Electronic structure and inverter

Abstract

The utility model discloses an electronic structure and an inverter. The electronic structure comprises a metal plate; the shell and the metal plate are integrally formed, the shell comprises a first part and a second part, the metal plate covers the first part and the second part in the first direction, the first part and the metal plate jointly form a first containing space, a film capacitor, an EMC filtering X capacitor and an EMC filtering Y capacitor are arranged in the first containing space, and the second part comprises a containing part; an EMC filter core is arranged in the accommodating part; the shielding cover is arranged on the outer side of the second part, a shielding space is defined by the shielding cover and one part of the metal plate, and the second part is located in the shielding space. According to the utility model, the size can be reduced, the integration level is high, and the power density of the inverter is improved.

Description

Technical Field

[0001] This utility model relates to the field of inverters, and in particular to an electronic structure and an inverter. Background Technology

[0002] To ensure the normal operation of the inverter, it is usually necessary to assemble thin film capacitors, EMC (Electromagnetic Compatibility) shields, EMC filters, and cooling structures inside to achieve the functions of heat dissipation, filtering, and shielding.

[0003] Currently, thin-film capacitors, EMC (Electromagnetic Compatibility) shields, EMC filters, and cooling structures are all designed and manufactured separately and then bolted together. This results in a large area occupied by the inverter, low integration between the various structures, and consequently affects the overall power density and other performance characteristics of the inverter. Utility Model Content

[0004] The purpose of this invention is to solve the problem of current inverter structures being large in size and occupying a large area, thus affecting the overall power density of the inverter. This invention provides an electronic structure and inverter that can reduce size, increase integration, and improve the power density of the inverter.

[0005] To solve the above-mentioned technical problems, an embodiment of this utility model discloses an electronic structure, including:

[0006] Metal sheet;

[0007] The outer shell is integrally formed with the metal plate. The outer shell includes a first part and a second part. Along a first direction, the metal plate covers the first part and the second part. The first part and the metal plate together form a first receiving space. The first receiving space is provided with a film capacitor, an EMC filter X capacitor and an EMC filter Y capacitor. The second part includes a receiving portion, and the receiving portion is provided with a filter core.

[0008] A shielding cover is disposed on the outside of the second part and together with a portion of the metal plate, forms a shielding space, the second part being located within the shielding space.

[0009] By adopting the above technical solution, the outer shell and the metal plate are integrally formed, simplifying the processing procedure. Simultaneously, the metal plate covers both the first and second parts of the outer shell. Thus, the film capacitor, EMC filter X capacitor, and EMC filter Y capacitor located in the first accommodating space formed by the first part and the metal plate, as well as the EMC filter core located in the accommodating portion of the second part, can all achieve heat dissipation through the metal plate. At the same time, the shielding cover and the metal plate together form a shielding space, thereby achieving the shielding function for the EMC filter core.

[0010] In other words, the electronic structure provided in this application integrates the film capacitor, the EMC filter X capacitor, and the EMC filter Y capacitor in the first accommodating space of the first part, and integrates the EMC filter core in the accommodating part of the second part. That is, the housing integrates the film capacitor and the X capacitor, Y capacitor, and EMC filter core of the EMC filter. In other words, the main structures of the film capacitor and the EMC filter are integrated into one housing, which improves the integration of the structure and eliminates the need for independent design and assembly of the film capacitor and the EMC filter, thereby reducing the assembly area.

[0011] Meanwhile, the metal plate enables heat dissipation for the main structures of the film capacitor and EMC filter, and the shielding cover enables shielding for the EMC filter core. The overall structure is small in size and highly integrated, which improves the power density of the inverter and achieves good heat dissipation and shielding effects. Assembly is simple, reducing the investment in a large number of assembly equipment and resulting in low assembly costs.

[0012] According to another specific embodiment of the present invention, an electronic structure is disclosed, wherein the second part further includes a separator, the separator dividing the receiving part into a second receiving space and a third receiving space, the second receiving space surrounding the third receiving space, the EMC filter core being disposed in the second receiving space, and the first copper busbar being disposed in the third receiving space.

[0013] By adopting the above technical solution, the accommodating part is divided into a second accommodating space that matches the shape of the EMC filter core and a third accommodating space for assembling the first copper busbar by a separator, so as to realize the assembly of the EMC filter core and the connection of the first copper busbar at the same time.

[0014] According to another specific embodiment of the present invention, an electronic structure is disclosed, wherein a cover plate is provided at one end of the second part away from the first part along a second direction, and the cover plate covers the second accommodating space to close the second accommodating space, wherein the first direction intersects the second direction.

[0015] By adopting the above technical solution, the second receiving space is sealed by the cover plate, which means that the EMC filter core is fixedly placed in the second receiving space to prevent the EMC filter core from falling off and from being affected by the external environment.

[0016] According to another specific embodiment of the present invention, an electronic structure is disclosed, wherein the cover plate includes a through hole, and along the second direction, the third accommodating space has an opening at one end away from the first part and is closed at the other end, the opening being connected to the through hole, and the first copper busbar extending out of the through hole along the second direction.

[0017] Using the above technical solution, the first copper busbar extends through the through hole in the second direction, so that the input terminal can be connected to the first copper busbar to realize the input of the electronic structure signal.

[0018] According to another specific embodiment of the present invention, an electronic structure is disclosed in which the two ends of the EMC filter core are respectively bonded to the inner wall of the second accommodating space and the cover plate along the second direction.

[0019] By adopting the above technical solution, since the EMC filter core is fragile, bonding both ends of it to the inner wall and cover plate of the second accommodating space can ensure the fixation of the EMC filter core and prevent damage caused by vibration due to unstable fixation.

[0020] According to another specific embodiment of the present invention, an electronic structure is disclosed, wherein the thin-film capacitor, the EMC filter X capacitor, and the EMC filter Y capacitor are encapsulated in the first accommodating space.

[0021] By adopting the above technical solution, the film capacitor, EMC filter X capacitor, and EMC filter Y capacitor are encapsulated in the first accommodating space, thereby fixing the film capacitor, EMC filter X capacitor, and EMC filter Y capacitor, and the connection method is stable and simple.

[0022] According to another specific embodiment of the present invention, an electronic structure is disclosed, wherein a ground terminal is provided on the outer side of the first part away from the E thin film capacitor.

[0023] According to another specific embodiment of the present invention, an electronic structure is disclosed. Along the second direction, one end of the first accommodating space has an opening and the other end is closed. A plurality of second copper busbars extend from the opening end. One end of the plurality of second copper busbars is respectively connected to a thin film capacitor, an EMC filter X capacitor and an EMC filter Y capacitor, and the other end is connected to an external device.

[0024] Using the above technical solution, one end of the second copper busbar is connected to a film capacitor, an EMC filter X capacitor, and an EMC filter Y capacitor, respectively, and the other end is connected to an external device. This enables the function of the entire electronic structure. Specifically, the high-voltage signal is input from the input terminal through the first copper busbar, passes through the EMC filter (including the EMC filter core and the EMC filter X capacitor and EMC filter Y capacitor) to filter out useless signals, and is then output to the external device (such as a power module) through the film capacitor.

[0025] According to another specific embodiment of the present invention, an electronic structure is disclosed, wherein the outer wall of the first accommodating space is provided with a positioning hole.

[0026] Using the above technical solution, the electronic structure can be connected to external devices (such as the inverter housing) through the positioning holes.

[0027] The present invention also discloses an inverter, including a housing and an electronic structure as described in any of the above embodiments, wherein the housing is connected to a positioning hole. Attached Figure Description

[0028] Figure 1 An exploded view of the electronic structure of the prior art is shown;

[0029] Figure 2 A perspective view of the front of the electronic structure provided by this utility model is shown;

[0030] Figure 3 A perspective view of the reverse side of the electronic structure provided by this utility model is shown;

[0031] Figure 4 A rear view of the electronic structure provided by this utility model is shown;

[0032] Figure 5 A partial exploded view of the electronic structure provided by this utility model is shown;

[0033] Figure 6 A front view of the electronic structure provided by this utility model is shown;

[0034] Figure 7 A cross-sectional view of the electronic structure provided by this utility model is shown.

[0035] In the attached figures, the following reference numerals are used: 10, film capacitor; 11, thermally conductive adhesive for film capacitor; 12, film capacitor housing; 20, EMC filter; 30, EMC shielding cover; 31, bolt; 40, cooling structure; 100, metal plate; 200, housing; 201, first part; 202, second part; 203, first receiving space; 204, receiving part; 205, separator; 206, second receiving space; 207, third receiving space; 208, cover plate; 209, through hole; 300, EMC shielding cover; 301, shielding space; 401, film capacitor; 402, EMC filter X capacitor and Y capacitor; 403, grounding terminal; 404, positioning hole; 500, EMC filter core; 501, core adhesive; 600, second copper busbar; 700, first copper busbar. Detailed Implementation

[0036] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0037] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0039] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0040] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0042] To ensure the normal operation of the inverter, it is typically equipped with a thin-film capacitor 10, an EMC (Electromagnetic Compatibility) shield 30, an EMC filter 20, and a cooling structure to achieve heat dissipation, filtering, and shielding functions. Currently, the thin-film capacitor 10, the EMC shield 30, the EMC filter 20, and the cooling structure are all designed and manufactured separately, and are connected together by bolts 31.

[0043] Specifically, refer to Figure 1 The film capacitor 10 is encapsulated within the film capacitor housing 12 and is thermally conductive via the film capacitor thermally conductive adhesive 11. Along the Z-direction, an EMC filter 20 (including an EMC filter core, an EMC filter X capacitor, and an EMC filter Y capacitor) is connected to the right side of the film capacitor 10. Along the X-direction, an EMC shielding cover 30 is connected above the EMC filter 20 via multiple bolts 31. The EMC shielding cover 30 and the inverter housing (not shown) together form a shielding space, within which the EMC filter 20 is located to shield it. Sufficient bolts 31 are used to prevent signal leakage and better achieve the shielding function. Along the X-direction, a cooling structure 40 is provided above the film capacitor 10 to cool it.

[0044] This design requires both the thin-film capacitor 10 and the EMC filter 20 to be designed and manufactured separately, resulting in a large overall size. The connection and assembly between the EMC filter 20 and the thin-film capacitor 10 are not compact enough, leading to low integration and affecting the overall power density and other performance characteristics of the inverter. Furthermore, the thin-film capacitor 10 requires an additional cooling structure 40 for cooling, while the EMC filter 20 cannot be cooled and requires an additional EMC shield 30 for EMC shielding. This makes assembly complex, requires significant equipment investment, and increases costs.

[0045] Therefore, embodiments of this application provide an electronic structure that integrates an EMC filter and a thin-film capacitor housing into one, achieving a compact structure while sharing the metal plate of the thin-film capacitor housing for heat dissipation.

[0046] The electronic structure provided in this application can be applied to any field that requires filters and capacitors, such as automotive electronics. This application will be used as an example to illustrate its application in inverters.

[0047] This application provides an inverter, including a housing (not shown) and electronic structure, see reference. Figure 2 and Figure 3 The electronic structure includes: a metal plate 100, a housing 200, and an EMC shield 300. The housing 200 is integrally formed with the metal plate 100, and the housing 200 includes a first part 201 and a second part 202, along a first direction (i.e., Figure 2 (as shown in the X direction), the metal plate 100 covers the first part 201 and the second part 202 ( Figure 3 (As can be seen), combined Figure 4 The first part 201 and the metal plate 100 together form a first receiving space 203. The first receiving space 203 contains a thin-film capacitor 401 and EMC filter X capacitors and Y capacitors 402. Figure 5 and Figure 6 The second part 202 includes a receiving part 204, in which an EMC filter core 500 is provided; an EMC shield 300 is provided on the outside of the second part 202, and together with a part of the metal plate 100 (i.e. the metal plate 100 located on the bottom surface of the second part 202 along the X direction) forms a shielding space 301, and the second part 202 is located in the shielding space 301.

[0048] By adopting the above technical solution, the outer shell 200 and the metal plate 100 are integrally formed, simplifying the processing procedure. Simultaneously, the metal plate 100 covers the first part 201 and the second part 202 of the outer shell 200. Thus, the film capacitor 401, the EMC filter X capacitor and Y capacitor 402 located in the first accommodating space 203 formed by the first part 201 and the metal plate 100, and the EMC filter core 500 located in the accommodating portion 204 of the second part 202 can all achieve heat dissipation through the metal plate 100. At the same time, the EMC shielding cover 300 is welded to the metal plate 100 using laser welding technology, and together with the metal plate 100, forms the shielding space 301, thus achieving the shielding function for the EMC filter core 500. Compared with the previous bolt connection, the welding method is simpler and less prone to signal leakage.

[0049] In other words, the electronic structure provided in this application embodiment integrates the thin-film capacitor 401 and the EMC filter X capacitor and Y capacitor 402 in the first accommodating space 203 of the first part 201, and integrates the EMC filter core 500 in the accommodating part 204 of the second part 202. That is, the outer casing 200 integrates the thin-film capacitor 401, the EMC filter X capacitor and Y capacitor 402 and the EMC filter core 500. In other words, the main structure of the thin-film capacitor 401 and the EMC filter is integrated in the outer casing 200. At the same time, the metal plate 100 realizes heat dissipation for the thin-film capacitor 401 and the EMC filter, and the EMC shielding cover 300 realizes the shielding function for the EMC filter core 500. The overall structure has a small volume, high integration, improves the power density of the inverter, and also achieves good heat dissipation and shielding effects. The assembly is simple, reduces the investment in a large number of assembly equipment, and has low assembly costs.

[0050] For example, refer to Figure 2 and Figure 4 Along the second direction (i.e.) Figure 2 (As shown in the Y direction), the first receiving space 203 has an opening at one end and a closed end at the other. Multiple second copper busbars 600 extend from the open end. Each second copper busbar 600 includes a copper busbar connecting the positive and negative terminals of the film capacitor 401 and a copper busbar connecting the positive and negative terminals of the EMC filter X capacitor and Y capacitor 402. In other words, one end of each of the multiple second copper busbars 600 is connected to the film capacitor 401, the EMC filter X capacitor, and the Y capacitor 402, respectively, and the other end is connected to an external device (e.g., a power module). The film capacitor 401, the EMC filter X capacitor, and the Y capacitor 402 are encapsulated within the first receiving space 203, thus fixing the film capacitor 401, the EMC filter X capacitor, and the Y capacitor 402.

[0051] For example, the first part 201 has a grounding terminal 403 on the outer side away from the film capacitor 401, and the outer wall of the first receiving space 203 has two positioning holes 404, but it is not limited to this, and may also have three, one, etc., depending on the specific structure of the inverter housing. The electronic structure can be connected to the inverter housing through the positioning holes 404.

[0052] It should be noted that the shape of the first accommodating space 203 is not limited in this application embodiment, as long as it can accommodate the film capacitor 401 and the EMC filter X capacitor and Y capacitor 402. In order to maximize the area utilization, the shape and area adopted in this application are adapted to the shape of the film capacitor 401 and the EMC filter X capacitor and Y capacitor 402, and can also be slightly larger than the area of ​​the film capacitor 401 and the EMC filter X capacitor and Y capacitor 402.

[0053] Among them, the first direction (i.e. Figure 2 The X direction shown) and the second direction (i.e. Figure 2The first direction (as shown in the Y direction) intersects with the second direction. This application embodiment will be described using the example of the first direction being perpendicular to the second direction.

[0054] For example, refer to Figure 5 and Figure 6 The receiving portion 204 is elliptical. The second part 202 also includes a separator 205, which divides the receiving portion 204 into an annular second receiving space 206 and an elliptical third receiving space 207. The second receiving space 206 surrounds the third receiving space 207. An EMC filter core 500 is provided in the second receiving space 206, and the shape of the second receiving space 206 is adapted to the EMC filter core 500. A first copper busbar 700 is provided in the third receiving space 207, so that the first copper busbar 700 can be connected at the same time as the filter core 500 is assembled.

[0055] For example, along the second direction (i.e. Figure 5 (As shown in the Y direction), the second part 202 is provided with a cover plate 208 at the end away from the first part 201. The cover plate 208 covers the second accommodating space 206 and is snapped into the second part 202 to close the second accommodating space 206, that is, to fix the EMC filter core 500 in the second accommodating space 206 to prevent the influence of the external environment on it.

[0056] At the same time, along the second direction (i.e. Figure 5 (As shown in the Y direction), the two ends of the EMC filter core 500 are respectively bonded to the inner wall of the second receiving space 206 and the cover plate 208. Specifically, along the second direction, the two ends of the EMC filter core 500 are respectively provided with core adhesive 501 for bonding to the inner wall of the second receiving space 206 and the cover plate 208 to prevent the EMC filter core 500 from falling off.

[0057] For example, refer to Figure 5 and Figure 6 The cover plate 208 includes a through hole 209 along the second direction (i.e. Figure 5 (As shown in the Y direction), the third accommodating space 207 has an opening at one end away from the first part 201 and is closed at the other end. The opening is connected to the through hole 209. The first copper busbar 700 extends out of the through hole 209 in the second direction, so that the input terminal can be connected to the first copper busbar 700 to realize the input of the electronic structure signal.

[0058] For example, combined Figure 4 The high-voltage signal is input from the input terminal through the first copper busbar 700, and after passing through the EMC filter (including the EMC filter core 500 and the EMC filter X capacitor and Y capacitor 402) to filter out useless signals, it is output from the second copper busbar 600 through the film capacitor 401 to the external device (such as the power module).

[0059] In summary, for reference Figures 2 to 7 The EMC filter's X and Y capacitors 402 and film capacitor 401 are encapsulated in a first part 201 of a plastic housing 200 with a metal plate 100 embedded in the same bottom surface. A second receiving space 206 (a contoured structure of the EMC filter core 500) is designed in the second part 202 of the plastic housing 200. The EMC filter core is assembled into the same plastic housing 200 using a core adhesive 501 and a cover plate 208. The metal plate 100, nested in the bottom surface of the plastic housing 200, enhances heat dissipation for the film capacitor 401, the first copper busbar 700, the second copper busbar 600, the safety capacitors (i.e., the EMC filter X and Y capacitors 402), and the EMC filter core 500, thereby improving the overall heat dissipation of the EMC filter and the film capacitor 401. An EMC shielding cover 300 is laser-welded onto the metal plate 100 in the second part 202 for EMC shielding.

[0060] The EMC filter core 500 is tightly attached to the metal plate 100 for cooling. The EMC shielding cover 300 is welded to the metal plate 100 using laser welding, forming a shielding space 301 between them to achieve EMC shielding. The EMC filter and the film capacitor 401 are assembled in the same housing 200, combining the two into one unit. This allows for a compact structure while sharing the metal plate 100 of the housing 200 for heat dissipation.

[0061] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. An electronic structure, characterized in that, include: Metal sheet; The outer shell is integrally formed with the metal plate. The outer shell includes a first part and a second part. Along a first direction, the metal plate covers the first part and the second part. The first part and the metal plate together form a first accommodating space. The first accommodating space is provided with a film capacitor, an EMC filter X capacitor and an EMC filter Y capacitor. The second part includes an accommodating portion, and the accommodating portion is provided with an EMC filter core. A shielding cover is disposed on the outside of the second part and together with a portion of the metal plate, forms a shielding space, the second part being located within the shielding space.

2. The electronic structure as described in claim 1, characterized in that, The second part further includes a separator that divides the receiving portion into a second receiving space and a third receiving space. The second receiving space surrounds the third receiving space. The EMC filter core is located in the second receiving space, and the first copper busbar is located in the third receiving space.

3. The electronic structure as described in claim 2, characterized in that, Along the second direction, a cover plate is provided at the end of the second part away from the first part, and the cover plate covers the second receiving space to close the second receiving space, wherein the first direction intersects the second direction.

4. The electronic structure as described in claim 3, characterized in that, The cover plate includes a through hole. Along the second direction, the third receiving space has an opening at one end away from the first portion and is closed at the other end. The opening is connected to the through hole, and the first copper busbar extends out of the through hole along the second direction.

5. The electronic structure as described in claim 3, characterized in that, Along the second direction, the two ends of the EMC filter core are respectively bonded to the inner wall of the second accommodating space and the cover plate.

6. The electronic structure as described in claim 1, characterized in that, The thin-film capacitor, EMC filter X capacitor, and EMC filter Y capacitor are encapsulated in the first accommodating space.

7. The electronic structure as described in claim 6, characterized in that, The first part has a ground terminal on its outer side away from the thin film capacitor.

8. The electronic structure as described in claim 1, characterized in that, Along the second direction, the first accommodating space has an opening at one end and a closed end at the other end. Multiple second copper busbars extend from the opening end. One end of each of the multiple second copper busbars is connected to a film capacitor, an EMC filter X capacitor, and an EMC filter Y capacitor, respectively, and the other end is connected to an external device.

9. The electronic structure as described in claim 8, characterized in that, The outer wall of the first accommodating space is provided with positioning holes.

10. An inverter, characterized in that, It includes a housing and an electronic structure as described in any one of claims 1-9, wherein the housing is connected to a positioning hole.

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