LED packaging structure and lighting device
By setting LED packages with different functions on both sides of the substrate, the problem that existing LED lights cannot achieve both lighting and display at the same time is solved, thus simplifying electrical layout and reducing decoration costs.
Patent Information
- Application Number
- CN202422837344.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-11-20
AI Technical Summary
When existing LED lights need to achieve both lighting and display functions in certain scenarios, two independent design schemes are required, which increases the difficulty of electrical layout and decoration costs.
Design an LED packaging structure with a first LED package and a second LED package on both sides of the substrate. The first type of LED chip is used for display, and the second type of LED chip is used for lighting. The power electrode pad is connected to an external power supply to realize the function of simultaneous display and lighting.
It enables simultaneous image display and lighting on the same substrate, simplifies electrical layout, and reduces decoration costs.
Smart Images
Figure CN223472511U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a light emitting diode technical field, especially a kind of LED packaging structure and lighting device. BACKGROUND
[0002] LED lamp is a kind of light emitting diode (LED) as light source lamp, with its high energy efficiency, long life and environmental protection characteristics and is widely used in lighting field.
[0003] At present, LED lamp is usually designed to perform a specific lighting task, for example as indicator light, signal light, decorative light, display screen, and the function is relatively single. However, in some special scenarios, multiple functions are required, for example in the commodity display cabinet of shopping mall, commodity display cabinet needs light illumination to fully display goods, and brand promotion video needs to be played to consumers outside commodity display cabinet, at this time, two sets of LED design schemes are needed, one set is lighting LED lamp group, and the other set is display LED lamp group, which not only increases electrical arrangement difficulty, but also increases decoration cost. INVENTION CONTENTS
[0004] Therefore, the utility model aims at providing a kind of LED packaging structure and lighting device, to realize the function of illumination and display simultaneously.
[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the utility model is as follows:
[0006] Firstly, the utility model provides a kind of LED packaging structure, including substrate, first LED packaging body, second LED packaging body, power electrode pad. First LED packaging body is located on one side of substrate, and first LED packaging body includes first type LED crystal grain fixed on substrate, and first type LED crystal grain is used to form display pixel point, and second LED packaging body is arranged on the side opposite to first LED packaging body of substrate, and second LED packaging body includes second type LED crystal grain fixed on substrate, and second type LED crystal grain is used to form preset color illumination source, and power electrode pad is used to connect external power supply, and power electrode pad is arranged on second LED packaging body, and power electrode pad is electrically connected with first type LED crystal grain and second type LED crystal grain.
[0007] The utility model has at least the following beneficial effects: first LED packaging body and second LED packaging body are arranged on the front and back of substrate respectively, so that image or picture can be displayed on the front of substrate, and illumination light source is emitted on the back of substrate; at the same time, power electrode pad is arranged on second LED packaging body, which is convenient for welding LED packaging structure to PCB board as a whole to connect power supply, so as to not affect the display on the front of substrate.
[0008] In addition, the LED packaging structure according to the above-mentioned utility model can have the following additional technical features.
[0009] Further, the first LED packaging body further comprises a first glue layer, and the first glue layer covers the first type of LED dies.
[0010] Further, the first type of LED dies comprises red light LED dies, green light LED dies and blue light LED dies.
[0011] Further, the red light LED dies, the green light LED dies and the blue light LED dies are horizontally arranged on the substrate.
[0012] Further, the red light LED dies, the green light LED dies and the blue light LED dies are vertically arranged on the substrate.
[0013] Further, a first chip electrode pad is arranged on a surface of the substrate on the same side as the first type of LED dies, and the first chip electrode pad is electrically connected to the power electrode pad in correspondence.
[0014] Further, the second LED packaging body further comprises an LED support and a second glue layer, the LED support is inwardly recessed to form a receiving cavity, the second type of LED dies are fixedly arranged on a bottom wall of the receiving cavity, the power electrode pad is arranged on an end surface of a side wall of the LED support away from the substrate, and the second glue layer covers the second type of LED dies and fills the receiving cavity.
[0015] Further, the second glue layer is dispersed with a color conversion material.
[0016] Further, a second chip electrode pad is arranged on a surface of the substrate on the same side as the second type of LED dies, and the second chip electrode pad is electrically connected to the power electrode pad in correspondence.
[0017] In a second aspect, the utility model further provides a lighting device which applies the above-mentioned LED packaging structure. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 is a sectional view of the LED packaging structure in an embodiment of the utility model;
[0019] Figure 2 is a top view of the LED packaging structure in an embodiment of the utility model;
[0020] Figure 3 is a top perspective view of the LED packaging structure in an embodiment of the utility model;
[0021] Explanation of main element symbols:
[0022] Substrate 100, first chip electrode pad 110, second chip electrode pad 120;
[0023] The first LED package 200, the first type LED die 210, the red light LED die 211, the green light LED die 212, the blue light LED die 213, the first glue layer 220;
[0024] The second LED package 300, the second type LED die 310, the LED support 320, the accommodating cavity 321, the second glue layer 330;
[0025] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0026] For the purpose of facilitating the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings show several embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. The terms "vertical", "horizontal", "left", "right", and similar expressions used herein are for illustrative purposes only.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein only for the purpose of describing specific embodiments of the present application and is not intended to limit the present application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0029] To simultaneously realize the functions of lighting and display, in a first aspect, referring to Figures 1 to 3 An LED packaging structure provided in the present application includes a substrate 100, a first LED package 200, a second LED package 300, and a power electrode pad (not shown in the drawings).
[0030] The first LED package 200 is arranged on the upper surface of the substrate 100. Specifically, the first LED package 200 includes a first type LED die 210 fixed to the substrate 100, and the first type LED die 210 is used to form a display pixel point. In this way, a predetermined picture can be displayed or an image played at a moving frame rate as needed, and the color tone of the aforementioned image or picture can be black and white or color.
[0031] The second LED package 300 is arranged on the upper surface of the substrate 100, and specifically, the second LED package 300 includes second type LED dies 310 fixed on the substrate 100, which are used to form a preset color of illumination source, such as a white illumination source, a red illumination source, or a yellow illumination source.
[0032] The power electrode pad is used to connect an external power source, and is arranged on the second LED package 300 and electrically connected with the first type LED dies 210 and the second type LED dies 310, so that the external power source provides electric energy to the first type LED dies 210 and the second type LED dies 310 through the power electrode pad, so that they emit corresponding light. Exemplarily, the second LED package 300 can be welded on a PCB or a substrate, and a pad and a power layer corresponding to the power electrode pad are arranged to realize the connection of the circuit.
[0033] In some optional embodiments, as shown in Figure 1 The first LED package 200 further includes a first glue layer 220 covering the first type LED dies 210. In the embodiment, the first glue layer 220 can be made of polyurethane, epoxy resin, or silicone. Since the first glue layer 220 made of these materials usually has a high refractive index, it can increase the light output efficiency of the LED. Meanwhile, the first glue layer 220 can protect the first type LED dies 210 from mechanical impact and vibration, and also provide a stress release function to prevent damage caused by thermal expansion or contraction. The glue layer can prevent water and dust, protect the first type LED dies 210 from moisture and other harmful chemicals, and improve the light extraction efficiency. In addition, the good thermal conductivity of the first glue layer 220 can maintain the working temperature of the first type LED dies 210 at an appropriate temperature, thereby prolonging the service life and maintaining the stability of the light output.
[0034] It should be noted that the first LED package 200 can form a rectangle or a convex lens shape to expand the light emitting angle.
[0035] In some optional embodiments, as shown in Figure 2 The first type LED dies 210 can perform full-color display, and the first type LED dies 210 can include red LED dies 211, green LED dies 212, and blue LED dies 213 arranged in a certain manner. The first type LED dies 210 can further include white LED dies (not shown in the drawings) to form RGBW four-color type pixels.
[0036] In some optional embodiments, as shown in Figure 2As shown, the red LED dies 211, the green LED dies 212, and the blue LED dies 213 can be arranged horizontally on the substrate 100, or can be arranged vertically on the substrate 100 to form a stacked RGB structure.
[0037] In some alternative embodiments, as shown in Figure 2 and Figure 3 The substrate 100 has a first chip electrode pad 110 on the surface on the same side as the first type of LED dies 210, which is electrically connected to the power electrode pad.
[0038] For example, the first type of LED dies 210 are formed by the red LED dies 211, the green LED dies 212, and the blue LED dies 213 arranged horizontally to form a display pixel. The red LED dies 211, the green LED dies 212, and the blue LED dies 213 are positive chips, and the substrate 100 has a first chip electrode pad 110a connected to the negative electrode of the red LED dies 211, a first chip electrode pad 110b connected to the negative electrode of the green LED dies 212, a first chip electrode pad 110c connected to the negative electrode of the blue LED dies 213, and a first chip electrode pad 110d connected to the positive electrodes of the red LED dies 211, the green LED dies 212, and the blue LED dies 213, to realize a common anode connection mode among the red LED dies 211, the green LED dies 212, and the blue LED dies 213. In actual connection, the red LED dies 211, the green LED dies 212, and the blue LED dies 213 can be connected by gold wires. It should be understood that the substrate 100 can also have a first chip electrode pad 110a connected to the positive electrode of the red LED dies 211, a first chip electrode pad 110b connected to the positive electrode of the green LED dies 212, a first chip electrode pad 110c connected to the positive electrode of the blue LED dies 213, and a first chip electrode pad 110d connected to the negative electrodes of the red LED dies 211, the green LED dies 212, and the blue LED dies 213, to realize a common cathode connection mode among the red LED dies 211, the green LED dies 212, and the blue LED dies 213.
[0039] In some alternative embodiments, as shown in Figure 1 The second LED package 300 further includes an LED support 320, and a second adhesive layer 330. The LED support 320 is recessed inward to form a receiving cavity 321, and the second type of LED dies 310 are fixed to the bottom wall of the receiving cavity 321. The power electrode pad is arranged on the end surface (end surface A in the drawing) of the side wall of the LED support 320 away from the substrate 100, and the second adhesive layer 330 covers the second type of LED dies 310 and fills the receiving cavity 321.
[0040] In the embodiment, the second adhesive layer 330 can be made of polyurethane, epoxy resin or silicone. The first adhesive layer 220 made of these materials usually has a high refractive index, which can increase the light output efficiency of the LED. Meanwhile, the second adhesive layer 330 can protect the second LED dies 310 from mechanical impact and vibration, and provide stress release function to prevent damage caused by thermal expansion or contraction. The adhesive layer can prevent water and dust, protect the second LED dies 310 from moisture and other harmful chemicals, and improve light extraction efficiency. In addition, the good thermal conductivity of the second adhesive layer 330 can maintain the working temperature of the second LED dies 310 at an appropriate temperature, thereby prolonging the service life and maintaining the stability of the light output. It should be noted that the first LED package 200 can be formed in a rectangular shape or a convex lens shape to expand the light output angle.
[0041] In some optional embodiments, the light emitted by the second LED dies 310 needs to be converted into other colors of light. Therefore, color conversion materials such as fluorescent powder and quantum dot particles are dispersed in the second adhesive layer 330. For example, when manufacturing a white light LED, a yellow fluorescent powder is excited by a blue light second LED die 310 to produce white light by mixing blue light and yellow light.
[0042] In some optional embodiments, as shown in Figure 3 The surface of the substrate 100 on the same side as the second LED dies 310 is provided with second chip electrode pads 120, and the second chip electrode pads 120 are electrically connected with the power electrode pads.
[0043] Exemplarily, the second LED dies 310 are white light LED dies, thereby forming a white light illumination light source, and the second LED dies 310 are flip chips, and the second LED dies 310 are provided with two and arranged side by side. Two second chip electrode pads (120a, 120b) for connecting the negative electrodes of the two second LED dies 310 are arranged on the substrate 100, and two second chip electrode pads (120c, 120d) for connecting the positive electrodes of the two second LED dies 310 are arranged on the substrate 100. When connecting, a conductive path can be arranged on the substrate 100 to electrically connect the positive and negative electrodes of the flip-chip second LED dies 310 with the corresponding second chip electrode pads 120.
[0044] In a second aspect, the utility model also provides a kind of illumination device, applied the LED package structure described above.
[0045] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0046] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but it cannot be understood as the limitation of the protection scope of the utility model. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.
Claims
1. An LED package structure, characterized in that, The LED packaging structure comprises: a substrate; a first LED packaging body located on one side of the substrate, the first LED packaging body comprising first type LED dies fixed on the substrate, the first type LED dies being used to form display pixels; a second LED packaging body located on the side of the substrate opposite to the first LED packaging body, the second LED packaging body comprising second type LED dies fixed on the substrate, the second type LED dies being used to form illumination sources of a preset color; a power electrode pad for connecting an external power supply, the power electrode pad being arranged on the second LED packaging body, and the power electrode pad being electrically connected with the first type LED dies and the second type LED dies.
2. The LED package structure of claim 1, wherein, The first LED packaging body further comprises a first glue layer covering the first type LED dies.
3. The LED package structure of claim 1, wherein, The first type LED dies comprise red light LED dies, green light LED dies and blue light LED dies.
4. The LED package structure of claim 3, wherein, The red light LED dies, the green light LED dies and the blue light LED dies are horizontally arranged on the substrate.
5. The LED package structure of claim 3, wherein, The red light LED dies, the green light LED dies and the blue light LED dies are vertically arranged on the substrate.
6. The LED package structure of claim 4, wherein, A first chip electrode pad is arranged on the surface of the substrate on the same side as the first type LED dies, and the first chip electrode pad is correspondingly electrically connected with the power electrode pad.
7. The LED package structure of claim 1, wherein, The second LED packaging body further comprises: an LED support, the LED support being inwardly recessed to form a receiving cavity, the second type LED dies being fixed on the bottom wall of the receiving cavity, and the power electrode pad being arranged on the end face of the side wall of the LED support away from the substrate; a second glue layer covering the second type LED dies and filling the receiving cavity.
8. The LED package structure of claim 7, wherein, The second glue layer is dispersed with color conversion materials.
9. The LED package structure of claim 7, wherein, A second chip electrode pad is arranged on the surface of the substrate on the same side as the second type LED dies, and the second chip electrode pad is correspondingly electrically connected with the power electrode pad.
10. An illumination device, characterized by The LED packaging structure is applied.