Semiconductor refrigeration bag power supply protection device

Abstract

The utility model relates to the technical field of power supply protection, and discloses a semiconductor refrigeration bag power supply protection device which comprises a semiconductor refrigeration bag body, a protection cover is fixedly installed on the front face of the semiconductor refrigeration bag body through bolts, a protection mechanism is arranged on the inner side of the protection cover, and a protection mechanism is arranged at the bottom of the protection cover. The protection mechanism comprises a waterproof assembly and a mistaken touch prevention assembly, and the mistaken touch prevention assembly is arranged at the top of the waterproof assembly. The angle of the water baffle is adjusted, the water baffle is used for shielding rainwater, the rainwater is prevented from entering the protection cover, after the water baffle is closed, heat dissipation operation is conducted through the heat dissipation holes in the surface of the water baffle, dust can be blocked through the dust cover, the protection cover is used for shielding the rotary knob, and the protection cover is used for protecting the rotary knob. And the situation that the angle of the water baffle is changed due to mistaken touch is prevented, then rainwater enters the protection cover, and a power source of the semiconductor refrigeration bag body is further protected.

Description

Technical Field

[0001] This utility model relates to the field of power protection technology, specifically a power protection device for a semiconductor cooling package. Background Technology

[0002] The semiconductor cooling bag is a portable small cooling device. The entire bag consists of two layers: an inner layer of white UV-resistant insulation material and an outer layer of rubber packaging. It has a cooling function, with the cooling module integrated as a whole and placed separately in the bag. The cooling device is a semiconductor cooling chip, mainly used in cars or for family travel to store wine or other products that need to be cooled, such as carrying ice-cold soda, ice-cold beer, etc.

[0003] Existing semiconductor cooling pack power protection devices only use a simple protective cover to protect the power supply during use, leaving the heat dissipation holes and power sockets exposed to the outside. If the cooling pack is used outdoors, rainwater and dust can easily enter the protective cover, causing damage to the power supply. Therefore, it is necessary to improve the semiconductor cooling pack power protection device to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a power protection device for a semiconductor cooling package to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A semiconductor cooling pack power protection device includes a semiconductor cooling pack body, a protective cover is fixedly installed on the front of the semiconductor cooling pack body by bolts, a protective mechanism is provided on the inner side of the protective cover, and a protective mechanism is provided at the bottom of the protective cover.

[0007] The protective mechanism includes a waterproof component and an anti-accidental contact component, with the anti-accidental contact component located on top of the waterproof component.

[0008] Preferably, the waterproof component includes a mounting bracket, which is fixedly installed inside the protective cover. A rotating rod is rotatably mounted inside the mounting bracket, a water baffle is fixedly mounted outside the rotating rod, a gear is fixedly mounted outside the rotating rod, a dust cover is fixedly mounted outside the water baffle, a threaded rod is rotatably mounted inside the protective cover, a rack is threadedly mounted outside the threaded rod, a knob is fixedly mounted on the top of the threaded rod, and a cooling fan is fixedly mounted outside the mounting bracket. The water baffle blocks rainwater from entering the protective cover and affecting the power supply.

[0009] Preferably, the baffle plate has heat dissipation holes inside, and the dust cover is set outside the heat dissipation holes. The rack is slidably installed inside the protective cover, and the gear meshes with the rack to adjust the angle of the baffle plate.

[0010] Preferably, the anti-accidental touch component includes a spring, which is fixedly installed inside the protective cover. A sliding block is fixedly installed at the end of the spring away from the protective cover, and a protective cover is fixedly installed on the top of the sliding block to further protect the power supply of the semiconductor cooling package body.

[0011] Preferably, the protective cover is located outside the knob, and the sliding block is slidably mounted on the top of the protective cover to prevent the angle of the water baffle from changing due to accidental touch.

[0012] Preferably, the protection mechanism includes a power port protection frame, which is fixedly installed at the bottom of the protective cover. A second spring is fixedly installed inside the power port protection frame. A slider is fixedly installed at the end of the second spring away from the power port protection frame. A protective plate is fixedly installed at the bottom of the slider. The protective plate is closed to prevent dust from entering the power port.

[0013] Preferably, the slider is slidably installed inside the power port protection frame, and the power port protection frame is located outside the power port to prevent dust from entering the power port.

[0014] Compared with the prior art, the present invention provides a power protection device for a semiconductor cooling package, which has the following advantages:

[0015] 1. This semiconductor cooling pack power protection device, through its protective mechanism, adjusts the angle of the baffle plate during use to block rainwater from entering the protective cover and affecting the power supply. After the baffle plate is closed, heat dissipation continues through the ventilation holes on its surface without affecting normal heat dissipation. A dust cover prevents dust from entering the protective cover, providing waterproof and dustproof protection for the power supply. The protective cover also covers the knobs to prevent accidental changes in the baffle plate angle, which could allow rainwater to enter the protective cover, further protecting the power supply of the semiconductor cooling pack.

[0016] 2. The power protection device for the semiconductor cooling package, through its protective mechanism, closes the protective plate during use to prevent dust from entering the power port, and the opening of the power port protection frame faces downwards, making it difficult for rainwater to enter the power port protection frame, thus protecting the power port. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the appearance and structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the external structure of the protective mechanism of this utility model.

[0020] Figure 3 This is an exploded view of the waterproof component of this utility model.

[0021] Figure 4 This is a cross-sectional structural diagram of the anti-accidental touch component of this utility model.

[0022] Figure 5 This is a schematic diagram of the appearance structure of the protection mechanism of this utility model.

[0023] In the diagram: 1. Semiconductor cooling package body; 2. Protective mechanism; 21. Waterproof component; 211. Mounting bracket; 212. Rotating rod; 213. Water baffle; 214. Dust cover; 215. Gear; 216. Threaded rod; 217. Knob; 218. Rack; 219. Cooling fan; 22. Anti-accidental touch component; 221. Spring 1; 222. Sliding block; 223. Protective cover; 3. Protective mechanism; 31. Power port protection frame; 32. Spring 2; 33. Protective plate; 34. Slider; 4. Protective cover. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0025] Please see Figure 1-3 This utility model provides a technical solution: a semiconductor cooling package power protection device, including a semiconductor cooling package body 1, a protective cover 4 is fixedly installed on the front of the semiconductor cooling package body 1 by bolts, a protective mechanism 2 is provided on the inner side of the protective cover 4, and a protective mechanism 3 is provided at the bottom of the protective cover 4; the protective mechanism 2 includes a waterproof component 21 and an anti-accidental contact component 22, and the anti-accidental contact component 22 is provided on the top of the waterproof component 21.

[0026] Furthermore, the waterproof component 21 includes a mounting bracket 211, which is fixedly installed inside the protective cover 4. A rotating rod 212 is rotatably installed inside the mounting bracket 211. A water baffle 213 is fixedly installed outside the rotating rod 212. A gear 215 is fixedly installed outside the rotating rod 212. A dust cover 214 is fixedly installed outside the water baffle 213. A threaded rod 216 is rotatably installed inside the protective cover 4. A rack 218 is threaded onto the outside of the threaded rod 216. A knob 217 is fixedly installed on the top of the threaded rod 216. A cooling fan 219 is fixedly installed outside the mounting bracket 211. The water baffle 213 is used to block rainwater and prevent rainwater from entering the interior of the protective cover 4 and affecting the power supply.

[0027] Furthermore, the baffle plate 213 has heat dissipation holes inside, and the dust cover 214 is set outside the heat dissipation holes. The rack 218 is slidably installed inside the protective cover 4, and the gear 215 meshes with the rack 218 to adjust the angle of the baffle plate 213.

[0028] Furthermore, the anti-accidental touch component 22 includes a spring 221, which is fixedly installed inside the protective cover 4. A sliding block 222 is fixedly installed at the end of the spring 221 away from the protective cover 4, and a protective cover 223 is fixedly installed on the top of the sliding block 222 to further protect the power supply of the semiconductor cooling package body 1.

[0029] Furthermore, the protective cover 223 is located outside the knob 217, and the sliding block 222 is slidably mounted on the top of the protective cover 4 to prevent the angle of the baffle plate 213 from changing due to accidental contact. Example 2

[0030] Please see Figure 4 Furthermore, in conjunction with Embodiment 1, the protection mechanism 3 includes a power port protection frame 31, which is fixedly installed at the bottom of the protective cover 4. A second spring 32 is fixedly installed inside the power port protection frame 31. A slider 34 is fixedly installed at the end of the second spring 32 away from the power port protection frame 31. A protective plate 33 is fixedly installed at the bottom of the slider 34. The protective plate 33 is closed to prevent dust from entering the power port.

[0031] Furthermore, the slider 34 is slidably installed inside the power port protection frame 31, which is located outside the power port to prevent dust from entering the power port.

[0032] In actual operation, when this device is in use, the protective cover 4 is installed on the outside of the power supply of the semiconductor cooling package body 1. In rainy outdoor environments, pull the protective cover 223 to expose the knob 217. Rotating the knob 217 causes the threaded rod 216 to rotate, which in turn causes the rack 218 to slide inside the protective cover 4, thereby causing the gear 215 to rotate and adjusting the angle of the baffle 213. This baffle 213 then blocks rainwater from entering the protective cover 4 and affecting the power supply. After the baffle 213 is closed, heat dissipation is achieved through the heat dissipation holes on the surface of the baffle 213, without affecting normal operation. For heat dissipation, the dust cover 214 can block dust, reducing the amount of dust entering the protective cover 4 and providing waterproof and dustproof protection for the power supply. The protective cover 223 covers the knob 217 to prevent accidental changes in the angle of the water baffle 213, which would allow rainwater to enter the protective cover 4. When power needs to be connected, the slider 34 is moved outward to allow the protective plate 33 to slide outside the power port protection frame 31, exposing the power port. When not in use, the protective plate 33 closes to prevent dust from entering the power port. Furthermore, the opening of the power port protection frame 31 faces downward, making it difficult for rainwater to enter the power port protection frame 31, thus protecting the power port.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A semiconductor cooling pack power protection device, comprising a semiconductor cooling pack body (1), characterized in that: The semiconductor cooling package body (1) is fixedly mounted with a protective cover (4) on the front by bolts. A protective mechanism (2) is provided on the inner side of the protective cover (4), and a protective mechanism (3) is provided at the bottom of the protective cover (4). The protective mechanism (2) includes a waterproof component (21) and an anti-accidental contact component (22). The anti-accidental contact component (22) is located on the top of the waterproof component (21).

2. The semiconductor cooling package power protection device according to claim 1, characterized in that: The waterproof component (21) includes a mounting bracket (211), which is fixedly installed inside the protective cover (4). A rotating rod (212) is rotatably installed inside the mounting bracket (211). A water baffle (213) is fixedly installed outside the rotating rod (212). A gear (215) is fixedly installed outside the rotating rod (212). A dust cover (214) is fixedly installed outside the water baffle (213). A threaded rod (216) is rotatably installed inside the protective cover (4). A rack (218) is threaded onto the outside of the threaded rod (216). A knob (217) is fixedly installed on the top of the threaded rod (216). A cooling fan (219) is fixedly installed on the outside of the mounting bracket (211).

3. The semiconductor cooling package power protection device according to claim 2, characterized in that: The baffle plate (213) has heat dissipation holes inside, and the dust cover (214) is set outside the heat dissipation holes. The rack (218) is slidably installed inside the protective cover (4), and the gear (215) meshes with the rack (218).

4. The semiconductor cooling package power protection device according to claim 2, characterized in that: The anti-accidental touch component (22) includes a spring (221), which is fixedly installed inside the protective cover (4). A sliding block (222) is fixedly installed at the end of the spring (221) away from the protective cover (4), and a protective cover (223) is fixedly installed on the top of the sliding block (222).

5. A semiconductor cooling package power protection device according to claim 4, characterized in that: The protective cover (223) is located outside the knob (217), and the sliding block (222) is slidably mounted on the top of the protective cover (4).

6. The semiconductor cooling package power protection device according to claim 1, characterized in that: The protection mechanism (3) includes a power port protection frame (31), which is fixedly installed at the bottom of the protective cover (4). A second spring (32) is fixedly installed inside the power port protection frame (31). A slider (34) is fixedly installed at the end of the second spring (32) away from the power port protection frame (31). A protective plate (33) is fixedly installed at the bottom of the slider (34).

7. A semiconductor cooling package power protection device according to claim 6, characterized in that: The slider (34) is slidably installed inside the power port protection frame (31), which is located outside the power port.

Images