Wafer grabbing device
By designing a wafer gripping device, the problems of low wafer handling frequency and size uncertainty caused by operation inconvenience were solved, realizing safe and efficient handling of multi-specification wafers, avoiding the dangers of manual operation and the trouble of robot arm debugging.
Patent Information
- Application Number
- CN202423004681.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-06
AI Technical Summary
In wafer testing and scientific research equipment, especially in the cleaning field, the frequency of wafer handling is low and the size is highly uncertain. Using robotic arms for automatic loading requires repeated adjustments, which is inconvenient to operate, and manual handling is dangerous.
A wafer gripping device is designed, including a movable handle, a movable plate, a reset module, a substrate, clamping wheels, and multiple limiting modules. The movable handle drives the movable plate and clamping wheels to move, allowing the wafer to enter the placement space defined by the limiting modules of the corresponding size. The reset module is used to clamp the wafer, supporting the pick-and-place of wafers of various sizes without adjustment.
The operator's hands are kept outside the equipment, avoiding the risk of chemical contamination and equipment damage. It can also accommodate wafers of different sizes without the need for adjustment, making it easy to operate.
Smart Images
Figure CN223487036U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and more particularly to a wafer gripping device. Background Technology
[0002] In the manufacturing of integrated circuits (ICs), wafers need to be handled manually. However, this manual handling requires operators to put their hands inside the equipment, which can easily lead to contact with chemicals or accidental injury.
[0003] Currently, wafers are mainly handled automatically, using robotic arms in conjunction with suction cups or fingers to pick up and place them.
[0004] However, for most wafer experimental testing and scientific research equipment, especially in the cleaning field, the frequency of wafer handling is low, the operation is highly immediacy, and the wafer size is highly uncertain. Therefore, the use of robotic arms for automatic feeding requires repeated adjustments based on the wafer size, which causes operational inconvenience. Utility Model Content
[0005] In view of this, this application provides a wafer gripping device to at least partially solve the above-mentioned technical problems.
[0006] This application provides a wafer gripping device, comprising: a movable handle, a movable plate, a reset module, a substrate, clamping wheels, and multiple limiting modules; a first end of the movable handle is connected to the substrate, a second end of the movable handle is connected to a first end of the movable plate, and a second end of the movable plate is connected to the clamping wheels; the reset module is connected to both the movable plate and the substrate; the limiting modules are connected to the substrate, and different limiting modules correspond to wafers of different sizes; the movable handle is used to drive the movable plate and the clamping wheels to move in a direction away from the limiting modules under the action of an external force, so that the wafer can enter and exit a placement space defined by the limiting module corresponding to the size of the wafer; the reset module is used to drive the movable plate and the clamping wheels to move in a direction closer to the limiting modules, so that when a wafer is placed in the placement space, the wafer is clamped by the clamping wheels and the corresponding limiting modules.
[0007] Optionally, the reset module includes an adjustment block and a spring, one end of the spring is connected to the adjustment block, the other end of the spring is connected to the movable plate, and the adjustment block is connected to the base plate.
[0008] Optionally, the device further includes: a slider and a guide rail, the guide rail being disposed on the base plate, and the straight line of the guide rail being parallel to the straight line of the center line of the spring, the slider being connected to the movable plate, and the slider being sleeved on the guide rail.
[0009] Optionally, the device further includes: a fixed handle connected to the base plate, a second end of the fixed handle connected to a first end of the movable handle; a protrusion is provided at the second end of the movable handle, and a groove is provided at the first end of the movable plate, with the protrusion disposed in the groove.
[0010] Optionally, the device further includes: a cover connected to the substrate; the projections of the slider, the guide rail, the reset module, and the slide groove on the substrate are located within the projection of the cover on the substrate.
[0011] Optionally, the device further includes a hanging ring, which is connected to the first end of the fixed handle via a connecting block.
[0012] Optionally, the movable handle further includes a gripping portion disposed on the outer surface of the movable handle.
[0013] Optionally, the limiting module includes: a plurality of limiting blocks, each limiting block including a limiting part and a supporting part, wherein the height of the limiting part in the direction perpendicular to the substrate is higher than the height of the supporting part in the direction perpendicular to the substrate.
[0014] Optionally, the height of the limiting module in the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module.
[0015] Optionally, the plurality of limiting modules include a limiting module corresponding to a four-inch wafer, a limiting module corresponding to a six-inch wafer, and a limiting module corresponding to an eight-inch wafer.
[0016] In this application, the operator uses a wafer gripper to pick up and place wafers, ensuring that the operator's hands remain outside the wafer processing equipment at all times. This avoids the risk of the operator putting their hands inside the equipment, getting their hands contaminated with chemicals, or being injured. Furthermore, because the wafer gripper is equipped with multiple limiting modules corresponding to wafers of different sizes, the operator can pick up and place wafers of various specifications using the wafer gripper without needing to adjust the device, making operation convenient. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.
[0018] Figure 1 This is a schematic diagram of a wafer gripping device according to an embodiment of this application;
[0019] Figure 2 This is a schematic diagram of a wafer gripping device in the wafer gripping state according to an embodiment of this application;
[0020] Figure 3 This is a schematic diagram illustrating a usage scenario of the wafer gripping device applicable to embodiments of this application;
[0021] Figure 4 This is a schematic diagram of a wafer gripping device including guide rails according to an embodiment of this application;
[0022] Figure 5 This is a schematic diagram of a wafer gripping device including a cover according to an embodiment of this application;
[0023] Figure 6 This is a schematic diagram of a wafer gripping device including a hanging ring according to an embodiment of this application;
[0024] Figure 7 This is a schematic diagram of a wafer gripping device including a gripping section according to an embodiment of this application;
[0025] Figure 8 This is a partial cross-sectional view of a wafer gripping device according to an embodiment of this application.
[0026] 10. Movable grip; 20. Movable plate; 30. Reset module; 40. Substrate; 50. Clamping wheel; 60. Limiting module; 70. Fixed grip; 1. Wafer gripping device; 2. Wafer feeding device; 31. Adjusting block; 32. Spring; 21. Slide groove; 11. Bump; 90. Guide rail; 80. Slider; 14. Connecting block; 15. Gripping part. Detailed Implementation
[0027] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.
[0028] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0029] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."
[0030] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.
[0031] Figure 1 A schematic diagram of a wafer gripping device according to an embodiment of this application. Figure 2 This is a schematic diagram of a wafer gripping device in a wafer gripping state according to an embodiment of this application. Figure 1-2 As shown, the wafer gripping device 1 includes: a movable handle 10, a movable plate 20, a reset module 30, a substrate 40, clamping wheels 50, and multiple limiting modules 60.
[0032] The first end of the movable handle 10 is connected to the substrate 40, the second end of the movable handle 10 is connected to the first end of the movable plate 20, the second end of the movable plate 20 is connected to the clamping wheel 50, the reset module 30 is connected to the movable plate 20 and the substrate 40 respectively, and the limiting module 60 is connected to the substrate 40. Different limiting modules 60 correspond to wafers of different sizes. The movable handle 10 is used to drive the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60 under the action of external force, so that the wafer can enter and exit the placement space defined by the limiting module 60 corresponding to the size of the wafer. The reset module 30 is used to drive the movable plate 20 and the clamping wheel 50 to move in a direction closer to the limiting module 60, so that when a wafer is placed in the placement space, the wafer is clamped by the clamping wheel 50 and the corresponding limiting module 60.
[0033] like Figure 3As shown, when acquiring a wafer, the operator grips the wafer gripping device 1 and inserts it into the wafer feeding device 2. The operator then applies external force to the movable handle 10, which causes the movable handle 10 to move the movable plate 20 and clamping wheel 50 away from the limiting module 60. The wafer feeding device 2 then lowers the wafer, which enters the placement space defined by the limiting module 60 corresponding to the size of the wafer. After the wafer is placed, the operator stops applying external force to the movable handle 10, and the reset module 30 drives the movable plate 20 and clamping wheel 50 to move towards the limiting module 60. At this time, the wafer is clamped by the clamping wheel 50 and the corresponding limiting module 60 in the placement space, and the operator can then remove the wafer gripping device 1 and move it to the wafer processing area. When the wafer gripping device 1 is moved to the wafer processing area and the placement space where the wafer is located is directly above the wafer processing point, the operator applies external force to the movable handle 10. Under the action of external force, the movable handle 10 drives the movable plate 20 and the clamping wheel 50 to move in a direction away from the limit module 60, so that the wafer falls out of the placement space under the action of gravity and is then placed at the wafer processing point.
[0034] It should be noted that different limiting modules 60 correspond to wafers of different sizes. For example, multiple limiting modules 60 may include a limiting module 60 corresponding to a four-inch wafer, a limiting module 60 corresponding to a six-inch wafer, and a limiting module 60 corresponding to an eight-inch wafer. Furthermore, the length of the movable plate 20 is greater than or equal to the distance from the wafer carrier section to the wafer pick-and-place port in the wafer feeding device 2. This ensures that the operator's hand will not be inserted into the wafer feeding device 2, preventing the operator's hand from being contaminated with chemicals and avoiding accidental injury from the wafer feeding device 2.
[0035] Specifically, the reset module 30 includes an adjustment block 31 and a spring 32. One end of the spring 32 is connected to the adjustment block 31, and the other end of the spring 32 is connected to the movable plate 20. The adjustment block 31 is connected to the base plate 40.
[0036] When the operator applies external force to the movable handle 10, the movable handle 10, under the action of the external force, drives the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60. At this time, since the adjusting block 31 is fixed on the substrate 40, the movable plate 20 is displaced closer to the adjusting block 31, causing the spring 32 to be compressed. When the operator stops applying external force to the movable handle 10, the spring 32 applies elastic force to the movable plate 20 to reset the movable plate 20. By setting the adjusting block 31 and the spring 32, the movable plate 20, which has moved in a direction away from the limiting module 60, can be reset in time when the operator stops applying external force, thereby improving the efficiency of wafer clamping.
[0037] Specifically, the wafer gripping device 1 further includes: a fixed grip 70, which is connected to the substrate 40, and the second end of the fixed grip 70 is connected to the first end of the movable grip 10. The second end of the movable grip 10 is provided with a protrusion 11, and the first end of the movable plate 20 is provided with a groove 21. The protrusion 11 is disposed in the groove 21 and moves in the groove 21.
[0038] When the operator applies external force to the movable handle 10, the protrusion 11 moves in the slide groove 21, thereby driving the movable plate 20 to move in a direction away from the limit module 60. By setting the protrusion 11 and the slide groove 21, the movement of the movable plate 20 can be made smoother and more stable.
[0039] When an operator does not need to apply pressure to the movable handle 10 but still needs to apply external force to the wafer gripping device 1, such as when moving the wafer gripping device 1, this can be achieved by gripping the fixed handle 70. This avoids the operator accidentally applying pressure to the movable handle 10, which could lead to the wafer being released. In addition, the movable handle 10 and the fixed handle 70 are arranged adjacent to each other and extend in the moving direction of the movable plate 20. The wafer gripping device arranged in this way has good balance when gripping wafers, which can ensure that the pick-and-place device can operate stably. Furthermore, the adjacent arrangement of the movable handle 10 and the fixed handle 70 also facilitates two-handed operation, which can reduce the difficulty of operation for the operator.
[0040] In this embodiment, the operator uses the wafer gripper 1 to pick up and place wafers, ensuring that the operator's hands remain outside the wafer processing equipment. This avoids the risk of the operator putting their hands inside the equipment, getting their hands contaminated with chemicals, or being injured. Furthermore, since the wafer gripper 1 is equipped with multiple limiting modules 60 corresponding to wafers of different sizes, the operator can pick up and place wafers of various specifications using the wafer gripper 1 without needing to adjust it, making operation convenient.
[0041] Figure 4 This is a schematic diagram of a wafer gripping device including guide rails according to an embodiment of this application, as shown below. Figure 4 As shown, the wafer gripping device 1 also includes a slider 80 and a guide rail 90. The guide rail 90 is disposed on the substrate 40, and the straight line of the guide rail 90 is parallel to the straight line of the center line of the spring 32. The slider 80 is connected to the movable plate 20, and the slider 80 is sleeved on the guide rail 90.
[0042] When the movable plate 20 is driven by the movable handle 10 or the reset module 30, the movable plate 20 will simultaneously drive the slider 80 to move. Since the slider 80 is sleeved on the guide rail 90, the movable plate 20 is limited to moving in a direction away from the limit module 60 or in a direction closer to the limit module 60. Specifically, multiple guide rails 90 can be provided, and multiple sliders 80 can be provided on one guide rail 90. The more guide rails 90 and sliders 80 there are, the smoother the movement of the movable plate 20.
[0043] In this embodiment of the application, by setting the guide rail 90, the movement direction of the movable plate 20 can be further limited, and the slider 80 can also stabilize the movable plate 20.
[0044] Figure 5 This is a schematic diagram of a wafer gripping device including a cover according to an embodiment of this application, as shown below. Figure 5 As shown, the wafer gripping device 1 also includes a cover 12, which is connected to the substrate 40.
[0045] The projections of slider 80, guide rail 09, reset module 30 and slide groove 21 on substrate 40 are located within the projection of cover 12 on substrate 40.
[0046] In this embodiment, by providing a cover over the slider 80, guide rail 09, reset module 30 and slide 21, the slider 80, guide rail 09, reset module 30 and slide 21 can be protected to prevent contaminants from entering and causing damage, thereby improving the service life of the wafer gripping device 1.
[0047] Figure 6 This is a schematic diagram of a wafer gripping device including a hanging ring according to an embodiment of this application, as shown below. Figure 6 As shown, the wafer gripping device 1 also includes a hanging ring 13, which is connected to the first end of the fixed handle 70 via a connecting block 14.
[0048] In this embodiment of the application, by providing a hanging ring 13 at the first end of the fixed handle 70, the wafer gripping device 1 can be hung on a wall or other location when not in use, which facilitates the storage of the wafer gripping device 1.
[0049] Figure 7 This is a schematic diagram of a wafer gripping device including a gripping section according to an embodiment of this application, as shown below. Figure 7 As shown. The movable handle 10 also includes a gripping part 15, which is disposed on the outer surface of the movable handle 10.
[0050] The shape of the gripping part 15 can correspond to the position of the fingers when a person grasps the object.
[0051] In this embodiment, by providing a gripping part 15 on the outer surface of the movable handle 10, it is easier for the operator to apply external force to the movable handle 10, thereby improving the operator's user experience.
[0052] Figure 8 This is a schematic diagram of a wafer gripping device according to another embodiment of this application, as shown below. Figure 8 As shown, the limiting module 60 includes multiple limiting blocks, each limiting block including a limiting part and a supporting part, wherein the height of the limiting part in the direction perpendicular to the substrate is higher than the height of the supporting part in the direction perpendicular to the substrate.
[0053] The placement space for accommodating the wafer is defined by limiting portions and supporting portions in multiple limiting modules 60. The supporting portions support the wafer, while the limiting portions limit the wafer when they contact the side of the wafer. For example, the limiting module 60 for a four-inch wafer includes four limiting blocks. When the four-inch wafer is placed in the placement space, the supporting portions of the four limiting blocks contact the bottom surface of the wafer, thereby supporting the wafer. After the reset module 30 drives the movable plate 20 and the clamping wheel 50 to move in a direction toward the limiting module 60, the wafer is clamped in the placement space by the clamping wheel 50 and the limiting portions of at least some of the four limiting blocks.
[0054] Specifically, the height of the limiting module 60 in the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module 60.
[0055] Since the wafer gripping device 1 supports the placement of wafers of various sizes, the positions of the limiting modules 60 corresponding to different wafer sizes are different. At the same time, in order to avoid the large-size wafer being affected by the limiting modules 60 corresponding to the small-size wafer, the height of the limiting modules 60 in the direction perpendicular to the substrate is set to be positively correlated with the size of the wafer corresponding to the limiting modules 60. That is, the height of the limiting modules 60 corresponding to the larger-size wafer in the direction perpendicular to the substrate is higher than the height of the limiting modules 60 corresponding to the smaller-size wafer in the direction perpendicular to the substrate.
[0056] In this embodiment, since the limiting block includes a limiting part and a bearing part, it can limit the wafer while supporting the wafer, and combined with the clamping wheel 50, it can clamp the wafer more stably.
[0057] When using the wafer gripper 1, you can hold the movable handle 10 and the fixed handle 70 with both hands respectively, and move the wafer gripper 1 above or below the wafer to be gripped.
[0058] Then you can grip the movable handle 10, which will cause the movable plate 20 and the clamping wheel 50 to move in a direction away from the limit module 60.
[0059] The movable handle 10 and the fixed handle 70 are moved to allow the wafer to enter the placement space defined by the limiting module 60 corresponding to the size of the wafer. After entering, the movable handle 10 is released, and the clamping wheel 50 clamps the wafer.
[0060] The movable handle 10 and the fixed handle 70 are used to transport the wafer to the wafer processing area, i.e., the cavity used for wafer processing. See [reference needed]. Figure 3 The handheld part is located outside the cavity of the wafer processing equipment.
[0061] After confirming the wafer is in the correct position, grip the movable handle 10 to move the movable plate 20 and clamping wheel 50 in a direction away from the limit module 60, place the wafer into the wafer processing equipment, and then move the wafer gripping device 1 out of the wafer processing equipment.
[0062] Although this application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and drawings. This application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the aforementioned components, the terminology used to describe such components is intended to correspond to any component (unless otherwise indicated) that performs the specified function of said component (e.g., is functionally equivalent to it), even if structurally not equivalent to the disclosed structure performing the functions in the exemplary implementations of this specification shown herein.
[0063] That is, the above description is only an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, such as the combination of technical features between different embodiments, or direct or indirect application in other related technical fields, are similarly included within the patent protection scope of this application.
[0064] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0065] The above description is provided to enable any person skilled in the art to implement and use this application. Various details are set forth in the above description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be implemented without using these specific details. In other embodiments, well-known processes will not be described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed herein.
[0066] It should be noted that, without conflict, the various embodiments and / or technical features described in this application can be arbitrarily combined with each other, and the resulting technical solutions should also fall within the protection scope of this application.
[0067] It should be understood that the specific examples in the embodiments of this application are only for the purpose of helping those skilled in the art to better understand the embodiments of this application, and are not intended to limit the scope of the embodiments of this application. Those skilled in the art can make various improvements and modifications based on the above embodiments, and all such improvements or modifications fall within the protection scope of this application.
[0068] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A wafer gripping device, characterized in that, include: The components include a movable handle, a movable plate, a reset module, a base plate, clamping wheels, and multiple limit modules. The first end of the movable handle is connected to the base plate, the second end of the movable handle is connected to the first end of the movable plate, and the second end of the movable plate is connected to the clamping wheel; The reset module is connected to the movable plate and the base plate respectively; The limiting module is connected to the substrate, and different limiting modules correspond to wafers of different sizes; The movable handle is used to drive the movable plate and the clamping wheel to move away from the limiting module under the action of external force, so that the wafer can enter and exit the placement space defined by the limiting module corresponding to the size of the wafer; The reset module is used to drive the movable plate and the clamping wheel to move in a direction toward the limiting module, so that when a wafer is placed in the placement space, the wafer is clamped by the clamping wheel and the corresponding limiting module.
2. The apparatus according to claim 1, characterized in that, The reset module includes an adjustment block and a spring. One end of the spring is connected to the adjustment block, and the other end of the spring is connected to the movable plate. The adjustment block is connected to the base plate.
3. The apparatus according to claim 2, characterized in that, The device further includes a slider and a guide rail, the guide rail being disposed on the base plate, and the straight line of the guide rail being parallel to the straight line of the center line of the spring, the slider being connected to the movable plate, and the slider being sleeved on the guide rail.
4. The apparatus according to claim 3, characterized in that, The device further includes: a fixed handle, the fixed handle being connected to the base plate, and a second end of the fixed handle being connected to a first end of the movable handle; The second end of the movable handle is provided with a protrusion, and the first end of the movable plate is provided with a sliding groove, with the protrusion disposed in the sliding groove.
5. The apparatus according to claim 4, characterized in that, The device further includes a cover, which is connected to the substrate; The projections of the slider, the guide rail, the reset module, and the slide groove on the substrate are located within the projection of the cover on the substrate.
6. The apparatus according to claim 4, characterized in that, The device further includes a hanging ring, which is connected to the first end of the fixed handle via a connecting block.
7. The apparatus according to claim 1, characterized in that, The movable handle further includes a gripping part disposed on the outer surface of the movable handle.
8. The apparatus according to claim 1, characterized in that, The limiting module includes multiple limiting blocks, each limiting block comprising a limiting part and a supporting part, wherein the height of the limiting part in a direction perpendicular to the substrate is higher than the height of the supporting part in a direction perpendicular to the substrate.
9. The apparatus according to claim 1, characterized in that, The height of the limiting module along the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module.
10. The apparatus according to any one of claims 1-9, characterized in that, The plurality of limiting modules include limiting modules corresponding to four-inch wafers, limiting modules corresponding to six-inch wafers, and limiting modules corresponding to eight-inch wafers.