Printed circuit assembly

Abstract

The utility model discloses a printed circuit assembly. The printed circuit assembly comprises a circuit board, a transformer and a high-voltage side switch. The manufacturing method of the printed circuit assembly comprises the following steps of: taking a high-voltage side switch; coating a protective material on the surfaces of a plurality of high-voltage side pins of the high-voltage side switch to form a first protective layer; the plurality of high-voltage side pins of the high-voltage side switch are inserted into the circuit board, the first high-voltage pin part of the plurality of high-voltage side pins is exposed out of the circuit board, and the first protection layer covers the surface of the first high-voltage pin part. Second high-voltage pin parts of the high-voltage side pins penetrate out of the circuit board, the second high-voltage pin parts penetrating through the lower portion of the circuit board are welded, so that the first protection layers covering the surfaces of the second high-voltage pin parts are melted at high temperature, and the high-voltage side pins and the bottom face of the circuit board are welded together.

Description

Technical Field

[0001] This application relates to the technical field of printed circuit assemblies, and more particularly to a printed circuit assembly.

[0002] Background technology.

[0003] In existing technology, power supply circuit boards are assembled with numerous electronic components, which are connected to the circuit board via pins. Due to tolerances in the assembly of these components, there is often a gap between the pins and the circuit board, meaning the pins cannot be fully inserted, leaving a small portion exposed. When a small insect crawls into the circuit board, it can directly contact the exposed pins of the high-voltage side components, causing unstable power output and potentially leading to a power outage. The traditional solution is to use insulating sleeves on the pins. This provides insulation and prevents insects from directly contacting the pins and causing a power outage. However, even with insulating sleeves, tolerance issues arise. The sleeves do not provide complete protection, and some pins may still remain exposed. Utility Model Content

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] A printed circuit assembly is provided, comprising: a circuit board, a transformer, and a high-voltage side switch. The transformer is disposed on the circuit board; and the high-voltage side switch is disposed on one side of the transformer, wherein the high-voltage side switch has a plurality of high-voltage side pins, the surfaces of the plurality of high-voltage side pins have a first protective layer, the plurality of high-voltage side pins are inserted into the circuit board, a first high-voltage pin portion of the plurality of high-voltage side pins is exposed on the circuit board, and the first protective layer covers the surface of the first high-voltage pin portion.

[0006] In one embodiment, a second high-voltage pin of the plurality of high-voltage side pins is located under the circuit board, and the second high-voltage pin is soldered to the bottom surface of the circuit board by a solder.

[0007] In one embodiment, a low-voltage side switch is further included, the low-voltage side switch having a plurality of low-voltage side pins, the surfaces of the plurality of low-voltage side pins having a second protective layer, the plurality of low-voltage side pins being inserted into the circuit board, a first low-voltage pin portion of the plurality of low-voltage side pins being exposed on the circuit board, and the second protective layer covering the surface of the first low-voltage pin portion.

[0008] In one embodiment, a second low-voltage pin of the plurality of low-voltage side pins extends under the circuit board, and the second low-voltage pin is soldered to the bottom surface of the circuit board by a solder.

[0009] In one embodiment, at least one electronic component is further included, which is disposed on the circuit board, wherein a third protective layer is covered on the surface of the electronic component.

[0010] In one embodiment, a fourth protective layer is applied to cover the surface of the circuit board.

[0011] The printed circuit assembly provided in this application forms a first protective layer by coating a protective material onto the surface of multiple high-voltage side pins of a high-voltage side switch; drying the first protective layer; and inserting the multiple high-voltage side pins of the high-voltage side switch into a circuit board, wherein the first high-voltage pin portions of the multiple high-voltage side pins are exposed on the circuit board, and the first protective layer covers the surface of the first high-voltage pin portions. The second high-voltage pin portions of the multiple high-voltage side pins extend under the circuit board, and are soldered through the multiple second high-voltage pin portions under the circuit board, causing the first protective layer covering the surface of the second high-voltage pin portions to be melted by the high temperature of the solder, and the multiple high-voltage side pins are soldered together with the bottom surface of the circuit board. Thus, the first high-voltage pin portions of the multiple high-voltage side pins exposed on the circuit board are protected by the first protective layer, achieving insulation, waterproofing, dustproofing, pollution prevention, and protection against insect influence. Attached Figure Description

[0012] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0013] Figure 1 This is a perspective view of the printed circuit assembly of this application;

[0014] Figure 2 This is a side view of the printed circuit assembly of this application;

[0015] Figure 3 yes Figure 2 A magnified diagram of region A; and

[0016] Figure 4 This is a step diagram of the manufacturing method of the printed circuit assembly of this application. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0018] Please see Figures 1 to 3 , Figure 1 This is a perspective view of the printed circuit assembly of this application. Figure 2 It is a side view and Figure 3 yes Figure 2 An enlarged schematic diagram of area A is shown. As illustrated, this embodiment provides a printed circuit assembly 1, which includes a circuit board 11, a transformer 12, and a high-voltage side switch 13. The transformer 12 is disposed on the circuit board 11. The high-voltage side switch 13 is disposed on one side of the transformer 12, wherein the high-voltage side switch 13 has a plurality of high-voltage side pins 131, the surfaces of the plurality of high-voltage side pins 131 have a first protective layer 100, the plurality of high-voltage side pins 131 are inserted into the circuit board 11, the first high-voltage pin portion 1311 of the plurality of high-voltage side pins 131 protrudes from the circuit board 11, and the first protective layer 100 covers the surface of the first high-voltage pin portion 1311. Furthermore, the second high-voltage pin portion 1312 of the plurality of high-voltage side pins 131 is located below the circuit board 11, the first protective layer 100 on the surface of the second high-voltage pin portion 1312 is melted by high-temperature solder 200, and the second high-voltage pin portion 1312 is soldered to the bottom surface of the circuit board 11 by solder 200.

[0019] In this embodiment, a low-voltage side switch 14 is further included. The low-voltage side switch 14 has a plurality of low-voltage side pins 141. The surfaces of the plurality of low-voltage side pins 141 have a second protective layer (not shown). The plurality of low-voltage side pins 141 are inserted into the circuit board 11. The first low-voltage pin portion 1411 of the plurality of low-voltage side pins 141 protrudes from the circuit board 11, and the second protective layer covers the surface of the first low-voltage pin portion 1411. Furthermore, the second low-voltage pin portion 1412 of the plurality of low-voltage side pins 141 protrudes from under the circuit board 11. The second protective layer on the surface of the second low-voltage pin portion 1412 is melted by high-temperature soldering, and the second low-voltage pin portion 1412 is soldered to the bottom surface of the circuit board 11.

[0020] In this embodiment, at least one electronic component 15 is further included. The electronic component 15 is disposed on the circuit board 11, and a third protective layer (not shown) is covered on the surface of the electronic component 15. This embodiment does not limit the type or number of electronic components 15, which can be configured according to user needs. The surface of the electronic component 15 can also be selectively coated with a protective material 10 according to user needs, thus forming a protective layer of protective material on the surface of the electronic component 15. Furthermore, the entire surface of the circuit board 11 can be coated with a protective material, thus forming a fourth protective layer (not shown) on the surface of the circuit board 11.

[0021] Please refer to the following: Figure 4This is a step diagram of the manufacturing method of the printed circuit assembly of this application. As shown in the figure, this embodiment provides a manufacturing method of a printed circuit assembly, the steps of which include:

[0022] Step S1: Take circuit board 11.

[0023] Step S2: Place the transformer 12 on the circuit board 11.

[0024] Step S3: Take the high-voltage side switch 13.

[0025] Step S4: Apply protective material 10 to the surface of the plurality of high-voltage side pins 131 of the high-voltage side switch 13 to form a first protective layer 100. The protective material can be silicone, acrylic, urethane, epoxy, polyurethane (PUR, PU), styrene block-copolymer (SBC), paraxylylene (XY), ultra-thin (UT), etc. The application method can be impregnation, spraying, brushing, etc. This embodiment does not limit the protective material or the application method; it can be adjusted according to the user's needs.

[0026] As described above, after the protective material 10 is applied to the surfaces of the plurality of high-voltage side pins 131 of the high-voltage side switch 13, the surfaces of the plurality of high-voltage side pins 131 are baked in a tunnel oven at a temperature between 171 and 175 degrees Celsius to dry the first protective layer 100 on the surfaces of the plurality of high-voltage side pins 131. In this way, the first protective layer 100 can be firmly covered on the plurality of high-voltage side pins 131 of the high-voltage side switch 13. This embodiment is not limited to the above-described drying method; the first protective layer 100 can also be dried by standing or air blowing.

[0027] Furthermore, once the protective material 10 is applied to the plurality of high-voltage side pins 131 of the high-voltage side switch 13, the user can use ultraviolet light to inspect the first protective layer 100 covering the surface of the plurality of high-voltage side pins 131 of the high-voltage side switch 13 to ensure that the protective material can completely cover the plurality of high-voltage side pins 131 and avoid any gaps in the surface of the plurality of high-voltage side pins 131 that are not completely covered.

[0028] Step S5: Insert the plurality of high-voltage side pins 131 of the high-voltage side switch 13 into the circuit board 11, wherein a first high-voltage pin portion 1311 of the plurality of high-voltage side pins 131 is exposed on the circuit board 11, and the first protective layer 100 completely covers the surface of the first high-voltage pin portion 1311. In other words, the surface of the plurality of high-voltage side pins 131 located above the circuit board 11 does not have a directly exposed pin surface, thus ensuring that no external insects or various contaminants can directly touch the surface of the plurality of high-voltage side pins 131, thereby causing poor circuit board connection and resulting in machine failure.

[0029] As described above, after inserting the plurality of high-voltage side pins 131 of the high-voltage side switch 13 into the circuit board 11 in step S5, the second high-voltage pin portions 1312 of the plurality of high-voltage side pins 131 extend out from under the circuit board 11. The plurality of second high-voltage pin portions 1312 extending through the circuit board 11 are soldered, wherein the first protective layer 100 covering the surface of the second high-voltage pin portions 1312 is melted by the high temperature of the solder 200, and the plurality of high-voltage side pins 131 are soldered together with the bottom surface of the circuit board 11 by the solder 200.

[0030] In addition, during step S5 above, besides installing the high-voltage side switch 13, a low-voltage side switch 14 can also be used simultaneously. A protective material 10 is applied to the surface of the plurality of low-voltage side pins 141 of the low-voltage side switch 14 to form a second protective layer (similar to the structure of the first protective layer 100), and the second protective layer on the surface of the plurality of low-voltage side pins 141 is dried. The second protective layer is then tested by ultraviolet light irradiation to ensure that the protective material completely covers the plurality of low-voltage side pins 141. Furthermore, the plurality of low-voltage side pins 141 of the low-voltage side switch 14 are inserted into the circuit board 11, with the first low-voltage pin portion 1411 of the plurality of low-voltage side pins 141 exposed on the circuit board 11. The second protective layer completely covers the surface of the first low-voltage pin portion 1411, thus ensuring that no external insects or various contaminants can directly touch the surface of the plurality of low-voltage side pins 141, thereby avoiding any impact on the low-voltage side switch 14.

[0031] As described above, the second low-voltage pins 1412 of the plurality of low-voltage side pins 141 extend under the circuit board 11. The plurality of second low-voltage pins 1412 extending under the circuit board 11 are soldered, wherein the second protective layer covering the surface of the second low-voltage pins 1412 is melted by the high temperature of the solder, and the plurality of low-voltage side pins 141 are soldered together with the bottom surface of the circuit board 11.

[0032] In this embodiment, at least one electronic component 15 is used. A protective material 10 is applied to the surface of the electronic component 15 to form a third protective layer (such as the structure of the first protective layer 100), and the third protective layer of the electronic component 15 is dried. The third protective layer is first tested with ultraviolet light to ensure that the third protective layer completely covers the surface of the electronic component 15 to be protected. Then, the electronic component 15 is placed on the circuit board 11. If the installation of the electronic component 15 requires soldering, the electronic component 15 needs to be assembled and inserted simultaneously in the step of inserting the plurality of high-voltage side pins of the high-voltage side switch into the circuit board. This allows the soldering process to be performed together in subsequent steps. If the installation of the electronic component 15 does not require soldering, the order of steps for assembling the electronic component 15 can be adjusted according to the user's needs.

[0033] Furthermore, in this embodiment, to protect the entire surface of the circuit board 11, after the soldering process is completed, a protective material 10 is applied to the upper and lower surfaces of the circuit board 11 to form a fourth protective layer (such as the structure of the first protective layer 100), and then the fourth protective layer of the circuit board 11 is dried. This provides insulation, waterproofing, dustproofing, pollution prevention, and protection against insects for the entire surface of the circuit board, and also avoids the high temperature of soldering from damaging the structure of the fourth protective layer.

[0034] In summary, this application provides a printed circuit assembly and its manufacturing method. The assembly involves coating a protective material onto the surface of multiple high-voltage side pins of a high-voltage side switch to form a first protective layer; drying the first protective layer; and inserting the multiple high-voltage side pins of the high-voltage side switch into a circuit board. The first high-voltage pin portions of the multiple high-voltage side pins are exposed on the circuit board, and the first protective layer covers the surface of the first high-voltage pin portions. The second high-voltage pin portions of the multiple high-voltage side pins extend under the circuit board, and are soldered through the lower part of the circuit board. The first protective layer covering the surface of the second high-voltage pin portions is melted by high-temperature solder, and the multiple high-voltage side pins are soldered together with the bottom surface of the circuit board. Thus, the first high-voltage pin portions of the multiple high-voltage side pins exposed on the circuit board are protected by the first protective layer, achieving insulation, waterproofing, dustproofing, pollution prevention, and protection against insect influence.

[0035] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0036] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms fall within the scope of protection of this application.

Claims

1. A printed circuit assembly, characterized in that, include: Circuit board; A transformer is mounted on the circuit board; as well as A high-voltage side switch is disposed on one side of the transformer. The high-voltage side switch has multiple high-voltage side pins. The surfaces of the multiple high-voltage side pins have a first protective layer. The multiple high-voltage side pins are inserted into the circuit board. The first high-voltage pin portion of the multiple high-voltage side pins is exposed on the circuit board, and the first protective layer covers the surface of the first high-voltage pin portion.

2. The printed circuit assembly as described in claim 1, characterized in that, The second high-voltage pin of the plurality of high-voltage side pins is located under the circuit board, and the second high-voltage pin is soldered to the bottom surface of the circuit board.

3. The printed circuit assembly as described in claim 1, characterized in that, It further includes a low-voltage side switch having multiple low-voltage side pins, the surfaces of the multiple low-voltage side pins having a second protective layer, the multiple low-voltage side pins being inserted into the circuit board, the first low-voltage pin portion of the multiple low-voltage side pins being exposed on the circuit board, and the second protective layer covering the surface of the first low-voltage pin portion.

4. The printed circuit assembly as described in claim 3, characterized in that, The second low-voltage pin of the plurality of low-voltage side pins extends out from under the circuit board, and the second low-voltage pin is soldered to the bottom surface of the circuit board.

5. The printed circuit assembly as described in claim 1, characterized in that, It further includes at least one electronic component disposed on the circuit board, wherein a third protective layer covers the surface of the electronic component.

6. The printed circuit assembly as claimed in claim 1, characterized in that, A fourth protective layer is applied to the surface of the circuit board.

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