Anti-irradiation performance detection system

Abstract

The utility model discloses an anti-irradiation performance detection system which comprises irradiation equipment and a low-temperature and low-humidity test device, the irradiation equipment is used for emitting a high-energy proton beam to the sample; the low-temperature and low-humidity test device comprises an experiment box, a cooling module and a dehumidifying module. The cooling module is composed of a double-layer semiconductor chilling plate, a water cooling head, an L-shaped graphite flake and a water cooling machine; the cold end of the double-layer semiconductor chilling plate is in contact with the L-shaped graphite flake, and a sample is adhered to the L-shaped graphite flake; the hot end of the double-layer semiconductor chilling plate is in contact with the water cooling head; the cooling-water machine is used for providing cold water for the water-cooling head; the humidity reduction module comprises an air compressor and a dryer and is used for reducing the air humidity in the experiment box. According to the utility model, a better cooling effect is achieved through refrigeration of the double-layer semiconductor refrigeration sheet and water-cooling heat dissipation at the same time; the humidity in the experiment box is reduced by dry air generated by the humidity reduction module, so that a low-temperature and low-humidity experiment environment is provided for the sample.

Description

Technical Field

[0001] This utility model relates to the field of radiation detection technology, and in particular to a radiation resistance performance testing system. Background Technology

[0002] The Large Hadron Collider (LHC) is a high-energy physics facility that accelerates and collides protons. Before mass production, the detectors used on the LHC require radiation resistance testing. This process involves slicing the sensors on the detector, irradiating the sliced ​​samples under a high-energy proton beam, and then performing relevant performance tests on the irradiated samples. During the irradiation process, the samples must be kept in a low-temperature, low-humidity experimental environment, while simultaneously meeting dew point calculation requirements to ensure that the sample surface does not freeze.

[0003] To achieve the low temperature and low humidity requirements during sensor irradiation experiments, liquid nitrogen is typically used to control temperature and humidity, or semiconductor cooling is employed. In liquid nitrogen cooling for humidity reduction, liquid nitrogen is introduced into the experimental chamber, and the temperature and humidity within the chamber are controlled by a temperature and humidity control module. This method is characterized by its wide applicability, high control precision, and low cost, but it carries the risk of liquid nitrogen leakage and is difficult to maintain. Furthermore, after the proton beam is activated for irradiation detection, the sample needs to be placed in an underground tunnel with a high ambient dose (greater than 300 μSv / h) for one week. During the experiment, personnel are prohibited from entering the tunnel. If the liquid nitrogen runs out during the experiment, personnel cannot enter the tunnel in time to replace it, reducing maintenance efficiency. Regarding semiconductor cooling solutions, Chinese patent CN202322996649.0 discloses a semiconductor cooling system installation structure that utilizes the Peltier effect of semiconductor devices for cooling, while simultaneously employing air cooling to dissipate heat from the semiconductor devices. This experimental setup is lightweight and highly reliable; however, the cooling capacity of this semiconductor cooling solution is limited and cannot meet the experimental requirements. Therefore, the existing experimental environment is insufficient to meet the experimental requirements for testing the radiation resistance of sliced ​​samples of sensors. Utility Model Content

[0004] This invention provides a radiation resistance performance testing system to solve the technical problem that existing experimental environments are insufficient to meet the experimental requirements for testing the radiation resistance performance of sliced ​​samples from sensors.

[0005] This utility model provides a radiation resistance performance testing system, comprising: an irradiation device and a low temperature and low humidity testing device;

[0006] Irradiation equipment used to emit high-energy proton beams onto samples;

[0007] The low temperature and low humidity test device includes an experimental chamber, a cooling module, and a dehumidification module;

[0008] The cooling module is mounted on the experimental chamber; the cooling module consists of a double-layer semiconductor cooling chip, a water cooling head, an L-shaped graphite sheet, and a cooling water system;

[0009] The cold end of the double-layer semiconductor refrigeration chip is in contact with the L-shaped graphite sheet, and the sample is adhered to the L-shaped graphite sheet; the hot end of the double-layer semiconductor refrigeration chip is in contact with the water-cooling head; the chiller is used to provide cold water to the water-cooling head;

[0010] The dehumidification module includes an air compressor and a dryer, used to reduce the air humidity inside the experimental chamber.

[0011] Furthermore,

[0012] The cooling module also includes a pressure block and a clamp;

[0013] The pressure block is disposed on the L-shaped graphite sheet and is used to press the L-shaped graphite sheet and the double-layer semiconductor refrigeration sheet together.

[0014] The clamp is disposed at the bottom of the water cooling head and is used to support the water cooling head;

[0015] Both the clamping block and the clamp are detachably connected to the experimental box via a nut assembly.

[0016] Furthermore,

[0017] Thermal grease is applied between the cold end of the double-layer semiconductor refrigeration chip and the L-shaped graphite sheet.

[0018] Thermal grease is applied between the hot end of the double-layer semiconductor cooling chip and the water cooling head.

[0019] Furthermore,

[0020] The bottom of the water cooling head is provided with an inlet and an outlet on both sides, and both the inlet and the outlet are connected to the chiller.

[0021] Furthermore, the number of L-shaped graphite sheets is 2;

[0022] Both L-shaped graphite sheets have square frames to provide an adhesion area for the sample.

[0023] Furthermore, the low temperature and low humidity test device also includes a support for supporting the test chamber;

[0024] The experimental chamber has a front window and a rear window.

[0025] The linear accelerator of the irradiation equipment is equipped with a vacuum test point and an atmospheric test point. The experimental chamber is placed in the atmospheric test point, so that the high-energy proton beam emitted from the linear accelerator pipe passes through the front window and the rear window.

[0026] Furthermore, the dehumidification module also includes an air filter;

[0027] The air filter, the air compressor, and the dryer are connected in sequence.

[0028] Furthermore, the low temperature and low humidity test device also includes: a temperature and humidity detection module and a thermometer;

[0029] The experimental chamber is equipped with an air inlet and a probe inlet;

[0030] The air output pipe of the dryer is connected to the air inlet.

[0031] The probe assembly of the temperature and humidity detection module extends into the experimental chamber through the probe inlet to monitor the air temperature and humidity inside the experimental chamber.

[0032] The temperature probe of the thermometer extends into the vicinity of the sample through the probe inlet to monitor the surface temperature of the sample.

[0033] Furthermore,

[0034] The experimental chamber is made of acrylic sheet;

[0035] Both the front window and the rear window are sealed with polyimide film.

[0036] Furthermore,

[0037] The specific model of the semiconductor cooling chip is TEC2-19006;

[0038] The specific model of the chiller is HS1500-LAS1-001A;

[0039] The specific model of the air compressor is DQE1380x2-55L;

[0040] The dryer is specifically model YDS1B.

[0041] As can be seen from the above technical solutions, this utility model has the following advantages:

[0042] This invention provides a radiation resistance performance testing system, comprising: an irradiation device and a low-temperature and low-humidity testing apparatus; the irradiation device is used to emit a high-energy proton beam onto the sample; the low-temperature and low-humidity testing apparatus includes an experimental chamber, a cooling module, and a dehumidification module; the cooling module is mounted on the experimental chamber; the cooling module consists of a double-layer semiconductor refrigeration chip, a water-cooling head, an L-shaped graphite sheet, and a chiller; the cold end of the double-layer semiconductor refrigeration chip is in contact with the L-shaped graphite sheet, and the sample adheres to the L-shaped graphite sheet; the hot end of the double-layer semiconductor refrigeration chip is in contact with the water-cooling head; the chiller is used to provide cold water to the water-cooling head; the dehumidification module includes an air compressor and a dryer, used to reduce the air humidity inside the experimental chamber.

[0043] In this invention, a dual-layer thermoelectric cooler combined with water cooling provides more efficient heat dissipation from the thermoelectric cooler, thus maximizing its cooling effect. Dry air is generated by an air compressor and dryer to reduce humidity within the experimental chamber, preventing icing on the sample surface and minimizing proton beam scattering. The low-temperature, low-humidity experimental device is easy to operate and maintain, and highly safe. It can operate stably for extended periods even under high ambient radiation levels. Furthermore, the compact and lightweight experimental chamber is suitable for underground tunnel environments, solving the technical problem that existing experimental environments cannot meet the requirements for testing the radiation resistance of sensor slices. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This application provides an overall structural schematic diagram of a radiation resistance performance testing system.

[0046] Figure 2 This is a schematic diagram of the cooling module provided in this application;

[0047] Figure 3 This is a structural connection diagram of the dehumidification module provided in this application;

[0048] The attached diagram is labeled as follows: 1. Experimental chamber; 2. Air inlet; 3. Probe inlet; 4. Support; 5. Front window; 6. Rear window; 7. Double-layer semiconductor cooling chip; 8. Water cooling head; 9. L-shaped graphite sheet; 10. Press block; 11. Fixture; 12. Air filter; 13. Air compressor; and 14. Dryer. Detailed Implementation

[0049] This utility model provides a radiation resistance performance testing system to solve the technical problem that existing experimental environments are difficult to meet the experimental requirements for testing the radiation resistance performance of sliced ​​samples of sensors.

[0050] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0051] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0052] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0053] Please see Figure 1-Figure 3 An embodiment of a radiation resistance performance testing system provided in this application includes: an irradiation device and a low temperature and low humidity testing device;

[0054] Irradiation equipment used to emit high-energy proton beams onto samples;

[0055] The low temperature and low humidity test device includes test chamber 1, cooling module and dehumidification module;

[0056] The cooling module is installed on the experimental chamber 1 to provide a low-temperature environment for the sample;

[0057] The cooling module consists of a double-layer semiconductor cooling chip 7, a water cooling head 8, an L-shaped graphite sheet 9, and a cooling mechanism;

[0058] The cold end of the double-layer semiconductor refrigeration chip 7 is in contact with the L-shaped graphite sheet 9, and the sample adheres to the L-shaped graphite sheet 9; the hot end of the double-layer semiconductor refrigeration chip 7 is in contact with the water cooling head 8; the chiller is used to provide cold water to the water cooling head 8;

[0059] The dehumidification module includes an air compressor 13 and a dryer 14, which are used to reduce the air humidity inside the experimental chamber 1.

[0060] It should be noted that when testing the radiation resistance of sensor slice samples, the samples need to be in an experimental environment with a temperature below -20°C and a relative humidity below 10%. The irradiation equipment can be the accompanying proton beam experimental device at the China Spallation Neutron Source, which can emit high-energy proton beams.

[0061] Among them, the double-layer semiconductor cooling chip 7 is composed of two layers of N-type and P-type semiconductor materials. Using the double-layer semiconductor cooling chip 7 for cooling can achieve a lower temperature than the single-layer semiconductor cooling chip, which meets the experimental requirements of low-temperature irradiation of sensor slice samples.

[0062] The working principle of a thermocouple is that when current flows through a thermocouple pair consisting of an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, creating a temperature difference that forms a hot and cold junction. Therefore, it only requires a continuous power supply to operate, has no risk of leakage, and has a simple structure and low failure rate, requiring only routine maintenance by laboratory personnel.

[0063] When using thermoelectric coolers, attention should be paid to heat dissipation at the hot end. Generally, the temperature of the hot side of the thermoelectric cooler should not exceed 60°C, otherwise damage may occur. Under the rated operating voltage (12V), ordinary cooling fans are insufficient to provide adequate heat dissipation for the cooler, easily causing overheating and damage. To better dissipate heat from the thermoelectric cooler and achieve a lower temperature at the cold end, this cooling module uses water cooling.

[0064] To achieve a cooling effect, this invention employs a dual-layer semiconductor refrigeration chip 7 combined with water cooling for more efficient heat dissipation from the semiconductor refrigeration chip, thus making fuller use of its cooling effect. To achieve a dehumidification effect, dry air is generated by an air compressor 13 and a dryer 14, reducing the humidity inside the experimental chamber 1 and ensuring that ice does not form on the sample surface, thereby reducing proton beam scattering. This low-temperature, low-humidity experimental device can provide the sample with a low-temperature environment (minus 28.5°C) that differs from room temperature (22.5°C) by 51°C, while maintaining a relative humidity of 3.6%.

[0065] In addition, attaching the sample to the L-shaped graphite sheet 9 can greatly reduce the residual dose in the experimental chamber 1 after irradiation, effectively reducing the radiation damage caused to the experimenters when removing the sample after the experiment, and providing safety for the experimenters.

[0066] The low-temperature and low-humidity testing device provided by this invention is easy to operate and maintain, and highly safe. It can still work stably for a long time in environments with high environmental doses. At the same time, the test chamber 1 is compact and lightweight, making it suitable for underground tunnel environments. The low-temperature and low-humidity testing device provides a low-temperature and low-humidity experimental environment for samples, which can further reduce the harm to the experimenters and also meet the experimental requirements of irradiation equipment to test the radiation resistance performance of samples.

[0067] In one specific embodiment, the cooling module further includes a pressure block 10 and a clamp 11;

[0068] The pressure block 10 is set on the L-shaped graphite sheet 9 to press the L-shaped graphite sheet 9 and the double-layer semiconductor cooling chip 7 together; the clamp 11 is set at the bottom of the water cooling head 8 to support the water cooling head 8; the clamp block and the clamp 11 are detachably connected to the experimental box 1 through the nut assembly.

[0069] It should be noted that you should refer to [link / reference]. Figure 1 and Figure 2 The bottom of the experimental chamber 1 has multiple screw holes and channels allowing the protrusions of the pressure block 10 to pass through. During assembly, the pressure block 10 is first placed on the channel of the experimental chamber 1. Then, the pressure block 10, the horizontal end of the L-shaped ink sheet, the double-layer thermoelectric cooler 7, and the water-cooling head 8 are stacked sequentially on top of the fixture 11. The fixture 11 is then fixedly connected to the experimental chamber 1 using a nut assembly to prevent movement during operation. After the pressure block 10 presses down on the horizontal end of the L-shaped ink sheet and the double-layer thermoelectric cooler 7, the pressure block 10 is fixedly connected to the experimental chamber 1 using the nut assembly. It is understood that the bottom surface of the horizontal end of the L-shaped ink sheet and the upper surface of the double-layer thermoelectric cooler 7 have the same area. Furthermore, the pressure block 10 and the fixture 11 can be fabricated using 3D printing technology.

[0070] In one specific embodiment, thermal grease is applied between the cold end of the double-layer semiconductor refrigeration chip 7 and the L-shaped graphite sheet 9; thermal grease is also applied between the hot end of the double-layer semiconductor refrigeration chip 7 and the water cooling head 8.

[0071] Understandably, thermal grease is used to enhance thermal conductivity to accelerate heat transfer and maintain temperature balance. Thermal grease is applied between the cold end of the double-layer thermoelectric cooler 7 and the L-shaped graphite sheet 9 to accelerate the transfer of heat from the L-shaped graphite sheet 9 to the cold end of the double-layer thermoelectric cooler 7. Thermal grease is applied between the hot end of the double-layer thermoelectric cooler 7 and the water cooling head 8 to accelerate the transfer of heat from the hot end of the double-layer thermoelectric cooler 7 to the water cooling head 8 and maintain the temperature of the hot end of the double-layer thermoelectric cooler 7.

[0072] In one specific embodiment, the bottom of the water cooling head 8 is provided with an inlet and an outlet on both sides, and both the inlet and outlet are connected to the chiller.

[0073] It should be noted that this utility model uses water cooling to dissipate the heat generated by the semiconductor refrigeration chip. Specifically, the chiller's refrigeration system cools the water in its internal water tank and then injects the low-temperature chilled water into the inlet of the water cooling head 8. The low-temperature water carries away the heat from the hot end of the semiconductor refrigeration chip, while the high-temperature water flows into the chiller through the outlet. The high-temperature water is then returned to the water tank twice for cooling. This circulating water exchange cooling improves the heat dissipation effect of the hot end of the semiconductor refrigeration chip.

[0074] In one specific embodiment, the number of L-shaped graphite sheets 9 is 2; both L-shaped graphite sheets 9 have square openings to provide an adhesion area to the sample.

[0075] It should be noted that this invention uses polyimide film tape to adhere the sample within the frame of the L-shaped graphite sheet 9. This ensures that the sample adheres well, minimizing obstacles in the beam-sample direction and improving the effectiveness of radiation detection. Simultaneously, placing two L-shaped graphite sheets 9 sequentially on the double-layer semiconductor cooling chip 7 enhances the stability of sample adhesion. By fixing the irradiation experiment sample with graphite sheets, and utilizing the excellent thermal conductivity of graphite sheets and the rapid decay of irradiated products, the residual dose within the experimental chamber 1 after irradiation is significantly reduced, further ensuring the safety and health of experimental personnel.

[0076] In one specific embodiment, the low temperature and low humidity test device also includes a support 4 for supporting the test chamber 1; the test chamber 1 has a front window 5 and a rear window 6, and the irradiation equipment is placed in front of the test chamber 1 so that the high-energy proton beam emitted by it passes through the rear window 6 through the front window 5.

[0077] It should be noted that the linear accelerator of the irradiation equipment is equipped with a vacuum test point and an atmospheric test point. The experimental chamber 1 is placed in the atmospheric test point, so that the high-energy proton beam emitted from its linear accelerator pipe passes through the front window 5 and the rear window 6.

[0078] In one specific embodiment, the dehumidification module further includes an air filter 12; the air filter 12, the air compressor 13, and the dryer 14 are connected in sequence.

[0079] It should be noted that the air filter 12 is used to remove large particulate impurities from the air, protecting the internal components of the air compressor 13 from damage. In the dehumidification module, outside air enters the air compressor 13 through the air filter 12. Inside the air compressor 13, the air is compressed to increase its pressure. Due to the high temperature of the compressed air, it usually needs to be cooled by a cooler (the air compressor 13 is equipped with a cooler). During the cooling process, some water vapor in the air condenses into liquid water, which is removed by a separator. Finally, the compressed air enters the dryer 14 for further removal of moisture and other impurities. The dryer 14 utilizes the principle of pressure swing adsorption; when humid air passes through the adsorbent, the moisture is adsorbed by the adsorbent, resulting in dry air.

[0080] In one specific embodiment, the low temperature and low humidity test device further includes: a temperature and humidity detection module and a thermometer;

[0081] The experimental chamber 1 has an air inlet 2 and a probe inlet 3; the air output pipe of the dryer 14 is connected to the air inlet 2; the probe assembly of the temperature and humidity detection module extends into the experimental chamber 1 through the probe inlet 3 to monitor the air temperature and humidity inside the experimental chamber 1; the temperature probe of the thermometer extends into the vicinity of the sample through the probe inlet 3 to monitor the surface temperature of the sample.

[0082] It should be noted that this system also includes a display screen to show the air temperature and humidity inside experimental chamber 1 and the surface temperature of the sample. The dehumidification module adjusts its operation based on the air temperature and humidity inside experimental chamber 1 to ensure that the air temperature and humidity inside chamber 1 meet the dew point calculation requirements, thereby preventing icing on the sample surface and reducing proton beam scattering.

[0083] In one specific embodiment, the experimental chamber 1 is made of acrylic sheet; the front window 5 and the rear window 6 are both sealed with polyimide film, which can reduce the scattering and attenuation of the proton beam during irradiation.

[0084] In one specific embodiment, the thermoelectric cooler is model TEC2-19006, with a maximum temperature difference of 75°C, a maximum cooling capacity of 56W, and a recommended operating voltage of 12V; the chiller is model HS1500-LAS1-001A(0.5HP), with a cooling capacity of 1.5kW and a temperature control range of 5-40°C (adjustable).

[0085] The air compressor 13 is specifically model DQE1380x2-55L, with a discharge capacity of 140L / min. The dryer 14 is specifically model YDS1B, a quick-change micro adsorption dryer 14 with a gas processing capacity of 0.3m³ / min. This model of dryer 14 is currently the smallest capacity refrigerated dryer 14 in China.

[0086] The radiation resistance testing system provided by this utility model has the following advantages:

[0087] 1) Using a double-layer semiconductor cooling chip for cooling can achieve a lower temperature than a single-layer semiconductor cooling chip, which meets the experimental requirements for low-temperature irradiation of sensor slice samples.

[0088] 2) In order to better dissipate heat from the thermoelectric cooler, a chiller combined with a water cooling head is used to provide low-temperature water to the hot end of the thermoelectric cooler for heat dissipation, thereby enabling the cold end of the thermoelectric cooler to reach the lowest temperature within its operating range.

[0089] 3) By fixing the irradiation experiment samples with graphite sheets, the good thermal conductivity of graphite sheets and the rapid decay of irradiation products can be used to greatly reduce the residual dose in the experimental chamber after irradiation, further ensuring the safety and health of the experimental personnel.

[0090] 4) The humidity of the experimental chamber is reduced by generating dry air through an air compressor and dryer, so that the humidity of the gas in the experimental chamber meets the dew point calculation and no icing occurs. This method reduces the scattering of the proton beam and has the characteristics of low cost and high reliability.

[0091] The operation process of the radiation resistance testing system provided by this utility model is as follows:

[0092] 1) The assembled experimental chamber is placed at the atmospheric test point of the linear accelerator in the underground tunnel using a bracket, and the linear accelerator pipes of the irradiation equipment are distributed in front of the front window and behind the rear window of the experimental chamber.

[0093] 2) The sample is fixed by attaching it to the frame of the L-shaped ink film with polyimide film adhesive.

[0094] 3) First, start the dehumidification module until the relative humidity of the air drops below 10%, then start the cooling module to reduce the amount of moisture remaining in the test chamber until the temperature and humidity of the sample environment meet the experimental requirements.

[0095] 4) The pipeline of the associated proton beam experimental device (irradiation equipment) of the China Spallation Neutron Source emits a high-energy proton beam. The high-energy proton beam enters through the front window of the experimental chamber and irradiates the sample fixed on the graphite sheet. It exits from the rear window of the experimental chamber and reaches the waste beam station through the linear accelerator pipeline to realize the radiation resistance test of the sample.

[0096] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A radiation resistance performance testing system, characterized in that, include: Irradiation equipment and low-temperature and low-humidity testing devices; Irradiation equipment used to emit high-energy proton beams onto samples; The low temperature and low humidity test device includes an experimental chamber, a cooling module, and a dehumidification module; The cooling module is mounted on the experimental chamber; the cooling module consists of a double-layer semiconductor cooling chip, a water cooling head, an L-shaped graphite sheet, and a cooling water system; The cold end of the double-layer semiconductor refrigeration chip is in contact with the L-shaped graphite sheet, and the sample is adhered to the L-shaped graphite sheet; the hot end of the double-layer semiconductor refrigeration chip is in contact with the water-cooling head; the chiller is used to provide cold water to the water-cooling head; The dehumidification module includes an air compressor and a dryer, used to reduce the air humidity inside the experimental chamber.

2. The radiation resistance testing system according to claim 1, characterized in that, The cooling module also includes a pressure block and a clamp; The pressure block is disposed on the L-shaped graphite sheet and is used to press the L-shaped graphite sheet and the double-layer semiconductor refrigeration sheet together. The clamp is disposed at the bottom of the water cooling head and is used to support the water cooling head; Both the pressure block and the clamp are detachably connected to the experimental box via a nut assembly.

3. The radiation resistance testing system according to claim 1, characterized in that, Thermal grease is applied between the cold end of the double-layer semiconductor refrigeration chip and the L-shaped graphite sheet. Thermal grease is applied between the hot end of the double-layer semiconductor cooling chip and the water cooling head.

4. The radiation resistance testing system according to claim 1, characterized in that, The bottom of the water cooling head is provided with an inlet and an outlet on both sides, and both the inlet and the outlet are connected to the chiller.

5. The radiation resistance testing system according to claim 1, characterized in that, The number of L-shaped graphite sheets is 2; Both L-shaped graphite sheets have square frames to provide an adhesion area for the sample.

6. The radiation resistance testing system according to claim 1, characterized in that, The low temperature and low humidity test device also includes a support frame for supporting the test chamber; The experimental chamber has a front window and a rear window. The irradiation device is placed in front of the experimental chamber, so that the high-energy proton beam emitted by it passes through the rear window from the front window.

7. The radiation resistance testing system according to claim 1, characterized in that, The dehumidification module also includes an air filter; The air filter, the air compressor, and the dryer are connected in sequence.

8. The radiation resistance testing system according to claim 1, characterized in that, The low-temperature and low-humidity test device also includes: a temperature and humidity detection module and a thermometer; The experimental chamber is equipped with an air inlet and a probe inlet; The air output pipe of the dryer is connected to the air inlet; The probe assembly of the temperature and humidity detection module extends into the experimental chamber through the probe inlet to monitor the air temperature and humidity inside the experimental chamber. The temperature probe of the thermometer extends into the vicinity of the sample through the probe inlet to monitor the surface temperature of the sample.

9. The radiation resistance testing system according to claim 6, characterized in that, The experimental chamber is made of acrylic sheet; Both the front window and the rear window are sealed with polyimide film.

10. The radiation resistance testing system according to claim 1, characterized in that, The specific model of the semiconductor cooling chip is TEC2-19006; The specific model of the chiller is HS1500-LAS1-001A; The specific model of the air compressor is DQE1380x2-55L; The dryer is specifically model YDS1B.

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