Heat dissipation structure for electronic product
By driving the fan blade group and adjustment mechanism through a motor, the heat dissipation mode is adjusted according to the power changes of the electronic products, solving the problem that the traditional heat dissipation method is limited by external temperature and power, and achieving efficient heat dissipation effect.
Patent Information
- Application Number
- CN202422654857.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-01
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-11-01
AI Technical Summary
Traditional heat dissipation methods rely on natural heat dissipation. When the outside air temperature is high, the heat dissipation effect is reduced, and it cannot be adjusted according to the power used by electronic products, affecting the heat dissipation effect and usage efficiency.
A motor is used to drive the fan blades to rotate and agitate the air flow, and the heat dissipation mode is adjusted through an adjustment mechanism. The heat dissipation method is adjusted according to the power used by the electronic product, and the heat dissipation fins and ventilation holes are combined to improve the heat dissipation efficiency.
It realizes automatic adjustment of the heat dissipation mode according to the power changes of electronic products, improves the heat dissipation efficiency and effect, and enhances the heat dissipation performance under different ambient temperatures.
Smart Images
Figure CN223472465U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation mechanism technical field, specifically is a heat dissipation structure for electronic product. BACKGROUND
[0002] The internal control unit and control panel of electronic product will heat up because of long time use when using, and the heat treatment will affect the use efficiency of electronic product, and the traditional heat dissipation mode is fixed in the heating part through the heat dissipation connecting seat, and the natural heat dissipation is carried out through the heat dissipation fin and air contact.
[0003] However, the traditional heat dissipation mode can only be heat dissipated in the natural state, and when the outside air is hot, the heat dissipation effect will be affected, and the internal heat dissipation effect is reduced, which affects the use of electronic product, and the traditional heat dissipation effect cannot be adjusted and changed according to the use power of electronic product. UTILITY MODEL CONTENT
[0004] In view of the deficiencies of the prior art, the utility model provides a heat dissipation structure for electronic product, which solves the problems in the background art.
[0005] To achieve the above object, the utility model realizes the following technical scheme: a heat dissipation structure for electronic product, including heat dissipation connecting seat and the heat dissipation fin fixed on the upper end of heat dissipation connecting seat, the heat dissipation fin is set up with the placing groove from top to bottom, the motor is fixed in the heat dissipation connecting seat, the output end of motor is fixed with the fan blade group, the outside of fan blade group is provided with fixed frame, the fixed frame is fixedly connected in the placing groove, the upper end of fixed frame is provided with adjusting mechanism, the side surface of heat dissipation connecting seat is fixed with electric telescopic rod, the output end of electric telescopic rod is fixed with drive mechanism, drive mechanism is matched with adjusting mechanism and is connected, electric telescopic rod is externally controlled by controller.
[0006] Further, the adjusting mechanism comprises: an end cover fixedly arranged at the upper end of the fixed frame, a plurality of heat dissipation holes are formed in the end cover, a rotating cover is rotatably connected to the outer end of the fixed frame, a plurality of waist-shaped holes are formed in the rotating cover, and the positions of the waist-shaped holes are matched with the positions of the heat dissipation holes; and a guide rod fixedly arranged at the upper end of the rotating cover, wherein the guide rod is in a meandering shape.
[0007] Further, the drive mechanism comprises: a connecting block fixedly arranged at the output end of the electric telescopic rod, a clamping rod rotatably connected to the upper end of the connecting block, and the end portion of the clamping rod is in a ring shape and is connected with the guide rod.
[0008] Further, the upper end portion of the heat dissipation fin is fixedly connected with an enclosing plate, and the enclosing plate is integrally formed with the heat dissipation fin.
[0009] Further, the side surface of the heat dissipation fin is provided with a plurality of ventilation holes arranged at equal intervals.
[0010] Further, the gap between the heat dissipation fins is arranged in communication with the ventilation holes.
[0011] With respect to the above background, the heat dissipation structure for electronic products provided by the present application comprises a heat dissipation mechanism which is very mature at present, and an adjusting mechanism and a driving mechanism as core components, and the principle thereof relies on rotating the fan blade group by the motor to drive the internal air flow, and adjusting the heat dissipation mode by the adjusting mechanism, adjusting the corresponding heat dissipation mode according to the use power of the electronic product, and thus improving the internal heat dissipation effect.
[0012] The utility model provides a kind of heat dissipation structure for electronic products.Compared with prior art, it has the following beneficial effects:
[0013] The heat dissipation structure for electronic products;By setting adjusting mechanism and driving mechanism, fan blade group is rotated by motor to make internal air flow heat dissipation, and two heat dissipation modes are provided by adjusting mechanism, to improve the internal heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is the overall structure diagram of the utility model;
[0015] Figure 2 It is the structure diagram of the utility model driving mechanism and adjusting mechanism;
[0016] Figure 3 It is the structure diagram of the utility model adjusting mechanism unfolding;
[0017] Figure 4 It is the structure diagram of the utility model fan blade group and motor;
[0018] Figure 5 It is the structure diagram of the utility model heat dissipation fin and ventilation hole.
[0019] In the figure: 1, heat dissipation connecting seat;2, heat dissipation fin;3, placing groove;4, fixed frame;5, motor;6, fan blade group;7, end cover;8, heat dissipation hole;9, rotating cover;10, waist type hole;11, guide rod;12, electric telescopic rod;13, connecting block;14, clamping rod;15, sealing plate;16, ventilation hole. DETAILED DESCRIPTION
[0020] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0021] Please refer to Figures 1-5 The present application provides a technical solution: a heat dissipation structure for electronic products, comprising a heat dissipation connecting seat 1 and a heat dissipation fin 2 fixed on the upper end of the heat dissipation connecting seat 1, the heat dissipation fin 2 is provided with a placing groove 3 from top to bottom, a motor 5 is fixed in the heat dissipation connecting seat 1, a fan blade group 6 is fixed on the output end of the motor 5, a fixed frame 4 is arranged on the outer side of the fan blade group 6, the fixed frame 4 is fixedly connected in the placing groove 3, an adjusting mechanism is arranged on the upper end of the fixed frame 4, an electric telescopic rod 12 is fixed on the side surface of the heat dissipation connecting seat 1, a driving mechanism is fixed on the output end of the electric telescopic rod 12, the driving mechanism is matched and connected with the adjusting mechanism, the electric telescopic rod 12 is externally controlled by a controller; the heat dissipation connecting seat 1 is fixed on the heating position of the electronic product, the heat dissipation connecting seat 1 absorbs heat from the heating position of the electronic product, and then dissipates heat through the heat dissipation fin 2, compared with the traditional heat dissipation fin 2, the placing groove 3 is arranged in the middle position of the heat dissipation fin 2, the fixed frame 4 is fixed in the placing groove 3, the output end of the motor 5 fixed in the heat dissipation connecting seat 1 passes through the fixed frame 4, the fan blade group 6 is fixed on the output end of the motor 5 in the fixed frame 4, the fan blade group 6 is driven to rotate by the motor 5, the internal air flows when the fan blade group 6 rotates, the adjusting mechanism is fixed on the upper end of the fixed frame 4, and the adjusting mechanism is matched and connected with the driving mechanism, the adjusting mechanism is adjusted by the electric telescopic rod 12, thereby changing the internal air flow state, improving the overall air flow, and improving the overall heat dissipation effect.
[0022] As Figure 3As shown, the adjusting mechanism comprises: an end cover 7 fixed on the upper end of the fixed frame 4, the end cover 7 is provided with a heat dissipation hole 8, the outer end of the fixed frame 4 is rotationally connected with a rotary cover 9, the rotary cover 9 is provided with a waist-shaped hole 10, and the waist-shaped hole 10 is matched with the heat dissipation hole 8; a guide rod 11 fixed on the upper end of the rotary cover 9, the guide rod 11 is provided in a meandering shape; the heat dissipation hole 8 on the end cover 7 is used for upwardly dissipating heat, and when the waist-shaped hole 10 on the rotary cover 9 is dislocated with the heat dissipation hole 8, dislocation sealing is realized, at this time, when the fan blade group 6 rotates, the internal air flows to both sides, at this time, the internal heat dissipation efficiency is better than that of the conventional natural heat dissipation, and when the waist-shaped hole 10 corresponds to the heat dissipation hole 8, the air flow at the upper end is increased, so that the heat absorbed in the internal is dissipated, and the internal heat dissipation of the heat dissipation connector base 1 is improved, so that two heat dissipation blocks are arranged, and the use power of the electronic product is changed, and the specific change is that the guide rod 11 on the outer end of the rotary cover 9 is driven to rotate.
[0023] As shown in the figure, Figure 2 The driving mechanism comprises: a connecting block 13 fixed to the output end of the electric telescopic rod 12, the upper end of the connecting block 13 is rotationally connected with a clamping rod 14, the end of the clamping rod 14 is provided in a ring shape and is connected with the guide rod 11 in a sleeved manner; the connecting block 13 moves with the driving of the electric telescopic rod 12, the connecting block 13 drives the rotatable clamping rod 14 to drive the guide rod 11 to move, the upper end of the clamping rod 14 is connected with the guide rod 11 in a sleeved manner, and the farthest end of the electric telescopic rod 12 corresponds to the closing of the waist-shaped hole 10 and the heat dissipation hole 8, and the bottommost end of the electric telescopic rod 12 corresponds to the opening of the waist-shaped hole 10 and the heat dissipation hole 8.
[0024] As shown in the figure, Figure 5 The upper end of the heat dissipation fin 2 is fixedly connected with an enclosing plate 15, and the enclosing plate 15 is integrally formed with the heat dissipation fin 2; the upper end enclosing plate 15 can seal the air flow at the upper end as a whole, which can be beneficial to limiting the flow of internal air, thereby achieving better air heat dissipation effect, and the enclosing plate 15 is integrally formed with the heat dissipation fin 2, so that the same heat dissipation effect can be achieved.
[0025] As shown in the figure, Figure 5 The side surface of the heat dissipation fin 2 is provided with a plurality of ventilation holes 16, and the ventilation holes 16 are arranged at equal intervals, so that the area of the heat dissipation fin 2 in contact with air can be increased, thereby achieving better heat dissipation effect.
[0026] As shown in the figure, Figure 5 The gap between the heat dissipation fins 2 is communicated with the ventilation holes 16; the gap between the heat dissipation fins 2 and the ventilation holes 16 are communicated, which can improve the internal air flow in the static state, so that the electronic product can be quickly cooled by natural heat dissipation when the electronic product stops running.
[0027] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as above with a preferred embodiment, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the technical solution of the present application. Any simple modification, equivalent change and modification of the above embodiments made according to the technical essence of the present application still belong to the scope of the technical solution of the present application.
Claims
1. A heat dissipation structure for electronic products, comprising a heat dissipation connecting seat (1) and a heat dissipation fin (2) fixed on the upper end of the heat dissipation connecting seat (1), characterized in that, The heat dissipation fin (2) is provided with a placing groove (3) from top to bottom, the heat dissipation connecting base (1) is fixed with a motor (5), the output end of the motor (5) is fixed with a fan blade group (6), the outer side of the fan blade group (6) is provided with a fixed frame (4), the fixed frame (4) is fixedly connected with the placing groove (3), the upper end of the fixed frame (4) is provided with an adjusting mechanism, the side surface of the heat dissipation connecting base (1) is fixed with an electric telescopic rod (12), the output end of the electric telescopic rod (12) is fixed with a driving mechanism, the driving mechanism is matchedly connected with the adjusting mechanism, the electric telescopic rod (12) is externally controlled by a controller.
2. The heat dissipation structure for electronic products according to claim 1, wherein The adjusting mechanism comprises: An end cover (7) is fixed at the upper end of the fixed frame (4), the end cover (7) is provided with a heat dissipation hole (8), the outer side end of the fixed frame (4) is rotatably connected with a rotating cover (9), the rotating cover (9) is provided with a waist-shaped hole (10), the waist-shaped hole (10) is matchedly arranged with the heat dissipation hole (8); A guide rod (11) is fixed at the upper end of the rotating cover (9), the guide rod (11) is provided in a meandering shape.
3. The heat dissipation structure for electronic products according to claim 2, wherein The driving mechanism comprises: A connecting block (13) is fixed at the output end of the electric telescopic rod (12), the upper end of the connecting block (13) is rotatably connected with a clamping rod (14), the end of the clamping rod (14) is provided in a ring shape and is sleevedly connected with the guide rod (11).
4. The heat dissipation structure for electronic products according to claim 2, wherein The upper end of the heat dissipation fin (2) is fixedly connected with an enclosing plate (15), the enclosing plate (15) is integrally formed with the heat dissipation fin (2).
5. The heat dissipation structure for electronic products according to claim 2, wherein The side surface of the heat dissipation fin (2) is provided with a plurality of ventilation holes (16) arranged at equal intervals.
6. The heat dissipation structure for electronic products according to claim 2, wherein The gap between the heat dissipation fins (2) is communicated with the ventilation holes (16).