Developer baking device for semiconductor processing

Abstract

The utility model discloses a developing machine baking device for semiconductor processing, which comprises a shell, and a baking turnover device is mounted in the shell in a sliding manner. According to the utility model, by installing the baking turnover device, a wafer is clamped between the two placing frames in a sliding manner to support the wafer, the arranged non-slip mat prevents the wafer from falling off in the turnover process, and in addition, the rotating shafts at the two ends drive the placing frames to turn over under the driving of the double-head motor, so that the wafer is prevented from falling off. The position of the wafer in the shell can be continuously changed, so that the wafer is heated more uniformly, the wafer baking efficiency is improved, energy is saved, consumption is reduced, the arranged locking assembly can fix the placement frame which stops overturning, the situation that the placement frame inclines due to mistaken rotation of the placement frame, and then the fixing frame is inconvenient to extract from the shell is avoided, and the wafer baking efficiency is improved. And when the turnover is finished and the placing frame is in a horizontal state, the arranged locking assembly fixes the rotating shaft through magnetic attraction after the upper electromagnet and the lower electromagnet are electrified, so that the baking turnover device can be conveniently pulled out.

Description

Technical Field

[0001] This utility model relates to the field of developing machine technology, specifically to a developing machine baking device for semiconductor processing. Background Technology

[0002] A developing machine is a printing processing device that completes some or all of the processes such as developing, washing, coating, and drying in one go through semi-automatic and fully automatic programs on the exposed printing plate. It generally consists of a transmission system, a developing system, a washing system, a drying system, and a program control system. Among them, the processing of wafers in semiconductors requires the use of a developing machine.

[0003] The prior art, patent publication number CN218675680U, discloses the following technical solution: a photolithography material baking device for a spin coater. This invention provides a photolithography material baking device for a spin coater that can bake multiple wafers at once with high baking efficiency. The device includes a base frame, an outer frame, placement frames, and pull rods. The base frame is connected to the left and right sides of the bottom of the outer frame. Two placement frames for placing wafers are slidably arranged inside the outer frame. At least two ventilation openings are opened on the top right side of the outer frame. Pull rods are connected to the front of each placement frame. The hot air blower of this invention can blow hot air to bake the wafers, and can bake multiple wafers at once with high baking efficiency.

[0004] The above technical solution places the wafer inside the limiting ring for baking, but the hot air blower installed at the bottom of the outer casing has a poor baking effect on the wafer, resulting in a longer baking time and reduced baking efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a developing and baking apparatus for semiconductor processing to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a baking apparatus for a semiconductor processing developing machine, comprising a housing, wherein a baking flipping device is slidably installed inside the housing.

[0007] The baking and flipping device includes a fixed frame, and a rotating shaft is rotatably connected to the middle of the groove of the fixed frame. The rotating shaft passes through the inner wall of the fixed frame and is fixedly connected to a placement frame. Anti-slip pads are provided on the upper and lower sides of the groove of the placement frame. A locking component is installed on one side of the groove in the middle of the fixed frame. The locking component is located on the upper and lower sides of the rotating shaft.

[0008] In the above technical solution, the rotating shafts at both ends of the dual-head motor drive the placement frame to rotate, which can continuously change the position of the wafer inside the outer shell, making the wafer heat more uniform, improving the efficiency of wafer baking and saving energy.

[0009] As a further preferred embodiment of this technical solution, ventilation holes are provided at the left and right ends of the top side of the outer shell, a box body is fixedly connected to the central groove of the top side of the outer shell, a heating plate is provided inside the box body, a hot air blower is installed at one end of the top side of the box body, and sliding grooves are provided on the left and right inner walls of the outer shell, and the outer walls on both sides of the fixed frame are slidably connected to the inner walls of the sliding grooves.

[0010] In the above technical solution, the hot air blower is turned on and the heating plate is powered during baking, and the hot air blown out bakes the wafer; the fixed frame is connected to the outer shell in a sliding manner, which makes it easy to remove.

[0011] As a further preferred embodiment of this technical solution, a dual-head motor is installed in the middle of the groove on the front side of the fixed frame, and each of the output ends of the dual-head motor is provided with a rotating rod, and the rotating rod and the rotating shaft are connected by a conveyor belt.

[0012] As a further preferred embodiment of this technical solution, a heat dissipation hole is provided on the front outer surface of the fixed frame and at the front end of the dual-head motor, and handles are provided at both ends of the front outer surface of the fixed frame.

[0013] In the above technical solution, the handle facilitates the removal of the fixing frame, and the heat dissipation holes can dissipate heat from the dual-head motor.

[0014] As a further preferred embodiment of this technical solution, the locking assembly includes a support, which is disposed on the upper and lower sides of the inner wall of the placement frame groove. Each support is slidably connected to a slide rod, and a limiting circular plate is fixedly connected to the opposite ends of the upper and lower slide rods. A spring is embedded in the bottom side of each support, and the spring is disposed on the outside of the slide rod.

[0015] In the above technical solution, the upper and lower electromagnets are attracted together by the spring, which fixes the rotating shaft and makes it easy to remove the baking flipping device.

[0016] As a further preferred embodiment of this technical solution, an electromagnet is provided on the other side of both the slide rod and the spring. The electromagnet is electrically connected to an external power source, and a pad is provided on the inner side of each electromagnet.

[0017] As a further preferred embodiment of this technical solution, the upper and lower electromagnets are energized and attract each other with opposite polarities, and the pad is set on the upper and lower outer surfaces of the rotating shaft by the magnetic attraction of the upper and lower electromagnets.

[0018] This utility model provides a developing and baking apparatus for semiconductor processing, which has the following beneficial effects:

[0019] (1) By installing a baking and flipping device, the wafer is slidably inserted between two placement frames to support the wafer. The anti-slip pads prevent the wafer from falling during the flipping process. In addition, the dual-head motor drives the rotating shafts at both ends to flip the placement frames, which can continuously change the position of the wafer in the outer shell, making the wafer heat more evenly, improving the efficiency of wafer baking and saving energy.

[0020] (2) The present invention can fix the placement frame when it stops flipping by setting the locking component, so as to avoid the placement frame tilting due to accidental rotation, which would make it difficult to remove the fixing frame from the outer shell. When the placement frame is in a horizontal state after the flipping is finished, the locking component fixes the rotating shaft by magnetic attraction after the upper and lower electromagnets are energized, which makes it easy to remove the baking flipping device. Attached Figure Description

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a partial cross-sectional view of the present invention;

[0023] Figure 3 This is a partial view of the baking and turning device of this utility model;

[0024] Figure 4 This is an enlarged view of Figure A of this utility model;

[0025] Figure 5 This is a schematic diagram of the internal structure of the placement frame of this utility model;

[0026] Figure 6 This is a schematic diagram of the structure of the electromagnet of this utility model;

[0027] In the diagram: 1. Outer shell; 11. Ventilation hole; 12. Box body; 13. Hot air blower; 14. Heating plate; 15. Slide groove; 2. Baking flipping device; 21. Fixing frame; 22. Dual-head motor; 23. Rotating rod; 24. Rotating shaft; 25. Placement frame; 26. Anti-slip pad; 27. Locking assembly; 271. Support; 272. Slide rod; 273. Limiting round plate; 274. Spring; 275. Electromagnet; 276. Pad; 211. Heat dissipation hole; 212. Handle. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0029] This utility model provides a technical solution: such as Figure 1 and Figure 2As shown in this embodiment, a baking apparatus for a semiconductor processing developing machine includes a housing 1, a baking flipping device 2 slidably installed inside the housing 1, ventilation holes 11 are provided at the left and right ends of the top side of the housing 1, a box body 12 is fixedly connected to the central groove of the top side of the housing 1, a heating plate 14 is provided inside the box body 12, a hot air blower 13 is installed at one end of the top side of the box body 12, and sliding grooves 15 are provided on both the left and right inner walls of the housing 1, and the outer walls on both sides of the fixing frame 21 are slidably connected to the inner walls of the sliding grooves 15.

[0030] like Figure 3 and Figure 5 As shown, the baking flipping device 2 includes a fixed frame 21. A rotating shaft 24 is rotatably connected to the center of each groove in the fixed frame 21. The rotating shaft 24 passes through the inner wall of the fixed frame 21 and is fixedly connected to a placement frame 25. Anti-slip pads 26 are provided on the upper and lower sides of the groove in the placement frame 25. A locking component 27 is installed on one side of each groove in the center of the fixed frame 21. The locking component 27 is located on the upper and lower sides of the rotating shaft 24. A dual-head motor 22 is installed in the center of the groove on the front side of the fixed frame 21. The model of the dual-head motor 22 is 48BYG250, which is existing technology. A rotating rod 23 is provided at the output end of each dual-head motor 22. The rotating rod 23 is connected to the rotating shaft 24. All are connected by a conveyor belt. The front outer surface of the fixed frame 21, located at the front end of the dual-head motor 22, has heat dissipation holes 211. Both ends of the front outer surface of the fixed frame 21 are provided with handles 212. By installing the baking flipping device 2, the wafer is slidably inserted between the two placement frames 25 to support the wafer. The anti-slip pads 26 prevent the wafer from falling during the flipping process. In addition, driven by the dual-head motor 22, the rotating shafts 24 at both ends drive the placement frames 25 to flip, which can continuously change the position of the wafer in the shell, making the wafer heat more evenly, improving the wafer baking efficiency and saving energy.

[0031] like Figure 4 and Figure 6As shown, the locking assembly 27 includes a support 271, which is disposed on the upper and lower sides of the inner wall of the groove of the placement frame 21. A slide rod 272 is slidably connected to each support 271. A limit plate 273 is fixedly connected to one of the opposite ends of the upper and lower slide rods 272. A spring 274 is embedded in the bottom side of each support 271, and the spring 274 is disposed on the outside of the slide rod 272. An electromagnet 275 is disposed on the other side of both the slide rod 272 and the spring 274. The electromagnet 275 is electrically connected to an external power source. A pad 276 is disposed inside each electromagnet 275. When magnets 275 are energized, opposite poles attract each other. The pad 276 is set on the upper and lower outer surfaces of the rotating shaft 24 by the magnetic attraction of the upper and lower electromagnets 275. The locking component 27 can fix the placement frame when it stops flipping, preventing the placement frame 25 from tilting due to accidental rotation, which would make it difficult to remove the fixing frame 21 from the outer shell 1. When the flipping is finished and the placement frame 25 is in a horizontal state, the locking component 27 fixes the rotating shaft 24 by the magnetic attraction of the upper and lower electromagnets 275 after they are energized, making it easy to remove the baking flipping device 2.

[0032] This utility model provides a baking device for a semiconductor processing developing machine. The specific working principle is as follows: The fixed frame 21 is pulled out, and the wafer is inserted between the two placement frames 25. Then, the fixed frame 21 is pushed into the outer casing 1. During baking, the hot air blower 13 is activated, and the heating plate 14 is energized, blowing hot air to bake the wafer. Simultaneously, the dual-head motor 22 is activated, causing the rotating rods 23 on both sides to rotate. This, through the conveyor belt, causes the rotating shafts 24 at both ends to rotate, thereby causing the placement frames 25 to rotate, and baking is performed by flipping the wafer. After baking, according to a preset number of rotations, the placement frames 25 are brought to a horizontal position. Then, the electromagnets 275 are energized, and the upper and lower electromagnets 275 are magnetically attracted together by the spring 274, thus fixing the rotating shaft 24. The wafer can then be extracted by pulling out the fixed frame 21.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A developing and baking apparatus for semiconductor processing, comprising a housing (1), characterized in that: A baking and turning device (2) is slidably installed inside the outer shell (1); The baking flipping device (2) includes a fixed frame (21), and a rotating shaft (24) is rotatably connected to the middle of the groove of the fixed frame (21). The rotating shaft (24) passes through the inner wall of the fixed frame (21) and is fixedly connected to a placement frame (25). Anti-slip pads (26) are provided on the upper and lower sides of the groove of the placement frame (25). A locking component (27) is installed on one side of the groove in the middle of the fixed frame (21). The locking component (27) is located on the upper and lower sides of the rotating shaft (24).

2. The semiconductor processing developing and baking apparatus according to claim 1, characterized in that: Ventilation holes (11) are provided on the left and right ends of the top side of the outer shell (1). A box body (12) is fixedly connected to the groove in the middle of the top side of the outer shell (1). A heating plate (14) is provided inside the box body (12). A hot air blower (13) is installed at one end of the top side of the box body (12). Sliding grooves (15) are provided on the left and right inner walls of the outer shell (1). The outer walls on both sides of the fixed frame (21) are slidably connected to the inner walls of the sliding grooves (15).

3. The semiconductor processing developing and baking apparatus according to claim 1, characterized in that: A dual-head motor (22) is installed in the middle of the groove on the front side of the fixed frame (21). The output end of the dual-head motor (22) is provided with a rotating rod (23). The rotating rod (23) and the rotating shaft (24) are connected by a conveyor belt.

4. The semiconductor processing developing and baking apparatus according to claim 1, characterized in that: The front outer surface of the fixed frame (21) and the front end of the dual-head motor (22) are provided with heat dissipation holes (211), and handles (212) are provided at both ends of the front outer surface of the fixed frame (21).

5. The semiconductor processing developing and baking apparatus according to claim 1, characterized in that: The locking assembly (27) includes a support (271), which is disposed on the upper and lower sides of the inner wall of the groove of the placement frame (25). Each support (271) is slidably connected to a slide rod (272). Each of the two slide rods (272) is fixedly connected to a limiting circular plate (273) at one end opposite to the other. Each support (271) has a spring (274) embedded in its bottom side, which is disposed on the outside of the slide rod (272).

6. The semiconductor processing developing and baking apparatus according to claim 5, characterized in that: An electromagnet (275) is provided on the other side of both the slide rod (272) and the spring (274). The electromagnet (275) is electrically connected to an external power source. A pad (276) is provided on the inner side of each electromagnet (275).

7. The semiconductor processing developing and baking apparatus according to claim 6, characterized in that: When the upper and lower electromagnets (275) are energized, opposite charges attract each other, and the pad (276) is set on the upper and lower outer surfaces of the rotating shaft (24) by the magnetic attraction of the upper and lower electromagnets (275).

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