Base transfer equipment and semiconductor processing system

Abstract

The utility model provides a base transfer device and a semiconductor processing system, the base transfer device comprises a transfer chamber and a transmission device arranged outside the transfer chamber and used for transferring a base, and a buffer device used for bearing the base is arranged in the transfer chamber. The temporary storage device comprises a bearing body and a plurality of supporting seats. The supporting seats are arranged around the middle of the bearing body, and the supporting seats are slidably arranged on the bearing body in the direction from the middle of the bearing body to the edge, so that the size of a bearing area defined by the supporting seats and used for bearing the base is adjusted, and the utilization rate of the temporary storage device is increased. The supporting seat comprises a lifting seat to move towards or away from the bearing body, so that after the base is borne by the supporting seats, the supporting seats can be lifted by controlling the lifting seat to reduce the space above the base, and the conveying device is prevented from carrying a new base to enter so as to avoid the disc stacking problem.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically, to base transfer equipment and semiconductor processing systems. Background Art

[0002] With the development of semiconductor technology, the requirements for wafer processing efficiency are increasing. The substrate, as a crucial component supporting the wafer, plays a key role in the semiconductor manufacturing process. After the wafer is placed on the substrate, it enters the process chamber to complete processes such as vapor deposition. After the process is completed, the substrate, or the substrate holding the coated wafer, needs to be transferred to a transfer chamber for cooling and preparation for subsequent use or removal of the coated wafer.

[0003] Some current semiconductor processing systems are equipped with multiple process chambers that can accommodate carrier substrates of different sizes. The carrier substrates of different sizes can hold wafers of different sizes, or they can hold wafers of the same size but different numbers, thereby enabling parallel processing of multiple numbers or sizes of wafers in the semiconductor processing system.

[0004] In terms of caching for substrates or substrates carrying coated wafers, existing technologies typically employ multiple cache devices to store substrates of specific sizes or substrates carrying coated wafers. While this method enables storage of substrates of different sizes, it requires a large number of cache devices, increasing space usage. Furthermore, it may result in a situation where a transfer chamber accommodating one size of substrate is idle, while another size of substrate, especially when smaller than the aforementioned size, cannot find a suitable cache device, thus reducing space utilization.

[0005] Furthermore, after the buffer unit in the transfer chamber carries the base, there is a certain amount of space above the base. When the transfer device moves the next base into the transfer chamber, if the base on the buffer unit has not been moved out of the transfer chamber, the transfer device will enter the space above the base and stack the next base on it, thus creating a stacking problem. Stacking can contaminate the wafer, and in severe cases, it can lead to wafer damage, which in turn reduces the yield of batch products. Utility Model Content

[0006] The purpose of this application is to provide a base transfer device and a semiconductor processing system including the base transfer device, so that the base transfer device can support bases of different sizes and increase utilization, and can prevent base stacking problems.

[0007] To achieve the above objectives, the base transfer device of this application includes a transfer chamber and a transmission device disposed outside the transfer chamber for transferring bases. A buffer device is provided in the transfer chamber. The buffer device includes a supporting body and several support seats. The support seats are arranged around the center of the supporting body, and each support seat is slidably disposed on the supporting body in a direction from the center of the supporting body to the edge, so as to adjust the size of the bearing area enclosed by the tops of the support seats. The bearing area is used to support the base. The support seats include lifting seats to move toward or away from the supporting body.

[0008] In one feasible solution, several load-bearing sensing devices are also included, and the support base also includes a support body sleeved outside the lifting base, with the load-bearing sensing devices located on the lifting base.

[0009] In one feasible embodiment, the transfer room includes at least two transfer buffer cavities, each of which is provided with at least one buffer device.

[0010] In one feasible embodiment, the carrier body of the buffer device includes a plurality of radially distributed displacement mechanisms, each displacement mechanism having at least one support seat slidably disposed thereon, the top of each support seat forming a bearing area. Secondly, this application also provides a semiconductor processing system, including the aforementioned base transfer device and a main control device, wherein the main control device is communicatively connected to the transmission device of the base transfer device and each lifting seat.

[0011] In one feasible solution, each lifting platform is equipped with a load-bearing sensor, and the main control device is communicatively connected to the load-bearing sensor.

[0012] In one feasible solution, the main control unit is communicatively connected to the displacement mechanism of each buffer unit.

[0013] In one feasible embodiment, at least two process chambers equipped with vision devices are also included, at least one of which is configured to accommodate a base of a different size from the remaining process chambers, and each vision device is communicatively connected to a main control device.

[0014] In one feasible solution, a pre-processing chamber and a transport device are also included. The transport device is equipped with a buffer to accommodate bases of different sizes by adjusting the size of the carrying area. The transport device is communicatively connected to the main control device to enter the pre-processing chamber under the control of the main control device.

[0015] In one feasible solution, the buffer device of the shipping device is communicatively connected to the main control device to adjust the size of the carrying area under the control of the main control device.

[0016] Compared with the prior art, the beneficial effects of the base transfer device of this application include at least the following:

[0017] In the base transfer device of this application, a buffer device for supporting bases is provided in the transfer chamber. The buffer device includes a support body and a plurality of support seats slidably disposed on the support body. The plurality of support seats are arranged around the middle of the support body, and each support seat is slidably disposed in a direction from the middle of the support body toward the edge, so as to adjust the size of the bearing area for supporting the base enclosed by the plurality of support seats. This allows the size of the bearing area enclosed by each support seat to be controlled and adapted to different base sizes before the transfer device moves the base into the transfer chamber for storage, thereby improving the utilization rate of the buffer device. Furthermore, the support seats include lifting seats that can move toward or away from the support body. This allows the support seats to be raised by controlling the lifting seats after the base is supported by the support seats, thereby reducing the space above the base and preventing the transfer device from bringing in new bases to avoid stacking problems. It also effectively avoids the risk of contamination and damage to the wafers in the transfer chamber due to stacking. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a base transfer device according to an embodiment of this application;

[0020] Figure 2 This is a top view of a base transfer device according to an embodiment of this application;

[0021] Figure 3 This is a perspective view of a cache device according to an embodiment of this application;

[0022] Figure 4 for Figure 3 Top view;

[0023] Figure 5 This is a schematic diagram illustrating the working state of the cache device with an increased carrying area size, as shown in an embodiment of this application.

[0024] Figure 6 This is a schematic diagram illustrating the working state of the cache device with a reduced carrying area size, as shown in the embodiments of this application.

[0025] Figure 7 This is a schematic diagram of a transfer chamber with multiple transfer buffer cavities, as shown in an embodiment of this application.

[0026] Figure 8This is a top view schematic diagram of a buffer device with multiple support seats on a displacement mechanism, as shown in an embodiment of this application;

[0027] Figure 9 This is a schematic diagram of the structure of a first semiconductor processing system as shown in an embodiment of this application;

[0028] Figure 10 This is a schematic diagram of the structure of a second semiconductor processing system as shown in an embodiment of this application.

[0029] In the diagram: 1. Transfer room; 11. Transfer buffer cavity; 2. Transmission device; 21. Clamping device; 3. Main control device; 4. Process room; 5. Pre-processing room; 6. Transport device; 7. Vision device; 100. Buffer device; 101. Support base; 102. Lifting base; 1021. Support body; 103. Displacement mechanism; 104. Bearing body; S. Buffer area; 01. Base; 02. Wafer. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] like Figure 1 and Figure 2 As shown, this application embodiment provides a base transfer device, including a transfer chamber 1 and a transmission device 2 disposed outside the transfer chamber 1 for transferring base 01. A buffer device 100 for carrying the base 01 is disposed in the transfer chamber 1. See also... Figure 2 The buffer device 100 includes a support body 104 and a plurality of support seats 101. The plurality of support seats 101 are arranged around the middle of the support body 104. Each support seat 101 is slidably disposed on the support body 104 in a direction from the middle of the support body 104 toward the edge, so as to adjust the size of the bearing area enclosed by the tops of the plurality of support seats 101. The bearing area is used to support the base 01. The support seat 101 includes a lifting seat 102 to move toward or away from the support body 104.

[0033] In the base transfer device of this embodiment, before the transmission device 2 moves the base 01 into the transfer chamber 1 for storage, the distance between each support 101 and the center of the support body 104 can be adjusted along the direction from the center of the support body 104 to the edge. This allows control over the size of the area enclosed by the top of each support 101 to accommodate different base sizes and improve the utilization rate of the buffer device 100. When the lifting seat 102 is lowered to a lower position, sufficient space can be reserved above the support 101 to facilitate the entry of the transmission device 2 carrying the base 01. Subsequently, the holding end of the transmission device 2 carries the base 01 into the upper space of the support 101, places the base 01 on the bearing area enclosed by the tops of each support 101, and then the transmission device 2 immediately withdraws from the transfer chamber 1. After the base 01 is placed in the bearing area enclosed by the top of each support 101, the lifting platform 102 starts to rise, raising the support 101 that has been loaded with the base 01 until the buffer space above the base 01 can prevent the transmission device 2 and new base 01 from entering, thereby avoiding the stacking phenomenon and effectively avoiding the risk of contamination and damage to the wafer 02 in the transfer room 1 due to the stacking.

[0034] Furthermore, after the base 01 is placed in the bearing area enclosed by the tops of each support 101, the process of the lifting seat 102 starting to rise will not interfere with the process of the transmission device 2 placing the base 01 in the bearing area enclosed by the tops of each support 101 and then immediately withdrawing from the transfer chamber 1. Specifically, this can be achieved by controlling the rate at which the lifting seat 102 starts to rise and the rate at which the transmission device 2 withdraws from the transfer chamber 1.

[0035] In some embodiments, each lifting seat 102 is an automatic lifting seat, capable of sensing the weight of the placed base 01 and automatically rising or falling after a set time interval. For example, when the transmission device 2 places the base 01 in the load-bearing area enclosed by the lifting seats 102, each lifting seat 102 senses the increase in load and automatically rises after a set time interval to prevent stacking problems. This set time interval is adaptively set according to the working conditions to ensure the stable placement of the base 01 in the load-bearing area without affecting the withdrawal of the transmission device 2 from the transfer room 1. For example, when the transmission device 2 moves the base 01 placed in the load-bearing area away from the load-bearing area, each lifting seat 102 senses the decrease in load weight to 0 and automatically falls after a set time interval to facilitate the subsequent transmission device 2 carrying other bases 01 into the space above the lifting seats 102. This set time interval is necessary to ensure that it does not affect the withdrawal of the transmission device 2 from the transfer room 1.

[0036] In some embodiments, the transmission device 2 can be a multi-degree-of-freedom robotic arm, a synchronous belt module, or a lead screw module.

[0037] In some embodiments, an obstacle sensor is provided at the front end of the transmission device 2. The obstacle sensor can be an infrared sensor, an ultrasonic probe, a proximity switch, a pressure sensor, etc. When the transmission device 2 enters above the support base 101, it will enter at a predetermined fixed height. Therefore, when the lifting seat 102 of the support base 101 rises, and the transmission device 2 carries the base 01 in at the predetermined height, the obstacle sensor can detect the raised support base 101, thereby preventing the transmission device 2 and the base 01 it carries from re-entering, thus preventing the stacking phenomenon from occurring.

[0038] In some embodiments, the support base 101 may be provided with a load-bearing sensing device (not shown in the figure) for sensing whether the support base 101 is bearing a base.

[0039] In some embodiments, such as Figure 1 As shown, the support base 101 also includes a support body 1021 sleeved outside the lifting base 102, and a load-bearing sensing device is installed on the lifting base 102. The main control device 3 controls the lifting base 102 to move up and down relative to the support body 1021.

[0040] In one embodiment, if Figure 2 As shown, the transmission device 2 may include a clamping device 21 with adjustable clamping size to facilitate clamping bases of different sizes.

[0041] In some embodiments, the transfer chamber 1 includes at least two transfer buffer cavities 11, and each transfer buffer cavity 11 is provided with at least one buffer device 100.

[0042] For example, in some embodiments, such as Figure 1 As shown, the transit buffer cavities 11 in transit chamber 1 can be arranged vertically.

[0043] For example, in some embodiments, such as Figure 2 As shown, the transit buffer cavities 11 in transit chamber 1 can be arranged in the same plane.

[0044] For example, in some embodiments, the transfer buffer cavities 11 in the transfer chamber 1 can be arranged in multiple layers along the vertical direction, and multiple transfer buffer cavities 11 can be arranged in the same plane of each layer.

[0045] In some embodiments, such as Figure 2 , Figure 3 and Figure 4 As shown, the carrier body 104 of the buffer device 100 includes a plurality of displacement mechanisms 103 radially distributed around a central position O. Each displacement mechanism 103 has a support seat 101 slidably mounted on it. The top of each support seat 101 forms a bearing area S of the carrier base (the bearing area S includes the top surface of each support seat 101). Figure 5As shown, the support seats 101 on all displacement mechanisms 103 move away from the center position O, and the size of the bearing area S increases, as shown. Figure 6 As shown, the support 101 moves closer to the center position O, and the size of the bearing area S becomes smaller. In some embodiments, the position, direction of movement, and distance of each support 101 on the displacement mechanism 103 are kept consistent, that is, each support 101 is synchronously adjusted on the displacement mechanism 103.

[0046] like Figure 7 As shown, when the buffer device 100 in the transfer chamber 1 stores the base 01, it adjusts the position of each support 101 on the displacement mechanism 103 in advance according to the size of the base 01 to be supported, so that the bearing area S enclosed by each support 101 is adapted to the size of the base to be supported. Because the bearing area of ​​the buffer device 100 can be flexibly adjusted, each buffer device 100 in the transfer chamber 1 can be fully utilized, improving the buffering flexibility of the base 01.

[0047] In some embodiments, the displacement mechanism 103 can be a guide rail, and the support base 101 can be provided with a sliding groove. The support base 101 is slidably mounted on the guide rail through the cooperation of the sliding groove and the guide rail, and the position of the support base 101 on the guide rail can be manually adjusted.

[0048] In some embodiments, such as Figure 8 As shown, each displacement mechanism 103 can be provided with multiple slidable support seats 101. On the same displacement mechanism 103, the support seat 101 far from the center position O determines the maximum size of the bearing area S, while the support seat 101 close to the center position O is used to provide effective support for the inner part of the base 01, thereby forming a more stable support effect and preventing the base 01 from falling as much as possible.

[0049] like Figure 9 As shown, this application embodiment also provides a semiconductor processing system, including any of the base transfer devices described in the foregoing embodiments. The semiconductor processing system further includes a main control device 3, which is communicatively connected to the transmission device 2 of the base transfer device and each lifting seat 102. The main control device 3 controls the transmission device 2 to transmit the base 01 to the transfer chamber 1 and place it on the buffer device 100. Furthermore, the main control device 3 can control the lifting movement of each lifting seat 102.

[0050] In some embodiments, the semiconductor processing system further includes one or at least two process chambers 4, and the main control device 3 controls the transmission device 2 to transmit the base 01 between the process chamber 4 and the transfer chamber 1.

[0051] In some embodiments, the main control device 3 is communicatively connected to the cache device 100 to control the size of the bearing area enclosed by each support 101, and also to control the height of each support 101.

[0052] In some embodiments, each lifting seat 102 is equipped with a load-bearing sensor, and each load-bearing sensor is communicatively connected to the main control device 3. The main control device 3 receives the load-bearing information of each lifting seat 102 through each load-bearing sensor and determines whether it is necessary to control each lifting seat to rise or fall.

[0053] In some embodiments, the supporting body 104 of the buffer device 100 includes a plurality of radially distributed displacement mechanisms 103. The displacement mechanisms 103 are connected to the main control device 3, and the main control device 3 controls the movement of the displacement mechanisms 103, thereby driving the support seat 101 to move along the extension direction of the displacement mechanisms 103 to change its position. In some specific embodiments, the displacement mechanism includes a guide rail and a drive mechanism. The support seat 101 is provided with a sliding groove, and the support seat 101 is mounted on the guide rail through the cooperation of the sliding groove and the guide rail. The drive mechanism includes a motor and a motor-driven traveling wheel. The drive mechanism is mounted on the support seat 101, and the traveling wheel contacts the guide rail or a surface near the guide rail. The motor controls the rotation of the traveling wheel, thereby causing the support seat 101 to slide along the guide rail to change its position.

[0054] In some embodiments, the displacement mechanism 103 can be an electrically driven control screw module, a synchronous belt module, etc.

[0055] In some embodiments, the main control device 3 is communicatively connected to each process chamber 4. The main control device 3 can determine which process chambers 4 need to be transferred out of the base 01 based on information sent by each process chamber 4, and then control the transmission device 2 to transfer the base out of that process chamber 4 and transport it to the transfer chamber 1. In this case, the base 01 is the base carrying the coated wafer.

[0056] In some embodiments, after the main control device 3 determines that the process chamber 4 is in the open state, it can first control the wafer picking mechanism to enter the corresponding process chamber 4 to perform wafer picking operation on the wafer 02, and then confirm that the corresponding process chamber 4 needs to be transferred out of the base 01.

[0057] In some embodiments, bases 01 of different sizes support wafers 02 of different sizes, or support wafers 02 of the same size but different numbers. For example... Figure 9 As shown, the number of process chambers 4 in the semiconductor processing system can be at least two, and at least one process chamber 4 is configured to accommodate a base of a different size from the remaining process chambers 4, which helps to enable parallel processing of multiple quantities or multiple sizes of wafers 02 and improves productivity.

[0058] In some embodiments, such as Figure 10As shown, the semiconductor processing system may include at least two process chambers 4 equipped with vision devices 7. At least one process chamber 4 is configured to accommodate a base of a different size from the remaining process chambers 4. Each vision device 7 is communicatively connected to a main control device 3. The main control device 3 obtains the size information of the base in the process chamber 4 through the vision devices 7, and then controls the displacement mechanism 103 of the empty buffer device 100 in the transfer chamber 1 to work, changing the position of the support 101 so that the size of the bearing area S enclosed by each support 101 is consistent with the size of the base 01 to be supported.

[0059] In some embodiments, there may be only one transit buffer chamber 11 in the transit chamber 1, and the number of buffer devices 100 in this transit buffer chamber 11 may be one. When a base 01 to be transferred in one process chamber 4 is transferred to the buffer device 100 and cooled to room temperature, the base 01 is transferred out of the transit chamber 1. At this time, the size of the carrying area of ​​the buffer device 100 is adapted to the base 01. When a base 01 of a different size to be transferred in another process chamber 4 needs to be transferred to the buffer device 100, because the carrying area of ​​the buffer device 100 can be flexibly adjusted, adjusting the size of the carrying area of ​​the buffer device 100 can still be used to buffer bases 01 of different sizes transferred out of another process chamber 4, thereby making full use of the buffer device 100 and improving the buffering flexibility for carrying bases 01 of different sizes.

[0060] In other embodiments, such as Figure 9 As shown, the number of buffer devices 100 in the transfer room 1 is preferably set to multiple, which further enhances the buffering capacity of the transfer room 1. Furthermore, since the size of the bearing area of ​​the unloaded buffer device 100 can be adaptively adjusted according to the size of the bearing base to be transferred, the buffer device 100 has more flexible adaptability and improves the utilization rate.

[0061] In one embodiment, if Figure 10 As shown, the semiconductor processing system may also include a pre-processing chamber 5 and a transport device 6. The transport device 6 is equipped with a buffer device 100 to carry bases 01 of different sizes by adjusting the size of the carrying area. For the specific implementation, please refer to the above description of the buffer device 100 set in the transit chamber 1.

[0062] In one embodiment, the transport device 6 is communicatively connected to the main control device 3 so that the transport base 01 enters the pre-processing chamber 5 under the control of the main control device 3.

[0063] In one embodiment, the buffer device 100 of the transport device 6 is communicatively connected to the main control device 3 to adjust the size of the carrying area under the control of the main control device 3.

[0064] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A base transfer device, characterized in that, It includes a transfer room and a transmission device located outside the transfer room and used for transferring the base; the transfer room is equipped with a buffer device. The buffer device includes a carrier body and a plurality of support seats. The plurality of support seats are arranged around the middle of the carrier body. Each support seat is slidably arranged on the carrier body in a direction from the middle of the carrier body to the edge, so as to adjust the size of the bearing area surrounded by the tops of the plurality of support seats. The bearing area is used to support the base. The support includes a lifting seat for moving toward or away from the load-bearing body.

2. The base transfer device according to claim 1, characterized in that, It also includes several load-bearing sensing devices, and the support base also includes a support body sleeved outside the lifting base, and the load-bearing sensing devices are located on the lifting base.

3. The base transfer device according to claim 1, characterized in that, The transfer chamber includes at least two transfer buffer cavities, and each transfer buffer cavity is provided with at least one of the buffer devices.

4. The base transfer device according to claim 1, characterized in that, The bearing body includes a plurality of displacement mechanisms arranged radially on the bearing body, and at least one support seat is slidably disposed on each displacement mechanism, with the top of each support seat forming the bearing area.

5. A semiconductor processing system, characterized in that, The device includes the base transfer equipment as described in any one of claims 1-4 and the main control device, wherein the main control device is communicatively connected to the transmission device of the base transfer equipment and each lifting seat.

6. The semiconductor processing system according to claim 5, characterized in that, Each of the lifting seats is equipped with a load-bearing sensing device, and the main control device is communicatively connected to the load-bearing sensing device.

7. The semiconductor processing system according to claim 5, characterized in that, The carrier body of the buffer device of the base transfer equipment includes several displacement mechanisms arranged radially, and the main control device is communicatively connected to each of the displacement mechanisms.

8. The semiconductor processing system according to claim 5, characterized in that, It also includes at least two process chambers equipped with vision devices, at least one of the process chambers being configured to accommodate a base of a different size from the remaining process chambers, and each of the vision devices being communicatively connected to the main control device.

9. The semiconductor processing system according to claim 5, characterized in that, It also includes a pre-processing room and a transport device. The transport device is equipped with a buffer device to support bases of different sizes by adjusting the size of the carrying area. The transport device is communicatively connected to the main control device so that it can enter the pre-processing room under the control of the main control device.

10. The semiconductor processing system according to claim 9, characterized in that, The buffer device of the transport device is communicatively connected to the main control device to adjust the size of the carrying area under the control of the main control device.

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