Novel polishing machine for wafer processing

Abstract

The utility model discloses a novel wafer processing polisher which comprises a polisher body, a driving motor is fixedly installed at the bottom of the polisher body, a polishing table is fixedly installed on the surface of the polisher body, and meanwhile a polishing bottom piece is movably installed in the polishing table. The polishing device comprises a polishing table and a polishing bottom plate, the polishing bottom plate is driven by a driving motor fixedly arranged at the bottom of the polishing machine body, a polishing pad adheres to the surface of the polishing bottom plate, a polishing assembly is arranged above the polishing pad and comprises a supporting column fixed to the surface of the polishing table in a screwed mode, and a fixing frame is fixedly installed at the top of the supporting column. According to the novel polishing machine for wafer processing, three sets of wafer bodies can be synchronously polished at a time; in the same time, the number of the processed wafers is three times that of one wafer polished at a time; the output speed of the wafers on a production line is greatly improved, the production period is shortened, and the increasing requirements of the market on the wafers can be met; the actual requirements of factories are met.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing, specifically a new type of polishing machine for wafer processing. Background Technology

[0002] Quartz crystals require polishing during use, which necessitates the use of a polishing machine. However, existing quartz wafer polishing machines suffer from excessive weight due to the heavy cast iron upper grinding disc, causing the quartz wafers to easily break under excessive pressure during polishing. Therefore, there is an urgent need for a lightweight quartz wafer polishing machine to address the problem mentioned in the background section where the existing cast iron upper grinding disc causes excessive pressure, leading to the quartz wafers' tendency to break during polishing.

[0003] To address the aforementioned issues, a search revealed a lightweight quartz wafer polishing machine with publication number CN217800995U. The paper proposes a method where a support plate lifts the lower grinding disc to the bottom of the main body, and a support frame supports the weight of the upper grinding disc. The upper and lower grinding discs are then activated to polish both ends of the main body. This prevents the upper grinding disc from pressing directly onto the lightweight quartz wafer, thus avoiding the risk of the upper grinding disc's excessive weight crushing the wafer and protecting it.

[0004] Although the aforementioned polishing machine can perform polishing work on wafers, it can only polish one group of wafers at a time. When a large number of wafers need to be polished, the polishing efficiency will be low and it will not meet the actual needs of the factory. Utility Model Content

[0005] The purpose of this invention is to provide a new type of polishing machine for wafer processing, so as to solve the defects mentioned in the background art.

[0006] To achieve the above objectives, a novel polishing machine for wafer processing is provided, comprising a polishing machine body, a drive motor fixedly mounted at the bottom of the polishing machine body, and a polishing table fixedly mounted on the surface of the polishing machine body. A polishing substrate is movably mounted inside the polishing table, and the polishing substrate is driven by the drive motor fixed at the bottom of the polishing machine body. A polishing pad is adhered to the surface of the polishing substrate, and a polishing assembly is disposed above the polishing pad. The polishing assembly includes a support column screwed to the surface of the polishing table, a fixing frame fixedly mounted on the top of the support column, and a central disk fixedly mounted at the end of the fixing frame. Three sets of wafer bodies are respectively covered on the surface of the polishing pad, and the three sets of wafer bodies are respectively adhered and fixed to the bottom of three sets of carrier disks.

[0007] Preferably, the central disk is a circular structure made of metal, and a cylinder is fixedly installed in the center of the surface of the central disk. At the same time, three sets of equidistant arc-shaped openings are evenly opened on the surface of the central disk.

[0008] Preferably, a drive plate is screwed onto the piston rod end at the bottom of the cylinder, and three sets of connecting plates are uniformly welded to the outer circumference of the drive plate, with the ends of the three sets of connecting plates fixedly connected to the outer circumference of the lifting plate.

[0009] Preferably, three sets of guide pillars are evenly installed on the surface of the lifting plate, and the tops of the three sets of guide pillars are all inserted into the three sets of guide holes opened on the surface of the central disk. The lifting plate is arranged in a ring, and the axial cross-sections of the driving plate, the lifting plate and the central disk are concentric circles.

[0010] Preferably, three sets of positioning pins are evenly screwed onto the bottom surface of the lifting plate, and a positioning seat is provided at the bottom of the positioning pin. The positioning pin is inserted into the interior of the positioning seat and fixedly connected by hexagonal socket head cap screws.

[0011] Preferably, the three sets of positioning seats are centrally symmetrical about the central axis of the lifting plate, and the loading trays at the bottom of the three sets of positioning seats are all circular. At the same time, the wafer body at the bottom of the loading tray covers the surface of the polishing pad and is polished by the polishing pad during the rotation process.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. This utility model features a wafer body mounted on the bottom of three sets of carrier trays. The piston rod of the cylinder drives the carrier trays downwards via a drive plate, positioning column, and positioning seat, where polishing is performed by a polishing pad during rotation. Simultaneous polishing of all three wafer bodies can be performed at once, meaning that the number of wafers processed in the same amount of time is three times that of polishing one wafer at a time. This significantly increases the wafer output speed on the production line, shortens the production cycle, and meets the growing market demand for wafers, fulfilling the actual needs of the factory.

[0014] 2. This utility model has three sets of guide columns, each with its top inserted into the surface of the central disk and three sets of guide holes. These guide holes can limit and guide the lifting plate during lifting, ensuring the stability of the lifting plate during lifting. This allows the downward-moving wafer body (59) to be accurately and tightly attached to the surface of the polishing pad (4), and to perform uniform and sufficient polishing on the wafer body (59). Attached Figure Description

[0015] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0016] Figure 2 for Figure 1 A bottom view;

[0017] Figure 3 for Figure 1 Top view;

[0018] Figure 4 This is a schematic diagram of the polishing assembly.

[0019] The following are the labels in the diagram: 1. Polishing machine body; 2. Polishing table; 3. Polishing substrate; 4. Polishing pad; 5. Polishing assembly; 50. Fixing frame; 501. Support column; 51. Cylinder; 52. Center plate; 53. Guide column; 54. Lifting plate; 55. Drive plate; 56. Positioning column; 57. Positioning seat; 58. Carrying tray; 59. Wafer body. Detailed Implementation

[0020] Please see Figure 1-4 This utility model provides a novel polishing machine for wafer processing, including a polishing machine body 1. A drive motor is fixedly installed at the bottom of the polishing machine body 1, and a polishing table 2 is fixedly installed on the surface of the polishing machine body 1. A polishing substrate 3 is movably installed inside the polishing table 2, and the polishing substrate 3 is driven by the drive motor fixed at the bottom of the polishing machine body 1. A polishing pad 4 is adhered to the surface of the polishing substrate 3, and a polishing assembly 5 is arranged above the polishing pad 4. The polishing assembly 5 includes a support column 501 screwed to the surface of the polishing table 2, and a fixing frame 50 is fixedly installed at the top of the support column 501. A center plate 52 is fixedly installed at the end of the fixing frame 50. Three sets of wafer bodies 59 are respectively covered on the surface of the polishing pad 4, and the three sets of wafer bodies 59 are respectively adhered to the bottom of three sets of carrier plates 58.

[0021] Working Principle: During operation, the wafer body 59 is first attached to the bottom of the carrier tray 58. All three carrier trays 58 have wafer bodies 59 at their bottoms. The piston rod of the cylinder 51 then drives the carrier tray 58 downwards via the drive plate 55, positioning post 56, and positioning seat 57. This causes the wafer body 59 at the bottom of the carrier tray 58 to cover the upper surface of the polishing pad 4, and the polishing pad 4 performs polishing during rotation. Three wafer bodies 59 can be polished simultaneously at once, meaning that the number of wafers processed in the same amount of time is three times that of polishing one wafer at a time. This significantly increases the wafer output speed on the production line, shortens the production cycle, and meets the growing market demand for wafers. In large-scale integrated circuit manufacturing, efficient wafer processing can accelerate chip production and enhance a company's competitiveness. For polishing machines, the preparation time for each processing cycle, such as equipment preheating and parameter adjustment, and the cleaning time after completion are relatively fixed. Processing three wafers at once fully utilizes these fixed times, reducing equipment idle time and improving equipment utilization.

[0022] When the central disk 52 is working, three sets of fixing brackets 50 are provided on its outer side. The fixing brackets 501 at the bottom of the three sets of fixing brackets 50 are used for support and fixation to ensure the stability of the polishing component 5 during operation. When the lifting plate 54 is raised and lowered, the tops of the three sets of guide pillars 53 on it are inserted into the three sets of guide holes on the surface of the central disk 52. The lifting plate 54 can be limited and guided during the raising and lowering process to ensure the stability of the lifting plate 54 during the raising and lowering process. After the wafer body 59 is polished, the carrier disk 58 and the wafer body 59 move upward under the action of the cylinder 51, so that the bolts screwed on the positioning seat 57 can be removed. After the carrier disk 58 is removed, the wafer body 59 attached to the bottom of the carrier disk 58 can be removed by heat melting.

[0023] The central disk 52 is a circular structure made of metal, and a cylinder 51 is fixedly installed in the center of the surface of the central disk 52. At the same time, three sets of equidistant arc-shaped openings are evenly opened on the surface of the central disk 52.

[0024] In a preferred embodiment, a drive plate 55 is screwed onto the piston rod end at the bottom of the cylinder 51, and three sets of connecting plates are uniformly welded to the outer circumference of the drive plate 55. At the same time, the ends of the three sets of connecting plates are fixedly connected to the outer circumference of the lifting plate 54.

[0025] Three sets of guide posts 53 are evenly installed on the surface of the lifting plate 54, and the tops of the three sets of guide posts 53 are inserted into the three sets of guide holes on the surface of the central disk 52. The lifting plate 54 is arranged in a ring, and the axial cross-sections of the driving plate 55, the lifting plate 54 and the central disk 52 are concentric circles.

[0026] In a preferred embodiment, three sets of positioning posts 56 are evenly screwed onto the bottom surface of the lifting plate 54, and a positioning seat 57 is provided at the bottom of the positioning post 56. The positioning post 56 is inserted into the interior of the positioning seat 57 and fixedly connected by hexagonal socket head cap screws.

[0027] The three sets of positioning seats 57 are centrally symmetrical about the central axis of the lifting plate 54, and the loading trays 58 at the bottom of the three sets of positioning seats 57 are all circular. At the same time, the wafer body 59 at the bottom of the loading tray 58 covers the surface of the polishing pad 4 and is polished by the polishing pad 4 during the rotation process.

Claims

1. A novel polishing machine for wafer processing, comprising a polishing machine body (1), characterized in that: A drive motor is fixedly installed at the bottom of the polishing machine body (1), and a polishing table (2) is fixedly installed on the surface of the polishing machine body (1). A polishing substrate (3) is movably installed inside the polishing table (2), and the polishing substrate (3) is driven by the drive motor fixed at the bottom of the polishing machine body (1). A polishing pad (4) is adhered to the surface of the polishing substrate (3), and a polishing assembly (5) is provided above the polishing pad (4). The polishing assembly (5) includes a support column (501) screwed to the surface of the polishing table (2), and a fixing frame (50) is fixedly installed on the top of the support column (501). A center plate (52) is fixedly installed at the end of the fixing frame (50). The surface of the polishing pad (4) is covered with three sets of wafer bodies (59), and the three sets of wafer bodies (59) are respectively adhered to the bottom of three sets of carrier plates (58).

2. The novel polishing machine for wafer processing according to claim 1, characterized in that: The central disk (52) is a circular structure made of metal, and a cylinder (51) is fixedly installed in the center of the surface of the central disk (52). At the same time, three sets of equidistant arc-shaped openings are evenly opened on the surface of the central disk (52).

3. The novel polishing machine for wafer processing according to claim 2, characterized in that: The piston rod end at the bottom of the cylinder (51) is screwed with a drive plate (55), and three sets of connecting plates are uniformly welded on the outer circumference of the drive plate (55). At the same time, the ends of the three sets of connecting plates are fixedly connected to the outer circumference of the lifting plate (54).

4. A novel polishing machine for wafer processing according to claim 3, characterized in that: The surface of the lifting plate (54) is uniformly equipped with three sets of guide pillars (53), and the tops of the three sets of guide pillars (53) are inserted into the three sets of guide holes on the surface of the central disk (52). The lifting plate (54) is arranged in a ring, and the axial cross-section of the driving plate (55), the lifting plate (54) and the central disk (52) is a concentric circle structure.

5. A novel polishing machine for wafer processing according to claim 4, characterized in that: The bottom surface of the lifting plate (54) is evenly screwed with three sets of positioning pins (56), and the bottom of the positioning pins (56) is provided with a positioning seat (57). At the same time, the positioning pins (56) are inserted into the interior of the positioning seat (57) and fixedly connected by hexagonal bolts.

6. A novel polishing machine for wafer processing according to claim 5, characterized in that: The three positioning seats (57) are centrally symmetrical about the central axis of the lifting plate (54), and the loading trays (58) at the bottom of the three positioning seats (57) are all circular. At the same time, the wafer body (59) at the bottom of the loading tray (58) covers the surface of the polishing pad (4) and is polished by the polishing pad (4) during the rotation process.

Images