Cooling device and heat dissipation plate assembly

Abstract

A cooling device and a heat sink assembly are provided, the cooling device is used for accommodating a cooling liquid, and the cooling device includes a heat sink assembly and a pump. The heat dissipation plate assembly comprises a first plate body and a second plate body. The first plate body has a recessed structure and is used for thermally coupling a heat source. The second plate body covers the concave structure, and the second plate body and the concave structure jointly form a heat dissipation flow channel, a liquid inlet and a liquid outlet. The heat dissipation flow channel is used for containing cooling liquid. And the liquid inlet and the liquid outlet are communicated with the heat dissipation flow channel. And the pump is communicated with the liquid inlet and the liquid outlet. The pump is used for driving the cooling liquid to circularly flow in the heat dissipation flow channel.

Description

Technical Field

[0001] This utility model relates to a cooling device and a heat sink assembly, particularly a cooling device and heat sink assembly in which two plates together form a heat dissipation channel. Background Technology

[0002] With the rapid development of technology, the operating efficiency of electronic components has increased significantly, but it also generates a lot of heat. In order to ensure that electronic components are not damaged by high heat, heat dissipation devices need to be installed on electronic products to dissipate excess heat and enable electronic components to operate within a certain operating temperature range.

[0003] Specifically, manufacturers install water-cooling devices such as water-cooled plates on electronic products to dissipate heat from electronic components. Current water-cooling devices use copper pipes as heat dissipation channels to hold the coolant, allowing it to flow through the heat source. However, these copper pipes require space for bending. When the pipe design is complex, the bends occupy a significant amount of space within the electronic product, making it difficult to place other electronic components. This results in inefficient use of space within the electronic product, leading to wasted space. Therefore, improving the space utilization rate within electronic products while maintaining the heat dissipation efficiency of water-cooling devices is one of the problems that researchers must solve. Utility Model Content

[0004] The present invention provides a cooling device and a heat sink assembly, thereby improving the space utilization rate within electronic products while maintaining the heat dissipation performance of the cooling device.

[0005] A cooling device disclosed in one embodiment of this utility model is used to contain a coolant and includes a heat sink assembly and a pump. The heat sink assembly includes a first plate and a second plate. The first plate has a recessed structure for thermally coupling a heat source. The second plate covers the recessed structure and, together with the recessed structure, forms a heat dissipation channel, a coolant inlet, and a coolant outlet. The heat dissipation channel contains the coolant. The coolant inlet and outlet are connected to the heat dissipation channel. The pump is connected to the coolant inlet and outlet and drives the coolant to circulate within the heat dissipation channel.

[0006] In one embodiment of the present invention, the heat dissipation channel has a first heat absorption part and a first heat dissipation part. One end of the first heat absorption part is connected to the liquid inlet, the other end of the first heat absorption part is connected to one end of the first heat dissipation part, and the other end of the first heat dissipation part is connected to the liquid outlet.

[0007] In one embodiment of the present invention, the heat dissipation channel further includes a second heat dissipation part, the first heat dissipation part is connected to the second heat dissipation part, and the first heat dissipation part and the second heat dissipation part are respectively connected to the first heat absorption part and the liquid outlet.

[0008] In one embodiment of the present invention, the width of the second heat dissipation part is greater than the width of the first heat dissipation part.

[0009] In one embodiment of the present invention, the heat dissipation channel further comprises a third heat dissipation part and a second heat absorption part. One end of the third heat dissipation part is connected to one end of the second heat dissipation part, the other end of the third heat dissipation part is connected to one end of the second heat absorption part, and the other end of the second heat absorption part is connected to the liquid outlet.

[0010] In one embodiment of the present invention, the heat dissipation channel further includes a fourth heat dissipation part, the third heat dissipation part is connected to the fourth heat dissipation part, and the third heat dissipation part and the fourth heat dissipation part are respectively connected to the second heat dissipation part and the second heat absorption part.

[0011] In one embodiment of the present invention, the width of the third heat dissipation part is greater than the width of the fourth heat dissipation part.

[0012] In one embodiment of the present invention, the first heat dissipation part and the second heat dissipation part are linearly symmetrical to the third heat dissipation part and the fourth heat dissipation part.

[0013] In one embodiment of the present invention, the heat dissipation channel further includes a first connecting portion, a second connecting portion and a third connecting portion. The first connecting portion connects the first heat-absorbing portion and the first heat-dissipating portion, the second connecting portion connects the second heat-dissipating portion and the third heat-dissipating portion, and the third connecting portion connects the fourth heat-dissipating portion and the second heat-absorbing portion.

[0014] In one embodiment of the present invention, the recess depth of the first heat-absorbing part and the second heat-absorbing part is greater than the recess depth of the first heat-dissipating part, the second heat-dissipating part, the third heat-dissipating part, the fourth heat-dissipating part, the first connecting part, the second connecting part, and the third connecting part.

[0015] In one embodiment of the present invention, a plurality of first fins are further included, the plurality of first fins being respectively disposed on the first heat absorption part, the first heat dissipation part, the second heat dissipation part, the third heat dissipation part, the fourth heat dissipation part, and the second heat absorption part.

[0016] In one embodiment of the present invention, at least one heat-conducting block is further included. The at least one heat-conducting block is disposed on the first plate and corresponds to the first fin located in the first heat-absorbing part or the first fin located in the second heat-absorbing part. The at least one heat-conducting block is used to thermally couple to at least one heat source.

[0017] In one embodiment of the present invention, at least one fan element is further included. The first plate and the second plate together form at least one ventilation opening. The at least one ventilation opening is separate from the heat dissipation channel. The at least one fan element is disposed at the at least one ventilation opening.

[0018] In one embodiment of the present invention, a plurality of second fins are further included. The plurality of second fins are disposed on the first plate. The at least one fan element includes a bottom and two side portions. The two side portions are connected to the bottom and are adjacent to each other. The bottom has an air inlet, and each of the two side portions has an air outlet. The plurality of second fins are respectively located at the two air outlets and respectively correspond to at least a portion of the plurality of first fins.

[0019] In one embodiment of this utility model, the first plate and the second plate are connected by welding.

[0020] Another embodiment of this utility model discloses a heat sink assembly for containing a coolant, comprising a first plate and a second plate. The first plate has a recessed structure for thermally coupling a heat source. The second plate covers the recessed structure and, together with the recessed structure, forms a heat dissipation channel, a coolant inlet, and a coolant outlet. The heat dissipation channel contains the coolant. The coolant inlet and outlet are connected to the heat dissipation channel.

[0021] According to the cooling device and heat sink assembly of the above embodiments, since the cooling device is equipped with a heat sink assembly, and the heat sink assembly forms a heat dissipation channel through the recessed structure of the first plate, the bends in the channel will not occupy a large amount of space inside the electronic device due to structural limitations. Therefore, a more complex heat dissipation path can be designed to make full use of the space inside the electronic device without affecting the placement of other electronic components. In this way, the space utilization rate inside the electronic device can be improved while maintaining the heat dissipation performance of the cooling device.

[0022] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principle of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description

[0023] Figure 1 This is a perspective view of the cooling device according to an embodiment of the present utility model;

[0024] Figure 2 for Figure 1 An exploded view of the cooling device;

[0025] Figure 3 for Figure 1 The cooling device is shown in a plan view omitting the second plate.

[0026] Figure 4 for Figure 1 A bottom view of the cooling device;

[0027] Figure 5 for Figure 1 A schematic diagram of the coolant flowing in the heat dissipation channel in the cooling device.

[0028]

Explanation of symbols

[0029] 10: Cooling device

[0030] 11: Heat sink assembly

[0031] 111: First Plate

[0032] 1111: Depressed structure

[0033] 112: Second Plate

[0034] 12: Pump

[0035] 13: First fin

[0036] 14: Fan components

[0037] 141: Bottom

[0038] 1411: Air Inlet

[0039] 142: Side

[0040] 1421: Air vent

[0041] 15: Second fin

[0042] 16: Heatsink

[0043] A~I: Direction

[0044] C1: Heat dissipation channel

[0045] C11: First heat absorption section

[0046] C12: First connecting part

[0047] C13: First heat dissipation section

[0048] C14: Second heat dissipation section

[0049] C15: Second connecting part

[0050] C16: Third heat dissipation section

[0051] C17: Fourth heat dissipation section

[0052] C18: Third connecting part

[0053] C19: Second heat absorption section

[0054] H1: Main heat source

[0055] H2: Secondary heat source

[0056] P1: Liquid inlet

[0057] P2: Liquid outlet

[0058] P3: Ventilation opening Detailed Implementation

[0059] Please see Figures 1 to 4 . Figure 1 This is a perspective view of the cooling device according to an embodiment of the present utility model. Figure 2 for Figure 1 An exploded view of the cooling device. Figure 3 for Figure 1 The cooling device is shown in a plan view of the second plate, which is omitted. Figure 4 for Figure 1 A bottom view of the cooling device.

[0060] The cooling device 10 of this embodiment is used to be disposed in an electronic device (not shown) and to contain a coolant (not shown). The electronic device is, for example, a notebook computer, and the coolant is, for example, water or a refrigerant. The cooling device 10 includes a heat sink assembly 11, a pump 12, a plurality of first fins 13, two fan elements 14, and a plurality of second fins 15. The heat sink assembly 11 includes a first plate 111 and a second plate 112. The first plate 111 and the second plate 112 are connected, for example, by soldering.

[0061] The first plate 111 has a recessed structure 1111, which is used for thermal coupling to two main heat sources H1 to dissipate heat from the two main heat sources H1. The two main heat sources H1 are, for example, a CPU and a GPU. Thermal coupling refers to thermal contact or connection through other thermally conductive media. The second plate 112 covers the recessed structure 1111, and together with the recessed structure 1111, forms a heat dissipation channel C1, a coolant inlet P1, and a coolant outlet P2. The heat dissipation channel C1 is used to contain coolant. The coolant inlet P1 and the coolant outlet P2 are connected to the heat dissipation channel C1. The pump 12 is connected to the coolant inlet P1 and the coolant outlet P2, and is used to drive the coolant to circulate within the heat dissipation channel C1.

[0062] In detail, the heat dissipation channel C1 has a first heat absorption section C11, a first connecting section C12, a first heat dissipation section C13, a second heat dissipation section C14, a second connecting section C15, a third heat dissipation section C16, a fourth heat dissipation section C17, a third connecting section C18, and a second heat absorption section C19. One end of the first heat absorption section C11 is connected to the liquid inlet P1. The other end of the first heat absorption section C11 is connected to one end of the first connecting section C12. The other end of the first connecting section C12 is connected to one end of the first heat dissipation section C13. The other end of the first heat dissipation section C13 is connected to one end of the second heat dissipation section C14. The other end of the second heat dissipation section C14 is connected to one end of the second connecting section C15. The other end of the second connecting section C15 is connected to one end of the third heat dissipation section C16. The other end of the third heat dissipation section C16 is connected to one end of the fourth heat dissipation section C17. The other end of the fourth heat dissipation section C17 is connected to one end of the third connecting section C18. The other end of the third connecting section C18 is connected to one end of the second heat absorption section C19. The other end of the second heat absorption section C19 is connected to the liquid outlet P2. For example, the main heat source H1 of a CPU may be thermally coupled to the first heat absorption section C11, and the main heat source H1 of a GPU may be thermally coupled to the second heat absorption section C19, but this is not a limitation.

[0063] In this embodiment, since the cooling device 10 is provided with a heat sink assembly 11, and the heat sink assembly 11 forms a heat dissipation channel C1 through the recessed structure 1111 of the first plate 111, the bends in the channel do not occupy a large amount of space inside the electronic device due to structural limitations. Therefore, a more complex heat dissipation path can be designed to make full use of the space inside the electronic device without affecting the placement of other electronic components. In this way, the space utilization rate inside the electronic device can be improved while maintaining the heat dissipation efficiency of the cooling device 10.

[0064] In this embodiment, the second connecting portion C15 of the heat dissipation channel C1 can also be thermally coupled to multiple secondary heat sources H2 to dissipate heat from these secondary heat sources H2, but is not limited thereto. These secondary heat sources H2 may be, for example, electronic components other than the CPU and GPU.

[0065] In this embodiment, the widths of the second heat dissipation portion C14 and the third heat dissipation portion C16 are, for example, greater than the widths of the first connecting portion C12, the first heat dissipation portion C13, the fourth heat dissipation portion C17, and the third connecting portion C18, and the widths of the first heat absorption portion C11 and the second heat absorption portion C19 are greater than the widths of the second heat dissipation portion C14 and the third heat dissipation portion C16. Furthermore, the first heat dissipation portion C13 and the second heat dissipation portion C14 are, for example, linearly symmetrical with respect to the third heat dissipation portion C16 and the fourth heat dissipation portion C17, to ensure consistency in the specifications of the two fan components 14. Moreover, the recess depths of the first heat absorption portion C11 and the second heat absorption portion C19 are, for example, greater than the recess depths of the first heat dissipation portion C13, the second heat dissipation portion C14, the third heat dissipation portion C16, the fourth heat dissipation portion C17, the first connecting portion C12, the second connecting portion C15, and the third connecting portion C18.

[0066] These first fins 13 are respectively disposed on the first heat-absorbing section C11, the first heat-dissipating section C13, the second heat-dissipating section C14, the third heat-dissipating section C16, the fourth heat-dissipating section C17, and the second heat-absorbing section C19. These first fins 13 are, for example, made of copper. Furthermore, the width of these first fins 13 disposed on the first heat-dissipating section C13, the second heat-dissipating section C14, the third heat-dissipating section C16, and the fourth heat-dissipating section C17 is, for example, the same as the width of the first heat-dissipating section C13, the second heat-dissipating section C14, the third heat-dissipating section C16, and the fourth heat-dissipating section C17, so that the coolant can flow evenly over these first fins 13. By providing these first fins 13, the heat exchange efficiency of the coolant flowing through the first heat-absorbing section C11, the first heat-dissipating section C13, the second heat-dissipating section C14, the third heat-dissipating section C16, the fourth heat-dissipating section C17, and the second heat-absorbing section C19 can be increased.

[0067] The first plate 111 and the second plate 112 together form two ventilation openings P3. The two ventilation openings P3 are separate from the heat dissipation channel C1. Two fan elements 14 are respectively disposed in the two ventilation openings P3. Each fan element 14 includes a bottom 141 and two side portions 142. The two side portions 142 are connected to the bottom 141 and are adjacent to each other. The bottom 141 has an air inlet 1411. Each of the two side portions 142 has an air outlet 1421. Among them, the two air outlets 1421 of one fan element 14 correspond to the first heat dissipation portion C13 with a smaller width and the second heat dissipation portion C14 with a larger width, respectively. The two air outlets 1421 of the other fan element 14 correspond to the fourth heat dissipation portion C17 with a smaller width and the third heat dissipation portion C16 with a larger width, respectively. That is to say, the two air outlets 1421 of each fan element 14 can be divided into a main air outlet and a secondary air outlet, and the main air outlet corresponds to the heat dissipation portion with a larger width, and the secondary air outlet corresponds to the heat dissipation portion with a smaller width. These second fins 15 are disposed on the first plate 111 and located at the two air outlets 1421, and each of the second fins 15 corresponds to at least a portion of the first fins 13, so that the two fan elements 14 can generate heat dissipation airflow on these second fins 15 to dissipate heat from the heat sink assembly 11. These second fins 15 are, for example, made of copper.

[0068] In this embodiment, the cooling device 10 may further include two heat-conducting blocks 16. The two heat-conducting blocks 16 are disposed on the first plate 111 and correspond to the first fin 13 located in the first heat-absorbing part C11 and the first fin 13 located in the second heat-absorbing part C19. The two heat-conducting blocks 16 are used to thermally couple to the two main heat sources H1 respectively. By providing the heat-conducting blocks 16, the efficiency of the main heat source H1 in conducting heat to the first plate 111 can be improved.

[0069] In this embodiment, the first heat-absorbing part C11 and the second heat-absorbing part C19 have multiple concave and convex structures, and the concave depth of the first heat-absorbing part C11 and the second heat-absorbing part C19 is greater than the concave depth of the first heat-dissipating part C13, the second heat-dissipating part C14, the third heat-dissipating part C16, the fourth heat-dissipating part C17, the first connecting part C12, the second connecting part C15 and the third connecting part C18. In this way, in addition to increasing the structural strength of the heat dissipation channel C1, when the cooling device 10 is thermally coupled to, for example, a main heat source H1, a secondary heat source H2, and other heat sources (not shown) provided on a circuit board (not shown), the recesses of the first heat-absorbing part C11, the first connecting part C12, the first heat-dissipating part C13, the second heat-dissipating part C14, the second connecting part C15, the third heat-dissipating part C16, the fourth heat-dissipating part C17, the third connecting part C18, and the second heat-absorbing part C19 can be tightly attached to the main heat source H1, the secondary heat source H2, and other heat sources, so that the heat dissipation channel C1 can dissipate heat from the main heat source H1, the secondary heat source H2, and other heat sources more efficiently.

[0070] In this embodiment, the heat dissipation channel C1 is configured with a first heat-absorbing part C11, a first connecting part C12, a first heat-dissipating part C13, a second heat-dissipating part C14, a second connecting part C15, a third heat-dissipating part C16, a fourth heat-dissipating part C17, a third connecting part C18, and a second heat-absorbing part C19, but is not limited thereto. In other embodiments, the configuration of the heat dissipation channel can also be adjusted according to the internal space configuration of different electronic devices.

[0071] In this embodiment, there are two vents P3 and two fan elements 14, but this is not a limitation. In other embodiments, there may be three or more vents and three or more fan elements, or only one fan element.

[0072] In this embodiment, there are two main heat sources H1 and two heat-conducting blocks 16, but this is not a limitation. In other embodiments, there may be three or more main heat sources and three or only one heat-conducting block.

[0073] Please see Figure 5 . Figure 5 for Figure 1 A schematic plan view of the coolant flowing within the heat dissipation channel in the cooling device. In this embodiment, when a user wants to dissipate heat from heat sources H1 and H2 through the cooling device 10, firstly, the heat sink assembly 11 is thermally coupled to the heat sources H1 and H2. Specifically, the first heat-absorbing part C11 and the second heat-absorbing part C19 are thermally coupled to the two main heat sources H1, for example, respectively, and the second connecting part C15 is thermally coupled to the secondary heat source H2, for example. Next, the coolant is driven by the pump 12 to circulate within the heat dissipation channel C1.

[0074] In detail, pump 12 drives coolant to flow into the first heat absorption section C11 from the inlet P1 along direction A. In the first heat absorption section C11, coolant absorbs heat from one of the two main heat sources H1, which is then transferred to the heat sink assembly 11. Next, coolant flows from the first heat absorption section C11 into the first connecting section C12 along direction B. Then, coolant flows from the first connecting section C12 into the first heat dissipation section C13 along direction C, where it releases the absorbed heat to dissipate the heat released by the coolant through the first fins 13 and the fan element 14. Next, coolant flows from the first heat dissipation section C13 into the second heat dissipation section C14 along direction D, where it continues to release the absorbed heat to dissipate the heat released by the coolant through the first fins 13 and the fan element 14.

[0075] Next, the coolant flows from the second heat dissipation section C14 into the second connecting section C15 and flows along direction E in the second connecting section C15. At this time, the coolant absorbs the heat transferred from the secondary heat source H2 to the heat sink assembly 11 at the second connecting section C15. Next, the coolant flows from the second connecting section C15 into the third heat dissipation section C16 and releases the absorbed heat at the third heat dissipation section C16 to dissipate the heat released by the coolant through the first fin 13 and the fan element 14. Next, the coolant flows from the third heat dissipation section C16 into the fourth heat dissipation section C17 along direction F and releases the absorbed heat at the fourth heat dissipation section C17 to dissipate the heat released by the coolant through the first fin 13 and the fan element 14. Next, the coolant flows from the fourth heat dissipation section C17 into the third connecting section C18 along direction G. Next, the coolant flows from the third connecting section C18 into the second heat absorption section C19 along direction H. The second heat-absorbing section C19 absorbs the heat transferred from the other of the two main heat sources H1 to the heat sink assembly 11. The coolant flows from the second heat-absorbing section C19 into the outlet P2 along direction I and returns to the pump 12 for the next cooling cycle. In this way, heat sources H1 and H2 can be continuously dissipated.

[0076] According to the cooling device and heat sink assembly of the above embodiments, since the cooling device is equipped with a heat sink assembly, and the heat sink assembly forms a heat dissipation channel through the recessed structure of the first plate, the bends in the channel will not occupy a large amount of space inside the electronic device due to structural limitations. Therefore, a more complex heat dissipation path can be designed to make full use of the space inside the electronic device without affecting the placement of other electronic components. In this way, the space utilization rate inside the electronic device can be improved while maintaining the heat dissipation performance of the cooling device.

[0077] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. A cooling device, characterized in that, The cooling device is used to contain a coolant and includes: A heat sink assembly, comprising: A first plate having a recessed structure for thermal coupling to at least one heat source; and A second plate covers the recessed structure and, together with the recessed structure, forms a heat dissipation channel, a liquid inlet, and a liquid outlet. The heat dissipation channel is used to contain the coolant, and the liquid inlet and the liquid outlet are connected to the heat dissipation channel; and A pump is connected to the inlet and the outlet, and the pump is used to drive the coolant to circulate in the heat dissipation channel.

2. The cooling device as described in claim 1, characterized in that, The heat dissipation channel has a first heat absorption section and a first heat dissipation section. One end of the first heat absorption section is connected to the liquid inlet, the other end of the first heat absorption section is connected to one end of the first heat dissipation section, and the other end of the first heat dissipation section is connected to the liquid outlet.

3. The cooling device as described in claim 2, characterized in that, The heat dissipation channel also has a second heat dissipation section, the first heat dissipation section is connected to the second heat dissipation section, and the first heat dissipation section and the second heat dissipation section are respectively connected to the first heat absorption section and the liquid outlet.

4. The cooling device as described in claim 3, characterized in that, The width of the second heat dissipation part is greater than the width of the first heat dissipation part.

5. The cooling device as described in claim 3, characterized in that, The heat dissipation channel also has a third heat dissipation section and a second heat absorption section. One end of the third heat dissipation section is connected to one end of the second heat dissipation section, and the other end of the third heat dissipation section is connected to one end of the second heat absorption section. The other end of the second heat absorption section is connected to the liquid outlet.

6. The cooling device as described in claim 5, characterized in that, The heat dissipation channel also has a fourth heat dissipation section, which is connected to the third heat dissipation section and the fourth heat dissipation section, and is respectively connected to the second heat dissipation section and the second heat absorption section.

7. The cooling device as claimed in claim 6, characterized in that, The width of the third heat dissipation part is greater than the width of the fourth heat dissipation part.

8. The cooling device as described in claim 6, characterized in that, The first heat dissipation section and the second heat dissipation section are symmetrical to the third heat dissipation section and the fourth heat dissipation section.

9. The cooling device as claimed in claim 6, characterized in that, The heat dissipation channel also has a first connecting part, a second connecting part and a third connecting part. The first connecting part connects the first heat absorption part and the first heat dissipation part, the second connecting part connects the second heat dissipation part and the third heat dissipation part, and the third connecting part connects the fourth heat dissipation part and the second heat absorption part.

10. The cooling device as claimed in claim 9, characterized in that, The recessed depth of the first heat-absorbing part and the second heat-absorbing part is greater than the recessed depth of the first heat-dissipating part, the second heat-dissipating part, the third heat-dissipating part, the fourth heat-dissipating part, the first connecting part, the second connecting part, and the third connecting part.

11. The cooling device as claimed in claim 10, characterized in that, It also includes a plurality of first fins, which are respectively disposed on the first heat absorption part, the first heat dissipation part, the second heat dissipation part, the third heat dissipation part, the fourth heat dissipation part and the second heat absorption part.

12. The cooling device as claimed in claim 11, characterized in that, It also includes at least one heat-conducting block disposed on the first plate and corresponding to the first fin located in the first heat-absorbing part or the first fin located in the second heat-absorbing part. The at least one heat-conducting block is used to thermally couple to at least one heat source.

13. The cooling device as claimed in claim 11, characterized in that, It also includes at least one fan element, the first plate and the second plate together form at least one vent, the at least one vent is separate from the heat dissipation channel, and the at least one fan element is disposed in the at least one vent.

14. The cooling device as claimed in claim 13, characterized in that, It also includes a plurality of second fins disposed on the first plate. The at least one fan element includes a bottom and two side portions connected to the bottom and adjacent to each other. The bottom has an air inlet and each of the two side portions has an air outlet. The plurality of second fins are respectively located at the two air outlets and respectively correspond to at least a portion of the plurality of first fins.

15. The cooling device as claimed in claim 1, characterized in that, The first plate and the second plate are connected by welding.

16. A heat sink assembly, characterized in that, The heat sink assembly, used to contain a coolant, includes: A first plate having a recessed structure for thermally coupling a heat source; and A second plate covers the recessed structure and together with the recessed structure forms a heat dissipation channel, a liquid inlet and a liquid outlet. The heat dissipation channel is used to contain the coolant, and the liquid inlet and the liquid outlet are connected to the heat dissipation channel.

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