Wireless microprocessor module

Abstract

The utility model provides a wireless microprocessor module, comprising a carrier plate having an upper surface and a lower surface; the wireless microprocessor circuit structure is arranged on the upper surface of the carrier plate; the at least one antenna pin is arranged on the lower surface of the carrier plate, and the at least one antenna pin is electrically connected with the wireless microprocessor circuit structure; and the antenna connecting buckle is arranged on the upper surface of the carrier plate, and the antenna connecting buckle is electrically connected with the wireless microprocessor circuit structure and the at least one antenna pin. Therefore, the antenna connecting buckle is built in the antenna pin, so that the antenna can be directly connected with antenna equipment; moreover, the wireless microprocessor core can enhance the transmitted signal through a preceding-stage chip, so that serious interference of noise is avoided.

Description

Technical Field

[0001] This utility model relates to a wireless microprocessor, and more particularly to a wireless microprocessor module with a built-in antenna connection clip. Background Technology

[0002] Currently, processor modules using wireless transmission have a relatively large overall circuit structure and require adapters to connect to the antenna before connecting to external connectors, such as miniature RF connectors (i.PEX). Furthermore, the signal strength during use is often weak, leading to frequent noise interference affecting transmission. Utility Model Content

[0003] In view of the above problems, the main purpose of this utility model is to provide a wireless microprocessor module with an antenna connection clip built in through the antenna pin, which can be directly connected to the antenna device; furthermore, the wireless microprocessor core can enhance the transmitted signal through the front-end chip to avoid serious interference from noise.

[0004] To achieve the aforementioned objectives, the present invention provides a wireless microprocessor module, comprising: a carrier board having an upper surface and a lower surface; a wireless microprocessor circuit structure disposed on the upper surface of the carrier board; at least one antenna pin disposed on the lower surface of the carrier board, the at least one antenna pin being electrically connected to the wireless microprocessor circuit structure; and an antenna connection clip disposed on the upper surface of the carrier board, the antenna connection clip being electrically connected to the wireless microprocessor circuit structure and the at least one antenna pin.

[0005] In some embodiments, the wireless microprocessor circuit structure includes a wireless microprocessor core, a front-end chip, and a memory. The front-end chip is electrically connected to the wireless microprocessor core and is electrically connected to the antenna connection clip via the at least one antenna pin. The memory is electrically connected to the wireless microprocessor core.

[0006] In some embodiments, the wireless microprocessor circuit structure further includes a quartz oscillator electrically connected to the wireless microprocessor core.

[0007] In some embodiments, the quartz oscillator has an oscillation frequency of 32 MHz.

[0008] In some embodiments, the wireless microprocessor core is in wafer-level chip scale packaging (WLCSP).

[0009] In some embodiments, the carrier plate has a dimension of 12mm. 16mm.

[0010] In some embodiments, the wireless microprocessor circuit structure further includes a Near Field Communication (NFC) module electrically connected to the wireless microprocessor core.

[0011] In some embodiments, the carrier plate has a dimension of 12mm. 16mm or 16mm 20mm.

[0012] In some embodiments, the front-end chip is also electrically connected to a Universal Subscriber Identity Module (USIM).

[0013] In some embodiments, the carrier is a circuit board or a semiconductor carrier material. Attached Figure Description

[0014] Figure 1 This is a block diagram illustrating the structure of the first embodiment of the wireless microprocessor module of this utility model;

[0015] Figure 2 This is a top view schematic diagram of the first embodiment of the wireless microprocessor module of this utility model;

[0016] Figure 3 This is a bottom view schematic diagram of the first embodiment of the wireless microprocessor module of this utility model;

[0017] Figure 4 This is a structural block diagram of the second embodiment of the wireless microprocessor module of this utility model;

[0018] Figure 5 This is a top view schematic diagram of the second embodiment of the wireless microprocessor module of this utility model; and

[0019] Figure 6 This is a bottom view diagram of a second embodiment of the wireless microprocessor module of this utility model at different sizes. Detailed Implementation

[0020] Figure 1 This is a block diagram illustrating the structure of the first embodiment of the wireless microprocessor module of this utility model. Figure 2 This is a top view schematic diagram of the first embodiment of the wireless microprocessor module of this utility model. Figure 3 This is a bottom view schematic diagram of the first embodiment of the wireless microprocessor module of this utility model. The wireless microprocessor module of this utility model can be defined as BFi53MLG.

[0021] Please refer to Figures 1 to 3The wireless microprocessor module 100 of this utility model includes a carrier board 110, a wireless microprocessor circuit structure 120, at least one antenna pin 130, and an antenna connection clip 140.

[0022] The carrier plate 110 may have an upper surface 111 (e.g., Figure 2 As shown) and the following surface 112 (as shown) Figure 3 (As shown). In some embodiments, the carrier 110 may be a circuit board or a semiconductor carrier, but is not limited thereto. In this embodiment, a dimension of the carrier 110 may be 12 mm. 16mm.

[0023] Please also refer to Figure 1 and Figure 2 The wireless microprocessor circuit structure 120 can be disposed on the upper surface 111 of the carrier board 110. The wireless microprocessor circuit structure 120 may include a wireless microprocessor core 121, a front-end chip 122, and a memory 124. The front-end chip 122 is electrically connected to the wireless microprocessor core 121, and the front-end chip 122 is electrically connected to the antenna pin 130. The memory 124 is electrically connected to the wireless microprocessor core 121. In this embodiment, the wireless microprocessor core 121 may be an ARM Cortex-M33 with 2.4GHz Lower Power RF, but is not limited thereto. In some embodiments, the memory 124 may be a QSPI (Quad Serial Peripheral Interface) 2M-byte flash memory, but is not limited thereto. In some embodiments, the operating voltage (VDD) of the wireless microprocessor core 121 may be 2.7V~5.5V. In some embodiments, the front-end chip 122 may be a front-end module (FEM) used to enhance the signal transmitted by the wireless microprocessor core 121, thereby avoiding interference from noise. In some embodiments, the operating voltage (FEM VDD) of the front-end chip 122 may be 2.7V to 3.6V.

[0024] Please also refer to Figure 1 and Figure 3 Antenna pin 130 can be disposed on the lower surface 112 of carrier board 110, and antenna pin 130 can be electrically connected to antenna connection clip 140, and antenna pin 130 can be electrically connected to front-end chip 122.

[0025] Please also refer to Figure 1 and Figure 3The antenna connection clip 140 can be disposed on the upper surface 111 of the carrier board 110, and the antenna connection clip 140 can electrically connect the wireless microprocessor circuit structure 120 and the antenna pin 130. That is, the antenna connection clip 140 can electrically connect to the wireless microprocessor core 121 of the wireless microprocessor circuit structure 120. In some embodiments, the antenna connection clip 140 can be a small radio frequency connector, such as i.PEX, but is not limited thereto. Thus, the wireless microprocessor module 100 of this invention can have the antenna connection clip 140 built into it through the antenna pin 130, and can directly connect to an antenna device (not shown).

[0026] Please refer to Figure 1 In some embodiments, the wireless microprocessor circuit structure 120 may further include a quartz oscillator 123 electrically connected to the wireless microprocessor core 121. In some embodiments, the oscillation frequency of the quartz oscillator may be 32MHz to provide a stable circuit frequency for the wireless microprocessor core 121.

[0027] Please refer to Figure 3 In some embodiments, the wireless microprocessor module 100 of this invention further includes at least 45 configurable input / output (IOs) (i.e., 45 pins), a downloader pin SWD, and a reset pin nRESET. The 45 configurable I / O pins can be used for data or signal input and output; the downloader pin SWD can be used to download an update program to update the wireless microprocessor core 121; and the reset pin nRESET can be used to receive signals to reset the wireless microprocessor core 121.

[0028] Figure 4 This is a block diagram illustrating the structure of the second embodiment of the wireless microprocessor module of this utility model. Figure 5 This is a top view schematic diagram of the second embodiment of the wireless microprocessor module of this utility model. Figure 6This is a bottom view of a second embodiment of the wireless microprocessor module of this utility model, showing different dimensions. The wireless microprocessor module of the second embodiment is similar to that of the first embodiment, except that the second embodiment includes a Near Field Communication (NFC) module 150, and the wireless microprocessor core 121 is an ARM Cortex-M33 with NB-IoT / LTE-M / DECT-NR+. Therefore, the operating voltage (VDD) of the wireless microprocessor core 121 in the second embodiment can be 3V~5.5V. Components identical to those in the second embodiment and the first embodiment are numbered the same, and their structures and functions are similar or identical, so further details are omitted.

[0029] Please also refer to Figure 4 and Figure 5 In this embodiment, the Near Field Communication (NFC) module 150 is electrically connected to the wireless microprocessor core 121. The NFC module 150 and the wireless microprocessor core 121 communicate via a start signal path V_EN and a data path I2C. The start signal path V_EN provides parameters to the wireless microprocessor core 121 for corresponding parameter execution functions; while the data path I2C is used by the wireless microprocessor core 121 to transmit data to the NFC module 150, and then to a near field communication reader (NFC Reader) (not shown). The NFC Reader can be, for example, a mobile phone for wireless communication, but is not limited thereto.

[0030] In some embodiments, the front-end chip 122 may also be electrically connected to a Universal Subscriber Identity Module (USIM) to identify the user's identity and enhance the security of the wireless microprocessor module 100 of this invention.

[0031] In some embodiments, the size of the carrier plate 110 in this embodiment may be 12mm. 16mm (e.g.) Figure 2 , Figure 3 and Figure 5 (as shown) or 16mm 20mm (e.g.) Figure 6 (As shown). When the size is 12mm 16mm (e.g.) Figure 2 , Figure 3 and Figure 5When shown), the wireless microprocessor module 100 of this embodiment can be defined as BFi913MLG (1216), and its size is the same as that of the wireless microprocessor module 100 of the first embodiment defined as BFi53MLG; while when the size is 16mm 20mm (e.g.) Figure 6 As shown, the wireless microprocessor module 100 of this embodiment can be defined as BFi915MLG(1620), thereby distinguishing it from the BFi53MLG defined in the wireless microprocessor module 100 of the first embodiment.

[0032] In summary, the wireless microprocessor module 100 of this utility model has an built-in antenna connection clip 140 through the antenna pin 130, which can be directly connected to an antenna device (not shown in the figure); furthermore, the wireless microprocessor core 121 can enhance the transmitted signal through the front-end chip 122 to avoid severe interference from noise.

[0033]

Explanation of symbols

[0034] 100: Wireless Microprocessor Module

[0035] 110: Carrier board

[0036] 111: Upper surface

[0037] 112: Lower surface

[0038] 120: Wireless Microprocessor Circuit Structure

[0039] 121: Wireless Microprocessor Core

[0040] 122: Pre-amplifier chip

[0041] 123: Quartz Oscillator

[0042] 124: Memory

[0043] 130: Antenna pin

[0044] 140: Antenna connection clip

[0045] 150: Near Field Communication Module

[0046] 200: Global User Identification Module

[0047] FEM VDD: Operating voltage

[0048] I2C: Data Path

[0049] nRESET: Reset pins

[0050] SWD: Download Program Pin

[0051] V_EN: Start signal path

[0052] VDD: Operating voltage

Claims

1. A wireless microprocessor module, comprising: A carrier plate having an upper surface and a lower surface; A wireless microprocessor circuit structure is disposed on the upper surface of the carrier board; At least one antenna pin is disposed on the lower surface of the carrier board, and the at least one antenna pin is electrically connected to the wireless microprocessor circuit structure; as well as An antenna connector is disposed on the upper surface of the carrier board, and the antenna connector electrically connects the wireless microprocessor circuit structure to the at least one antenna pin.

2. The wireless microprocessor module as described in claim 1, wherein, The wireless microprocessor circuit structure includes a wireless microprocessor core, a front-end chip, and a memory. The front-end chip is electrically connected to the wireless microprocessor core and is electrically connected to the antenna connection clip through at least one antenna pin. The memory is electrically connected to the wireless microprocessor core.

3. The wireless microprocessor module as described in claim 2, wherein, The wireless microprocessor circuit structure also includes a quartz oscillator electrically connected to the wireless microprocessor core.

4. The wireless microprocessor module as described in claim 3, wherein, The quartz oscillator has an oscillation frequency of 32MHz.

5. The wireless microprocessor module as described in claim 2, wherein, The core of this wireless microprocessor is packaged at the wafer-level chip scale.

6. The wireless microprocessor module as described in claim 1, wherein, The carrier plate has a dimension of 12mm. 16mm.

7. The wireless microprocessor module as described in claim 2, wherein, The wireless microprocessor circuit structure also includes a near-field communication module, which is electrically connected to the wireless microprocessor core.

8. The wireless microprocessor module as described in claim 7, wherein, The carrier plate has a dimension of 12mm. 16mm or 16mm 20mm.

9. The wireless microprocessor module as described in claim 7, wherein, The front-end chip is also electrically connected to a global subscriber identification module.

10. The wireless microprocessor module as claimed in claim 1, wherein, The carrier board is a circuit board or a semiconductor carrier board.

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