LED device and light-emitting device

Abstract

In order to solve the problem of non-uniformity of LED light emission in the prior art, the utility model provides an LED device and a light-emitting device, the LED device comprises a light-emitting chip, a packaging support, a packaging glue layer and an optical coating, the packaging support comprises a substrate and a frame, the frame is a light-transmitting piece, the packaging glue layer is arranged on the substrate, and the optical coating is arranged on the packaging glue layer. The frame surrounds the substrate to form a containing cavity with an opening in one end, the light-emitting chip is located in the containing cavity and connected to the substrate, and at least the periphery of the frame exceeding the surface, connected with the fixed light-emitting chip, of the substrate is an arc-shaped surface; the packaging adhesive layer is filled in the accommodating cavity, and the optical coating is arranged on one surface, deviating from the substrate, of the packaging adhesive layer. According to the LED device provided by the utility model, through the arrangement of the transparent arc-shaped frame and the optical coating, the light emitting uniformity of the LED device can be effectively improved, the light loss is reduced, and the light propagation path is optimized, so that a more uniform and efficient illumination effect can be provided when the LED device is applied to a light-emitting device.

Description

Technical Field

[0001] The utility model relates to the technical field of LED, in particular to an LED device and a lighting device. Background Art

[0002] Since the light energy mainly emits from above the chip, and the light energy around the chip is relatively low, resulting in uneven overall light output distribution. This unevenness will cause poor light交接 (it seems there is a wrong word here, maybe "junction") in practical applications, forming a "field" - shaped optical distribution, affecting the lighting effect. In addition, using a bracket with a square structure will cause light refraction and total reflection phenomena, further reducing the light energy around, limiting the light efficiency and irradiation range of the LED; the existing packaging process involves multiple steps, including using materials such as solder paste and silver glue to fix the chip, as well as the encapsulation and curing process of the fluorescent glue. These materials and complex process flows increase the production cost. Summary of the Utility Model<统一格式错误,应为 ,但按照要求保留 原样<统一格式错误,应为

[0003] ,但按照要求保留

[0003] 原样 The technical problem to be solved by the utility model is to provide an LED device and a lighting device for the problem of uneven light output of LED in the prior art.

[0004] On the one hand, the utility model provides an LED device, including a light - emitting chip, a packaging bracket, a packaging glue layer and an optical coating. The packaging bracket includes a substrate and a frame. The frame is a light - transmissive member. The frame surrounds the substrate to form a receiving cavity with one end open. The light - emitting chip is located in the receiving cavity and connected to the substrate. At least the outer periphery of the frame that fixes the surface of the light - emitting chip beyond the substrate is an arc surface.

[0005] The optical coating is arranged on the side of the packaging glue layer背离 (should be "opposite to") the substrate, and the outer periphery of the frame is an arc surface.

[0006] Optionally, the distance from the end of the frame in contact with the surface of the substrate that fixes the light - emitting chip to the end of the frame靠近 (should be "close to") the optical coating is < 1 mm. <统一格式错误,应为

[0007] ,但按照要求保留

[0007] 原样Optionally, at least part of the arc surface is located on the spherical surface with the center point of the light - emitting chip as the center of the sphere, and the arc curvature of the arc surface is 0.5 - 5.

[0008] Optionally, the diameter of the opening of the receiving cavity is 0.8 - 3.5 mm.

[0009] Optionally, the side of the optical coating背离 (should be "opposite to") the packaging glue layer is an arc.

[0010] Optionally, the coverage area of the optical coating on the packaging glue layer is 12% - 90% of the opening of the receiving cavity.

[0011] Optionally, the inner wall of the frame gradually expands from the end close to the substrate to the end close to the optical coating.

[0012] Optionally, the LED device further comprises a solder layer, which is arranged between the light emitting chip and the substrate, and is used for connecting the light emitting chip and the substrate.

[0013] Optionally, the LED device further comprises an isolation groove, which is arranged on the substrate.

[0014] In another aspect, the utility model provides a light emitting device, including the LED device.

[0015] The utility model has the advantages of:

[0016] The LED device provided by the utility model uses a light-transmitting piece as a frame, which can minimize the absorption and scattering of light, ensure that more light can pass through the frame and enter the encapsulation adhesive layer, reduce the total reflection of light in the LED device, that is, the light-transmitting piece as the frame helps to maintain the original directionality and intensity of light, thereby improving the uniformity of light emission, and the outer periphery of the frame is designed as an arc surface to realize the uniform distribution of light in the encapsulation, the setting of the arc surface of the outer periphery of the frame can reduce the reflection and refraction loss of light at the edge of the frame, so that more light can be uniformly emitted from the encapsulation adhesive layer.

[0017] On the other hand, the LED device further comprises an optical coating, which is arranged on the side of the encapsulation adhesive layer away from the substrate, which can further optimize the emission angle and distribution of light, cause the refraction and total reflection of light, reduce the light intensity directly above the LED device, and simultaneously reflect the light to the periphery of the LED device, that is, the optical coating can effectively adjust the refraction of light, improve the angle distribution of light emission, and make the light emission more uniform. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the utility model, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0019] Figure 1is a cross section schematic view of the LED device provided by the utility model;

[0020] Figure 2 is a front view of the LED device provided by the utility model;

[0021] Figure 3 is a light path schematic view of the light emitting device provided by the utility model.

[0022] The reference signs in the drawings of the specification are as follows:

[0023] 1, package support;11, substrate;12, frame;121, inner wall;122, outer periphery;2, package glue layer;3, optical coating;4, light emitting chip;5, isolation groove;6, accommodating cavity;7, welding layer. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clearly understood, the utility model is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model, and are not used to limit the utility model.

[0025] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0026] In the description of the utility model, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected;It can be mechanically connected, or it can be electrically connected;It can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0027] The utility model provides a kind of LED device, including emitting diode 4, encapsulation support 1, encapsulation adhesive layer 2 and optical coating 3, the encapsulation support 1 includes substrate 11 and frame 12, the frame 12 is light-transmitting piece, the frame 12 is surrounded in the substrate 11 to form the containing cavity 6 of one end opening, the outer periphery of the frame 12 exceeding the surface of the fixed emitting diode 4 of the substrate 11 is arc surface;The emitting diode 4 is located in the containing cavity 6 and is connected on the substrate 11, the encapsulation adhesive layer 2 is filled in the containing cavity 6, the optical coating 3 is arranged in the one side of the encapsulation adhesive layer 2 away from the substrate 11, and the outer periphery 122 of the frame 12 is arc surface.

[0028] Specifically, the LED device provided by the utility model uses light-transmitting piece as frame 12, which can minimize the absorption and scattering of light, ensure that more light can pass through frame 12 and enter encapsulation adhesive layer 2, and reduce the total reflection of light in the LED device, that is, the light-transmitting piece as frame 12 helps to maintain the original directionality and intensity of light, thereby improving the uniformity of light emission, and the design of the arc surface of the outer periphery 122 of frame 12 realizes the uniform distribution of light in the encapsulation, which can reduce the reflection and refraction loss of light at the edge of frame 12 and make more light evenly emit from encapsulation adhesive layer 2.

[0029] On the other hand, the LED device further includes optical coating 3, which is arranged on the side of encapsulation adhesive layer 2 away from substrate 11. This structure can further optimize the emission angle and distribution of light, cause refraction and total reflection of light, reduce the intensity of light directly above the LED device, and simultaneously reflect light to the four sides of the LED device, that is, optical coating 3 can effectively adjust the refraction of light and improve the angle distribution of light emission, so that the light emission is more uniform. In summary, the LED device provided by the present application can effectively improve the uniformity of light emission of the LED device, reduce light loss, and optimize the propagation path of light, so that it can provide more uniform and efficient lighting effect when applied to a light-emitting device, and the light emission effect is as shown in Figure 3 .

[0030] Specifically, in the design of the LED device, emitting diode 4 as the core component generates light energy, and is arranged on substrate 11, and then encapsulation adhesive layer 2 is used to cover emitting diode 4, which is beneficial to improve the performance and reliability of the LED device.

[0031] Specifically, substrate 11 is made of a material with high thermal conductivity (such as copper or aluminum), which can effectively conduct heat and reduce heat accumulation. Arranging emitting diode 4 on substrate 11 with high thermal conductivity can further reduce thermal resistance and improve heat management efficiency.

[0032] Specifically, the refractive index of the encapsulation layer 2 is usually different from that of air, and the encapsulation layer 2 is used to coat the light emitting chip 4, which helps to improve the light extraction efficiency and reduce the loss of total reflection of light inside the chip. In addition, the encapsulation layer 2 provides physical protection for the light emitting chip 4, preventing mechanical impact and vibration from damaging the light emitting chip 4, and the encapsulation layer 2 can also block moisture and contaminants to protect the light emitting chip 4 from environmental factors.

[0033] Specifically, the substrate 11 is a conductive metal to ensure that the current can be effectively transmitted from the substrate 11 to the LED chip, and the material of the substrate 11 includes but is not limited to gold, silver, and copper high-conductivity metal.

[0034] In an embodiment, the distance from the end of the frame 12 in contact with the surface of the substrate 11 on which the light emitting chip 4 is fixed to the end of the frame 12 close to the optical coating 3 is <1mm, and at least part of the arc surface is located on a spherical surface with the center point of the light emitting chip 4 as the spherical center, and the arc curvature of the arc surface is 0.5-5.

[0035] Specifically, the distance between the two ends of the frame 12 is less than 1mm, which means that the height of the frame 12 is low, which helps to reduce the propagation distance of light inside the package, and the shorter propagation distance can reduce the scattering and absorption of light in the encapsulation layer 2, thereby improving the light extraction efficiency and uniformity. In addition, the design of the arc surface can reduce the loss of light energy and improve the light extraction efficiency, and the arc curvature of the frame 12 is between 0.5 and 5, which provides sufficient curvature to effectively guide the light, i.e. the curvature in this range can help the light to be more evenly distributed in the encapsulation layer 2, reducing the aggregation or scattering of light at the edge, thereby obtaining a more uniform light extraction effect.

[0036] Specifically, the arc curvature of the frame 12 can be 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5 or 5.

[0037] In an embodiment, the diameter of the opening of the accommodating cavity 6 is 0.8-3.5mm.

[0038] It should be noted that in the design of the LED device, the diameter of the opening of the accommodating cavity 6 is a key parameter that affects the distribution of light and the light extraction efficiency in the LED device.

[0039] Specifically, in the LED device of the present application, the diameter of the opening of the accommodating cavity 6 is set to 0.8-3.5mm, which provides sufficient space for the light to be emitted from the encapsulation layer 2 more freely, while avoiding excessive scattering of light caused by an excessively large opening. Maintaining an appropriate opening helps to maintain the directionality of the light and improve the concentration of the light.

[0040] Specifically, the diameter of the opening of the accommodating cavity 6 can be 0.8 mm, 1.2 mm, 1.5 mm, 2 mm, 2.3 mm, 2.5 mm, 2.8 mm, 3 mm, 3.2 mm, or 3.5 mm.

[0041] In an embodiment, the optical coating 3 is arc-shaped on the side facing away from the encapsulation layer 2.

[0042] Specifically, since the optical coating 3 is arranged on the side of the encapsulation layer 2 facing away from the substrate 11, meaning that the optical coating 3 directly acts on the light emitted from the encapsulation layer 2, this arrangement can effectively utilize the optical coating 3 to adjust the propagation path and distribution of the light; the side of the optical coating 3 facing away from the encapsulation layer 2 is arranged to be arc-shaped, which focuses the light by the curvature of the arc-shaped surface of the optical coating 3, so that the light emitted from the encapsulation layer 2 is more concentrated, thereby improving the concentration and directivity of the light intensity, in addition, the arc-shaped optical coating 3 helps to uniformly disperse the light, reducing the phenomenon that the light is concentrated in a certain point or a certain area, thereby achieving a more uniform lighting effect, and at the same time, the arc-shaped surface changes the incidence angle and reflection path of the light, which helps to reduce light loss and improve the utilization rate of the light.

[0043] In summary, the arc-shaped design of the side of the optical coating 3 facing away from the encapsulation layer 2 can significantly improve the light uniformity of the LED device, optimize the focusing and divergence of the light, and improve the refraction and reflection efficiency of the light. This arrangement not only helps to enhance the performance of the LED device, but also can expand its application range, so that it can meet more extensive market demands.

[0044] In an embodiment, the coverage area of the optical coating 3 on the encapsulation layer 2 is 12% to 90% of the opening of the accommodating cavity 6.

[0045] It should be noted that when the coverage area of the optical coating 3 is small, it means that more light can be directly emitted from the encapsulation layer 2, and when the coverage area of the optical coating 3 is large, it means that most of the light emitted from the encapsulation layer 2 will pass through the optical coating 3.

[0046] Specifically, when the coverage area of the optical coating 3 on the encapsulation layer 2 is 12% to 90% of the opening of the accommodating cavity 6, that is, the coverage area of the optical coating 3 on the encapsulation layer 2 is smaller than the area of the opening of the accommodating cavity 6, the light is refracted and totally reflected, the refraction intensity of the light directly above the LED device is reduced, and the light is distributed to the surrounding area, thereby improving the light uniformity of the LED device; by adjusting the coverage area of the optical coating 3, the balance point of the light uniformity and coverage range can be found in different application scenarios, and a proper coverage area helps to uniformly disperse the light, reducing the phenomenon that the light is concentrated in a certain point or a certain area, thereby achieving a more uniform lighting effect.

[0047] Specifically, the coverage area of the optical coating 3 on the encapsulation adhesive layer 2 can be 12%, 20%, 30%, 40%, 50%, 60%, 70%, 80% or 90% of the opening of the accommodating cavity 6.

[0048] In an embodiment, the optical coating 3 comprises an adhesive selected from a resin or a silica gel and a light-transmitting material selected from SI, SIO2, optical glass, optical crystal or optical plastic.

[0049] Specifically, the resin or silica gel in the adhesive has good adhesion and plasticity, which can effectively fix the optical coating 3 on the encapsulation adhesive layer 2, and in addition, these materials generally have good transparency and weather resistance, which helps to maintain long-term optical performance.

[0050] Specifically, in the preparation of the optical coating 3 provided by the present application, a transparent material with optical properties and an adhesive are mixed.

[0051] SI material has excellent heat resistance and chemical stability, which is suitable for application in high temperature environment, SiO2 is a high transparency material with low refractive index and high temperature resistance, which is suitable for precise control of light propagation, optical glass has high transparency and good optical uniformity, and optical crystal has extremely high hardness and transparency, that is, the light transmittance of light can be significantly improved by the light-transmitting material, and the light loss is reduced, and the refractive index of these materials is low, which helps to achieve more uniform light distribution; In the present application, the light-transmitting material is mixed with the adhesive (epoxy resin, silicone resin or silica gel), which can increase the adhesion and mechanical strength of the coating while maintaining high light transmittance, and ensure the stability of the coating in long-term use.

[0052] In an embodiment, the inner wall 121 of the frame 12 gradually expands from an end close to the substrate 11 to an end close to the optical coating 3.

[0053] Specifically, the inner wall 121 of the frame 12 gradually expands from an end close to the substrate 11 to an end close to the optical coating 3, which can effectively guide the propagation path of light in the encapsulation adhesive layer 2, reduce the loss of light in the encapsulation, and improve the light extraction efficiency. At the same time, this structure also helps to reduce the scattering of light in the encapsulation adhesive layer 2, so as to obtain more uniform light extraction effect.

[0054] In an embodiment, the LED device further comprises a solder layer 7, which is arranged between the light emitting chip 4 and the substrate 11, and the solder layer 7 is used to connect the light emitting chip 4 and the substrate 11.

[0055] Specifically, the soldering layer 7 is made of high thermal conductive material (such as gold, silver or tin paste), which can effectively conduct the heat generated by the light emitting chip 4 to the substrate 11, reduce the thermal resistance, and through the uniform distribution of the soldering layer 7, the heat can be evenly spread on the whole substrate 11, avoiding the generation of local hot spots; in addition, the soldering layer 7 enhances the bonding force between the light emitting chip 4 and the substrate 11, improves the mechanical shear and tensile resistance of the LED device; the soldering layer 7 can also prevent environmental factors from eroding the electrical connection point, prolonging the service life of the LED device.

[0056] In an embodiment, the LED device further comprises an isolation groove 5 arranged on the substrate 11.

[0057] Specifically, the isolation groove 5 can form a physical separation between the light emitting chips 4, reducing the lateral transfer of heat between the chips, thereby reducing the thermal coupling effect, while the isolation groove 5 provides additional space to ensure that adjacent electrical connections or conductive paths do not come into contact with each other, thereby reducing the risk of short circuit, and the isolation groove 5 can be filled with insulating material to improve the strength of the LED device; the edges of the isolation groove 5 can act as reflectors, or the isolation groove 5 can be filled with reflective material, helping to control the direction of light propagation and reduce light loss.

[0058] In another embodiment, the utility model provides a kind of light emitting device, comprising the LED device.

[0059] Specifically, the LED device in the light emitting device can effectively improve the uniformity of LED device light output, reduce light loss, and optimize the light propagation path by setting transparent arc-shaped frame 12 and optical coating 3, so that more uniform and efficient lighting effect can be provided when applied to light emitting device.

[0060] The above-described embodiments are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent substitutions for part of the technical features; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model, and should be included in the protection scope of the utility model.

Claims

1. An LED device, characterized by, The LED device comprises a light emitting chip, a package support, a package adhesive layer and an optical coating layer, the package support comprises a substrate and a frame, the frame is a light-transmitting member, the frame surrounds the substrate to form a containing cavity with an open end, the light emitting chip is located in the containing cavity and connected to the substrate, and the outer periphery of the frame beyond the surface of the substrate fixing the light emitting chip is an arc surface; the package adhesive layer is filled in the containing cavity, and the optical coating layer is arranged on the side of the package adhesive layer away from the substrate.

2. The LED device of claim 1, wherein, The distance from the end of the frame in contact with the surface of the substrate fixing the light emitting chip to the end of the frame close to the optical coating layer is less than 1 mm.

3. The LED device of claim 1, wherein, At least part of the arc surface is located on a spherical surface with the center point of the light emitting chip as the spherical center, and the arc curvature of the arc surface is 0.5-5.

4. The LED device of claim 1, wherein, The diameter of the opening of the containing cavity is 0.8-3.5 mm.

5. The LED device of claim 1, wherein, The side of the optical coating layer away from the package adhesive layer is arc-shaped.

6. The LED device of claim 1, wherein, The coverage area of the optical coating layer on the package adhesive layer is 12%-90% of the opening of the containing cavity.

7. The LED device of claim 1, wherein, The inner wall of the frame gradually expands from the end close to the substrate to the end close to the optical coating layer.

8. The LED device of claim 1, wherein, The LED device further comprises a solder layer arranged between the light emitting chip and the substrate, and the solder layer is used for connecting the light emitting chip and the substrate.

9. The LED device of claim 1, wherein, The LED device further comprises an isolation groove arranged on the substrate.

10. A light emitting device, characterized in that: The LED device comprises the LED device according to any one of claims 1-9. The LED device comprises the LED device according to any one of claims 1-9.

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