Auxiliary cleaning device for silicon wafer processing

Abstract

The auxiliary cleaning device for silicon wafer processing comprises an ultrasonic cleaning machine and a placing frame, a pushing plate is arranged on the rear side of the top of the placing frame, a lifting plate is arranged on the rear side of the pushing plate, and limiting blocks are arranged on the left side and the right side of the rear side of the placing frame. A lifting device used in cooperation with the limiting block is arranged on the rear side of the ultrasonic cleaning machine, limiting columns used in cooperation with the lifting device are arranged on the left side and the right side of the rear side of the top of the ultrasonic cleaning machine, and limiting plates are arranged on the tops of the limiting columns. Through the cooperative use of the placement rack, the lifting device and the control device, the problems that when silicon wafers are cleaned by an existing ultrasonic cleaning machine, the silicon wafer placement rack is mostly manually placed in an inner cavity of the ultrasonic cleaning machine, and after cleaning is completed, a grip at the top of the placement rack is held, so that the silicon wafers are inconvenient to clean are solved. When the placing rack is taken out of the inner cavity of the ultrasonic cleaning machine, the operation process is time-consuming and labor-consuming, and the use of the ultrasonic cleaning machine is influenced.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer processing technology, and in particular relates to an auxiliary cleaning device for silicon wafer processing. Background Technology

[0002] An ultrasonic cleaner is a cleaning device used in silicon wafer processing. It is specifically designed for cleaning precision objects such as crystalline silicon wafers. This equipment uses ultrasonic vibrations to create tiny bubbles in a liquid. The shock waves generated by the bursting of these bubbles remove contaminants from the silicon wafer surface. As integrated circuits place increasingly stringent quality requirements on silicon wafers, there are extremely strict control standards for surface contaminants. If monocrystalline silicon wafers are not cleaned properly, it will seriously affect the quality and yield of devices. Therefore, cleaning has become a crucial step in the manufacturing process of monocrystalline silicon wafers. Ultrasonic technology is widely used in the semiconductor industry and is favored for its excellent cleaning effect and simple operation. However, existing technologies have the following problems: Currently, most ultrasonic cleaners require manual placement of the wafer rack into the machine's cavity. After cleaning, the rack is removed from the machine by holding the handle at the top. This process is time-consuming and labor-intensive, affecting the usability of the ultrasonic cleaner. Utility Model Content

[0003] To address the problems existing in the prior art, this utility model provides an auxiliary cleaning device for silicon wafer processing. It has the advantages of automatically placing and removing silicon wafer holders and improving the efficiency of silicon wafer cleaning. It solves the problem that in existing ultrasonic cleaning machines, the silicon wafer holders are mostly placed manually into the inner cavity of the ultrasonic cleaning machine, and after cleaning, the holders are removed from the inner cavity by holding the handle on the top of the holder. This operation is time-consuming and laborious, affecting the use of the ultrasonic cleaning machine.

[0004] This invention is implemented as follows: an auxiliary cleaning device for silicon wafer processing includes an ultrasonic cleaner and a placement rack. The placement rack is disposed on top of the ultrasonic cleaner. A push plate is disposed on the rear side of the top of the placement rack, and a lifting plate is disposed on the rear side of the push plate. Limit blocks are disposed on the left and right sides of the rear side of the placement rack. A lifting device that cooperates with the limit blocks is disposed on the rear side of the ultrasonic cleaner. Limit posts that cooperate with the lifting device are disposed on the left and right sides of the rear top of the ultrasonic cleaner. Limit plates are disposed on the top of the limit posts. A control device that cooperates with the lifting plate is disposed on the rear side of the placement rack. A support plate that cooperates with the lifting device is disposed on the rear side of the ultrasonic cleaner.

[0005] In a preferred embodiment of this invention, the bottom of the push plate is fixedly connected to the placement frame, the front side of the lifting plate is fixedly connected to the push plate, the front side of the limiting block is fixedly connected to the placement frame, and the front side of the support plate is fixedly connected to the ultrasonic cleaner.

[0006] As a preferred embodiment of this utility model, the top and bottom of the curved surface of the limiting post are fitted with cushioning pads and are fixedly connected to the cushioning pads. The top and bottom of the limiting post are respectively fixedly connected to the ultrasonic cleaner and the limiting plate.

[0007] In a preferred embodiment of this invention, the lifting device includes a control cylinder, the output end of which is fixedly connected to a lifting plate. Positioning blocks are provided on the left and right sides of the rear side of the lifting plate, and lifting columns are provided on the left and right sides of the bottom of the lifting plate. A positioning plate is provided at the bottom of the lifting column.

[0008] As a preferred embodiment of this invention, the control device includes a control motor, the output end of which is fixedly connected to a transmission rod, and a control cam is provided on the side of the transmission rod away from the control motor.

[0009] In a preferred embodiment of this utility model, the bottom of the control cylinder is fixedly connected to the support plate, the rear side of the positioning block is fixedly connected to the lifting plate, the positioning block is sleeved on the surface of the limiting column, the top of the lifting column is fixedly connected to the lifting plate, the bottom of the lifting column penetrates the limiting block and extends to the outside of the limiting block and is fixedly connected to the positioning plate, and the top of the positioning plate contacts the bottom of the limiting block.

[0010] In a preferred embodiment of this invention, the bottom of the control motor is fixedly connected to the ultrasonic cleaner, and the right side of the transmission rod is fixedly connected to the control cam.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] 1. This utility model solves the problem that existing ultrasonic cleaning machines, when cleaning silicon wafers, mostly require manual placement of the silicon wafer placement rack into the inner cavity of the ultrasonic cleaning machine. After cleaning, the rack is removed from the inner cavity of the ultrasonic cleaning machine by holding the handle on the top of the rack. This operation is time-consuming and laborious, affecting the use of the ultrasonic cleaning machine.

[0013] 2. This utility model can drive the placement frame to move up and down by setting a push plate and a lifting plate. It can support and limit the placement frame by setting a limit block. It can support and limit the control cylinder by setting a support plate.

[0014] 3. This utility model can support and limit the lifting plate by setting the limiting column and the limiting plate. By setting the buffer pad, it can prevent the lifting plate from directly contacting and colliding with the ultrasonic cleaner and the limiting plate when the lifting plate is raised and lowered.

[0015] 4. This utility model, by setting up a lifting device, can lift the shelf, making it convenient for users to use.

[0016] 5. By setting up a control device, this utility model can improve the cleaning efficiency of silicon wafers and make it more convenient for users to use silicon wafers.

[0017] 6. This utility model can drive the lifting plate to rise and fall by setting a control cylinder. By setting the lifting plate, it can drive the lifting column and positioning plate to rise and fall synchronously. By setting the positioning block, it can limit the lifting plate. By setting the lifting column and positioning plate, it can drive the placement frame to rise and fall.

[0018] 7. This utility model, by setting a control motor, can drive the transmission rod to rotate. By setting the transmission rod, it can drive the control cam to rotate. By setting the control cam, it can drive the push plate and the lifting plate to move up and down. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall three-dimensional structure provided in an embodiment of the present utility model;

[0020] Figure 2 This is a three-dimensional structural diagram of the control device provided in an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of the three-dimensional structure of the cushioning pad provided in this embodiment of the utility model;

[0022] Figure 4 This is a three-dimensional structural diagram of the lifting device provided in an embodiment of this utility model.

[0023] In the diagram: 1. Ultrasonic cleaner; 2. Placement rack; 3. Push plate; 4. Lifting plate; 5. Limiting block; 6. Lifting device; 7. Limiting column; 8. Limiting plate; 9. Control device; 10. Support plate; 11. Buffer pad; 601. Control cylinder; 602. Lifting plate; 603. Positioning block; 604. Lifting column; 605. Positioning plate; 901. Control motor; 902. Transmission rod; 903. Control cam. Detailed Implementation

[0024] To further understand the invention content, features and effects of this utility model, the following embodiments are provided, and detailed descriptions are given in conjunction with the accompanying drawings.

[0025] The structure of this utility model will now be described in detail with reference to the accompanying drawings.

[0026] like Figures 1 to 4 As shown in the figure, an auxiliary cleaning device for silicon wafer processing provided by this utility model embodiment includes an ultrasonic cleaner 1 and a placement rack 2. The placement rack 2 is disposed on the top of the ultrasonic cleaner 1. A push plate 3 is disposed on the rear side of the top of the placement rack 2. A lifting plate 4 is disposed on the rear side of the push plate 3. Limiting blocks 5 are disposed on the left and right sides of the rear side of the placement rack 2. A lifting device 6 that cooperates with the limiting blocks 5 is disposed on the rear side of the ultrasonic cleaner 1. Limiting posts 7 that cooperate with the lifting device 6 are disposed on the left and right sides of the rear top of the ultrasonic cleaner 1. A limiting plate 8 is disposed on the top of the limiting posts 7. A control device 9 that cooperates with the lifting plate 4 is disposed on the rear side of the placement rack 2. A support plate 10 that cooperates with the lifting device 6 is disposed on the rear side of the ultrasonic cleaner 1.

[0027] refer to Figure 1 and Figure 3 The bottom of the push plate 3 is fixedly connected to the placement frame 2, the front side of the lifting plate 4 is fixedly connected to the push plate 3, the front side of the limiting block 5 is fixedly connected to the placement frame 2, and the front side of the support plate 10 is fixedly connected to the ultrasonic cleaner 1.

[0028] The above scheme is adopted: by setting the push plate 3 and the lifting plate 4, the placement rack 2 can be driven to move up and down; by setting the limit block 5, the placement rack 2 can be supported and limited; by setting the support plate 10, the control cylinder 601 can be supported and limited.

[0029] refer to Figure 3 The top and bottom of the curved surface of the limiting post 7 are fitted with cushioning pads 11 and are fixedly connected to the cushioning pads 11. The top and bottom of the limiting post 7 are fixedly connected to the ultrasonic cleaner 1 and the limiting plate 8, respectively.

[0030] The above solution is adopted: by setting the limiting column 7 and the limiting plate 8, the lifting plate 602 can be supported and limited. By setting the buffer pad 11, the lifting plate 602 can be prevented from directly contacting and colliding with the ultrasonic cleaner 1 and the limiting plate 8 when it is raised and lowered.

[0031] refer to Figure 4 The lifting device 6 includes a control cylinder 601, the output end of which is fixedly connected to a lifting plate 602. Positioning blocks 603 are provided on the left and right sides of the rear side of the lifting plate 602. Lifting columns 604 are provided on the left and right sides of the bottom of the lifting plate 602. Positioning plates 605 are provided at the bottom of the lifting columns 604.

[0032] The above solution is adopted: by setting up the lifting device 6, the placement rack 2 can be raised and lowered, making it convenient for users to use the placement rack 2.

[0033] refer to Figure 2 The control device 9 includes a control motor 901, and a transmission rod 902 is fixedly connected to the output end of the control motor 901. A control cam 903 is provided on the side of the transmission rod 902 away from the control motor 901.

[0034] By adopting the above solution, the control device 9 can improve the cleaning efficiency of silicon wafers and facilitate the use of silicon wafers by users.

[0035] refer to Figure 3 and Figure 4 The bottom of the control cylinder 601 is fixedly connected to the support plate 10, the rear side of the positioning block 603 is fixedly connected to the lifting plate 602, the positioning block 603 is sleeved on the surface of the limiting column 7, the top of the lifting column 604 is fixedly connected to the lifting plate 602, the bottom of the lifting column 604 passes through the limiting block 5 and extends to the outside of the limiting block 5 and is fixedly connected to the positioning plate 605, and the top of the positioning plate 605 contacts the bottom of the limiting block 5.

[0036] The above scheme is adopted as follows: by setting up a control cylinder 601, the lifting plate 602 can be driven to rise and fall; by setting up the lifting plate 602, the lifting column 604 and the positioning plate 605 can be driven to rise and fall synchronously; by setting up the positioning block 603, the lifting plate 602 can be limited; and by setting up the lifting column 604 and the positioning plate 605, the placement rack 2 can be driven to rise and fall.

[0037] refer to Figure 1 and Figure 2 The bottom of the control motor 901 is fixedly connected to the ultrasonic cleaner 1, and the right side of the transmission rod 902 is fixedly connected to the control cam 903.

[0038] The above scheme is adopted: by setting the control motor 901, the transmission rod 902 can be driven to rotate; by setting the transmission rod 902, the control cam 903 can be driven to rotate; by setting the control cam 903, the push plate 3 and the lifting plate 4 can be driven to move up and down.

[0039] The working principle of this utility model:

[0040] In use, the silicon wafer holder is placed at a suitable position on top of the placement rack 2. Then, the cylinder is activated to retract, causing the lifting plate 602 to descend on the surface of the limiting post 7. The lifting plate 602 drives the control post and positioning plate 605 to descend synchronously. At the same time, the placement rack 2 and the limiting block 5 descend synchronously with the positioning plate 605. The placement rack 2 drives the push plate 3 and lifting plate 4 to descend synchronously. When the placement rack 2 descends to a suitable position inside the ultrasonic cleaner 1, the lifting plate 4 will contact the control cam 903. Then, the control motor 901 is activated, driving the transmission rod 902 and the control cam 903 to rotate synchronously. The control cam 903 drives the lifting plate 4 to move up and down reciprocally. The lifting plate 4 drives the push plate 3 to move up and down reciprocally. The moving plate 3 and the placement frame 2 move back and forth synchronously. The placement frame 2 drives the limiting block 5 to move back and forth on the surface of the lifting column 604, allowing the silicon wafer to move up and down during cleaning. This increases the contact area and frequency between the liquid medium and the silicon wafer surface, potentially improving cleaning efficiency. After cleaning, the control motor 901 is stopped, and the control cylinder 601 extends, causing the lifting plate 602 to rise on the surface of the limiting column 7. The lifting plate 602 drives the control column and the positioning plate 605 to rise synchronously. At the same time, the placement frame 2 and the limiting block 5 rise synchronously with the positioning plate 605. The placement frame 2 drives the pushing plate 3 and the lifting plate 4 to rise synchronously. When the placement frame 2 rises to the appropriate position, the work is completed.

[0041] In summary, this auxiliary cleaning device for silicon wafer processing, through the coordinated use of the placement rack 2, lifting device 6, and control device 9, solves the problem that existing ultrasonic cleaning machines mostly rely on manual placement of the silicon wafer placement rack into the inner cavity of the ultrasonic cleaning machine during cleaning. After cleaning, the rack is then removed from the inner cavity by holding the handle on top of the rack. This process is time-consuming and laborious, affecting the use of the ultrasonic cleaning machine.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An auxiliary cleaning device for silicon wafer processing, comprising an ultrasonic cleaner (1) and a placement rack (2), wherein the placement rack (2) is disposed on top of the ultrasonic cleaner (1), characterized in that: A push plate (3) is provided on the rear side of the top of the placement rack (2), and a lifting plate (4) is provided on the rear side of the push plate (3). Limiting blocks (5) are provided on the left and right sides of the rear side of the placement rack (2). A lifting device (6) is provided on the rear side of the ultrasonic cleaner (1) in cooperation with the limiting block (5). Limiting posts (7) are provided on the left and right sides of the rear top of the ultrasonic cleaner (1) in cooperation with the lifting device (6). A limiting plate (8) is provided on the top of the limiting post (7). A control device (9) is provided on the rear side of the placement rack (2) in cooperation with the lifting plate (4). A support plate (10) is provided on the rear side of the ultrasonic cleaner (1) in cooperation with the lifting device (6).

2. The auxiliary cleaning device for silicon wafer processing as described in claim 1, characterized in that: The bottom of the push plate (3) is fixedly connected to the placement frame (2), the front side of the lifting plate (4) is fixedly connected to the push plate (3), the front side of the limiting block (5) is fixedly connected to the placement frame (2), and the front side of the support plate (10) is fixedly connected to the ultrasonic cleaner (1).

3. The auxiliary cleaning device for silicon wafer processing as described in claim 1, characterized in that: The top and bottom of the curved surface of the limiting post (7) are fitted with buffer pads (11) and are fixedly connected to the buffer pads (11). The top and bottom of the limiting post (7) are fixedly connected to the ultrasonic cleaner (1) and the limiting plate (8) respectively.

4. The auxiliary cleaning device for silicon wafer processing as described in claim 1, characterized in that: The lifting device (6) includes a control cylinder (601), the output end of which is fixedly connected to a lifting plate (602). Positioning blocks (603) are provided on the left and right sides of the rear side of the lifting plate (602), and lifting columns (604) are provided on the left and right sides of the bottom of the lifting plate (602). A positioning plate (605) is provided at the bottom of the lifting column (604).

5. The auxiliary cleaning device for silicon wafer processing as described in claim 1, characterized in that: The control device (9) includes a control motor (901), the output end of which is fixedly connected to a transmission rod (902), and a control cam (903) is provided on the side of the transmission rod (902) away from the control motor (901).

6. The auxiliary cleaning device for silicon wafer processing as described in claim 4, characterized in that: The bottom of the control cylinder (601) is fixedly connected to the support plate (10), the rear side of the positioning block (603) is fixedly connected to the lifting plate (602), the positioning block (603) is sleeved on the surface of the limiting column (7), the top of the lifting column (604) is fixedly connected to the lifting plate (602), the bottom of the lifting column (604) penetrates through the limiting block (5) and extends to the outside of the limiting block (5) and is fixedly connected to the positioning plate (605), and the top of the positioning plate (605) contacts the bottom of the limiting block (5).

7. The auxiliary cleaning device for silicon wafer processing as described in claim 5, characterized in that: The bottom of the control motor (901) is fixedly connected to the ultrasonic cleaner (1), and the right side of the transmission rod (902) is fixedly connected to the control cam (903).

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