Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which comprises a base, a sliding plate, a driving piece, a limiting frame, a sliding seat and a fan. A receding groove is formed in one side of the base. The sliding plate is in sliding connection with the receding groove. The driving piece is arranged on the outer side of the base and used for driving the sliding plate to enter and exit from the base; the limiting frame is mounted on the sliding plate; the sliding seat is in sliding connection with one side of the outer wall of the base, and the sliding seat can extend out of the base; and the fan is arranged on the sliding seat and points to the top end of the limiting frame. The base, the sliding plate, the limiting frame and the fan are arranged to form an open type heat dissipation structure, and the heat dissipation efficiency can be effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to welding equipment technical field, concretely relates to a heat dissipation device. BACKGROUND

[0002] PCB board is the support body of electronic components, and the heat dissipation fan on the heating box needs to be turned on after the PCB board is heated to cool down. The utility model patent with publication number CN216391572U discloses a kind of PCB board reflow soldering accelerated heat dissipation device, and it constructs heat dissipation structure by setting recess and fan;Specifically, the ice water cool air in the recess is transported to the upper of fan by fan and realizes circulation reflux, to improve cooling efficiency.

[0003] But the temperature of ice water in the above heat dissipation structure will continue to rise, and the continuous occurrence of heat exchange and heat transfer will weaken the cooling effect, and since the PCB board is always located in the heating box, the heat gathering effect around the PCB is strong, that is, the overall heat dissipation efficiency is still not high. UTILITY MODEL CONTENT

[0004] The utility model aims at overcoming the above technical deficiencies, and proposes a kind of heat dissipation device, to solve the technical problems that the heat around PCB is gathered and the ice water is in the state of loss at low temperature in prior art, and then the overall heat dissipation efficiency is still not high.

[0005] To achieve the above technical purpose, the utility model takes the following technical scheme:

[0006] The utility model provides a kind of heat dissipation device, including base, sliding plate, driving part, limit frame, sliding seat and fan;The side of the base is provided with let slot;The sliding plate is connected with the let slot slidingly;The driving part is located on the outside of the base and is used to drive the sliding plate to enter and exit the base;The limit frame is installed on the sliding plate;The sliding seat is connected with the outer wall side of the base slidingly, and the sliding seat can extend out of the base;The fan is located on the sliding seat and is directed to the top end of the limit frame.

[0007] In some embodiments, the two sides of the sliding plate away from each other are provided with sliding blocks, and the opposite inner walls of the let slot are provided with sliding grooves corresponding to the sliding blocks, and the sliding grooves are matched with the sliding blocks.

[0008] In some embodiments, the limit frame includes a base and a support plate, the bottom end of the base is fixedly connected with the top end of the sliding plate, the top end of the base is fixedly connected with the bottom end of the support plate, a square groove is formed in the support plate, and a plurality of heat dissipation holes are formed in the square groove.

[0009] In some embodiments, the heat dissipation holes are distributed in a matrix.

[0010] In some embodiments, the diameter of the heat dissipation hole is at least 5mm.

[0011] In some embodiments, the two inner walls of the square groove are symmetrically distributed with a clamping strip at the lower part.

[0012] In some embodiments, the limiting frame is provided with at least three.

[0013] In some embodiments, the sliding seat is provided with an extension table, and the fan is arranged on the extension table.

[0014] In some embodiments, the extension table comprises at least three extension segments, and each adjacent extension segment is sleeved from bottom to top.

[0015] In some embodiments, the driving member is a double-shaft air cylinder.

[0016] Compared with the prior art, the heat dissipation device provided by the utility model constructs an open heat dissipation structure through the setting of the base, the sliding plate, the limiting frame and the fan; specifically, the base is installed at the bottom of the heating device, and when the PCB needs to dissipate heat, the sliding plate is slid out, so as to drive the PCB on the limiting frame to be exposed to the outside world, so that the heat of the PCB and the surrounding heat can be rapidly dissipated; further, the fan directly points to the limiting frame, so that the PCB can be directly and comprehensively cooled, and the overall cooling efficiency is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic view of a heat dissipation device provided by the utility model embodiment;

[0018] Figure 2 is Figure 1 is an enlarged schematic view of A in FIG. 4;

[0019] Figure 3 is Figure 1 is a structural schematic view of the base.

[0020] MARKS OF THE DRAWINGS:

[0021] 100, base; 110, let go slot; 111, sliding groove; 200, sliding plate; 210, sliding block; 300, driving member; 310, double-shaft air cylinder; 400, limiting frame; 410, bottom plate; 420, support plate; 421, square groove; 422, heat dissipation hole; 430, clamping strip; 500, sliding seat; 600, fan; 700, extension table; 710, extension segment. DETAILED DESCRIPTION

[0022] In order to make the utility model purposes, technical solutions and advantages more clearly, the following will be further described in detail with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.

[0023] In order to solve the technical problems of low overall heat dissipation efficiency caused by heat accumulation around the PCB and ice water low temperature, the utility model provides a heat dissipation device, which can improve the overall heat dissipation efficiency.

[0024] It should be noted that the heat dissipation device is used for but not limited to PCB heat dissipation, in order to facilitate the description, in the utility model, only the heat dissipation device is applied to the PCB heat dissipation equipment as an example for description, and the principle of the heat dissipation device applied to other types of equipment is substantially the same as that applied to the PCB heat dissipation equipment, which will not be described here.

[0025] Please refer to Figure 1 - Figure 3 , wherein Figure 1 is a structural diagram of a heat dissipation device in an embodiment of the utility model, a heat dissipation device, comprising a base 100, a sliding plate 200, a driving part 300, a limiting frame 400, a sliding seat 500 and a fan 600;The base 100 is provided with a let go slot 110 on one side;The sliding plate 200 is slidably connected with the let go slot 110;The driving part 300 is arranged on the outer side of the base 100 and is used to drive the sliding plate 200 to enter and exit the base 100;The limiting frame 400 is installed on the sliding plate 200;The sliding seat 500 is slidably connected with one side of the outer wall of the base 100, and the sliding seat 500 can extend out of the base 100;The fan 600 is arranged on the sliding seat 500 and points to the top end of the limiting frame 400.

[0026] In the embodiment, the base 100, the sliding plate 200, the limiting frame 400 and the fan 600 are arranged to form an open heat dissipation structure;Specifically, the base 100 is installed at the bottom of the heating device, and when the PCB needs to be cooled, the sliding plate 200 is slid out, so as to drive the PCB on the limiting frame 400 to be exposed to the outside, so that the heat of the PCB and the surrounding heat can be quickly dissipated;Further, the fan 600 directly points to the limiting frame 400, which can cool the PCB in all directions and more directly, effectively improving the overall heat dissipation efficiency.

[0027] In one of the embodiments, please refer to Figure 1 , the two sides of the sliding plate 200 are provided with sliding blocks 210, and the opposite inner walls of the let go slot 110 are provided with sliding grooves 111 correspondingly, and the sliding grooves 111 are matched with the sliding blocks 210.

[0028] In one of the embodiments, please refer toFigure 1 The limiting frame 400 comprises a bottom plate 410 and a support plate 420, the bottom end of the bottom plate 410 is fixedly connected with the top end of the sliding plate 200, the top end of the bottom plate 410 is fixedly connected with the bottom end of the support plate 420, the support plate 420 is provided with a square groove 421, and a plurality of heat dissipation holes 422 are formed in the square groove 421.

[0029] In the embodiment, the heat dissipation holes 422 can make the heat at the bottom end of the PCB board dissipate rapidly, which is beneficial to improving the heat dissipation efficiency.

[0030] In one of the embodiments, referring to Figure 1 The heat dissipation holes 422 are arranged in a matrix.

[0031] In the embodiment, the matrix arrangement of the heat dissipation holes 422 is helpful to uniformly dissipating the heat at each part of the PCB board.

[0032] In one of the embodiments, referring to Figure 1 The diameter of the heat dissipation holes 422 is at least 5 mm.

[0033] In the embodiment, the diameter of the heat dissipation holes 422 is set to help ensure good heat dissipation.

[0034] In one of the embodiments, referring to Figure 1 The two inner walls of the square groove 421 are symmetrically provided with clamping strips 430 at the lower part.

[0035] In the embodiment, the clamping strips 430 are used to clamp the two sides of the PCB board which are opposite to each other, so as to avoid easy movement of the PCB.

[0036] In one of the embodiments, referring to Figure 1 The limiting frame 400 is provided with at least three.

[0037] In the embodiment, the limiting frame 400 is provided with at least three, which is convenient for simultaneously fixing and heating and welding multiple PCB boards.

[0038] In one of the embodiments, referring to Figure 1 The telescopic table 700 is installed on the sliding seat 500, and the fan 600 is arranged on the telescopic table 700.

[0039] In the embodiment, the telescopic table 700 can make the fan 600 be at different heights and blow air to the PCB board from different angles.

[0040] In one of the embodiments, referring to Figure 1 The telescopic table 700 comprises at least three telescopic segments 710, and each adjacent telescopic segment 710 is sleeved from bottom to top.

[0041] In the embodiment, each adjacent telescopic section 710 is sleeved from bottom to top with a height adjusting aid of the telescopic table 700.

[0042] In one of the embodiments, referring to Figure 1 The driving member 300 is a double-shaft air cylinder 310.

[0043] For better understanding of the utility model, the following will be combined with Figures 1 to 3 The technical scheme of the utility model will be described in detail:

[0044] First, the PCB is clamped on the clamping strip 430; then, the base 100 is fixedly installed on the bottom of the heating device; then, after heating, the sliding plate 200 is driven by the driving member 300 to extend out of the base 100, so that the PCB and the limiting frame 400 are completely exposed to the outside; then, the sliding seat 500 is slid to the corresponding position and the fan 600 blows the PCB directly; since the PCB is directly contacted with the outside, the open space radiates faster, and since the design of the heat dissipation hole 422, the heat at the bottom end of the PCB can be quickly dissipated under the action of the fan 600, and the overall heat dissipation efficiency is effectively improved. It should be pointed out that the installation of the base 100 is equivalent to replacing the original bottom plate of the heating device, and the installation and use of the base 100 are not in conflict with the use of the heating device, that is, according to the process requirements, the displacement, hole opening and sealing treatment can be carried out.

[0045] The specific embodiments of the utility model above do not constitute a limitation on the protection scope of the utility model. Any various other corresponding changes and modifications made according to the technical concept of the utility model should be included in the protection scope of the utility model claims.

Claims

1. A heat dissipating device, characterized by, Include: The base, one side of the base is provided with a let slot; Slide, the slide is in sliding connection with the let slot; Driving element, the driving element is provided outside the base and is used for driving the slide in and out of the base; Limiting frame, the limiting frame is installed on the slide; Slide seat, the slide seat is in sliding connection with one side of the outer wall of the base, and the slide seat can extend out of the base; and Fan, the fan is provided on the slide seat and points to the top end of the limiting frame.

2. A heat dissipating device according to claim 1, wherein The slide plate is provided with a sliding block on the two sides away from each other, and the opposite inner walls of the let slot are provided with a sliding groove corresponding to each other, and the sliding groove is matched with the sliding block.

3. The heat dissipating device of claim 1, wherein The limiting frame includes a base and a support plate, the bottom end of the base is fixedly connected with the top end of the slide plate, the top end of the base is fixedly connected with the bottom end of the support plate, a square groove is formed in the support plate, and a plurality of heat dissipation holes are formed in the square groove.

4. A heat dissipating device according to claim 3, wherein The heat dissipation holes are distributed in a matrix.

5. The heat dissipating device of claim 3, wherein The diameter of the heat dissipation hole is at least 5mm.

6. The heat dissipating device of claim 3, wherein The lower part of the two inner walls of the square groove is symmetrically distributed with a clamping strip.

7. The heat dissipating device of claim 1, wherein The limiting frame is provided with at least three.

8. The heat dissipating device of claim 1, wherein The slide seat is provided with a telescopic table, and the fan is provided on the telescopic table.

9. A heat dissipating device according to claim 8, wherein The telescopic table includes at least three telescopic segments, and each adjacent telescopic segment is sleeved from bottom to top.

10. The heat dissipating device of claim 1, wherein The driving element is a double shaft air cylinder.

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