Slot device

Abstract

The utility model relates to a slot device, and the device comprises a slot main body which is provided with a slot for the insertion of an object to be tested; the flexible circuit board is arranged on the slot main body; the sensing assembly is arranged on the flexible circuit board, located on the side, close to the slot body, of the flexible circuit board and used for obtaining sensing data of the to-be-detected object inserted into the slot, and the sensing assembly is electrically connected with the flexible circuit board so as to transmit the sensing data through the flexible circuit board; when the to-be-detected object is inserted into the slot, the to-be-detected object contacts the flexible circuit board and enables the flexible circuit board to deform, so that the sensing assembly is moved from the first position to the second position. According to the slot device, the problem of friction and collision between the to-be-detected object and the sensing assembly can be reduced, effective protection is provided for the sensing assembly, and meanwhile the accuracy of sensing data obtained by the sensing assembly can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a slot device. Background Art

[0002] After the memory module is inserted into the motherboard slot, a temperature sensor is needed to monitor its temperature. The closer the temperature sensor is to the memory module, the more accurate the monitoring data will be. However, the frequent insertion and removal of the memory module can easily cause friction or collisions to the temperature sensor, leading to damage or even malfunction.

[0003] Related technologies typically employ highly precise processes to manufacture appropriately sized motherboard slots for installing temperature sensors, thereby reducing friction and collisions between the temperature sensor and the memory module during insertion and removal. However, this method cannot guarantee a reduction in friction and collision issues, and it has high process requirements and costs. Furthermore, since the installation position of the temperature sensor is relatively fixed, if the distance between the temperature sensor and the memory module is too large, it is difficult for the temperature sensor to get close enough to the memory module to obtain accurate sensing data. Utility Model Content

[0004] In view of the above, it is necessary to provide a slot device that can reduce the problem of friction and collision between the object under test and the sensing component, provide effective protection for the sensing component, and improve the accuracy of the sensing data obtained by the sensing component.

[0005] This application provides a slot device, comprising: a slot body having a slot for inserting a test object; a flexible circuit board disposed on the slot body; and a sensing component disposed on the flexible circuit board and located on the side of the flexible circuit board near the slot body, for acquiring sensing data of the test object inserted into the slot, and electrically connected to the flexible circuit board to transmit the sensing data through the flexible circuit board; wherein, when the test object is inserted into the slot, the test object contacts the flexible circuit board and deforms the flexible circuit board to move the sensing component from a first position to a second position.

[0006] In this application, because the flexible circuit board has deformation capability, and because the sensing component is disposed on the flexible circuit board and located on the side of the flexible circuit board close to the slot body, when the slot body inserts the object under test through the slot, the object under test first contacts the flexible circuit board, causing the flexible circuit board to deform. The sensing component changes position accordingly when the flexible circuit board deforms; that is, the deformation of the flexible circuit board can move the sensing component from a first position to a second position. This reduces the problem of friction and collision between the object under test and the sensing component, providing effective protection for the sensing component. Furthermore, when the slot body inserts the object under test through the slot, the deformation capability of the flexible circuit board allows it to fit tightly against the object under test, thereby bringing the sensing component disposed on the flexible circuit board close to the object under test, which improves the accuracy of the sensing data obtained by the sensing component.

[0007] In some embodiments, the slot body has a placement portion in the shape of a groove or a hollowed-out section, and at least a portion of the flexible circuit board is disposed in the placement portion.

[0008] In some embodiments, the flexible circuit board is provided in a portion of the placement portion to form a receiving portion for accommodating a sensing component. The sensing component is disposed in the receiving portion and located on the side of the receiving portion close to the slot body. A partition portion is formed in the receiving portion in the same direction as the insertion direction of the object to be tested.

[0009] In some embodiments, the sensing component includes a sensor and at least one elastic element, the sensor and the elastic element being disposed in the receiving portion and located on the side of the receiving portion near the slot body.

[0010] In some embodiments, there is one elastic element, and the elastic element is in the form of a ring, with the sensor located at the center of the ring of the elastic element.

[0011] In some embodiments, there are multiple elastic elements, and the multiple elastic elements are evenly distributed around the sensor.

[0012] In some embodiments, the thickness of the elastic element is equal in the same direction as the insertion direction of the object under test.

[0013] In some embodiments, the thickness of the elastic element increases in the same direction as the insertion direction of the object under test.

[0014] In some embodiments, the thickness of the elastic element decreases in the same direction as the insertion direction of the object under test.

[0015] In some embodiments, the sensing component includes at least one connector having thermal and electrical conductivity, the connector being disposed in the receiving portion and at least a portion being located on the side of the receiving portion away from the slot body, the connector being used to connect the sensing component and the flexible circuit board. Attached Figure Description

[0016] Figure 1 This is a schematic diagram illustrating a scenario where a memory module is inserted into a motherboard slot in a related technology.

[0017] Figure 2 This is a schematic diagram of the slot device according to an embodiment of this application.

[0018] Figure 3 This is a schematic diagram illustrating an application scenario of the slot device according to an embodiment of this application.

[0019] Figure 4 This is an exploded view of the slot device according to an embodiment of this application.

[0020] Figure 5 This is a schematic diagram of the structure of the slot body according to an embodiment of this application.

[0021] Figure 6This is a schematic diagram of the structure of the flexible circuit board according to an embodiment of this application.

[0022] Figure 7 This application Figure 2 A cross-sectional structural schematic diagram of the slot device in the embodiment.

[0023] Figure 8 This is another cross-sectional structural schematic diagram of the slot device according to an embodiment of this application.

[0024] Explanation of main component symbols

[0025] 10. Motherboard slot; 101. Temperature sensor; 20. Memory module; 1. Slot device; 2. Object under test; 3. Testing device; 11. Slot body; 12. Flexible circuit board; 13. Sensing component; 111. Placement part; 112. Hook part; 121. Receiving part; 122. Partition part; 123. Circuit body part; 131. Elastic element; 132. Sensor; 133. Connector.

[0026] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. DETAILED DESCRIPTION

[0027] In the description of the embodiments in this application, the words "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary," "or," and "for example" is intended to present the relevant concepts in a specific manner.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. It should be understood that, unless otherwise stated, " / " in this application means "or". For example, A / B can mean A or B. "And / or" in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. "At least one" refers to one or more. "More than one" refers to two or more. For example, at least one of a, b, or c can represent: a, b, c, a and b, a and c, b and c, and a, b, and c (seven cases).

[0029] It should also be noted that the terms "first" and "second" in the specification, claims, and drawings of this application are used to distinguish similar objects, not to describe a specific order or sequence. The methods disclosed in the embodiments of this application or the methods shown in the flowcharts include one or more steps for implementing the method. Without departing from the scope of the claims, the execution order of multiple steps can be interchanged, and some steps can also be deleted.

[0030] Figure 1 This is a schematic diagram of a scenario in which a memory module 20 is inserted into a motherboard slot 10 in a related technology.

[0031] The integrated circuit (IC) of memory module 20 may malfunction if it is exposed to low temperatures outside its operating temperature range. Therefore, after memory module 20 is inserted into motherboard slot 10 (i.e., the motherboard slot device), a temperature sensor 101 is needed to monitor its temperature. The motherboard or the entire system will only allow memory module 20 to operate when the detected temperature of memory module 20 is within its operating temperature range. The closer the temperature sensor 101 is to the memory module 20, the more accurate the monitoring data; ideally, it should be in close contact. Please refer to [link / reference]. Figure 1 As shown, the surface of the memory module 20 is not usually flat. During use, the memory module 20 needs to be frequently plugged in and out. The relative position of the temperature sensor 101 and the memory module 20 is fixed, which can easily cause friction or collision between the memory module 20 and the temperature sensor 101, which may damage the temperature sensor 101 or the memory module 20, or even cause it to malfunction.

[0032] In related technologies, a motherboard slot 10 of suitable size is typically manufactured using very precise processes to install the temperature sensor 101, in order to reduce friction and collision between the memory module 20 and the temperature sensor 101 during insertion and removal. However, this method involves inserting the memory module 20 with a very small gap between it and the temperature sensor 101, which cannot guarantee a reduction in friction and collision issues. Furthermore, the presence of this gap may lead to heat dissipation, resulting in inaccurate monitoring by the temperature sensor 101. In other words, this method makes it difficult for the temperature sensor 101 to obtain accurate monitoring data.

[0033] To address this issue, this application provides a slot device that reduces friction and collision between the object under test and the sensing component, effectively protecting the sensing component and improving the accuracy of the sensing data obtained. Some embodiments will be described below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] Figure 2 This is a schematic diagram of the slot device 1 according to an embodiment of this application. Figure 3This is a schematic diagram illustrating an application scenario of the slot device 1 according to an embodiment of this application. Figure 4 This is an exploded view of the slot device 1 according to an embodiment of this application.

[0035] Please see Figure 2 and Figure 3 This application provides a slot device 1, which can be installed on a computer motherboard or a test device 3 for inserting a memory module 20 or other objects required for use on the computer motherboard or test device 3. The slot device 1 may have slots that match DIMM or SIMM memory modules. The memory module or other objects required for use on the computer motherboard or test device 3 are collectively referred to as the object under test 2.

[0036] In some embodiments, the object under test 2 may include a DIMM (Dual Inline Memory Module) memory module or a SIMM (Single Inline Memory Module) memory module.

[0037] In some embodiments, such as Figure 3 As shown, the number of slot devices 1 can correspond to the number of test objects 2. For example, when 1, 2, 3...n test objects need to be plugged into a computer motherboard or test device 3, there can be 1, 2, 3...n slot devices, where n is a positive integer.

[0038] Please see Figure 4 The slot device 1 of this application embodiment may include: a slot body 11, a sensing component 13, and a flexible circuit board 12. The slot body 11 may have a slot for inserting the object under test 2. The flexible circuit board 12 may be disposed on the slot body 11. The sensing component 13 may be disposed on the flexible circuit board 12 and located on the side of the flexible circuit board 12 close to the slot body 11. The sensing component 13 can be used to acquire sensing data of the object under test 2 inserted into the slot. Furthermore, the sensing component 13 and the flexible circuit board 12 may be electrically connected, enabling the sensing component 13 to transmit sensing data through the flexible circuit board 12. In this embodiment, when the object under test 2 is inserted into the slot, the object under test 2 contacts the flexible circuit board 12 and causes the flexible circuit board 12 to deform, thereby moving the sensing component 13 from a first position to a second position.

[0039] The first position refers to the position of the sensing component 13 before the flexible circuit board 12 deforms, and the second position refers to the position of the sensing component 13 after the flexible circuit board 12 deforms. For example, before the flexible circuit board 12 deforms, the sensing component 13 is 1 mm away from the slot body 11, which is the first position. After the flexible circuit board 12 deforms, the sensing component 13 is 0.2 mm away from the slot body 11, which is the second position.

[0040] Figure 5 This is a schematic diagram of the structure of the slot body 11 in an embodiment of this application.

[0041] Please see Figure 5 In some embodiments, the slot body 11 has a recessed or hollowed-out placement portion 111, and at least a portion of the flexible circuit board 12 can be disposed in the placement portion 111. In this case, the flexible circuit board 12 is disposed in the recessed or hollowed-out placement portion 111, which can reduce the overall weight and space occupation of the slot device 1, thereby reducing costs and saving space to allow more slot devices 1 to be arranged on a computer motherboard or test device 3.

[0042] The slot body 11 can be in the shape of a long plate. One long side of the slot body 11 extends along the direction of the plate surface and then extends parallel to the plate surface to form a hook 112. In this embodiment, the hook 112 can be used as a slot for inserting the object to be tested 2.

[0043] In some embodiments, a portion of the long plate surface of the slot body 11 has an area larger than the remaining portion. The larger portion can be used to house the sensing component 13 and the flexible circuit board 12, while the smaller portion can facilitate optimized space utilization and reduce the weight of the slot body 11.

[0044] In other embodiments, the slot device 1 may further include a slot portion, a fixing portion, and a circuit connection portion. The slot portion can be used to form a slot. The slot portion is an elongated rectangular body, and the rectangular body can be formed with a groove that matches the shape of the object to be tested 2, that is, a slot is formed. In this embodiment, the hook portion 112 of the slot body 11 can be used to install and fix the slot portion. That is, at this time, the hook portion 112 can not be used as a slot for inserting the object to be tested 2, and the slot for inserting the object to be tested 2 is formed by the rectangular slot portion.

[0045] The fixing part can be provided in the slot part and used to fix the object to be tested 2 inserted into the slot in cooperation with the slot part. The fixing part can be provided at both ends of the slot part. The fixing part can be a snap-fit ​​mechanism provided at both ends of the slot part. Through the cooperation between the slot body 11, the slot part and the fixing part, the object to be tested 2 inserted into the slot can be framed, thereby enhancing the stability of the object to be tested 2 inserted into the slot device 1.

[0046] The circuit connection part is disposed in the slot of the slot part, and the circuit connection part can be used to make a circuit connection between the motherboard and the device under test 2. The circuit connection part can be disposed in the slot of the slot part and make contact with the conductive contacts (commonly known as "gold fingers") of the device under test 2 when the device under test 2 is inserted into the slot. Thus, the motherboard and the device under test 2 can be made a circuit connection through the circuit connection part.

[0047] In some embodiments, the slot body 11, the slot portion, and the fixing portion may be made of non-metallic materials, and the circuit connection portion may be made of conductive metallic materials.

[0048] Figure 6 This is a schematic diagram of the structure of the flexible circuit board 12 according to an embodiment of this application.

[0049] As described above, the slot device 1 in this embodiment may include a flexible circuit board 12. The flexible circuit board 12 in this embodiment may also be called a flexible printed circuit board (FPC). The flexible circuit board 12 is a highly reliable and highly flexible printed circuit board made with polyimide or polyester film as a substrate. In other words, the flexible circuit board 12 in this embodiment may have a certain degree of elasticity or deformation capability.

[0050] In some embodiments, the flexible circuit board 12 can be constructed by embedding circuit elements on a flexible, thin plastic sheet. The circuit elements in the flexible circuit board 12 enable the sensing component 13 to be electrically connected to the motherboard or test apparatus 3. This facilitates the sensing component 13 transmitting sensing data to the motherboard or test apparatus 3 via the flexible circuit board 12.

[0051] In some embodiments, such as Figure 6 As shown, the flexible circuit board 12 may include a receiving portion 121, a partition portion 122, and a circuit body portion 123. The receiving portion 121 and the partition portion 122 may be portions disposed on the placement portion 111. The receiving portion 121 and the partition portion 122 may form a receiving structure, which may be used to accommodate a sensing component 13. The sensing component 13 may be disposed on the receiving portion 121 and located on the side of the receiving portion 121 near the slot body 11.

[0052] In some embodiments, the circuit body portion 123 of the flexible circuit board 12 can be configured to fit against the slot body 11. In some embodiments, the circuit body portion 123 of the flexible circuit board 12 can have a positioning groove, and the slot body 11 can have a positioning protrusion that matches the positioning groove of the circuit body portion 123. Thus, the flexible circuit board 12 can be quickly and accurately installed onto the slot body 11 using the positioning groove and the positioning protrusion, improving installation efficiency.

[0053] In some embodiments, the receiving portion 121 and the partition portion 122 may be formed by extending and bending the circuit body portion 123. Specifically, the receiving portion 121 and the partition portion 122 may be formed by bending a portion of the circuit body portion 123 through the hollow area of ​​the slot body 11 in the same direction as the insertion direction of the object under test 2. The receiving portion 121 is used to house the sensing component 13 and is close to the object under test 2 after it is inserted; the partition portion 122 is used to offset the friction and impact of the object under test 2 during the insertion process, and can be correspondingly stretched and deformed to change the position of the sensing component 13 disposed on the receiving portion 121, thereby effectively protecting the sensing component 13.

[0054] As described above, a partition 122 may be formed in the same direction as the insertion direction of the receiving portion 121 and the object to be tested 2. In some embodiments, the partition 122 may have a preset tilt angle, for example, the preset tilt angle may be 45°, 60° or 75°. The preset tilt angle may be in the range of 0° to 90°.

[0055] The flexible circuit board 12 of this embodiment may include an insulating film, a conductor, and an adhesive in terms of materials. The insulating film serves as a protective cover to isolate the circuit from dust and moisture and to reduce stress during flexing. The conductor is used to form a conductive layer. The adhesive is used to bond the insulating film to the conductive layer. The insulating film may be made of polyimide or polyester, and the conductor may include copper foil, which is formed in the insulating film by electrodepositing (ED) or plating methods.

[0056] In some embodiments, the flexible circuit board 12 may not include adhesives in terms of materials. It is understood that in the flexible circuit board 12, adhesive-free stacks can form thinner circuits with greater flexibility. This embodiment has better thermal conductivity compared to adhesive-based stack constructions. In this case, due to the thin structure of the adhesive-free flexible circuit and the improved thermal conductivity due to the elimination of adhesive thermal resistance, the deformation and high thermal conductivity of the flexible circuit board 12 can be utilized to protect the sensing component 13, while also improving the accuracy of the sensing data acquired by the sensing component 13.

[0057] Figure 7 This application Figure 2 A cross-sectional structural schematic diagram of the slot device 1 in the embodiment. Figure 8 This is a schematic cross-sectional view of the slot device 1 according to an embodiment of this application.

[0058] As described above, the slot device 1 in this application embodiment may include a sensing component 13.

[0059] like Figure 7 or Figure 8 As shown, in some embodiments, the sensing component 13 may include a sensor 132 and at least one elastic element 131, both of which are disposed in the receiving portion 121 and located on the side of the receiving portion 121 near the slot body 11.

[0060] like Figure 8 As shown, in some embodiments, a gap, such as 1 mm, may be provided between the sensor 132 and the slot body 11. This reduces the likelihood of the sensor 132 touching the slot body 11 and being damaged when the position of the sensing component 13 changes due to the deformation of the flexible circuit board 12.

[0061] In some embodiments, a gap may be provided between the elastic element 131 and the slot body 11, and the gap between the elastic element 131 and the slot body 11 is smaller than the gap between the sensor 132 and the slot body 11, for example, 0.5 mm. This allows the elastic element 131 to touch the slot body 11 first when the flexible circuit board 12 deforms and the position of the sensing component 13 changes, thus acting as a buffer and reducing the possibility of the sensor 132 being damaged by touching the slot body 11.

[0062] In other embodiments, the elastic element 131 can be filled between the receiving portion 121 and the placement portion 111, that is, the elastic element 131 is connected to both the flexible circuit board 12 and the slot body 11. In this case, if the object to be tested 2 is inserted into the slot device 1, the flexible circuit board 12 deforms, but the position of the elastic element 131 does not change. Therefore, the positional change of the sensing component 13 can refer to the positional change of the sensor 132.

[0063] In some embodiments, there is one elastic element 131, and the elastic element 131 is annular, with the sensor 132 located at the center of the annular elastic element 131. The elastic element 131 can be a square ring, a rectangular ring, or a circular ring. In this case, the annular elastic element 131 can provide all-around protection for the sensor 132.

[0064] In some embodiments, there are multiple elastic elements 131, such as 2, 3...n, where n is a positive integer, and the multiple elastic elements 131 are evenly distributed around the sensor 132. For example, there can be 2 elastic elements 131, with one elastic element 131 arranged above the sensor 132 and the other elastic element 131 arranged below the sensor 132 in the same direction as the object to be tested 2 is inserted into the slot device 1; or, for example, there can be 4 elastic elements 131, with 2 elastic elements 131 arranged above the sensor 132 and the other 2 elastic elements 131 arranged below the sensor 132 in the same direction as the object to be tested 2 is inserted into the slot device 1. In this case, having multiple elastic elements 131 can protect the sensor 132 while also reducing material costs.

[0065] In some embodiments, the thickness of the elastic element 131 can be equal in the same direction as the insertion direction of the object under test 2. For example, there can be two elastic elements 131. In the same direction as the object under test 2 is inserted into the slot device 1, one elastic element 131 can be arranged above the sensor 132, and the other elastic element 131 can be arranged below the sensor 132. The thickness of the elastic elements 131 in the same direction as the insertion direction of the object under test 2 is equal, that is, the height is the same in the direction perpendicular to the insertion direction of the object under test 2. In this case, when the object under test 2 is inserted, the flexible circuit board 12 can be evenly close to the object under test 2, and the overall friction and impact force is small, which can improve the life of the flexible circuit board 12.

[0066] In some embodiments, the thickness of the elastic element 131 can increase in the same direction as the insertion direction of the object under test 2. For example, there can be two elastic elements 131. In the same direction as the insertion of the object under test 2 into the slot device 1, one elastic element 131 can be arranged above the sensor 132, and the other elastic element 131 can be arranged below the sensor 132. The thickness of the elastic element 131 increases in the same direction as the insertion direction of the object under test 2, that is, the height increases in the direction perpendicular to the insertion direction of the object under test 2. In other words, the thickness of the elastic element 131 above the sensor 132 is less than the thickness of the elastic element 131 below the sensor 132. In this case, when the object under test 2 is inserted into the slot device 1, it can be guided by the inclined flexible circuit board 12 to ensure smooth insertion, and the impact force between the object under test 2 and the flexible circuit board 12 can be reduced, thereby improving the lifespan of the flexible circuit board 12.

[0067] Furthermore, the thickness of the elastic member 131 located above or below the sensor 132 can increase in the same direction as the insertion direction of the object under test 2. That is, the surface of the elastic member 131 located above or below the sensor 132 that contacts the flexible circuit board 12 can be an inclined surface that is narrower at the top and wider at the bottom.

[0068] In some embodiments, the thickness of the elastic element 131 may decrease in the same direction as the insertion direction of the object under test 2. For example, there may be two elastic elements 131. In the same direction as the insertion of the object under test 2 into the slot device 1, one elastic element 131 may be arranged above the sensor 132, and the other elastic element 131 may be arranged below the sensor 132. The thickness of the elastic element 131 increases in the same direction as the insertion direction of the object under test 2, that is, the height increases in the direction perpendicular to the insertion direction of the object under test 2. In other words, the thickness of the elastic element 131 above the sensor 132 is greater than the thickness of the elastic element 131 below the sensor 132. In this case, when the object under test 2 is inserted into the slot device 1, since the thickness of the elastic member 131 above the sensor 132 is greater than the thickness of the elastic member 131 below the sensor 132, the elastic member 131 above the sensor 132 provides greater elasticity, thereby improving the closeness between the flexible circuit board 12 and the object under test 2, and thus improving the accuracy of the sensor 132 in acquiring sensing data.

[0069] Furthermore, the thickness of the elastic member 131 located above or below the sensor 132 can decrease in the same direction as the insertion direction of the object under test 2. That is, the surface of the elastic member 131 located above or below the sensor 132 that contacts the flexible circuit board 12 can be a sloping surface that is narrow at the bottom and wide at the top.

[0070] In some embodiments, the elastic element 131 may include at least one elastic structure such as sponge, silicone, or a non-conductive spring.

[0071] In some embodiments, sensor 132 may be a temperature sensor, and the sensing data may be temperature sensing data. The temperature sensor may be a semiconductor temperature sensor, such as a temperature sensor based on a BJT (Bipolar Junction Transistor).

[0072] In other embodiments, sensor 132 may be various types of sensors other than temperature sensors, such as travel sensors, current sensors, or position sensors. Sensing data may include travel, electrical parameters, or position data.

[0073] Please see Figure 8As shown, in some embodiments, the sensing component 13 may include at least one connector 133 having thermal and electrical conductivity. The connector 133 may be disposed in the receiving portion 121 and at least a portion thereof is located on the side of the receiving portion 121 away from the slot body 11. The connector 133 is used to connect the sensing component 13 and the flexible circuit board 12.

[0074] In some embodiments, the connector 133 may be copper, silver, gold, or other metals or alloys with good thermal and electrical conductivity.

[0075] In some embodiments, the connector 133 can be configured as a Via or Pad hole for connecting the sensor 132 and the flexible circuit board 12. This enables the circuit connection between the sensor 132 and the flexible circuit board 12.

[0076] like Figure 8 As shown, in some embodiments, a portion of the connector 133 may be disposed on the surface of the flexible circuit board 12 and located on the side of the flexible circuit board 12 closer to the object under test 2. In this case, the thermal conductivity of the connector 133 can be used to transfer the temperature of the object under test 2 to the sensor 132, thereby improving the accuracy of the sensing data acquired by the sensor 132.

[0077] In this embodiment, since the flexible circuit board 12 has the ability to deform, and since the sensing component 13 is disposed on the flexible circuit board 12 and located on the side of the flexible circuit board 12 close to the slot body 11, when the slot body 11 inserts the object under test 2 through the slot, the object under test 2 first contacts the flexible circuit board 12 and causes the flexible circuit board 12 to deform. The sensing component 13 changes position accordingly when the flexible circuit board 12 deforms. That is, the deformation of the flexible circuit board 12 can move the sensing component 13 from the first position to the second position, thereby reducing the problem of friction and collision between the object under test 2 and the sensing component 13 and providing effective protection for the sensing component 13.

[0078] In addition, when the slot body 11 inserts the test object 2 through the slot, the deformation capability of the flexible circuit board 12 can make it fit tightly against the test object 2, thereby making the sensing component 13 disposed on the flexible circuit board 12 close to the test object 2, thereby improving the accuracy of the sensing data obtained by the sensing component 13.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A slot device, characterized in that, include: The slot body has a slot for inserting the object to be tested; A flexible circuit board is disposed in the slot body; A sensing component is disposed on the flexible circuit board and located on the side of the flexible circuit board close to the slot body, for acquiring sensing data of the object under test inserted into the slot, and electrically connected to the flexible circuit board to transmit the sensing data through the flexible circuit board. When the object under test is inserted into the slot, the object under test contacts the flexible circuit board and deforms the flexible circuit board to move the sensing component from the first position to the second position.

2. The slot device according to claim 1, characterized in that, The slot body has a placement portion in the shape of a groove or a hollowed-out section, and at least a portion of the flexible circuit board is disposed in the placement portion.

3. The slot device according to claim 2, characterized in that, The flexible circuit board is disposed in the placement portion, forming a receiving portion for accommodating the sensing component. The sensing component is disposed in the receiving portion and located on the side of the receiving portion close to the slot body. A partition portion is formed in the receiving portion in the same direction as the insertion direction of the object to be tested.

4. The slot device according to claim 3, characterized in that, The sensing component includes a sensor and at least one elastic element, the sensor and the elastic element being disposed in the receiving portion and located on the side of the receiving portion close to the slot body.

5. The slot device according to claim 4, characterized in that, The elastic element is a single, annular shape, and the sensor is located at the center of the annular shape of the elastic element.

6. The slot device according to claim 4, characterized in that, There are multiple elastic elements, and the multiple elastic elements are evenly distributed around the sensor.

7. The slot device according to claim 4, characterized in that, The thickness of the elastic element is equal in the same direction as the insertion direction of the object under test.

8. The slot device according to claim 4, characterized in that, The thickness of the elastic element increases in the same direction as the insertion direction of the object under test.

9. The slot device according to claim 4, characterized in that, The thickness of the elastic element decreases in the same direction as the insertion direction of the object under test.

10. The slot device according to claim 3, characterized in that, The sensing component includes at least one connector with thermal and electrical conductivity, the connector being disposed in the receiving portion and at least a portion of which is located on the side of the receiving portion away from the slot body, the connector being used to connect the sensing component and the flexible circuit board.

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