Mobile power supply circuit using Bluetooth and infrared modulation technologies

Abstract

The utility model discloses a module circuit using Bluetooth and infrared modulation technology, which relates to the technical field of mobile power supply circuits, and comprises a Bluetooth chip U1, a voltage-regulator tube U2, capacitors C1, C18 and C19, resistors R5 and R6, infrared light emitting diodes D1 and D2, an MOS tube Q2 and the like, a No.32 pin of the Bluetooth chip U1 is connected with a No.2 pin of the voltage-regulator tube U2, the pins are also connected with emitters of the capacitors C1 and C18 and the MOS tube Q2, and a No.32 pin of the Bluetooth chip U1 is connected with a No.2 pin of the voltage-regulator tube U2. A C18 is connected with a crystal oscillator Y2, a third pin and a first pin of the crystal oscillator Y2 are respectively connected with a seventh pin and an eighth pin of a Bluetooth chip U1, an emitting electrode of an MOS tube Q2 is connected with resistors R5 and R6 in parallel and then connected with infrared light-emitting diodes D1 and D2, a base electrode of the MOS tube Q2 is connected with a ninth pin of the Bluetooth chip U1, and a collector electrode of the MOS tube Q2 is connected with an infrared light-emitting diode D3, a resistor R4 and a capacitor C22 through a resistor R3. The circuit is built in the mobile power supply by applying Bluetooth and infrared modulation technologies, the reuse rate is improved, the problems of power supply and the like are solved, multiple remote controllers are replaced, and the user experience is improved.

Description

Technical Field

[0001] This utility model relates to the field of mobile power supply circuit technology, specifically a mobile power supply circuit utilizing Bluetooth and infrared modulation technology. Background Technology

[0002] A power bank is a portable charger that can be carried around and stores its own electrical energy. It is mainly used to charge consumer electronic products such as handheld mobile devices (e.g., cordless phones, laptops), especially in situations where there is no external power supply.

[0003] Portable power banks are now essential travel items. However, most portable power banks on the market only offer wired or wireless charging, and they remain idle most of the time. Furthermore, existing remote controls only work with specific products, leading to a cumbersome experience for users with numerous appliances and remotes. Currently, none of Apple's iPhones, iPads, or MacBooks have built-in infrared emitters, thus lacking infrared remote control functionality. To enable infrared remote control for Apple devices, an infrared accessory is typically designed to connect via a Thunderbolt or Lightning connector, providing both power and data transfer. However, using Thunderbolt or Lightning connectors requires Apple's MFi (Made in China) certification. MFi certification is cumbersome, time-consuming, and requires expensive Apple-designed chips. For Android and HarmonyOS phones, OTG is disabled by default on some models, automatically turning off after 5-10 minutes of inactivity. This is detrimental to the rapid market launch, cost-effectiveness, and user experience of consumer electronics.

[0004] To address the above issues, a mobile power supply circuit utilizing Bluetooth and infrared modulation technologies is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a mobile power bank circuit that utilizes Bluetooth and infrared modulation technology. By using this device, the problems mentioned above can be solved, such as the limited functionality and high idle rate of existing mobile power banks, the need for additional infrared accessories and cumbersome MFi certification for Apple devices, and the inconvenience of enabling OTG on some Android phones, which affects the user experience of consumer electronics products.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a mobile power supply circuit utilizing Bluetooth and infrared modulation technology, comprising a Bluetooth chip U1, wherein pin 32 of the Bluetooth chip U1 is connected to pin 2 of a Zener diode U2, pin 2 of the Zener diode U2 is connected to a capacitor C1, the other end of capacitor C1 is connected to a capacitor C18, the two ends of capacitor C18 are respectively connected to pins 2 and 3 of a crystal oscillator Y2, pins 3 and 1 of the crystal oscillator Y2 are also connected to pins 6 and 7 of the Bluetooth chip U1, pin 1 of the crystal oscillator Y2 is also connected to a capacitor C19, the other end of capacitor C19 is grounded, pin 4 of the crystal oscillator Y2 is connected to a ground wire, and the Bluetooth chip U1... Pin 32 of chip 1 is also connected to the emitter of MOSFET Q2. The emitter of MOSFET Q2 is connected to resistors R5 and R6 in parallel. The other ends of resistors R5 and R6 are connected to infrared LEDs D1 and D2, respectively. The other ends of infrared LEDs D1 and D2 are both connected to the base of MOSFET Q2. The base of MOSFET Q2 is connected to pin 9 of Bluetooth chip U1. The collector of MOSFET Q2 is connected to resistor R3. The other end of resistor R3 is connected to infrared LED D3, resistor R4, and capacitor C22 in parallel. The other ends of infrared LED D3, resistor R4, and capacitor C22 are all connected to pin 8 of Bluetooth chip U1.

[0007] Furthermore, resistors R5 and R6 are connected to the anodes of infrared LEDs D1 and D2, respectively, and the cathodes of LEDs D1 and D2 are connected to the base of MOSFET Q2. A resistor R2 is connected between the base and emitter of MOSFET Q2.

[0008] Furthermore, capacitors C16 and C17 are connected in parallel on pin 32 of the Bluetooth chip U1, and the other ends of capacitors C16 and C17 are connected to ground. Additionally, capacitors C14 and C15 are also connected in parallel on pin 32 of the Bluetooth chip U1, and the other ends of capacitors C14 and C15 are connected to ground.

[0009] Furthermore, pin 1 of the Zener diode U2 is connected to the ground wire, pin 3 of the Zener diode U2 is connected to the BIT port of the pad, and the end of the capacitor C1 away from the Zener diode U2 is connected to the GND port of the pad.

[0010] Furthermore, capacitors C20 and C21 are connected in parallel on pin 16 of the Bluetooth chip U1, and the other ends of capacitors C20 and C21 are connected to ground.

[0011] Furthermore, the anode of the infrared LED D3 is connected to the end of the resistor R3 away from the collector of the MOS transistor Q2, and the cathode of the infrared LED D3 is connected to the ground wire.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] This invention proposes a mobile power bank circuit utilizing Bluetooth and infrared modulation technology. By embedding an infrared control circuit within the mobile power bank, and employing an infrared modulation transmission / reception control circuit composed of a low-power Bluetooth chip U1, infrared LEDs D1-D3, and a MOSFET Q2, it achieves infrared signal acquisition and encoding functions, improving the reuse rate of the mobile power bank, solving the power supply problem for the infrared control module, and replacing multiple ordinary remote controls. This reduces the number of ordinary remote controls needed, enhances the user experience, reduces the use of ordinary remote controls, saves production resources, and is beneficial to environmental protection. Simultaneously, it avoids the Apple MFI certification process and its high costs, providing convenience for Android users. Users can more easily receive commands from the host computer using the Bluetooth chip U1, and after circuit processing, achieve functions such as controlling infrared devices or learning infrared codes. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the circuit principle of this utility model. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] To further understand the content of this utility model, a detailed description of this utility model will be provided in conjunction with the accompanying drawings.

[0017] Combination Figure 1 To address the issues of existing power banks having limited functionality and high idle rates, requiring additional infrared accessories and cumbersome MFi certification for Apple devices, and the inconvenience of enabling OTG on some Android phones, which negatively impacts the user experience of consumer electronics, the following preferred technical solutions are provided:

[0018] This utility model discloses a mobile power supply circuit utilizing Bluetooth and infrared modulation technology, comprising three parts: a main control MCU module, a power supply module, and an infrared transmitting module. Specifically:

[0019] The circuit includes a Bluetooth chip U1 using a Bluetooth protocol version below 4.0 (excluding 4.0). Pin 32 of Bluetooth chip U1 is connected to pin 2 of Zener diode U2. Zener diode U2 plays a role in stabilizing the voltage in this circuit, ensuring that the input voltage is kept within a suitable range. This ensures that subsequent circuit components can operate under stable voltage and avoids the impact of voltage fluctuations on circuit performance. A capacitor C1 (4.7uF) is connected to pin 2 of Zener diode U2. The other end of capacitor C1 is connected to capacitor C18. The two ends of capacitor C18 are connected to pins 2 and 3 of crystal oscillator Y2, respectively. Pins 1 and 3 of crystal oscillator Y2 are connected to each other (the operating frequency of crystal oscillator Y2 is 16MHz, which is used to provide a stable clock frequency for Bluetooth chip U1 or other components in the circuit that require a precise clock. A stable clock signal helps to ensure the stability and accuracy of the circuit, especially in situations where precise time control is required, such as the modulation and demodulation process of Bluetooth and infrared communication). Pins 3 and 1 of crystal oscillator Y2 are connected to pins 6 and 7 of Bluetooth chip U1, respectively. Pin 1 of crystal oscillator Y2 is connected to capacitor C19, and the other end of capacitor C19 is grounded. Pin 4 of crystal oscillator Y2 is grounded. Meanwhile, pin 32 of the Bluetooth chip U1 is also connected to the emitter of MOSFET Q2. Resistors R5 and R6 (both 1kΩ) are connected in parallel to the emitter of MOSFET Q2. Resistors R5 and R6 are connected to the anodes of infrared LEDs D1 and D2, respectively. The cathodes of infrared LEDs D1 and D2 are connected to the base of MOSFET Q2. A resistor R2 (1kΩ) is connected between the base and emitter of MOSFET Q2. Resistor R2 limits the base current of MOSFET Q2, preventing excessive current from damaging the MOSFET. The base of MOSFET Q2 is connected to pin 9 of Bluetooth chip U1. The collector of MOSFET Q2 is connected to resistor R3 (5.1Ω). The other end of resistor R3 is connected to the anode of infrared LED D3 (connected in parallel), resistor R4 (180kΩ), and capacitor C22. The cathode of infrared LED D3, the other end of resistor R4, and capacitor C22 are all connected to pin 8 of Bluetooth chip U1. Through the coordinated operation of pins 8 and 9, Bluetooth chip U1 can modulate the infrared LEDs D3, D1, and D2. For example, by changing the frequency and duty cycle of the output signals from pins 8 and 9, the intensity and frequency characteristics of infrared light can be modulated. Radio frequency signals include 315MHz, 433MHz, 915MHz, 2.4GHz, and 5GHz, thereby enabling the transmission of different encoded information for more complex data interaction with devices that support infrared reception and decoding, such as precise control of electrical appliances in smart home systems.

[0020] Capacitors C16 and C17 are connected in parallel to pin 32 of Bluetooth chip U1, with the other ends of capacitors C16 and C17 grounded. Capacitors C14 and C15 are also connected in parallel to pin 32 of Bluetooth chip U1, with the other ends of capacitors C14 and C15 grounded. The capacitance of capacitors C14, C15, C16, and C17 is 1uF. Pin 1 of Zener diode U2 is grounded, and pin 3 of Zener diode U2 is connected to the BIT port of the pad. The end of capacitor C1 furthest from Zener diode U2 is connected to the GND port of the pad. Capacitors C20 (0.1uF) and C21 (10pF) are connected in parallel to pin 16 of Bluetooth chip U1, with the other ends of capacitors C20 and C21 grounded. Capacitors C20 and C21 act as filters at pin 16 of Bluetooth chip U1, mainly to filter out any noise signals that may appear on this pin, ensuring the stability of Bluetooth chip U1 during data processing and communication operations. Because pin 16 of the Bluetooth chip U1 may be involved in the transmission or processing of some critical signals during operation, such as data bus signals, a stable signal environment helps improve the accuracy and reliability of data transmission, reduces the probability of data errors and communication interference, and thus ensures the normal operation of the entire Bluetooth communication function.

[0021] Specifically, the power supply module uses BIT and GND pads to input a 3.7-5V power supply. This power is regulated by Zener diode U2 and outputs a 3.3V voltage to power the system and ensure normal circuit operation. Bluetooth chip U1, as the core component, receives infrared control commands from the host computer (such as a mobile phone or other Bluetooth master device). The commands are output through pin 9 (PWM3) of Bluetooth chip U1, driving MOSFET Q2 to encode the commands into infrared square wave signals, which are then emitted by infrared LED D3 to control infrared devices. Infrared LED D3 can also receive infrared signals emitted by other infrared devices. Bluetooth chip U1 collects information through pin 8 (AD0 acquisition port), and the main control algorithm analyzes and identifies the waveform signal corresponding to the infrared command. The signal is then transmitted to the mobile phone via Bluetooth to enable infrared code learning and expand the cloud server's code library. During this process, capacitors C1, C14-C18, and C20-C21 act as filters, stabilizing circuit performance. Resistors R2-R6, along with infrared LEDs D1-D3 and MOSFET Q2, work together to modulate, transmit, and receive the infrared signal. This circuit utilizes Bluetooth and infrared modulation technology to integrate the infrared control circuit into the power bank, improving its reuse rate and solving the power supply problem for the infrared control module. It can replace multiple ordinary remote controls, reducing the number of remote controls needed, improving user experience, saving production resources, protecting the environment, and avoiding Apple's MFI certification process and high costs, making it convenient for Android users.

[0022] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0023] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A mobile power bank circuit utilizing Bluetooth and infrared modulation technology, comprising a Bluetooth chip U1, characterized in that: Pin 32 of the Bluetooth chip U1 is connected to pin 2 of the Zener diode U2. A capacitor C1 is connected to pin 2 of the Zener diode U2, and a capacitor C18 is connected to the other end of C1. The two ends of capacitor C18 are connected to pins 2 and 3 of the crystal oscillator Y2, respectively. Pins 3 and 1 of the crystal oscillator Y2 are connected to pins 6 and 7 of the Bluetooth chip U1, respectively. A capacitor C19 is also connected to pin 1 of the crystal oscillator Y2, with the other end of C19 grounded. Pin 4 of the crystal oscillator Y2 is connected to the ground wire. Pin 32 of the Bluetooth chip U1 is also connected to the emitter of the MOSFET Q2. The emitter of transistor Q2 is connected to resistors R5 and R6 in parallel. The other ends of resistors R5 and R6 are connected to infrared LEDs D1 and D2, respectively. The other ends of infrared LEDs D1 and D2 are both connected to the base of MOSFET Q2. The base of MOSFET Q2 is connected to pin 9 of Bluetooth chip U1. The collector of MOSFET Q2 is connected to resistor R3. The other end of resistor R3 is connected to infrared LED D3, resistor R4, and capacitor C22 in parallel. The other ends of infrared LED D3, resistor R4, and capacitor C22 are all connected to pin 8 of Bluetooth chip U1.

2. The mobile power supply circuit utilizing Bluetooth and infrared modulation technology according to claim 1, characterized in that: The resistors R5 and R6 are connected to the anodes of infrared LEDs D1 and D2, respectively. The cathodes of LEDs D1 and D2 are both connected to the base of MOSFET Q2, and a resistor R2 is connected between the base and emitter of MOSFET Q2.

3. A mobile power supply circuit utilizing Bluetooth and infrared modulation technology according to claim 1, characterized in that: Capacitors C16 and C17 are connected in parallel on pin 32 of the Bluetooth chip U1. The other ends of capacitors C16 and C17 are connected to ground. Capacitors C14 and C15 are also connected in parallel on pin 32 of the Bluetooth chip U1. The other ends of capacitors C14 and C15 are connected to ground.

4. A mobile power supply circuit utilizing Bluetooth and infrared modulation technology according to claim 1, characterized in that: The first pin of the Zener diode U2 is connected to the ground wire, the third pin of the Zener diode U2 is connected to the BIT port of the pad, and the end of the capacitor C1 away from the Zener diode U2 is connected to the GND port of the pad.

5. A mobile power supply circuit utilizing Bluetooth and infrared modulation technology according to claim 1, characterized in that: The Bluetooth chip U1 has two capacitors C20 and C21 connected in parallel on pin 16. The other ends of capacitors C20 and C21 are connected to ground.

6. A mobile power supply circuit utilizing Bluetooth and infrared modulation technology according to claim 1, characterized in that: The anode of the infrared LED D3 is connected to the end of the resistor R3 away from the collector of the MOS transistor Q2, and the cathode of the infrared LED D3 is connected to the ground wire.

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