Laminating device for inner layer of circuit board of computer host
By integrating cutting and pressing functions into the inner layer pressing device for computer host circuit boards, the problem of additional cutting after pressing multi-layer circuit boards is solved, thereby improving production efficiency and enhancing the quality of the inner layer boards.
Patent Information
- Application Number
- CN202422993089.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-05
AI Technical Summary
Existing multi-layer circuit boards require additional cutting of the outer edges after lamination, resulting in low production efficiency and poor quality of the inner layer boards.
Design a computer host circuit board inner layer pressing device that integrates cutting and pressing functions. The cutting tool is driven by a hydraulic system, and the grinding is achieved by using a half gear and a return spring to realize the transverse reciprocating motion of the cutting tool.
The integration of pressing and cutting is achieved, which improves production efficiency and enhances the quality of inner layer boards through polishing.
Smart Images

Figure CN223488504U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of circuit board lamination devices, specifically a lamination device for the inner layer of a computer host circuit board. Background Technology
[0002] Multilayer circuit board lamination refers to the process of stacking multiple single-layer circuit boards (also known as circuit boards or printed circuit boards) together using certain methods and processes, and applying appropriate pressure to fix them. This process aims to connect the circuits of multiple single-layer circuit boards to form a whole multilayer circuit board structure.
[0003] Currently, after the inner layers of a multilayer circuit board are laminated by a laminating device, the outer side of the resulting complete inner layer board has an edge. Therefore, after the inner layer board is laminated, it needs to be transported to the cutting process location for cutting. To address this, we propose an integrated cutting and laminating device for the inner layer laminating of computer host circuit boards. Utility Model Content
[0004] Therefore, the purpose of this utility model is to provide a computer host circuit board inner layer lamination device to solve the technical problems mentioned in the background.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a computer host circuit board inner layer pressing device, including a pressing device, a feeding port on one side of the pressing device, and a first discharge port on the other side of the pressing device, a cutting box connected to the end of the first discharge port, and a second feeding port on one side of the cutting box, a base plate for supporting the inner layer board in the cutting box, and a base fixed to the bottom wall of the cutting box connected to the bottom end of the base plate, and a cutting tool for cutting the inner layer board is provided above the base plate.
[0006] By adopting the above technical solution, cutting and pressing are integrated, which is beneficial to the overall production efficiency of the inner layer board. In addition, the cutting component can also polish the cut edge after cutting the inner layer board, thereby further improving the quality of the inner layer board.
[0007] The present invention is further configured such that a pressure plate is provided above the bottom plate to achieve pressing and limiting of the inner plate, and a return spring is installed between the top plate and the pressure plate, and multiple sets of return springs are distributed in parallel array between the pressure plate and the top plate.
[0008] By adopting the above technical solution, the movement of the top plate can be assisted.
[0009] The present invention is further configured such that a top plate for mounting the tool and driving the tool to move is provided on the inner side of the tool, and a hydraulic cylinder is installed at the top of the top plate.
[0010] By adopting the above technical solution, the top plate is driven, which in turn drives the cutting tool.
[0011] The present invention is further configured such that a grinding part is provided on the inner end face of the cutter below the top plate, and a limiting block extending into the interior of the top plate and slidably connected to the interior of the top plate is fixed on the inner end face of the cutter, and a sliding groove adapted to the limiting block is provided on the outer side of the limiting block inside the top plate.
[0012] By adopting the above technical solution, the cutting edge can be polished.
[0013] The present invention is further configured such that a half gear is installed inside the top plate, and a drive motor is connected to the top of the half gear. A driven tooth plate is provided on both sides of the half gear, and a connecting rod extending to the end face of the cutter is fixedly connected to the outer wall of the driven tooth plate. The driven tooth plate and the inner wall of the top plate are connected by a sliding groove and a spring for sliding reset.
[0014] By adopting the above technical solution, the tool can be driven to move laterally and reciprocate.
[0015] In summary, the present invention has the following main advantages:
[0016] 1. This utility model, by setting a cutting box, firstly, the inner layer board to be pressed is fed into the pressing device through the feed port for pressing. After pressing, the inner layer board will enter the cutting box through the first discharge port for cutting. Specifically, the hydraulic cylinder is started, and the hydraulic cylinder will drive the top plate to move downward. At the same time, the pressure plate will move synchronously under the action of the top plate until the pressure plate moves to the top of the inner layer board to achieve pressing and limiting of the inner layer board. Then the hydraulic cylinder will continue to drive the top plate to move downward until the cutter moves to the end face of the inner layer board to achieve cutting of the inner layer board edge.
[0017] 2. This utility model, by setting a cutting tool, after the inner layer plate is cut, the hydraulic cylinder will drive the top plate to reset and move. During this process, the drive motor is started, which drives the half gear to rotate. After the half gear rotates, it will drive the driven tooth plates on both sides to move. When the teeth of the half gear rotate to the point where they no longer contact the driven tooth plates, the driven tooth plates will reset under the action of the spring. This cycle repeats, realizing the lateral reciprocating drive effect of the driven tooth plates on the cutting tool. This allows the grinding part on the end face of the cutting tool to grind the cut surface, further improving the quality of the inner layer plate. Attached Figure Description
[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0019] Figure 2 This is a schematic diagram of the internal structure of the cutting box of this utility model;
[0020] Figure 3 This is a schematic diagram of the tool installation of this utility model;
[0021] Figure 4 This is a schematic diagram of the internal structure of the top plate of this utility model;
[0022] Figure 5 This is a top view of the internal structure of the top plate of this utility model.
[0023] In the diagram: 1. Pressing device; 2. Feed inlet; 3. First discharge outlet; 4. Cutting box; 5. Second discharge outlet; 6. Base plate; 7. Base; 8. Pressure plate; 9. Top plate; 10. Hydraulic cylinder; 11. Cutting tool; 12. Return spring; 13. Grinding part; 14. Limiting slider; 15. Half gear; 16. Driven gear plate; 17. Connecting rod. Detailed Implementation
[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0025] The embodiments of this utility model will be described below based on its overall structure.
[0026] A computer motherboard circuit board inner layer lamination device, such as Figure 1-5 As shown, it includes a pressing device 1, a feed inlet 2 on one side of the pressing device 1, and a first discharge outlet 3 on the other side of the pressing device 1. The end of the first discharge outlet 3 is connected to a cutting box 4, and a second feed inlet 5 is provided on one side of the cutting box 4. A bottom plate 6 for supporting the inner layer board is provided in the cutting box 4, and a base 7 fixed to the bottom wall of the cutting box 4 is connected to the bottom end of the bottom plate 6. A cutting tool 11 for cutting the inner layer board is provided above the bottom plate 6.
[0027] Furthermore, in this embodiment, a pressure plate 8 is also provided above the bottom plate 6 to achieve pressing and limiting of the inner layer plate. A return spring 12 is installed between the top plate 9 and the pressure plate 8, and multiple sets of return springs 12 are distributed in parallel array between the pressure plate 8 and the top plate 9.
[0028] Please see Figure 2 The inner side of the cutter 11 is provided with a top plate 9 for mounting the cutter 11 and driving the cutter 11 to move, and a hydraulic cylinder 10 is installed at the top of the top plate 9 to drive the top plate 9.
[0029] Please see Figure 4The inner end face of the cutter 11 is provided with a grinding part 13 located below the top plate 9, and the inner end face of the cutter 11 is also fixed with a limiting block 14 extending into the interior of the top plate 9 and slidingly connected to the interior of the top plate 9. The outer side of the limiting block 14 is provided with a sliding groove adapted to the limiting block 14 located inside the top plate 9, so as to assist the movement of the cutter 11.
[0030] Please see Figure 5 The top plate 9 has a half gear 15 installed inside, and a drive motor is connected to the top of the half gear 15. Both sides of the half gear 15 are provided with driven tooth plates 16, and the outer wall of the driven tooth plate 16 is fixedly connected with a connecting rod 17 extending to the end face of the cutter 11. The driven tooth plate 16 and the inner wall of the top plate 9 are connected to slide and reset through a groove and a spring, so as to realize the transverse reciprocating drive of the cutter 11.
[0031] The working principle of this utility model is as follows: First, the inner layer plate to be pressed is fed into the pressing device 1 through the feed port 2 for pressing. After pressing, the inner layer plate will enter the cutting box 4 through the first discharge port 3 for cutting.
[0032] Specifically, when the hydraulic cylinder 10 is activated, the hydraulic cylinder 10 will drive the top plate 9 to move downward. At the same time, the pressure plate 8 will move synchronously under the action of the top plate 9 until the pressure plate 8 moves to the top of the inner layer plate to achieve the pressing and limiting of the inner layer plate. Then the hydraulic cylinder 10 will continue to drive the top plate 9 to move downward until the cutter 11 moves to the end face of the inner layer plate to achieve the cutting of the inner layer plate edge.
[0033] Furthermore, after the inner layer plate is cut, the hydraulic cylinder 10 will drive the top plate 9 to reset and move. During this process, the drive motor is started, and the drive motor will drive the half gear 15 to rotate. After the half gear 15 rotates, it will drive the driven tooth plates 16 on both sides to move. When the teeth of the half gear 15 rotate to the point where they no longer contact the driven tooth plates 16, the driven tooth plates 16 will reset under the action of the spring. This cycle repeats, realizing the effect of the driven tooth plates 16 driving the cutter 11 laterally through the connecting rod 17. This allows the grinding part 13 on the end face of the cutter 11 to grind the cut edge of the inner layer plate, further improving the quality of the inner layer plate.
[0034] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.
Claims
1. A computer host circuit board inner layer lamination device, comprising a lamination device (1), characterized in that: The pressing device (1) has a feed inlet (2) on one side and a first discharge outlet (3) on the other side. The end of the first discharge outlet (3) is connected to a cutting box (4), and a second feed inlet (5) is provided on one side of the cutting box (4). The cutting box (4) is provided with a base plate (6) for supporting the inner layer plate, and the bottom end of the base plate (6) is connected to a base (7) fixed on the bottom wall of the cutting box (4). A cutting tool (11) for cutting the inner layer plate is provided above the base plate (6).
2. The computer host circuit board inner layer lamination device according to claim 1, characterized in that: A pressure plate (8) is also provided above the base plate (6) to achieve pressure and limit the inner layer plate.
3. The computer host circuit board inner layer lamination device according to claim 2, characterized in that: The inner side of the cutting tool (11) is provided with a top plate (9) for mounting the cutting tool (11) and driving the cutting tool (11) to move, and a hydraulic cylinder (10) is installed at the top of the top plate (9).
4. The computer host circuit board inner layer lamination device according to claim 3, characterized in that: A reset spring (12) is installed between the top plate (9) and the pressure plate (8), and multiple sets of reset springs (12) are distributed in parallel array between the pressure plate (8) and the top plate (9).
5. The computer host circuit board inner layer lamination device according to claim 3, characterized in that: The inner end face of the cutting tool (11) is provided with a grinding part (13) located below the top plate (9), and the inner end face of the cutting tool (11) is also fixed with a limiting block (14) extending into the interior of the top plate (9) and slidingly connected to the interior of the top plate (9). The outer side of the limiting block (14) is provided with a sliding groove adapted to the limiting block (14) located inside the top plate (9).
6. The computer host circuit board inner layer lamination device according to claim 3, characterized in that: The top plate (9) is equipped with a half gear (15), and a drive motor is connected to the top of the half gear (15). Both sides of the half gear (15) are provided with driven tooth plates (16), and a connecting rod (17) extending to the end face of the cutter (11) is fixedly connected to the outer wall of the driven tooth plate (16).
7. The computer host circuit board inner layer lamination device according to claim 6, characterized in that: The driven toothed plate (16) and the inner wall of the top plate (9) are connected by a sliding groove and a spring for sliding reset.