Power converter

Abstract

The utility model provides a power converter. The power converter includes a chassis. The interior of the case is divided into a first cavity and a second cavity by a partition plate. And a heating device is arranged in the first cavity. An air inlet is formed in the front face of the second cavity, two air outlets are formed in the side face of the second cavity, and the two air outlets are located in different sides. And a fan and a radiator are arranged in the second cavity. The air inlet side of the fan faces the air inlet. The radiator comprises an evaporation cavity and a condenser. The partition plate is provided with an opening, the evaporation cavity covers the opening and is connected with the partition plate, and a cooling working medium is arranged in the evaporation cavity. The condenser is located on the side, facing the air inlet, of the evaporation cavity and communicates with the evaporation cavity. The condenser is located between the air inlet and any air outlet. In the heat dissipation process, air enters the power converter from the front face and exits from the two different side faces so that heat can be discharged from the two different air channels, the length of a heat dissipation path can be shortened, accumulation of the heat in the air channels can be reduced, and then the heat dissipation capacity of the power converter can be improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a power converter. Background Technology

[0002] During the transmission and use of electrical energy, parameters such as voltage and current need to be converted or regulated. For example, in a photovoltaic power generation system, the direct current (DC) generated by the solar panels needs to be converted into alternating current (AC) before being output. This function can be achieved through an inverter. Electronic components such as chips and inductors in the inverter generate a large amount of heat during operation. This heat needs to be dissipated into the external environment in a timely manner through a heat dissipation device to prevent the electronic components from failing due to overheating.

[0003] As inverter power increases, the heat generated by the power components within them also increases, placing higher demands on the inverter's heat dissipation capabilities. Currently, inverters incorporate internal fans. Air outlets are located at the top, and air inlets at the bottom. When the inverter is cooling, air enters through the bottom inlet and exits through the top outlet. Inside the inverter, the airflow flows from bottom to top, sequentially passing over the heat-generating components. However, because the airflow has already exchanged heat with the bottom heat-generating components and heated up, the heat exchange effect between the top heat-generating components and the airflow is significantly less than that between the bottom heat-generating components and the airflow, leading to thermal cascading. Furthermore, the relatively long heat dissipation path inside the inverter results in high air resistance, reducing the airflow velocity and significantly impacting the overall cooling performance. Therefore, improving the heat dissipation of the inverter's power components has become a pressing technical challenge. Utility Model Content

[0004] This application provides a power converter that shortens the heat dissipation path within the power converter, thereby improving the heat dissipation efficiency of the power converter.

[0005] In a first aspect, this application provides a power converter. The power converter includes a chassis. An internal partition is provided within the chassis, dividing the internal space of the chassis into a first chamber and a second chamber. Specifically, at least one heat-generating device is disposed in the first chamber. The second chamber includes a top plate disposed opposite to the partition and a plurality of side plates connected in sequence. These side plates are located between the partition and the top plate, and these side plates, the partition, and the top plate enclose the second chamber. In the second chamber, the top plate is provided with an air inlet, and the plurality of side plates include a first side plate and a second side plate. The first side plate is provided with a first air outlet, and the second side plate is provided with a second air outlet. A first fan and at least one heat sink are disposed in the second chamber. The first fan is disposed at the air inlet. The partition has openings corresponding to the at least one heat sink. Each of the at least one heat sink includes an evaporator chamber and a condenser. The evaporator chamber is covered by the corresponding opening, and the evaporator chamber is fixedly connected to the partition, and the at least one heat-generating device is attached to the evaporator chamber. A cooling medium is disposed within the evaporator chamber. The condenser is fixedly connected to the surface of the evaporator chamber facing the top plate, and the condenser is in communication with the evaporator chamber to allow the cooling medium to flow between the evaporator chamber and the condenser. The condenser is located between the air inlet and the first air outlet, or between the air inlet and the second air outlet.

[0006] In the power converter of this application, the internal space of the chassis is divided into two chambers. The first chamber houses the various components of the power converter, and the second chamber serves as the heat dissipation chamber for the power converter. Using openings in the partition, the heat-generating components in the first chamber can be placed against the evaporation chamber, thereby transferring heat from the heat-generating components to the heat sink. The liquid coolant in the evaporation chamber is heated and vaporized into a gaseous coolant, which can then flow within the condenser, transferring heat to the second chamber. During heat dissipation, air enters from the front of the heat sink casing and exits from two different sides, forming two air ducts within the second chamber. The length of each air duct is less than the height or width of the second chamber, thus shortening the heat dissipation path and reducing heat accumulation within the air ducts, thereby improving the heat dissipation capacity of the power converter.

[0007] The aforementioned power converter can be mounted in a wall-mounted configuration, meaning the first and second chambers are arranged side-by-side horizontally. In this configuration, the first side panel can be located at the top of the power converter along the direction of gravity, and the second side panel can be located at the bottom along the direction of gravity. Therefore, the first and second side panels are positioned opposite each other, and the two air outlets are located at the top and bottom of the power converter, respectively, thus creating a heat dissipation path with front air intake and top and bottom air exhaust.

[0008] The aforementioned at least one heating device includes a first heating device and a second heating device. The partition is provided with a first opening and a second opening. The aforementioned at least one heat sink includes a first heat sink and a second heat sink. Specifically, the first heat sink includes a first evaporation chamber and a first condenser. The first evaporation chamber covers the first opening and is fixedly connected to the partition. The first heating device is attached to the first evaporation chamber, and the first condenser is located between the air inlet and the first air outlet. The second heat sink includes a second evaporation chamber and a second condenser. The second evaporation chamber covers the second opening and is fixedly connected to the partition. The second heating device is attached to the second evaporation chamber, and the second condenser is located between the air inlet and the second air outlet. In this scheme, the two heat sinks dissipate heat from the heating device in the first chamber, and the two heat sinks are located in independent air ducts. In this way, the airflow carries away the heat transferred to the heating device through the two air ducts, reducing the length of the air ducts, thereby improving heat dissipation efficiency and mitigating thermal cascading.

[0009] A second fan can also be installed in the aforementioned second chamber to accelerate the gas flow rate within the second chamber and improve heat dissipation efficiency. Specifically, the first fan's exhaust direction is directed towards the first condenser. The exhaust direction of the first fan forms a first angle with the plane of the top plate, which is less than 90 degrees. The second fan's exhaust direction is directed towards the second condenser. The exhaust direction of the second fan forms a second angle with the plane of the top plate, which is less than 90 degrees. In this way, the first fan can directly blow airflow towards the first condenser, and the second fan can directly blow airflow towards the second condenser, while shortening the distance between the fan and the condenser to shorten the overall heat dissipation path length. Furthermore, the fans can be axial fans or centrifugal fans to increase the fan's airflow volume.

[0010] In the power converter of this application, the airflow direction of the first fan can be perpendicular to the partition. In this way, the airflow blown out from the first fan diffuses to the periphery of the second chamber as it flows toward the partition, thereby carrying away the surface heat of the partition.

[0011] The aforementioned radiator is a two-phase radiator. Specifically, the condenser includes multiple parallel condenser tubes. In these multiple condenser tubes, the gap between adjacent tubes faces either the first or second air outlet. These multiple condenser tubes communicate with the evaporation chamber, allowing the cooling medium to flow between the evaporation chamber and the condenser tubes. When the cooling medium in the evaporation chamber is heated, it vaporizes and flows towards the condenser tubes, thereby transferring heat to them. Airflow passing through the gaps between the multiple condenser tubes can carry away surface heat from the tubes. This structural design increases the contact area between the radiator and the airflow, thus improving heat dissipation efficiency.

[0012] In the aforementioned condenser, multiple parallel flat tube fins are arranged between two adjacent condensing flat tubes. The gaps between adjacent flat tube fins are oriented in the same direction as the gaps between adjacent condensing flat tubes. When the first fan rotates, external airflow enters through the air inlet, and a portion of the airflow passes through the gaps between adjacent flat tube fins before exiting through either the first or second air outlet. In this design, the multiple flat tube fins are connected to the condensing flat tubes, thereby transferring heat from the condensing flat tubes to the flat tube fins. The airflow passes through both the gaps between adjacent condensing flat tubes and the gaps between adjacent flat tube fins, increasing the contact area between the condenser and the airflow, further improving heat dissipation efficiency.

[0013] The aforementioned radiator may further include heat dissipation fins. The heat dissipation fins are fixedly connected to the surface of the evaporator chamber facing the top plate, and are arranged adjacent to the condenser. In the plurality of heat dissipation fins, the gap between two adjacent heat dissipation fins is oriented in the same direction as the gap between two adjacent condenser tubes. In this design, the arrangement of heat dissipation fins increases the heat dissipation area of ​​the radiator and reduces the surface temperature of the second chamber and the condenser, thereby improving the heat dissipation efficiency of the radiator.

[0014] A first heat exchanger can be installed in the aforementioned first chamber. A partition has a third opening, which is opposite to the first fan. The first heat exchanger covers the third opening and is fixedly connected to the partition. When the temperature inside the first chamber rises due to the heat-generating device, the first heat exchanger can dissipate heat from the interior of the first chamber. When the first fan operates, a portion of the airflow from the second chamber enters the first heat exchanger through the third opening, allowing for heat exchange with the first heat exchanger. In this way, the heat exchange area inside the first chamber can be increased through the first heat exchanger, thereby improving the heat dissipation efficiency of the power converter.

[0015] A second heat exchanger may also be provided in the second chamber. The second heat exchanger is located on the side of the at least one heat sink facing the first air outlet or the second air outlet. This second heat exchanger can increase the heat exchange area in the second chamber, thereby improving the heat dissipation efficiency of the power converter.

[0016] In one possible implementation, a third fan is also installed inside the chassis. The third fan can be placed anywhere within the first chamber to improve the internal temperature of the first chamber, maintain uniformity, and prevent localized overheating that could affect the operation of electronic components.

[0017] In one possible implementation, a circuit board is also housed inside the chassis, positioned opposite to the partition. At least one heat-generating device is located between the circuit board and the partition, and is connected to the circuit board. The second chamber also houses a magnetic device near either the first or second air outlet, fixedly connected to the partition. The partition has a fourth opening through which the magnetic device connects to the circuit board. When gas flows within the second chamber, the airflow entering from the air inlet can directly carry away the heat from the magnetic device, or the airflow entering from the air inlet can carry away the heat from the magnetic device after passing through the condenser.

[0018] In one possible implementation, a baffle is provided on the side of the top plate facing the condenser, and the baffle is positioned opposite the condenser. The baffle can shorten the gap between the condenser and the top plate and can guide airflow to the condenser, thereby improving heat dissipation performance. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of an application scenario of a photovoltaic system provided in an embodiment of this application;

[0020] Figure 2 This is a side cross-sectional view of the inverter in its mounted state, as provided in an embodiment of this application.

[0021] Figure 3 This is a side cross-sectional view of an inverter provided in an embodiment of this application;

[0022] Figure 4 A top sectional view of an inverter provided in an embodiment of this application;

[0023] Figure 5 for Figure 2 A schematic diagram of the heat sink and heat-generating components of a medium-voltage inverter;

[0024] Figure 6 for Figure 5 A side cross-sectional view of the heat sink and heat-generating components;

[0025] Figure 7 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application;

[0026] Figure 8 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application;

[0027] Figure 9 for Figure 8 A schematic diagram of the structure of the heat sink and the heat-generating device;

[0028] Figure 10 for Figure 9 A side cross-sectional view of the heat sink and heat-generating components;

[0029] Figure 11 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application;

[0030] Figure 12 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application;

[0031] Figure 13 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application;

[0032] Figure 14 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application;

[0033] Figure 15 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application;

[0034] Figure 16 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application.

[0035] Figure label:

[0036] 1-Photovoltaic System

[0037] 2- Photovoltaic Modules

[0038] 3-Power Grid

[0039] 4-Load

[0040] 5-Wall

[0041] 10-Power Converter

[0042] 20-Inverter

[0043] 21-First Chamber

[0044] 22-Second Chamber

[0045] 23-Partition

[0046] 24-Top Plate

[0047] 25-First side plate

[0048] 26-Second side panel

[0049] 27-Air Inlet

[0050] 28-First air outlet

[0051] 29-Second air outlet

[0052] 31-Heating Components

[0053] 32-fan

[0054] 33-Radiator

[0055] 34-Evaporation chamber

[0056] 35-Condenser

[0057] 36-Condensing Flat Tube

[0058] 37-Flat tube fin

[0059] 38-Cooling medium

[0060] 39-Heat dissipation fins

[0061] 40-Circuit Board

[0062] 41-Magnetic Devices

[0063] 42-First heat exchanger

[0064] 43-Second heat exchanger

[0065] 44-Third Fan

[0066] 45-Windshield

[0067] 321 - First Fan

[0068] 322 - Second Fan

[0069] 331 - First Radiator

[0070] 332-Second Radiator

[0071] 333-First Evaporation Chamber

[0072] 334 - First Condenser

[0073] 335 - Second Evaporation Chamber

[0074] 336 - Second Condenser Detailed Implementation

[0075] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0076] It should be noted that the terminology used in the following embodiments is for the purpose of describing specific embodiments only and is not intended to be a limitation of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0077] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0078] In this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0079] Furthermore, in this article, directional terms such as "top," "bottom," "upper," and "lower" are defined relative to the orientation of the structure as shown in the attached drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the structure.

[0080] To facilitate understanding of the power converter provided in the embodiments of this application, its application scenarios are described below. The power converter of this application can be applied to power supply systems and power generation systems. Taking a photovoltaic system as an example, a photovoltaic system can be used in two application scenarios: residential power stations and industrial photovoltaic power stations. A photovoltaic system includes a power converter, which converts solar energy into electrical energy to supply the power grid or load. Figure 1 This is a schematic diagram illustrating an application scenario of the photovoltaic system provided in an embodiment of this application. For example... Figure 1 As shown, the photovoltaic system 1 is applied in a home power station. Specifically, the photovoltaic module 2 is used to convert solar energy into electrical energy. The power converter 10 includes an inverter, whose input is connected to the photovoltaic module 2 as a DC power source, and whose output is connected to the power grid 3 / load 4 via a power line. The inverter is used to convert the DC power from the photovoltaic module 2 into AC power and transmit the AC power to the power grid 3 / load 4. Of course, the inverter can also be connected to an energy storage device. The AC power converted by the inverter can also be transmitted to the energy storage device for energy storage.

[0081] As inverter power increases, the heat generated by the circuit board components inside the inverter chassis also increases, leading to a rise in the internal temperature of the chassis. This is particularly detrimental to heat-generating components located inside the chassis. For power modules with high heat density, the risk of failure increases significantly under sustained high temperatures.

[0082] In existing technology, when an inverter is mounted on a wall, air enters the inverter from the bottom and exits from the top, forming an upward airflow channel. As the air flows within the channel, it carries away heat from the heat-generating components. However, this heat dissipation path results in faster heat dissipation for components located upstream (near the air inlet) and slower heat dissipation for components downstream (near the air outlet). Heat may also accumulate downstream, preventing effective cooling of the inverter's internal chassis. Consequently, the lifespan and reliability of various components inside the chassis cannot be guaranteed, ultimately affecting the overall lifespan of the inverter.

[0083] To address the aforementioned issues, this application's embodiments improve the inverter's heat dissipation methods and the layout of heat-generating components, thereby achieving effective heat dissipation, reducing the risk of internal power module failure, improving the inverter's reliability, and ultimately extending its service life.

[0084] Figure 2 This is a side cross-sectional view of the inverter in its mounted state, as provided in the embodiments of this application. Figure 3 This is a side cross-sectional view of an inverter provided in an embodiment of this application. Figure 2 and Figure 3 As shown, the inverter 20 can be installed on the wall surface 5. Specifically, the inverter 20 can be mounted on the wall surface 5 using a bracket. The wall surface 5 can be a wall, equipment housing, or an auxiliary mounting surface. The inverter 20 of this application can be installed on the wall alone, or two inverters 20 can be installed back to back using an auxiliary mounting surface.

[0085] Please continue to refer to Figure 2 and Figure 3 The inverter 20 includes a chassis and multiple devices located within the chassis. Specifically, the chassis has an internal partition 23 that divides it into a first chamber 21 and a second chamber 22, both arranged adjacent to each other. The second chamber 22 includes a top plate 24 and multiple side plates, wherein the top plate 24 is positioned opposite the partition 23, and the multiple side plates are sequentially connected between the top plate 24 and the partition 23, thereby forming the second chamber 22. At least one heat-generating device 31 is disposed within the first chamber 21.

[0086] like Figure 3As shown, in the second chamber 22, the top plate 24 is provided with an air inlet 27. The aforementioned multiple side plates include a first side plate 25 and a second side plate 26. The first side plate 25 is provided with a first air outlet 28, and the second side plate 26 is provided with a second air outlet 29. Therefore, the second chamber 22 has two air ducts: a first air duct is formed between the air inlet 27 and the first air outlet 28, and a second air duct is formed between the air inlet 27 and the second air outlet 29. When the inverter 20 is installed, along the direction of gravity (e.g., ... Figure 2 In the vertical direction of the inverter 20, the first air outlet 28 can be located at the top of the inverter 20, and the second air outlet 29 can be located at the bottom of the inverter 20. Alternatively, along the direction of gravity, the first air outlet 28 can be located on the right side of the inverter 20, and the second air outlet 29 can be located on the left side of the inverter 20. In other words, the inverter 20 receives air from the back (i.e., the outer surface of the top plate 24) and exhausts air from the side plate. Figure 3 As shown by the dashed line. For ease of description, the following description uses the example of the first air outlet 28 being located at the top of the inverter 20 and the second air outlet 29 being located at the bottom of the inverter 20.

[0087] Figure 4 This is a top sectional view of an inverter provided in an embodiment of this application. Figure 3 and Figure 4 As shown, in the inverter 20 of this application, a second chamber 22 is provided with at least one fan 32 and at least one heat sink 33. The aforementioned at least one fan 32 is mounted in the second chamber 22 and is located near the air inlet 27. The air inlet side of the fan 32 faces the air inlet 27. Figure 5 for Figure 2 A schematic diagram of the heat sink and heat-generating components of a medium-voltage inverter. Figure 5 As shown, the radiator 33 specifically includes an evaporator 34 and a condenser 35. The partition 23 has an opening, which is covered by the evaporator 34, and the evaporator 34 is fixedly connected to the partition 23, thus forming a chamber with a high level of protection in the first chamber 21. The heating element 31 is attached to the evaporator 34. A cooling medium 38 is provided inside the evaporator 34. The condenser 35 is fixedly connected to the surface of the evaporator 34 facing the top plate 24, and is in communication with the evaporator 34. Thus, the cooling medium 38 in the evaporator 34 can flow within the condenser 35 after vaporization. The condenser 35 can be located between the air inlet 27 and the first air outlet 28, or it can be located between the air inlet 27 and the second air outlet 29. It should be noted that the positional relationship between the heating element 31 and the radiator 33 is illustrated for ease of understanding. Figure 5The partition is omitted in the middle.

[0088] In the above embodiment, the heating element 31 in the first chamber 21 can directly contact the evaporation chamber 34, thereby directly transferring the heat from the heating element 31 to the evaporation chamber 34. The cooling medium 38 in the evaporation chamber 34 is heated and vaporized into a gaseous state, allowing the gaseous cooling medium 38 to flow within the condenser 35, thereby transferring heat to the second chamber 22. The fan 32 can increase the gas flow rate within the second chamber 22, thereby improving the heat dissipation capacity of the inverter 20. The airflow direction of the fan 32 can be perpendicular to the partition 23, so that the airflow from the fan 32 diffuses around the second chamber 22 as it flows towards the partition 23, thus carrying away the surface heat of the partition 23.

[0089] In the inverter 20 of this application, the second chamber 22 has two air ducts. During heat dissipation, air enters from the front of the second chamber 22 and exits from two different sides to exhaust heat from the second chamber 22 through the two different air ducts. This air duct arrangement can shorten the length of the air ducts, thereby reducing the accumulation of heat in the air ducts and improving the heat dissipation capacity of the power converter 10.

[0090] Figure 6 for Figure 5 A sectional view of one side of the heat sink and heat-generating components. (See attached image.) Figure 5 and Figure 6 As shown, the condenser 35 includes a plurality of parallel condensing flat tubes 36. The condensing flat tubes 36 are connected to the evaporation chamber 34, so the cooling medium 38 can flow between the evaporation chamber 34 and the condensing flat tubes 36. A plurality of flat tube fins 37 are arranged between adjacent condensing flat tubes 36. When multiple condensing flat tubes 36 are arranged, the gap between adjacent condensing flat tubes must be oriented towards the first air outlet 28 or the second air outlet 29. For ease of arrangement, the aforementioned plurality of condensing flat tubes 36 are arranged in a first direction, which can be parallel to the partition plate 23. The aforementioned plurality of flat tube fins 37 can also be arranged in a second direction, which can be perpendicular to the partition plate 23. That is, if along the direction of gravity (e.g., ... Figure 2 In the vertical direction of the inverter 20, the first air outlet 28 can be located at the top of the inverter 20, and the second air outlet 29 can be located at the bottom of the inverter 20. In this case, the arrangement direction of the multiple condensing flat tubes 36 can be the second direction. Alternatively, along the direction of gravity, the first air outlet 28 can be located on the right side of the inverter 20, and the second air outlet 29 can be located on the left side of the inverter 20. In this case, the arrangement direction of the multiple condensing flat tubes 36 can be the first direction. Furthermore, the condensing flat tubes 36 and the flat tube fins 37 can be arranged perpendicularly, and the gap between two adjacent condensing flat tubes 36 and the gap between two adjacent flat tube fins 37 have the same orientation.

[0091] When the cooling medium 38 in the evaporation chamber 34 is heated and vaporized, the vaporized cooling medium 38 can flow within the condensing flat tube 36, thereby transferring heat from the baffle 23 to the condensing flat tube 36. The vaporized cooling medium 38 then transfers heat to the flat tube fins 37 within the condensing flat tube 36. When the fan 32 operates, the gas in the air duct flows through the gaps between the flat tube fins 37, from the side of the condensing tube near the air inlet 27 to the side near the air outlet, thus carrying away heat from the flat tube fins 37 to achieve heat dissipation. Subsequently, the cooling medium 38 cools down and condenses into a liquid. The liquid cooling medium 38 can flow back from the condensing flat tube 36 to the evaporation chamber 34, thus forming a heat dissipation circulation path.

[0092] Please continue reading. Figure 5 and Figure 6 In this embodiment, the radiator 33 further includes a plurality of heat dissipation fins 39. These heat dissipation fins 39 are arranged parallel to each other in a direction parallel to the partition plate 23. The heat dissipation fins 39 are fixedly connected to the surface of the evaporation chamber 34 facing the top plate 24, and the heat dissipation fins 39 are arranged adjacent to the condenser 35. The gap between two adjacent heat dissipation fins 39 is oriented in the same direction as the gap between two adjacent condensing flat tubes 36. Furthermore, the arrangement direction of these heat dissipation fins 39 is the same as the arrangement direction of the condensing flat tubes 36, and the gap between the heat dissipation fins 39 is continuous with the gap between two adjacent condensing flat tubes 36, thereby increasing the gas flow rate through the gap between the condensing flat tubes 36. The arrangement of the heat dissipation fins 39 can increase the heat dissipation area of ​​the radiator 33 and reduce the surface temperature of the second chamber 22 and the condenser 35, thereby improving the heat dissipation efficiency of the radiator 33. When the inverter 20 is mounted, the cooling medium 38 accumulates at the bottom of the evaporation chamber 34 due to gravity. Therefore, to improve the heat dissipation efficiency of the cooling medium 38, the heat dissipation fins 39 can be positioned close to the bottom of the evaporation chamber 34. Inside the second chamber 22, the heat dissipation fins 39 can be positioned on the condenser 35 near the air inlet 27, and opposite to the fan 32. That is, the radiator 33 is located above the fan 32. Alternatively, the heat dissipation fins 39 can also be positioned on the condenser 35 away from the air inlet 27, i.e., the radiator 33 is located below the fan 32.

[0093] Figure 7 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. (See image below.) Figure 7As shown, a circuit board 40 is also provided in the first chamber 21, and the circuit board 40 is arranged opposite to the partition 23. A heating device 31 is located between the circuit board 40 and the partition 23, and is connected to the circuit board. The heating device 31 may include a power module, specifically including various power devices such as chips, resistors, capacitors, and transformers. These power devices can be connected in a certain functional combination to achieve a specific function. The chip may include an insulated-gate bipolar transistor (IGBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), or a power transistor, etc. Furthermore, a surface-mount resistor and a surface-mount capacitor may be provided on the side of the circuit board 40 facing away from the partition 23.

[0094] Please continue reading. Figure 7 The second chamber 22 may also be provided with at least one magnetic device 41. Each of the aforementioned at least one magnetic device 41 is positioned near either the first air outlet 28 or the second air outlet 29. The magnetic device 41 is fixedly connected to a partition 23, which has a fourth opening through which the magnetic device 41 passes and connects to the circuit board 40. The magnetic device 41 is located in either the first or second air duct. When gas flows within the second chamber 22, the airflow entering from the air inlet 27 can directly carry away the heat from the magnetic device 41, or the airflow entering from the air inlet 27 can carry away the heat from the magnetic device 41 after passing through the condenser 35. In this embodiment, the magnetic device 41 can be a DC boost inductor assembly or an inverter inductor assembly.

[0095] Figure 8 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. Figure 9 for Figure 8 A schematic diagram of the structure of the heat sink and the heat-generating device. Figure 10 for Figure 9 A sectional view of one side of the heat sink and heat-generating components. (See attached image.) Figure 8 , Figure 9 and Figure 10As shown, in one embodiment, the at least one heating device 31 includes a plurality of heating devices 31, which may be arranged in two groups. The at least one heat sink 33 may include a first heat sink 331 and a second heat sink 332. The first heat sink 331 includes a first evaporation chamber 333 and a first condenser 334, and the second heat sink 332 includes a second evaporation chamber 335 and a second condenser 336. The partition 23 has a first opening and a second opening, the first evaporation chamber 333 covers the first opening, the second evaporation chamber 335 covers the second opening, and the first evaporation chamber 333 and the second evaporation chamber 335 are respectively fixedly connected to the partition 23. The first evaporation chamber 333 and the second evaporation chamber 335 may be arranged side by side in the second chamber 22. The first condenser 334 is located between the air inlet 27 and the first air outlet 28, the second condenser 336 is located between the air inlet 27 and the second air outlet 29, and the fan 32 is located between the first condenser 334 and the second condenser 336. In other words, the first condenser 334 is located within the first air duct, and the second condenser 336 is located within the second air duct. Of the two sets of heating elements 31, one set is attached to the first evaporation chamber 333, and the other set is attached to the second evaporation chamber 335. That is, one set of heating elements 31 dissipates heat through the first radiator 331, and the other set dissipates heat through the second radiator 332. During heat dissipation, the fan 32 blows air from outside the inverter 20 into the space between the first and second radiators 331 through the air inlet 27. Of the air entering the second chamber 22, a portion passes through the first condenser 334 within the first air duct, thus carrying away the heat transferred from one set of heating elements 31 to the first radiator 331; the other portion passes through the second condenser 336 within the second air duct, thus carrying away the heat transferred from the other set of heating elements 31 to the second radiator 332. In this embodiment, two heat sinks 33 are used to dissipate heat from the heat-generating device 31, and the two heat sinks 33 are located in separate air ducts. In this way, the airflow carries away the heat transferred to the second chamber 22 through the two air ducts, which can reduce the heat dissipation path, thereby improving the heat dissipation efficiency and mitigating the thermal cascading phenomenon.

[0096] Figure 11 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. (See image below.) Figure 11As shown, in the above embodiment, the at least one fan 32 includes a first fan 321 and a second fan 322 arranged adjacent to each other. The first fan 321 and the second fan 322 are arranged side by side at the air inlet 27 and share the same air inlet 27. The air outlet side of the first fan 321 can face the first condenser 334, and the air outlet side of the second fan 322 can face the second condenser 336. In this way, the first fan 321 can dissipate heat from the first radiator 331, and the second fan 322 can dissipate heat from the second radiator 332, thereby accelerating the gas flow rate within the second chamber 22 to improve heat dissipation efficiency.

[0097] Furthermore, the airflow direction of fan 32 can be set at an acute angle to the plane of top plate 24. For example, in one embodiment, the airflow direction of the first fan 321 can be set at a first angle to the plane of top plate 24, where the first angle is less than 90 degrees. The airflow direction of the second fan 322 can be set at a second angle to the plane of top plate 24, where the second angle is less than 90 degrees. In this way, the first fan can directly blow airflow towards the first condenser 334, and the second fan 322 can directly blow airflow towards the second condenser 336, while shortening the distance between fan 32 and condenser 35 to shorten the entire heat dissipation path. Furthermore, fan 32 can be an axial fan to increase the airflow volume of fan 32.

[0098] Furthermore, in order to accelerate the heat dissipation of the heat-generating device 31, a first heat exchanger 42 may also be provided in the first chamber 21. Figure 12 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. (See image below.) Figure 12 As shown, the first heat exchanger 42 can be fixedly connected to the partition 23. The partition 23 has a third opening, which is opposite to the fan 32. The first heat exchanger 42 covers the third opening and is fixedly connected to the partition 23. That is, when the heat-generating device 31 causes the temperature inside the first chamber 21 to rise, the first heat exchanger 42 can be used to dissipate heat from the inside of the first chamber 21. When the fan 32 is working, a portion of the airflow enters the first heat exchanger 42 through the opening, which can cool the first heat exchanger 42. In this way, the heat exchange area inside the first chamber 21 can be increased through the first heat exchanger 42, thereby improving the heat dissipation efficiency.

[0099] Figure 13 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. (See image below.) Figure 13 As shown, similarly, a second heat exchanger 43 can also be installed in the second chamber 22, which can be used to dissipate heat from the second chamber 22. Figure 13As shown, in one embodiment, the second heat exchanger 43 and the condenser 35 can be located on opposite sides of the air inlet 27. For example, the condenser 35 can be located inside the first air duct, and the second heat exchanger 43 can be located inside the second air duct. In this way, of the airflow entering from the air inlet 27, a portion of the airflow passes through the condenser 35 in the first air duct and is then discharged from the first air outlet 28, thereby carrying away the heat from the radiator 33; another portion of the airflow passes through the second heat exchanger 43 in the second air duct and is then discharged from the second air outlet 29, thereby carrying away the heat from the second heat exchanger 43. Figure 14 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. (See image below.) Figure 14 As shown, in another embodiment, the second heat exchanger 43 can also be located on the side of the condenser 35 away from the air inlet 27. For example, when the condenser 35 is located in the second air duct, the second heat exchanger 43 can be located between the condenser 35 and the second air outlet 29. In this way, when the airflow passes through the condenser 35, it can also carry away the heat from the second heat exchanger 43. Therefore, the second heat exchanger 43 can increase the heat exchange area in the second chamber 22 to improve heat dissipation efficiency.

[0100] Furthermore, when the second chamber 22 is equipped with the first radiator 331 and the second radiator 332, the second heat exchanger 43 can be located within the first air duct along with the first radiator 331. Specifically, the second heat exchanger 43 can be located on the side of the first radiator 331 near the air inlet 27, or the second heat exchanger 43 can be located on the side of the first radiator 331 near the first air outlet 28. Alternatively, the second heat exchanger 43 can also be located within the second air duct along with the second radiator 332. Specifically, the second heat exchanger 43 can be located on the side of the second radiator 332 near the air inlet 27, or the second heat exchanger 43 can be located on the side of the second radiator 332 near the second air outlet 29.

[0101] Figure 15 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. (See image below.) Figure 15 As shown, a third fan 44 can also be installed inside the first chamber 21. The third fan 44 can be placed at any position inside the first chamber 21 to improve the internal temperature of the first chamber 21 and maintain uniformity, so as to avoid local overheating and affect the operation of electronic components.

[0102] Figure 16 This is a cross-sectional view of another side of the inverter provided in an embodiment of this application. (See image below.) Figure 16As shown in this application, in order to allow the airflow blown by the fan 32 to pass through the radiator 33 as much as possible, the surface of the top plate 24 facing the condenser 35 can have a baffle 45, which is arranged opposite to the condenser 35. The baffle 45 can shorten the gap between the condenser 35 and the top plate 24, and the side of the baffle 45 near the air inlet 27 can be set as an inclined surface to guide the airflow to the condenser 35.

[0103] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power converter, characterized in that, The system includes a chassis, and the chassis has a partition that divides the internal space of the chassis into a first chamber and a second chamber, wherein: At least one heating device is provided in the first chamber; The second chamber includes a top plate disposed opposite to the partition and a plurality of side plates connected in sequence; the plurality of side plates are located between the partition and the top plate, and the plurality of side plates, the partition and the top plate enclose the second chamber; the top plate is provided with an air inlet, and the plurality of side plates include a first side plate and a second side plate, the first side plate is provided with a first air outlet, and the second side plate is provided with a second air outlet; The second chamber is provided with a first fan and at least one radiator; the first fan is disposed at the air inlet; the partition has openings corresponding to the at least one radiator; each of the at least one radiator includes an evaporation chamber and a condenser; the evaporation chamber covers the corresponding opening and is fixedly connected to the partition, and the at least one heating element is attached to the evaporation chamber; the evaporation chamber is provided with a cooling medium; the condenser is fixedly connected to the surface of the evaporation chamber facing the top plate and communicates with the evaporation chamber so that the cooling medium flows between the evaporation chamber and the condenser; the condenser is located between the air inlet and the first air outlet, or between the air inlet and the second air outlet.

2. The power converter as described in claim 1, characterized in that, In the operating state of the power converter, the first side plate is located at the top of the power converter along the direction of gravity, and the second side plate is located at the bottom of the power converter along the direction of gravity.

3. The power converter as described in claim 2, characterized in that, The at least one heating device includes a first heating device and a second heating device, and the partition is provided with a first opening and a second opening; The at least one radiator includes a first radiator and a second radiator; the first radiator includes a first evaporation chamber and a first condenser, the first evaporation chamber is covered by the first opening and fixedly connected to the partition, the first heating element is attached to the first evaporation chamber, and the first condenser is located between the air inlet and the first air outlet. The second radiator includes a second evaporation chamber and a second condenser. The second evaporation chamber is covered by the second opening and fixedly connected to the partition. The second heating element is attached to the second evaporation chamber. The second condenser is located between the air inlet and the second air outlet.

4. The power converter as described in claim 3, characterized in that, The second chamber is also equipped with a second fan, which is located at the air inlet; The first fan is directed toward the first condenser, and the first fan is directed at a first angle to the plane of the top plate, which is less than 90 degrees. The second fan is directed toward the second condenser, and the air outlet direction of the second fan is set at a second angle to the plane of the top plate, the second angle being less than 90 degrees.

5. The power converter as described in any one of claims 1 to 3, characterized in that, The airflow direction of the first fan is perpendicular to the partition.

6. The power converter as described in any one of claims 1 to 4, characterized in that, The condenser includes a plurality of parallel condensing flat tubes; among the plurality of condensing flat tubes, the gap between two adjacent condensing flat tubes is set toward the first air outlet or the second air outlet. The plurality of condensing flat tubes are connected to the evaporation chamber so that the cooling working fluid flows between the evaporation chamber and the condensing flat tubes.

7. The power converter as described in claim 6, characterized in that, Multiple flat tube fins are arranged in parallel between two adjacent condensing flat tubes; among the multiple flat tube fins, the gap between two adjacent flat tube fins is oriented in the same direction as the gap between two adjacent condensing flat tubes.

8. The power converter as described in claim 7, characterized in that, The radiator also includes a plurality of heat dissipation fins, which are respectively fixedly connected to the surface of the evaporation chamber facing the top plate, and are arranged adjacent to the condenser; among the plurality of heat dissipation fins, the gap between two adjacent heat dissipation fins is oriented in the same direction as the gap between two adjacent condenser flat tubes.

9. The power converter as described in any one of claims 1 to 4, characterized in that, The partition is provided with a third opening, which is positioned opposite to the first fan. The first chamber is provided with a first heat exchanger, which is covered by the third opening and fixedly connected to the partition.

10. The power converter as described in any one of claims 1 to 4, characterized in that, The second chamber is provided with a second heat exchanger, which is located on the side of the at least one radiator facing the first air outlet or the second air outlet.

11. The power converter as described in any one of claims 1 to 4, characterized in that, The first chamber is also provided with a circuit board, which is disposed opposite to the partition; at least one heating device is located between the circuit board and the partition, and the at least one heating device is connected to the circuit board; The second chamber is also provided with a magnetic device located near the first air outlet or the second air outlet. The magnetic device is fixedly connected to the partition. The partition is provided with a fourth opening. The magnetic device is connected to the circuit board through the fourth opening.

12. The power converter as described in any one of claims 1 to 4, characterized in that, A windshield is provided on the side of the top plate facing the condenser, and the windshield is positioned opposite to the condenser.

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