Wafer grabbing device

Abstract

The utility model discloses a wafer grabbing device, which is applied to a wafer cleaning device, and comprises a substrate; the limiting module is arranged at the first end of the substrate and is used for limiting the wafer; the movable grab handle is arranged at the second end of the base plate and used for being in a clenched state under the action of external force, and the distance from the limiting module to the movable grab handle is larger than the distance from a wafer bearing part of the wafer cleaning device to the inlet and outlet; the movable plate is arranged on the base plate through a reset device, the first end of the movable plate is connected with the clamping wheel, and the second end of the movable plate is movably connected with the movable grab handle; when the movable grab handle is in a holding state, the movable grab handle drives the movable plate to move to a first position so as to drive the clamping wheel to move to a clamping position to clamp the wafer; when the movable grab handle is in the non-holding state, the reset device drives the movable plate to move to the second position so as to drive the clamping wheel to move to the non-clamping position. According to the wafer grabbing device, wafers of various sizes can be grabbed, and operation is convenient.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and more particularly to a wafer gripping device. Background Technology

[0002] In the manufacturing of integrated circuits (ICs), wafers need to be handled manually. However, this manual handling requires operators to put their hands inside the equipment, which can easily lead to contact with chemicals or accidental injury.

[0003] Currently, wafers are mainly handled automatically, using robotic arms in conjunction with suction cups or fingers to pick up and place them.

[0004] However, for most wafer experimental testing and scientific research equipment, especially in the cleaning field, the frequency of wafer handling is low, the operation is highly immediacy, and the wafer size is highly uncertain. Therefore, the use of robotic arms for automatic feeding requires repeated adjustments based on the wafer size, which causes operational inconvenience. Summary of the Invention

[0005] In view of this, this application provides a wafer gripping device to at least partially solve the above-mentioned technical problems.

[0006] This application provides a wafer gripping device for use in a wafer cleaning apparatus, comprising: a substrate; a limiting module disposed at a first end of the substrate for limiting the wafer; a movable handle disposed at a second end of the substrate for gripping under external force, wherein the distance from the limiting module to the movable handle is greater than the distance from the wafer carrier portion of the wafer cleaning apparatus to the inlet / outlet; and a movable plate disposed on the substrate via a reset device, wherein a first end of the movable plate is connected to a clamping wheel, and a second end is movably connected to the movable handle; when the movable handle is in the gripping state, the movable handle drives the movable plate to a first position, thereby driving the clamping wheel to a clamping position to clamp the wafer; when the movable handle is in the non-gripping state, the reset device drives the movable plate to a second position, thereby driving the clamping wheel to a non-clamping position.

[0007] Optionally, the reset device includes an adjusting block and a spring, one end of the spring is connected to the adjusting block, the other end of the spring is connected to the movable plate, and the adjusting block is connected to the base plate.

[0008] Optionally, the number of springs may include multiple springs arranged side by side along the length of the substrate and symmetrically distributed about the centerline of the substrate along the length of the substrate.

[0009] Optionally, the device further includes: multiple sets of sliders and guide rails, the guide rails being disposed on the substrate, the sliders being connected to the movable plate, the sliders being sleeved on the guide rails, and the center lines of the multiple sets of sliders and guide rails in the sliding direction overlapping with the center line of the substrate in the length direction.

[0010] Optionally, there are multiple clamping wheels, and the center lines of the multiple clamping wheels in the length direction of the substrate overlap with the center line in the length direction of the substrate.

[0011] Optionally, the first end of the movable handle is provided with a plurality of protrusions symmetrically distributed about the center line of the substrate length direction, and the second end of the movable plate is provided with a plurality of sliding grooves symmetrically distributed about the center line of the substrate length direction, with the protrusions disposed in the sliding grooves.

[0012] Optionally, the movable handle further includes a gripping portion disposed on the outer surface of the movable handle.

[0013] Optionally, the limiting module includes: a plurality of limiting blocks, each limiting block including a limiting part and a supporting part, wherein the height of the limiting part in the direction perpendicular to the substrate is higher than the height of the supporting part in the direction perpendicular to the substrate.

[0014] Optionally, the height of the limiting module in the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module.

[0015] Optionally, the limiting module includes multiple modules, namely a limiting module corresponding to a four-inch wafer, a limiting module corresponding to a six-inch wafer, and a limiting module corresponding to an eight-inch wafer.

[0016] In this application, the operator picks up and places the wafer using a wafer gripping device, ensuring that the operator's hands remain outside the wafer processing equipment at all times, thereby avoiding the risk of the operator putting their hands inside the equipment and getting them contaminated with chemicals or getting injured. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0018] Figure 1 This is a schematic diagram of a wafer gripping device according to an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of a wafer gripping device in the wafer gripping state according to an embodiment of this application;

[0020] Figure 3 This is a schematic diagram illustrating a usage scenario of the wafer gripping device applicable to embodiments of this application;

[0021] Figure 4 This is a schematic diagram of a wafer gripping device including guide rails according to an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of a wafer gripping device including a cover according to an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of a wafer gripping device including a hanging ring according to an embodiment of this application;

[0024] Figure 7 This is a schematic diagram of a wafer gripping device including a gripping section according to an embodiment of this application;

[0025] Figure 8 This is a partial cross-sectional view of a wafer gripping device according to an embodiment of this application.

[0026] 10. Movable grip; 20. Movable plate; 30. Reset device; 40. Substrate; 50. Clamping wheel; 60. Limiting module; 70. Fixed grip; 1. Wafer gripping device; 2. Wafer feeding device; 31. Adjusting block; 32. Spring; 21. Slide groove; 11. Bump; 90. Guide rail; 80. Slider; 14. Connecting block; 15. Gripping part. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0028] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0029] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0030] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.

[0031] Figure 1 A schematic diagram of a wafer gripping device according to an embodiment of this application. Figure 2 This is a schematic diagram of a wafer gripping device in a wafer gripping state according to an embodiment of this application. Figure 1-2 As shown, the wafer gripping device 1 includes:

[0032] substrate 40;

[0033] The limiting module 60 is disposed at the first end of the substrate and is used to limit the wafer.

[0034] The movable handle is located at the second end of the substrate and is used to be in a gripping state under the action of external force. The distance from the limiting module to the movable handle is greater than the distance from the wafer carrier part of the wafer cleaning device 2 to the inlet and outlet.

[0035] The movable plate is set on the base plate by a reset device. The first end of the movable plate is connected to the clamping wheel, and the second end is movably connected to the movable handle.

[0036] When the movable handle is in the gripped state, the movable handle drives the movable plate to the first position, thereby driving the clamping wheel to the non-clamping position to release the wafer; when the movable handle is in the non-griped state, the reset device drives the movable plate to the second position, thereby driving the clamping wheel to the clamping position to clamp the wafer.

[0037] like Figure 3As shown, when acquiring a wafer, the operator applies external force to the movable handle 10. Under the action of external force, the movable handle 10 drives the movable plate 20 and the clamping wheel 50 to move away from the limiting module 60 to the non-clamping position. Then, the wafer can enter the placement space defined by the limiting module 60 corresponding to the size of the wafer. After the wafer is placed, the operator stops applying external force to the movable handle 10, and the reset device 30 drives the movable plate 20 to the second position. The clamping wheel 50 also moves towards the clamping position. At this time, the wafer is clamped by the clamping wheel 50 and the corresponding limiting module 60 in the placement space. The operator can then put the limiting module 60 on the wafer gripping device 1 into the wafer cleaning device 2 through the inlet and outlet of the wafer cleaning device 2. After the limiting module 60 and the wafer are moved into the wafer cleaning apparatus 2, and the placement space where the wafer is located is directly above the wafer carrier of the wafer cleaning apparatus 2, the operator applies external force to the movable handle 10. Under the action of the external force, the movable handle 10 drives the movable plate 20 to move to the first position, and the clamping wheel 50 also moves to the non-clamping position in the direction away from the limiting module 60, so that the wafer falls out of the placement space under the action of gravity and is placed in the wafer carrier.

[0038] It should be noted that there can be multiple limiting modules 60, each corresponding to a different wafer size. For example, multiple limiting modules 60 may include a limiting module 60 corresponding to a four-inch wafer, a limiting module 60 corresponding to a six-inch wafer, and a limiting module 60 corresponding to an eight-inch wafer. Furthermore, the distance from the limiting module 60 to the movable handle 10 is greater than the distance from the wafer carrier portion of the wafer cleaning device 2 to the inlet and outlet, ensuring that the operator's hand will not be inserted into the wafer cleaning device 2, preventing the operator's hand from becoming contaminated with chemicals, and avoiding accidental injury from the wafer cleaning device 2.

[0039] Specifically, the reset device 30 includes an adjusting block 31 and a spring 32. One end of the spring 32 is connected to the adjusting block 31, and the other end of the spring 32 is connected to the movable plate 20. The adjusting block 31 is connected to the base plate 40.

[0040] When the operator applies external force to the movable handle 10, the movable handle 10, under the action of the external force, drives the movable plate 20 and the clamping wheel 50 to move in a direction away from the limiting module 60. At this time, since the adjusting block 31 is fixed on the substrate 40, the movable plate 20 is displaced closer to the adjusting block 31, causing the spring 32 to be compressed. When the operator stops applying external force to the movable handle 10, the spring 32 applies elastic force to the movable plate 20 to reset the movable plate 20. By setting the adjusting block 31 and the spring 32, the movable plate 20, which has moved in a direction away from the limiting module 60, can be reset in time when the operator stops applying external force, thereby improving the efficiency of wafer clamping.

[0041] The number of springs includes multiple springs arranged side by side along the length direction of the substrate and symmetrically distributed about the center line of the substrate along the length direction.

[0042] Multiple springs arranged side by side along the length of the substrate means that the length of the springs is the same as the length of the substrate, and the arrangement direction of the multiple springs is the width direction of the substrate.

[0043] The symmetrical distribution of multiple springs about the centerline of the substrate length direction means that there can be two or more springs, and the centerlines of the two or more springs in the substrate length direction overlap with the centerline of the substrate length direction.

[0044] This configuration ensures balanced force distribution across the wafer gripper 1, improving its stability in gripping wafers.

[0045] Specifically, the wafer gripping device 1 also includes: a fixed handle 70, which is connected to the substrate 40, and the second end of the fixed handle 70 is connected to the first end of the movable handle 10.

[0046] The first end of the movable handle 10 is provided with a plurality of protrusions 11 symmetrically distributed about the center line of the substrate length direction, and the second end of the movable plate 20 is provided with a plurality of grooves 21 symmetrically distributed about the center line of the substrate length direction. The protrusions 11 are disposed in the grooves 21 and move in the grooves 21.

[0047] When the operator applies external force to the movable handle 10, the protrusion 11 moves in the slide groove 21, thereby driving the movable plate 20 to move in a direction away from the limiting module 60. By setting the protrusion 11 and the slide groove 21, the movement of the movable plate 20 can be made smoother and more stable. Furthermore, the protrusion 11 and the slide groove 21 are also symmetrical about the centerline in the length direction of the substrate, further ensuring the force balance of the wafer gripping device 1.

[0048] When an operator does not need to apply pressure to the movable handle 10 but still needs to apply external force to the wafer gripping device 1, such as when moving the wafer gripping device 1, this can be achieved by gripping the fixed handle 70. This avoids the operator accidentally applying pressure to the movable handle 10, which could lead to the wafer being released. In addition, the movable handle 10 and the fixed handle 70 are arranged adjacent to each other and extend in the moving direction of the movable plate 20. The wafer gripping device arranged in this way has good balance when gripping wafers, which can ensure that the pick-and-place device can operate stably. Furthermore, the adjacent arrangement of the movable handle 10 and the fixed handle 70 also facilitates two-handed operation, which can reduce the difficulty of operation for the operator.

[0049] In this embodiment, the operator uses the wafer gripper 1 to pick up and place wafers, ensuring that the operator's hands remain outside the wafer processing equipment. This avoids the risk of the operator putting their hands inside the equipment, getting their hands contaminated with chemicals, or being injured. Furthermore, since the wafer gripper 1 is equipped with multiple limiting modules 60 corresponding to wafers of different sizes, the operator can pick up and place wafers of various specifications using the wafer gripper 1 without needing to adjust it, making operation convenient.

[0050] Figure 4 This is a schematic diagram of a wafer gripping device including guide rails according to an embodiment of this application, as shown below. Figure 4 As shown, the wafer gripping device 1 also includes multiple sets of sliders 80 and guide rails 90. The guide rails 90 are disposed on the substrate 40, the sliders 80 are connected to the movable plate, and the sliders 80 are slidably disposed on the guide rails 90. The center lines of the multiple sets of sliders and guide rails in the sliding direction overlap with the center line of the substrate in the length direction. Through the multiple sets of sliders 80 and guide rails 90, the movement of the substrate can be ensured to be smooth, thus ensuring the stability of the wafer gripping device 1.

[0051] When the movable plate 20 is driven by the movable handle 10 or the reset device 30, the movable plate 20 will simultaneously drive the slider 80 to move. Since the slider 80 is sleeved on the guide rail 90, the movable plate 20 is limited to moving in a direction away from the limit module 60 or in a direction closer to the limit module 60. Specifically, multiple guide rails 90 can be provided, and multiple sliders 80 can be provided on one guide rail 90. The more guide rails 90 and sliders 80 there are, the smoother the movement of the movable plate 20.

[0052] In this embodiment of the application, by setting the guide rail 90, the movement direction of the movable plate 20 can be further limited, and the slider 80 can also stabilize the movable plate 20.

[0053] In this embodiment, there are multiple clamping wheels, and the center lines of the multiple clamping wheels in the length direction of the substrate overlap with the center line in the length direction of the substrate to further ensure the stability of wafer gripping.

[0054] In this application, the distance from the limiting module to the movable handle is greater than the distance from the wafer carrier to the inlet and outlet of the wafer cleaning device. This results in an excessively long substrate and a greater distance between the movable handle and the wafer. If the movable handle is unstable and vibrates, the vibration transmitted to the wafer may be amplified. However, by combining springs, bumps, slide rails, guide rails, clamping wheels, etc., which are symmetrically distributed about the centerline of the substrate length direction, the stability of the wafer gripping device can be improved. Even if the movable handle is unstable and vibrates, the vibration transmitted to the wafer is relatively small.

[0055] Figure 5 This is a schematic diagram of a wafer gripping device including a cover according to an embodiment of this application, as shown below. Figure 5 As shown, the wafer gripping device 1 also includes a cover 12, which is connected to the substrate 40.

[0056] The projections of slider 80, guide rail 09, reset device 30 and slide groove 21 on substrate 40 are located within the projection of cover 12 on substrate 40.

[0057] In this embodiment of the application, by providing a cover on the outside of the slider 80, guide rail 09, reset device 30 and slide 21, the slider 80, guide rail 09, reset device 30 and slide 21 can be protected to prevent contaminants from entering and causing damage, thereby improving the service life of the wafer gripping device 1.

[0058] Figure 6 This is a schematic diagram of a wafer gripping device including a hanging ring according to an embodiment of this application, as shown below. Figure 6 As shown, the wafer gripping device 1 also includes a hanging ring 13, which is connected to the first end of the fixed handle 70 via a connecting block 14.

[0059] In this embodiment of the application, by providing a hanging ring 13 at the first end of the fixed handle 70, the wafer gripping device 1 can be hung on a wall or other location when not in use, which facilitates the storage of the wafer gripping device 1.

[0060] Figure 7 This is a schematic diagram of a wafer gripping device including a gripping section according to an embodiment of this application, as shown below. Figure 7 As shown. The movable handle 10 also includes a gripping part 15, which is disposed on the outer surface of the movable handle 10.

[0061] The shape of the gripping part 15 can correspond to the position of the fingers when a person grasps the object.

[0062] In this embodiment of the application, by providing a gripping part 15 on the outer surface of the movable handle 10, it is easier for the operator to apply external force to the movable handle 10, thereby improving the operator's user experience.

[0063] Figure 8 This is a schematic diagram of a wafer gripping device according to another embodiment of this application, as shown below. Figure 8 As shown, the limiting module 60 includes multiple limiting blocks, each limiting block including a limiting part and a supporting part, wherein the height of the limiting part in the direction perpendicular to the substrate is higher than the height of the supporting part in the direction perpendicular to the substrate.

[0064] The placement space for accommodating the wafer is defined by limiting portions and supporting portions in multiple limiting modules 60. The supporting portions support the wafer, while the limiting portions limit the wafer when they contact the side of the wafer. For example, the limiting module 60 for a four-inch wafer includes four limiting blocks. When the four-inch wafer is placed in the placement space, the supporting portions of the four limiting blocks contact the bottom surface of the wafer, thereby supporting the wafer. After the reset device 30 drives the movable plate 20 and the clamping wheel 50 to move in a direction toward the limiting module 60, the wafer is clamped in the placement space by the clamping wheel 50 and the limiting portions of at least some of the four limiting blocks.

[0065] Specifically, the height of the limiting module 60 in the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module 60.

[0066] Since the wafer gripping device 1 supports the placement of wafers of various sizes, the positions of the limiting modules 60 corresponding to different wafer sizes are different. At the same time, in order to avoid the large-size wafer being affected by the limiting modules 60 corresponding to the small-size wafer, the height of the limiting modules 60 in the direction perpendicular to the substrate is set to be positively correlated with the size of the wafer corresponding to the limiting modules 60. That is, the height of the limiting modules 60 corresponding to the larger-size wafer in the direction perpendicular to the substrate is higher than the height of the limiting modules 60 corresponding to the smaller-size wafer in the direction perpendicular to the substrate.

[0067] In this embodiment, since the limiting block includes a limiting part and a bearing part, it can limit the wafer while supporting the wafer, and combined with the clamping wheel 50, it can clamp the wafer more stably.

[0068] When using the wafer gripper 1, you can hold the movable handle 10 and the fixed handle 70 with both hands respectively, and move the wafer gripper 1 above or below the wafer to be gripped.

[0069] Then you can grip the movable handle 10, which will cause the movable plate 20 and the clamping wheel 50 to move in a direction away from the limit module 60.

[0070] The movable handle 10 and the fixed handle 70 are moved to allow the wafer to enter the placement space defined by the limiting module 60 corresponding to the size of the wafer. After entering, the movable handle 10 is released, and the clamping wheel 50 clamps the wafer.

[0071] The movable handle 10 and the fixed handle 70 are used to transport the wafer to the wafer processing area, i.e., the cavity used for wafer processing. See [reference needed]. Figure 3 The handheld part is located outside the cavity of the wafer processing equipment.

[0072] After confirming the wafer is in the correct position, grip the movable handle 10 to move the movable plate 20 and clamping wheel 50 in a direction away from the limit module 60, place the wafer into the wafer processing equipment, and then move the wafer gripping device 1 out of the wafer processing equipment.

[0073] Although this application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and drawings. This application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the aforementioned components, the terminology used to describe such components is intended to correspond to any component (unless otherwise indicated) that performs the specified function of said component (e.g., is functionally equivalent to it), even if structurally not equivalent to the disclosed structure performing the functions in the exemplary implementations of this specification shown herein.

[0074] That is, the above description is only an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, such as the combination of technical features between different embodiments, or direct or indirect application in other related technical fields, are similarly included within the patent protection scope of this application.

[0075] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0076] The above description is provided to enable any person skilled in the art to implement and use this application. Various details are set forth in the above description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be implemented without using these specific details. In other embodiments, well-known processes will not be described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed herein.

[0077] It should be noted that, without conflict, the various embodiments and / or technical features described in this application can be arbitrarily combined with each other, and the resulting technical solutions should also fall within the protection scope of this application.

[0078] It should be understood that the specific examples in the embodiments of this application are only for the purpose of helping those skilled in the art to better understand the embodiments of this application, and are not intended to limit the scope of the embodiments of this application. Those skilled in the art can make various improvements and modifications based on the above embodiments, and all such improvements or modifications fall within the protection scope of this application.

[0079] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A wafer gripping device, applied to a wafer cleaning device, characterized in that, include: substrate; A limiting module is disposed at the first end of the substrate and is used to limit the wafer. A movable handle is provided at the second end of the substrate for gripping under external force. The distance from the limiting module to the movable handle is greater than the distance from the wafer carrier to the inlet and outlet of the wafer cleaning device. A movable plate is mounted on the base plate via a reset device. The first end of the movable plate is connected to a clamping wheel, and the second end is movably connected to the movable handle. When the movable handle is in the gripped state, the movable handle drives the movable plate to the first position, thereby driving the clamping wheel to the non-clamping position; when the movable handle is in the non-griped state, the reset device drives the movable plate to the second position, thereby driving the clamping wheel to the clamping position to clamp the wafer.

2. The apparatus according to claim 1, characterized in that, The reset device includes an adjusting block and a spring. One end of the spring is connected to the adjusting block, and the other end of the spring is connected to the movable plate. The adjusting block is connected to the base plate.

3. The apparatus according to claim 2, characterized in that, The number of springs includes multiple springs arranged side by side along the length direction of the substrate and symmetrically distributed about the center line of the substrate along the length direction.

4. The apparatus according to claim 3, characterized in that, The device further includes: multiple sets of sliders and guide rails, the guide rails being disposed on the substrate, the sliders being connected to the movable plate, the sliders being slidably disposed on the guide rails, and the center lines of the multiple sets of sliders and guide rails in the sliding direction overlapping with the center line of the substrate in the length direction.

5. The apparatus according to claim 4, characterized in that, The number of clamping wheels is multiple, and the center lines of the multiple clamping wheels in the length direction of the substrate overlap with the center line in the length direction of the substrate.

6. The apparatus according to claim 3, characterized in that, The first end of the movable handle is provided with a plurality of protrusions symmetrically distributed about the center line of the substrate length direction, and the second end of the movable plate is provided with a plurality of sliding grooves symmetrically distributed about the center line of the substrate length direction, with the protrusions disposed in the sliding grooves.

7. The apparatus according to any one of claims 1-6, characterized in that, The movable handle further includes a gripping part disposed on the outer surface of the movable handle.

8. The apparatus according to any one of claims 1-6, characterized in that, The limiting module includes multiple limiting blocks, each limiting block comprising a limiting part and a supporting part, wherein the height of the limiting part in a direction perpendicular to the substrate is higher than the height of the supporting part in a direction perpendicular to the substrate.

9. The apparatus according to any one of claims 1-6, characterized in that, The height of the limiting module along the direction perpendicular to the substrate is positively correlated with the size of the wafer corresponding to the limiting module.

10. The apparatus according to any one of claims 1-6, characterized in that, The limiting module includes multiple modules, namely the limiting module corresponding to the four-inch wafer, the limiting module corresponding to the six-inch wafer, and the limiting module corresponding to the eight-inch wafer.

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