Optical module

Abstract

The embodiment of the utility model discloses an optical module, the optical module comprises a substrate, an array waveguide grating assembly and a supporting assembly, and the substrate is provided with a first surface; the array waveguide grating assembly comprises a substrate layer and a waveguide layer which are stacked, the waveguide layer is provided with an array waveguide grating, the waveguide layer faces the first surface of the substrate, and the substrate layer is opposite to the first surface; the supporting assembly is connected with the substrate layer of the array waveguide grating assembly to support the array waveguide grating assembly, and the array waveguide grating assembly is suspended on the first surface of the substrate through the supporting assembly. According to the application, the array waveguide grating assembly is indirectly fixed on the substrate through the supporting assembly, so that the array waveguide grating assembly is suspended on the first surface of the substrate, and the array waveguide grating assembly is not directly fixed with the substrate; the problem of cracking of the array waveguide grating assembly caused by mismatching of thermal expansion coefficients of the substrate and the array waveguide grating assembly is avoided, and the reliability of the optical module is effectively improved.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] An arrayed waveguide grating (AWG) is a planar waveguide device used for wavelength division multiplexing and demultiplexing. It is typically used at the receiving or transmitting end of an optical module to perform multiplexing and demultiplexing of multiple optical paths.

[0003] like Figure 1 As shown, the arrayed waveguide grating assembly 30' typically has a three-layer structure, including a stacked base layer 31' and a waveguide layer 33', and a cover plate 32' covering the waveguide layer 33'. The cover plate 32' usually serves as the supporting bottom of the arrayed waveguide grating assembly 30', used for bonding and fixing to other substrates. The cover plate 32' does not completely cover the waveguide layer 33' to avoid the optical ports at the waveguide ends. When coupling the arrayed waveguide grating assembly in an optical module, the optical ports of the waveguide layer need to be aligned and coupled with the optical chip (e.g., a photodiode at the receiving end or a light-emitting chip at the transmitting end). After determining the position, the cover plate of the arrayed waveguide grating assembly is fixed to the bottom substrate using adhesive.

[0004] Figure 2 A schematic diagram of an optical module is shown, omitting the module's housing. The optical module includes a circuit board 3 and an optical receiver chip 1 that receives optical signals transmitted from an optical fiber 2 via an arrayed waveguide grating assembly 30'. Both the optical receiver chip 1 and the arrayed waveguide grating assembly 30' are fixed to the circuit board 3. The positional relationship between the receiving-end arrayed waveguide grating assembly 30' and the optical receiver chip 1 is shown below. Figure 2 As shown, the end of the arrayed waveguide grating assembly 30' has an inclined reflective surface (such as...). Figure 1 As shown), the optical port of waveguide layer 33' is located at the tilted reflective surface, and the optical receiving chip 1 (e.g., a photodiode) is located below the tilted reflective surface. The light output from the optical port of waveguide layer 33' is reflected by the tilted reflective surface and then enters the optical receiving chip 1. The optical receiving chip 1 is electrically connected to the functional circuit chip 4, converts the received optical signal into an electrical signal, and transmits it to the functional circuit chip 4.

[0005] Arrayed waveguide grating (AWFR) components have a complex structure, fabricated using semiconductor processes to create a substrate and waveguide layer. The substrate, being relatively thick, serves as the base material for the waveguide layer and is commonly made of Si or SiO2. The waveguide layer, typically SiO2, is very thin, approximately 20µm, and contains the grating, where light is split or combined. The cover plate is the direct contact layer for bonding and is also typically made of SiO2. The three-layer structure of the AWFR requires a high degree of CTE (Coefficient of Thermal Expansion) matching between the layers; otherwise, cracks are likely to appear during TCT (Temperature Cycling Test). Furthermore, the cover plate is directly bonded to the substrate with adhesive, which can also lead to cracking of the waveguide layer or cover plate due to CTE mismatch. Utility Model Content

[0006] Embodiments of this application provide an optical module to solve the problem that arrayed waveguide grating components are prone to cracking due to CTE mismatch in the prior art.

[0007] To address the aforementioned technical problems, embodiments of this application disclose the following technical solutions:

[0008] According to a first aspect of this application, an optical module is provided, comprising: a substrate having a first surface; an arrayed waveguide grating assembly including a stacked base layer and a waveguide layer, the waveguide layer having an arrayed waveguide grating, the waveguide layer facing the first surface of the substrate, and the base layer facing away from the first surface; and a support assembly connected to the base layer of the arrayed waveguide grating assembly to support the arrayed waveguide grating assembly, the arrayed waveguide grating assembly being suspended on the first surface of the substrate by the support assembly.

[0009] Furthermore, the support component is fixedly connected to the upper surface of the base layer, which is the surface of the base layer facing away from the substrate.

[0010] Furthermore, the support assembly includes an upper connector and a side support; the upper connector is fixedly connected to the upper surface of the substrate layer, the bottom surface of the side support is fixedly connected to the first surface, and the upper connector is fixedly connected to the side support, so that the upper connector and the arrayed waveguide grating assembly are suspended above the first surface by the support.

[0011] Furthermore, the upper connector is fixedly connected to the top or side surface of the side support.

[0012] Furthermore, the side support is also fixedly connected to the side of the substrate layer of the arrayed waveguide grating assembly.

[0013] Furthermore, the upper connector and the side support are fixed together by adhesive, or the upper connector and the side support are integrally formed components; the side support is fixed to the first surface of the substrate by adhesive.

[0014] Furthermore, the number of the side supports is at least two.

[0015] Furthermore, the support assembly includes a side support member, the side of which is fixedly connected to the side of the base layer.

[0016] Furthermore, the base layer is located within the interval enclosed by the at least two side supports.

[0017] Furthermore, the arrayed waveguide grating assembly also includes a cover plate disposed on the side of the waveguide layer facing away from the substrate layer and suspended above the first surface of the substrate, for protecting the waveguide layer.

[0018] Furthermore, the arrayed waveguide grating assembly is bonded and fixed to the support assembly with adhesive, and the support assembly is bonded to the first surface of the substrate with adhesive.

[0019] Furthermore, the optical module also includes an optoelectronic chip, which is used to convert optical signals into electrical signals or electrical signals into optical signals; the optoelectronic chip is disposed on the substrate and electrically connected to the substrate, and the arrayed waveguide grating assembly is optically coupled to the optoelectronic chip.

[0020] One of the above technical solutions has the following advantages or beneficial effects: the arrayed waveguide grating assembly is indirectly fixed to the substrate by the support component, so that the arrayed waveguide grating assembly is suspended above the first surface of the substrate. The arrayed waveguide grating assembly is not directly fixed to the substrate, which avoids the problem of cracking due to the mismatch of the thermal expansion coefficients of the substrate and the arrayed waveguide grating assembly, and effectively improves the reliability of the optical module. Attached Figure Description

[0021] The following detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application apparent.

[0022] Figure 1 This is a schematic diagram of an arrayed waveguide grating assembly.

[0023] Figure 2 This is a schematic diagram of the structure of an optical module;

[0024] Figure 3 This is a schematic diagram of the structure of an optical module according to an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of the structure of an optical module according to another embodiment of this application;

[0026] Figure 5 This is a schematic diagram of the connection structure between the support component and the arrayed waveguide grating component according to another embodiment of this application;

[0027] Figure 6 This is a schematic diagram of the structure of an optical module according to another embodiment of this application.

[0028] The reference numerals in the attached drawings have the following meanings: substrate 10; first surface 11; support assembly 20; upper connector 21; side support 22; arrayed waveguide grating assembly 30, 30'; base layer 31, 31'; cover plate 32, 32'; waveguide layer 33, 33'; optical receiver chip 1; optical fiber 2; circuit board 3; functional circuit chip 4 Detailed Implementation

[0029] To make the objectives, technical solutions, and beneficial effects of this application clearer, the following detailed description, in conjunction with the accompanying drawings and specific embodiments, further illustrates this application. It should be understood that the specific embodiments described in this specification are merely for explaining this application and are not intended to limit it.

[0030] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] Optical modules, a crucial component of optical communication, are core parts responsible for photoelectric and electro-optical conversion during optical signal transmission. An optical module primarily comprises optical components (such as optical transmitters and receivers), functional circuits, and optical interfaces. The optical transmitter mainly includes optical emitting chips, such as semiconductor laser chips (LDs) or optical modulators, used to convert electricity into light and as optical elements or waveguides that transmit light between the transmitter and the optical interface. The optical receiver mainly includes optical receiving chips, such as photodiodes / photomultiplier diodes (PDs / APDs), used to convert received light into electricity and as optical elements or waveguides that transmit light between the receiver and the optical interface. Both the transmitter and receiver chips are electrically connected to the functional circuits, which typically include a circuit board and electrical components mounted on it, such as controllers, signal processors, drivers, and / or amplifiers. The optical module is electrically connected to external devices via the circuit board.

[0034] During operation, the functional circuit receives commands and electrical signals from external devices (such as optical switches, servers, and other host computers). After processing the electrical signals, it drives the optical emitting chip to emit light and modulates the electrical signals onto light to convert them into optical signals. Alternatively, it drives the optical emitting chip to directly emit modulated optical signals. These signals are then transmitted to the optical interface via passive optical components such as lenses, wavelength division multiplexers, or optical waveguides. From there, they are transmitted to the remote end via external optical fibers connected to the interface, achieving electro-optical conversion and completing the information upload. The optical signals transmitted from the remote end to the near-end optical module are transmitted to the optical receiving chip via the optical interface and passive optical components such as wavelength division multiplexers, optical waveguides, or lenses. The receiving chip converts the received optical signals into electrical signals and transmits them to the functional circuit. The functional circuit processes these electrical signals and transmits them to the external device, achieving photoelectric conversion and completing the information download.

[0035] This application provides an optical module that uses an arrayed waveguide grating assembly for optical transmission and wavelength division multiplexing / demultiplexing between its optical interface and an optoelectronic chip (optical emitting chip and / or optical receiving chip). The arrayed waveguide grating assembly is fixed on a substrate 10, for example, on a circuit board, so that the optical port of its waveguide is aligned with the optoelectronic chip located on the circuit board to achieve optical coupling with the optoelectronic chip.

[0036] Specifically, this application addresses the problem in the prior art where the arrayed waveguide grating assembly 30 is directly bonded to the surface of the substrate 10, which easily leads to cracking, by providing an optical module. For example... Figure 3-6 As shown, the optical module includes a substrate 10, a support assembly 20, and an arrayed waveguide grating assembly 30. The substrate has a first surface; the arrayed waveguide grating assembly includes a stacked base layer and a waveguide layer, the waveguide layer having an arrayed waveguide grating, the waveguide layer facing the first surface of the substrate, and the base layer facing away from the first surface. The support assembly is connected to the base layer of the arrayed waveguide grating assembly to support the arrayed waveguide grating assembly, which is suspended on the first surface of the substrate via the support assembly.

[0037] The substrate 10 can be a printed circuit board (PCB). A photoelectric chip and a functional circuit chip are fixed on the first surface 11 of the substrate 10. The photoelectric chip and the functional circuit chip are electrically connected, and the functional circuit chip is then electrically connected to the substrate. During coupling, the position of the arrayed waveguide grating assembly is adjusted so that its optical port is optically aligned with the photoelectric chip for optical coupling. After adjusting the arrayed waveguide grating assembly to this coupling position, a support assembly suspends and fixes the arrayed waveguide grating assembly on the substrate, maintaining it at this coupling position.

[0038] The arrayed waveguide grating assembly is indirectly fixed to the substrate by a support component, allowing it to suspend above the first surface of the substrate. This direct fixation of the waveguide grating assembly to the substrate avoids cracking issues caused by CTE mismatch between the substrate and the waveguide grating assembly, effectively improving product reliability. Furthermore, it prevents optical module failures due to light loss caused by cracking of the waveguide grating assembly leading to misalignment of its optical port relative to the optoelectronic chip, further enhancing product stability.

[0039] It is important to note that the substrate 31, serving as the supporting material for the waveguide layer 33, has a thickness significantly greater than that of the waveguide layer 33. For example, the waveguide layer 33 can have a thickness of 20 μm. Furthermore, the substrate 31 can be made of silicon or silicon dioxide, while the waveguide layer 33 is typically made of silicon dioxide. The waveguide layer 33 is the layer containing the grating, where light is split or combined. When the arrayed waveguide grating assembly 30 is coupled to an external optical signal via a FA (Fiber Array), the waveguide layer 33 multiplexes or demultiplexes the received multi-channel optical signals.

[0040] The connection structure between the arrayed waveguide grating assembly and the support assembly in the optical module provided in this application is described in detail below with reference to the accompanying drawings.

[0041] Example 1

[0042] like Figure 3 As shown, in this embodiment, the support component 20 is fixedly connected to the upper surface of the substrate 31, and the upper surface of the substrate 31 is the surface of the substrate 31 facing away from the substrate 10. Specifically, in this embodiment, the support component 20 includes an upper connector 21 and a side support 22. The upper connector 21 is fixedly connected to the upper surface of the substrate 31, and the bottom surface of the side support 22 is fixedly connected to the first surface 11. The upper connector 21 is fixedly connected to the side support 22 so that the upper connector 21 and the arrayed waveguide grating assembly 30 are suspended above the first surface 11 by the side support 22. In this embodiment, the upper connector 21 is a flat plate, bonded to the upper surface of the substrate 31, and extending out of both sides of the substrate 31. There can be two side supports 22, which are connected to and support the portions extending from the upper connector 21 on both sides of the substrate 31, respectively. In some embodiments, the upper connector 21 and the side support 22 may also be structural members of other shapes, such as regular geometric structures like cubes, triangular prisms, or cylinders, or other irregular geometric structures.

[0043] exist Figure 3 In the illustrated embodiment, the upper connector 21 is fixedly connected to the top surface of the side support 22. In other embodiments, the upper connector 21 may also be fixedly connected to the side surface of the side support 22.

[0044] exist Figure 3 In the illustrated embodiment, there is a gap between the side support 22 and the side surface of the base layer 31 of the arrayed waveguide grating assembly 30, and the base layer 31 is connected to the upper connector 21 only through its upper surface. In other embodiments, the side support 22 may also be fixedly connected to the side surface of the base layer 31 of the arrayed waveguide grating assembly 30. When the base layer 31 is fixedly connected to the upper connector 21 through its upper surface and to the side support 22 through its side surface, the arrayed waveguide grating assembly 30 has strong connection stability.

[0045] In this embodiment, the arrayed waveguide grating assembly 30 is bonded to the support assembly 20 with adhesive, the support assembly 20 is bonded to the first surface 11 with adhesive, and the upper connector and the side support are bonded and fixed with adhesive. During assembly, the upper connector 21 and the substrate layer 31 can be combined first, and the side support 22 and the first surface 11 can be combined separately. During coupling, the arrayed waveguide grating assembly is moved by clamping the upper connector with a jig to optically align and couple the optical port of the arrayed waveguide grating assembly with the optoelectronic chip. Then, the upper connector 21 and the side support 22 are bonded and fixed to fix the arrayed waveguide grating assembly at the coupling position. The upper connector 21 and the substrate layer 31 can be bonded with adhesive, and the side support 22 and the first surface 11 can be bonded with adhesive. In some embodiments, the upper connector and the side support can also be integrally formed components. During assembly, the support assembly and the arrayed waveguide grating assembly are fixed together first. During coupling, the support component and the arrayed waveguide grating component are moved together by clamping the support component and adjusted to the coupling position. Then, the support component is fixed to the first surface of the substrate by glue, thereby suspending and fixing the arrayed waveguide grating above the coupling position on the first surface.

[0046] exist Figure 3 In the illustrated embodiment, the arrayed waveguide grating assembly 30 includes a substrate layer 31 and a waveguide layer 33, wherein the substrate layer 31 is away from the first surface 11, and the waveguide layer 33 is close to the first surface 11, with the direction close to the first surface 11 being downward and the direction away from the first surface 11 being upward. The lower surface of the waveguide layer 33 is suspended above the first surface 11 of the substrate 10. In some embodiments, the lower surface of the waveguide layer 33 may be suspended parallel to the first surface 11 of the substrate 10. That is, the lower surface of the waveguide layer 33 is not in contact with or connected to the substrate 10, and there is a gap between it and the first surface 11 of the substrate 10.

[0047] In this embodiment, there are two side supports 22, and the base layer 31 is located within the gap enclosed by the two side supports 22. That is, one side support 22 is provided on each side of the arrayed waveguide grating assembly 30 to stably support the arrayed waveguide grating assembly 30. In some embodiments, the number of side supports 22 may also be greater than two, with multiple side supports 22 evenly distributed on both sides of the base layer 31. When the number of side supports 22 is even, the number of side supports 22 on both sides of the base layer 31 is the same; when the number of side supports 22 is odd, the difference in the number of side supports 22 on both sides of the base layer 31 is not greater than 1. When there are more side supports 22 and they are evenly distributed on both sides of the base layer 31, the fixing effect on the base layer 31 is better. In other embodiments, the number of side supports 22 in the support assembly 20 may also be one, which reduces the space occupied on the circuit board surface and is beneficial to improving the circuit board wiring capability.

[0048] In this embodiment, since the support component 20 is fixedly connected to the upper surface of the substrate layer 31, the lower surface of the array waveguide grating component 30 is suspended above the substrate 10. Therefore, it is no longer necessary to set a cover plate 32 located below the waveguide layer 33. This not only avoids the problem of cracking of the waveguide layer 33 or the cover plate 32 caused by the bonding and adhesive stress between the cover plate 32 and the waveguide layer 33, but also reduces the cover plate 32, simplifies the manufacturing process, and reduces the production cost.

[0049] Example 2

[0050] like Figure 4 As shown, this embodiment includes most of the technical features of Embodiment 1. The difference from Embodiment 1 is that, in this embodiment, the arrayed waveguide grating assembly 30 further includes a cover plate 32, which is disposed on the other side of the waveguide layer 33 opposite to the substrate layer 31. Since the waveguide layer 33 is relatively thin, the cover plate 32 can isolate and protect the waveguide layer 33, preventing damage to the waveguide layer 33 before assembly is completed, thus avoiding affecting the transmission effect of the optical signal.

[0051] Example 3

[0052] like Figure 5As shown, unlike Embodiment 1, in this embodiment, the side support 22 is also fixedly connected to the side surface of the base layer 31 of the arrayed waveguide grating assembly 30. That is, the side support 22 is fixedly connected to both the upper connector 21 and the side surface of the base layer 31. Specifically, in this embodiment, the support assembly 20 includes an upper connector 21 and a side support 22. The lower surface of the upper connector 21 is fixedly connected to the upper surface of the base layer 31, the side surface of the side support 22 is fixedly connected to the side surface of the base layer 31, the upper connector 21 is fixedly connected to the side support 22, and the lower surface of the side support 22 is fixedly connected to the first surface 11. Compared to Embodiment 1, in this embodiment, the side support 22 is connected to both the upper connector 21 and the base layer 31, resulting in a more stable connection. Figure 5 As shown, in this embodiment, only one side support 22 is used to support the arrayed waveguide grating assembly 30 and the upper connector 21, which reduces the space occupied on the circuit board surface and is beneficial to improving the circuit board wiring capability. In some embodiments, two or more side supports 22 can also be used to more stably support the arrayed waveguide grating assembly 30.

[0053] Example 4

[0054] like Figure 6 As shown, unlike Embodiment 1, in this embodiment, the support component 20 only includes a side support member 22, and the side of the side support member 22 is fixedly connected to the side of the base layer 31.

[0055] Specifically, in this embodiment, there can be two side supports 22, with the base layer 31 located within the gap enclosed by the two side supports 22. That is, one side support 22 is provided on each side of the arrayed waveguide grating assembly 30 to stably support it. Compared to Embodiment 1, this example eliminates the upper connector 21, reducing its thickness and thus lowering the overall height of the arrayed waveguide grating assembly 30, thereby reducing the space occupied by the overall coupling structure and making the structure more compact. In some embodiments, the number of side supports 22 can also be one or more, similar to the above embodiments, and will not be repeated here.

[0056] In the above embodiments, the substrate 10 can be a rigid circuit board, the optoelectronic chip is a light receiver chip including multiple PD arrays, and the functional circuit chip is a transimpedance amplifier used to process the electrical signals output by the light receiver chip before transmitting them to the rigid circuit board. The arrayed waveguide grating assembly is used to demultiplex the optical signals received by the optical interface of the optical module and output multiple optical signals, which are respectively input into each PD of the light receiver chip.

[0057] In some embodiments, the optoelectronic chip may also include multiple laser chips. The multiple optical signals emitted by the multiple laser chips are multiplexed into a single optical signal after passing through an arrayed waveguide grating assembly and output to the optical interface of the optical module.

[0058] The above steps are provided only to help understand the method, structure, and core ideas of this application. Those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims.

Claims

1. An optical module, characterized in that, include: A substrate having a first surface; An arrayed waveguide grating assembly includes a stacked substrate layer and a waveguide layer, wherein the waveguide layer is provided with an arrayed waveguide grating, the waveguide layer faces a first surface of the substrate, and the substrate layer faces away from the first surface; A support component is connected to the base layer of the arrayed waveguide grating assembly to support the arrayed waveguide grating assembly, which is suspended on the first surface of the substrate by the support component.

2. The optical module as described in claim 1, characterized in that, The support component is fixedly connected to the upper surface of the base layer, which is the surface of the base layer facing away from the substrate.

3. The optical module as described in claim 2, characterized in that, The support assembly includes an upper connector and a side support; The upper connector is fixedly connected to the upper surface of the substrate layer, the bottom surface of the side support is fixedly connected to the first surface, and the upper connector is fixedly connected to the side support so that the upper connector and the arrayed waveguide grating assembly are suspended above the first surface through the side support.

4. The optical module as described in claim 3, characterized in that, The upper connector is fixedly connected to the top or side surface of the side support.

5. The optical module as described in claim 4, characterized in that, The side support is also fixedly connected to the side of the substrate layer of the arrayed waveguide grating assembly.

6. The optical module as described in any one of claims 3-5, characterized in that, The upper connector and the side support are fixed together by adhesive, or the upper connector and the side support are integrally formed components. The side support is fixed to the first surface of the substrate by adhesive.

7. The optical module as described in claim 1, characterized in that, The support assembly includes a side support member, the side of which is fixedly connected to the side of the base layer.

8. The optical module as described in any one of claims 3-5 or 7, characterized in that, The number of side supports is at least two.

9. The optical module as described in claim 8, characterized in that, The base layer is located within the interval enclosed by the at least two side supports.

10. The optical module as described in claim 1, characterized in that, The arrayed waveguide grating assembly also includes a cover plate disposed on the side of the waveguide layer facing away from the substrate layer and suspended above the first surface of the substrate, for protecting the waveguide layer.

11. The optical module as described in claim 1, characterized in that, The arrayed waveguide grating assembly is bonded and fixed to the support assembly with adhesive, and the support assembly is bonded to the first surface of the substrate with adhesive.

12. The optical module as described in claim 1, characterized in that, The optical module also includes an optoelectronic chip, which is used to convert optical signals into electrical signals or electrical signals into optical signals. The optoelectronic chip is disposed on the substrate and electrically connected to the substrate, and the arrayed waveguide grating assembly is optically coupled to the optoelectronic chip.

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