via rubber posts to ensure dust protection. The filter effectively blocks external dust from entering the adapter, maintaining efficient cooling and extending the life of the device.

[0032] The thin film radiator is clamped in the fixing frame and cooperates with the notches, further enhancing the fixing of the radiator, avoiding displacement or loosening due to vibration or impact during operation of the equipment, and ensuring long-term stable heat dissipation performance.

[0033] The adapter adopts a closed structure design and realizes efficient heat dissipation in limited space through close cooperation of the thin film radiator and the heat plate, while ensuring compact structure of the adapter, and is suitable for various miniaturized electronic equipment. BRIEF DESCRIPTION OF DRAWINGS

[0034] The accompanying drawings, which are included to provide a further understanding of the present application and constitute a part of this application, illustrate certain illustrative embodiments of the present application and together with the description serve to explain the present application.

[0035] In the drawings:

[0036] Fig. 1 It is an appearance schematic view of the present application;

[0037] Fig. 2 It is an appearance schematic view of the power module of the present application;

[0038] Fig. 3 It is an appearance schematic view of the top cover of the present application;

[0039] Fig. 4 It is an appearance schematic view of the fixing frame of the present application.

[0040] In the drawings, the component list represented by each number is as follows:

[0041] 1, dustproof heat dissipation module; 101, thin film radiator; 102, fixing frame; 103, notch; 104, through hole; 105, rubber column; 106, filter screen; 2, power module; 201, input interface; 202, output interface; 203, base; 204, top cover; 205, heat plate; 206, limiting plugboard; 207, buckle. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0043] Please refer to Figs. 1 to 4 The embodiments provided by the present application are shown in the drawings:

[0044] Embodiment One

[0045] A power adapter with harmonic current suppression includes a power module 2, which is provided with a base 203 and a top cover 204. Below the top cover 204, there are limiting plugs 206 and buckles 207. The top cover 204 is connected to the base 203 through the limiting plugs 206 and buckles 207, and then fixed by screws. The combination of limiting plugs 206, buckles 207 and screw fixation can effectively enhance the stable connection between the top cover 204 and the base 203. This multiple fixation mechanism prevents the components from loosening due to vibration or impact during use, ensuring the stability and reliability of the equipment. The design of limiting plugs 206 and buckles 207 simplifies the docking process of the top cover 204 and the base 203. During installation, the user only needs to align the top cover 204 and the base 203, and then complete the installation by screwing. This design reduces the complexity and time of installation, improving production efficiency. When maintenance or component replacement is needed, the user can easily separate the top cover 204 and the base 203 by removing the screws and buckles 207, making it convenient and efficient to perform maintenance or replacement operations. The base 203 is provided with input and output interfaces 201 and 202.

[0046] Embodiment Two

[0047] In order to dissipate heat from the fully enclosed power module 2, for example, Figs. 1 to 4As shown, the application also includes: the top end of the top cover 204 is installed with a dustproof heat dissipation module 1, which is composed of a thin film radiator 101, a fixing frame 102 and a filter screen 106, the fixing frame 102 is provided with a through hole 104, the bottom end of the filter screen 106 is provided with a rubber column 105, and the filter screen 106 is limitingly installed on the fixing frame 102 through the mutual insertion of the rubber column 105 and the through hole 104, the upper end surface of the fixing frame 102 is arc-shaped, and the filter screen 106 is attached to the upper end surface of the fixing frame 102, the arc-shaped design can effectively guide the flow of air and reduce the resistance of air when passing through the fixing frame 102 and the filter screen 106. This design helps to improve the smoothness of airflow, thereby enhancing the heat dissipation effect. The arc-shaped shape of the upper end surface of the fixing frame 102 can make the filter screen 106 contact the fixing frame 102 more closely, thereby optimizing the heat conduction path and improving the heat dissipation efficiency. Heat can be more effectively conducted from the filter screen 106 to the fixing frame 102, and then to the radiator, enhancing the overall heat dissipation performance. The fixing frame 102 is installed on the top cover 204 through an adhesive, and the top cover 204 is inlaid with a heat spreader 205, which is uniformly distributed on the top cover 204. The heat spreader 205 is usually made of high thermal conductivity material, which can quickly and effectively conduct heat from the heat generating components of the power module 2 to a wider area. The uniform distribution of the heat spreader 205 on the top cover 204 allows heat to spread rapidly, avoiding local overheating and improving overall heat dissipation efficiency. Due to the uniform distribution of the heat spreader 205, heat can be more evenly transferred to the thin film radiator 101. This design ensures that every part of the thin film radiator 101 can fully participate in heat dissipation, maximizing the role of the radiator and improving the cooling effect of the device. The uniform distribution of the heat spreader 205 also reduces the temperature gradient on the surface and inside the top cover 204, preventing material expansion or thermal stress concentration caused by uneven temperature, improving the reliability and service life of the device. The power module 2 is of a closed structure, and the heat in the power module 2 is conducted to the thin film radiator 101 through the heat spreader 205. The closed structure can prevent dust, moisture and other external environmental factors from entering the power module 2, reducing corrosion or damage to internal components. At the same time, the design of the heat spreader 205 helps to maintain the device at an appropriate working temperature, improving the reliability and stability of the device. The closed power module 2 can effectively isolate the external environment, thereby reducing the influence of external factors on internal components. At the same time, the closed design prevents direct heat dissipation, allowing heat to be concentrated and conducted to the heat spreader 205 for effective management. The heat spreader 205 has good heat conduction performance and can evenly distribute the heat generated in the power module 2 to the thin film radiator 101.Through the mediation of the heat plate 205, heat can be evenly transferred from the heat source to the heat sink, improving the heat dissipation efficiency. The position and size of the thin film heat sink 101 are matched with the position and size of the heat plate 205, and the position and size of the thin film heat sink 101 are matched with the heat plate 205, which ensures that the heat transferred by the heat plate 205 can be directly and efficiently conducted to the thin film heat sink 101. This precise matching reduces the loss of heat during the conduction process and improves the overall heat dissipation efficiency. The thin film heat sink 101 usually uses high-thermal-conductivity materials such as copper, aluminum, or special thermal-conductivity composite materials, which can quickly conduct heat away from the heat-generating components. The high thermal conductivity of the material ensures that heat can be effectively conducted from the heat source to the surface of the heat sink. The thin film heat sink 101 uses micro air flow technology to generate micro air flow through the vibration of the thin film surface or other means. These air flows can carry away the heat emitted from the surface of the thin film, forming a local convection, thereby improving the heat dissipation efficiency. The micro air flow can form a vortex, further enhancing the heat dissipation effect. Due to the strong heat exchange capacity of the air flow, these micro air flows can carry away the heat from the surface of the heat sink, making the heat sink more efficient in heat dissipation. The thin film heat sink 101 is located in the fixed frame 102 on the top cover 204, and the fixed frame 102 has notches 103 on both sides, which are engaged with the thin film heat sink 101, further fixing the thin film heat sink 101. The design of the notches 103 provides additional fixing points for the thin film heat sink 101, further enhancing the stability of the heat sink. Even in the case of device vibration or external force impact, the thin film heat sink 101 can still be stably installed in place, reducing the risk of loosening. Through the engagement of the notches 103 and the thin film heat sink 101, the fixed frame 102 can evenly distribute mechanical stress on multiple contact points of the heat sink, avoiding stress concentration phenomenon caused by a single fixing point, thereby prolonging the service life of the heat sink and the fixed frame 102.

[0048] It should be noted that the thin film heat sink 101 for heat dissipation is a commercially available product, which is prior art. The working principle and internal structure of the thin film heat sink 101 have been disclosed in patent number TW109139198, and are known to those skilled in the art. The present utility model only utilizes the functions of the above-mentioned components and does not improve the internal structure, therefore, it will not be described in detail here.

[0049] Working principle:

[0050] When the power module 2 is working, the power adapter is equipped with a harmonic detection circuit inside, which can monitor the harmonic components in the output current of the power module 2 in real time. By sampling the input current and voltage waveform, the non-sinusoidal components in the current or voltage are detected, and the type and amplitude of the harmonic are determined. Once the harmonic current is detected, the active filter in the power adapter will generate a compensation current with the same frequency as the harmonic current but opposite phase. This compensation current is injected into the power output to offset the harmonic current, making the output current waveform closer to a sinusoidal wave.

[0051] When the power module 2 is working, the internal electronic components will generate heat. If this heat is not dissipated in time, it may cause the power module 2 to overheat, affecting its performance or causing failure. To solve the heat problem, the heat inside the power module 2 is first distributed by the heat plate 205. The heat plate 205 is inlaid on the top cover 204 and evenly distributed on the surface of the top cover 204, so that the heat can be evenly conducted to each part of the top cover 204.

[0052] The heat plate 205 transmits heat to the thin film radiator 101 in contact with it. The thin film radiator 101 is a heat dissipation device based on micro air flow technology, which quickly removes heat from its surface through air vortex generated by micro vibration. The thin film radiator 101 is installed inside the dustproof heat dissipation module 1 of the top cover 204, inside the fixed frame 102. The thin film radiator 101 effectively dissipates the heat transmitted from the heat plate 205 to the surrounding environment through the micro air flow generated on its surface, preventing the temperature of the power module 2 from being too high.

[0053] The dustproof heat dissipation module 1 not only dissipates heat, but also prevents dust from entering the inside of the thin film radiator 101 through the filter screen 106. The filter screen 106 is installed on the fixed frame 102 through the rubber column 105, and the arc design of the fixed frame 102 fits the filter screen 106, ensuring smooth air flow while blocking external dust. When it is necessary to clean the filter screen 106, the user can easily take out the filter screen 106 for cleaning or replacement, thereby ensuring the long-term reliable operation of the power adapter.

[0054] The top cover 204 is spliced with the base 203 through the limiting plugboard 206 and the buckle 207, and then locked and fixed by screws. The thin film radiator 101 is interlocked with the fixed frame 102 through the slot 103, and the fixed frame 102 is installed on the top cover 204 through an adhesive. This multiple fixing design ensures the stability of the adapter structure and prevents any component from loosening due to vibration or external force. Through the coordinated work of the heat plate 205, the thin film radiator 101 and the dustproof module, the heat can be continuously and effectively managed, avoiding the influence of overheating on the performance of the power module 2.

[0055] The basic principle and main features of the present application and the advantages of the present application are shown and described above. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.

[0056] In addition, it should be understood that, although the present application is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A power adapter with harmonic current suppression, comprising a power module (2), the power module (2) is provided with a base (203) and a top cover (204), the base (203) is provided with an input interface (201) and an output interface (202), characterized in that: a dustproof and heat dissipation module (1) is mounted at the top end of the top cover (204), the dustproof and heat dissipation module (1) is composed of a thin film radiator (101), a fixing frame (102) and a filter screen (106), a through hole (104) is formed in the fixing frame (102), the bottom end of the filter screen (106) is provided with a rubber column (105), the filter screen (106) is limitingly installed on the fixing frame (102) by being inserted into the through hole (104) through the rubber column (105), the fixing frame (102) is installed on the top cover (204) by an adhesive, and the thin film radiator (101) is located in the fixing frame (102) on the top cover (204).

2. A power adapter with harmonic current suppression as defined in claim 1, wherein: Grooves (103) are formed in the two sides of the fixing frame (102), the grooves (103) and the thin film radiator (101) are clamped with each other, and the thin film radiator (101) is further fixed.

3. The power adapter with harmonic current suppression of claim 1, wherein: A uniform heating plate (205) is inlaid on the top cover (204), and the uniform heating plate (205) is uniformly distributed on the top cover (204).

4. The power adapter with harmonic current suppression of claim 2, wherein: The position and size of the thin film radiator (101) are adapted to the position and size of the uniform heating plate (205).

5. The power adapter with harmonic current suppression of claim 3, wherein: A limiting plug-in plate (206) and a buckle (207) are arranged below the top cover (204), the top cover (204) is spliced with the base (203) through the limiting plug-in plate (206) and the buckle (207), and then is fixed by screw locking.

6. The power adapter with harmonic current suppression of claim 1, wherein: The power module (2) is of a closed structure, and the heat in the power module (2) is conducted to the thin film radiator (101) through the uniform heating plate (205).

7. The power adapter with harmonic current suppression of claim 1, wherein: The upper end surface of the fixing frame (102) is a curved surface, and the filter screen (106) is attached to the upper end surface of the fixing frame (102).

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